Printed circuit boards provide a practical and economical means for the interconnection of large numbers of electronic devices. The demand for increased functionality has led to the development of integrated circuits and other components having greater speeds and functionalities, along with an increase in printed circuit board component densities.
This increase in printed circuit board component densities and operational speeds has placed increased demands on their testing. During the development and manufacture of these electronic circuits, it is necessary to perform various tests to confirm design concept, as well as to verify functionality of the manufactured parts. In order to perform such tests in a reasonable time at an affordable cost, test systems dedicated to such purposes have been developed.
These test systems are referred to as ATE (automatic text equipment) systems. The term Automatic Test Equipment refers to the test hardware and its accompanying software. The ATE system is typically controlled by a computer which is used to control various electronic test instruments such as digital voltmeters, waveform analyzers, signal generators, switching assemblies, and the like. This equipment typically operates under control of specially designed test software which operates on the computer and which can provide stimuli to various parts of the printed circuit board. The various stimuli which the printed circuit board could be expected to experience during its normal operation can be applied and the response of the board to these stimuli observed. The results of the test can then be compared with that which would be expected in order to determine whether or not the board meets the specification for the particular test performed.
Typically the interface between the ATE computer with the various electronic test instruments that it controls and the printed circuit board being tested is a test head. The test head includes a number of probes for electrical connection to the various test points on the printed circuit board, driver electronics, and relays for switching the electronics between the various probes. The test head electronics is referred to as pin electronics and forms basically a buffer between the main part of the test system and the printed circuit board being tested. The need to test printed circuit boards at high frequencies has dictated that this buffering be as close to the board as possible, i.e., on the test head. However, space considerations on the test head, as well as cost, have necessitated the multiplexing of test head electronics between the various test probes of the test head. Multiplexing has added a degree of complexity to the software programs controlling the testing.
In a representative embodiment, an electronic interface circuit comprises a stimulus circuit which further comprises a first voltage source, a driver circuit having a first and a second driver outputs, a first switch having a first-switch input, a first-switch output, and a first-switch control input, a first filter having a first-filter input and a first-filter output, a second switch having a second-switch input, a second-switch output, and a second-switch control input, and a second filter having a second-filter input and a second-filter output. The output of the first voltage source is connected to the first-switch input; the first driver output is connected to the first-switch control input; the first-switch output is connected to the first-filter input; the second-switch input is connected to a reference potential; the second driver output is connected to the second-switch control input; the second-switch output is connected to the second-filter input; and the first-filter output is connected to the second-filter output.
In another representative embodiment, an electronic interface circuit, comprises a stimulus circuit which further comprises a first voltage source, a second voltage source, a driver circuit having a first and a second driver outputs, a first switch having a first-switch input, a first-switch output, and a first-switch control input, a first filter having a first-filter input and a first-filter output, a second switch having a second-switch input, a second-switch output, and a second-switch control input, and a second filter having a second-filter input and a second-filter output. The output of first voltage source is connected to the first-switch input; the first driver output is connected to the first-switch control input; the first-switch output is connected to the first-filter input; the output of second voltage source is connected to the second-switch input; the second driver output is connected to the second-switch control input; the second-switch output is connected to the second-filter input; and the first-filter output is connected to the second-filter output.
Other aspects and advantages of the representative embodiments presented herein will become apparent from the following detailed description, taken in conjunction with the accompanying drawings.
The accompanying drawings provide visual representations which will be used to more fully describe various representative embodiments and can be used by those skilled in the art to better understand them and their inherent advantages. In these drawings, like reference numerals identify corresponding elements.
As shown in the drawings for purposes of illustration, the present patent document discloses novel techniques for the implementation of pin electronics that are inexpensive, power efficient, and require only a small area of the test head printed circuit board to implement. The components used can be standard, off the shelf devices. The resulting solution enables the construction of an overdriving, non-multiplexed, printed circuit board test system at a cost competitive with existing multiplexed test systems. Previous solutions, which were capable of testing printed circuit boards having comparable component densities at comparable speeds, typically required multiplexing the test head electronics to obtain the needed performance or sacrificed overdriving performance in order to increase the number of test channels.
In the following detailed description and in the several figures of the drawings, like elements are identified with like reference numerals.
It will be recognized by one of ordinary skill in the art that the device under test 40 could be a loaded or bare printed circuit board, a packaged integrated circuit or other electronic device, an integrated circuit in die form on a semiconductor wafer, or the like.
As shown in the representative embodiment of
The output of first voltage source 115 which is at first drive voltage V1 is connected to the first-switch input 126; the first driver output 122 is connected to the first-switch control input 129; the first-switch output 127 is connected to the first-filter input 131; the second-switch input 136 is connected to a reference potential V2, also referred to herein as a second drive voltage V2, which in the representative embodiment of
The electronic interface circuit 100 further comprises the detection circuit 150, wherein the detection circuit 150 comprises a differential receiver 155, also referred to herein as a receiver 155, and a third voltage reference 165, also referred to herein as a detection voltage reference 165. The differential receiver 155 has a first receiver input 156, a second receiver input 157, and a receiver output 158. The first receiver input 156 is connected to first-filter output 132 and to the second-filter output 142, and the second receiver input 157 is connected to output of the detection voltage reference 165 which is at comparison voltage V3. The receiver output 158 can be connected to the test system 10 electronics for the collection, comparison, and/or analysis of the test stimulus signal 102 at the stimulus-circuit output 112 or a response signal 103 received from the device under test 40 due to the test stimulus signal 102 received by the device under test 40 at another test pin 31 on the test head 30. In response to the response signal 103, the differential receiver 155 outputs a response output signal 104 at the receiver output 158.
In operation, a test signal indicated in
If the first switch 125 is turned on and the second switch 135 is turned off, the output of the first voltage source 115 is electrically connected to the first-switch output 127 which results in the potential of the output of the first voltage source 115 less any voltage drop across the first switch 125 appearing at the first-switch output 127. Again, the potential of the output of the first voltage source 115 is identified in
If the second switch 135 is turned on and the first switch 125 is turned off, the reference potential V2 (less any voltage drop across the second switch 135) is connected to the second-switch output 137. The reference potential V2 is at ground potential V2 in the representative embodiment of
If neither first switch 125 nor second switch 135 is turned on, the stimulus-circuit output 112 is in a high-impedance state (tri-state). In this condition the stimulus circuit 110 presents a minimal load to the device under test 40.
As shown in the representative embodiment of
In
The second-switch input 136 is shown as the source of the second field effect transistor 135, wherein the second field effect transistor 135 is depicted as an n-channel metal-oxide-semiconductor field effect transistor; the second-switch output 137 is shown as the drain of the n-channel metal-oxide-semiconductor field effect transistor; and the second-switch control input 139 is shown as the gate of the n-channel metal-oxide-semiconductor field effect transistor.
Also in
Further in
The driver circuit 120 has driver input 121 and first and second driver outputs 122,123.
The output of the first voltage source 115 which is at first drive voltage V1 is connected to the first-switch input 126; the first driver output 122 is connected to the first-switch control input 129; the first-switch output 127 is connected to the first-filter input 131; the second-switch input 136 is connected to the reference potential V2 which in the representative embodiment of
The electronic interface circuit 100 further comprises the detection circuit 150, wherein the detection circuit 150 comprises the differential receiver 155, and the detection voltage reference 165. The differential receiver 155 has the first receiver input 156, the second receiver input 157, and the receiver output 158. The first receiver input 156 is connected to first-filter output 132 and to the second-filter output 142, and the second receiver input 157 is connected to output of the detection voltage reference 165 which is at comparison voltage V3. The detection voltage reference 165 could be a digital to analogue converter (DAC) with its input set appropriately or the like. The receiver output 158 can be connected to the test system 10 electronics for the collection, comparison, and/or analysis of the test stimulus signal 102 at the stimulus-circuit output 112 or a response signal 103 received from the device under test 40 due to the test stimulus signal 102 received by the device under test 40 at another test pin 31 on the test head 30. In response to the response signal 103, the differential receiver 155 outputs a response output signal 104 at the receiver output 158.
In operation, a test signal indicated in
If the first field effect transistor 125 is turned on and the second field effect transistor 135 is turned off, the output of the first voltage source 115 is electrically connected to the first-switch output 127 which results in the potential of the output of the first voltage source 115 less any voltage drop across the first field effect transistor 125 appearing at the first-switch output 127. Again, the potential of the output of the first voltage source 115 is identified in
If the second field effect transistor 135 is turned on and the first field effect transistor 125 is turned off, the reference potential V2 (less any voltage drop across the second field effect transistor 135) is connected to the second-switch output 137 (the drain of the MOSFET). The reference potential V2 is at ground potential V2 in the representative embodiment of
If neither first field effect transistor 125 nor second field effect transistor 135 is turned on, the stimulus-circuit output 112 is in a high-impedance state (tri-state). In this condition the stimulus circuit 110 presents a minimal load to the device under test 40.
As shown in the representative embodiment of
The output of first voltage source 115 which is at first drive voltage V1 is connected to the first-switch input 126; the first driver output 122 is connected to the first-switch control input 129; the first-switch output 127 is connected to the first-filter input 131; the output of second voltage source 160 which is at second drive voltage V2 is connected to the second-switch input 136; the second driver output 123 is connected to the second-switch control input 139; the second-switch output 137 is connected to the second-filter input 141; and the first-filter output 132 is connected to the second-filter output 142.
The electronic interface circuit 100 further comprises the detection circuit 150, wherein the detection circuit 150 comprises a differential receiver 155 and a detection voltage reference 165. The differential receiver 155 has a first receiver input 156, a second receiver input 157, and a receiver output 158. The first receiver input 156 is connected to first-filter output 132 and to the second-filter output 142, and the second receiver input 157 is connected to output of the detection voltage reference 165 which is at comparison voltage V3. The receiver output 158 can be connected to the test system 10 electronics for the collection, comparison, and/or analysis of the test stimulus signal 102 at the stimulus-circuit output 112 or a response signal 103 received from the device under test 40 due to the test stimulus signal 102 received by the device under test 40 at another test pin 31 on the test head 30. In response to the response signal 103, the differential receiver 155 outputs a response output signal 104 at the receiver output 158.
In operation, a test signal indicated in
If the first switch 125 is turned on and the second switch 135 is turned off, the output of the first voltage source 115 is electrically connected to the first-switch output 127 which results in the potential of the output of the first voltage source 115 less any voltage drop across the first switch 125 appearing at the first-switch output 127. Again, the potential of the output of the first voltage source 115 is identified in
If the second switch 135 is turned on and the first switch 125 is turned off, a second drive voltage V2 less any voltage drop across the second switch 135 is connected to the second-switch output 137. The second filter 140 filters the high-frequency components of the voltage waveform appearing at the second-switch output 137 to reduce/remove any ringing that might be present due to the switching on and off of the second switch 135. This filtered signal appears at the second-filter output 142 as test stimulus signal 102. The test stimulus signal 102 is then available for application to the device under test 40 via one of the test pins 31.
If neither first switch 125 nor second switch 135 is turned on, the stimulus-circuit output 112 is in a high-impedance state (tri-state). In this condition, the stimulus circuit 110 presents a minimal load to the device under test 40.
As shown in the representative embodiment of
In
The second-switch input 136 is shown as the source of the second field effect transistor 135, wherein the second field effect transistor 135 is depicted as an n-channel metal-oxide-semiconductor field effect transistor; the second-switch input 136 is shown as the source of the n-channel metal-oxide-semiconductor field effect transistor; the second-switch output 137 is shown as the drain of the n-channel metal-oxide-semiconductor field effect transistor; and the second-switch control input 139 is shown as the gate of the n-channel metal-oxide-semiconductor field effect transistor.
Also in
Further in
The driver circuit 120 has driver input 121 and first and second driver outputs 122,123.
The second voltage source 160 comprises a second electrical power source 480, also referred to herein as a second power source 480, a second voltage reference 482, a second voltage regulator 485, and a second feedback resistor 483. The second voltage reference 482 could be a digital to analogue converter (DAC) with its input set appropriately or the like. The second voltage regulator 485 has a second-voltage regulator input 486, a second-voltage regulator output 487, and second-voltage regulator control input 489. In the representative embodiment of
The output of the first voltage source 115 which is at first drive voltage V1 is connected to the first-switch input 126; the first driver output 122 is connected to the first-switch control input 129; the first-switch output 127 is connected to the first-filter input 131; the output of second voltage source 160 which is at second drive voltage V2 is connected to the second-switch input 136; the second driver output 123 is connected to the second-switch control input 139; the second-switch output 137 is connected to the second-filter input 141; and the first-filter output 132 is connected to the second-filter output 142.
The electronic interface circuit 100 further comprises the detection circuit 150, wherein the detection circuit 150 comprises the differential receiver 155, and the detection voltage reference 165. The differential receiver 155 has the first receiver input 156, the second receiver input 157, and the receiver output 158. The first receiver input 156 is connected to first-filter output 132 and to the second-filter output 142, and the second receiver input 157 is connected to output of the detection voltage reference 165 which is at comparison voltage V3. The detection voltage reference 165 could be a digital to analogue converter (DAC) with its input set appropriately or the like. The receiver output 158 can be connected to the test system 10 electronics for the collection, comparison, and/or analysis of the test stimulus signal 102 at the stimulus-circuit output 112 or a response signal 103 received from the device under test 40 due to the test stimulus signal 102 received by the device under test 40 at another test pin 31 on the test head 30. In response to the response signal 103, the differential receiver 155 outputs a response output signal 104 at the receiver output 158.
In operation, a test signal indicated in
If the first field effect transistor 125 is turned on and the second field effect transistor 135 is turned off, the output of the first voltage source 115 is electrically connected to the first-switch output 127 (the source of the MOSFET) which results in the potential of the output of the first voltage source 115 less any voltage drop across the first field effect transistor 125 appearing at the first-switch output 127. Again, the potential of the output of the first voltage source 115 is identified in
If the second field effect transistor 135 is turned on and the first field effect transistor 125 is turned off, a second drive voltage V2 less any voltage drop across the second field effect transistor 135 is connected to the second-switch output 137 (the drain of the MOSFET). The second filter 140 filters the high-frequency components of the voltage waveform appearing at the second-switch output 137 to reduce/remove any ringing that might be present due to the switching on and off of the second switch 135. This filtered signal appears at the second-filter output 142 as test stimulus signal 102. The test stimulus signal 102 is then available for application to the device under test 40 via one of the test pins 31.
One of the dangers in testing any device under test 40, as for example a printed circuit board or other device, is the possibility of a short circuit, for example a short to ground or a short to the power supply voltage. If, for example in
Similar comments can be made for the second voltage source 160 in
The second field effect transistor 135 of
Embodiments described herein are small enough that a sufficient number of them can be placed on a test head such that the tests to be performed on typical devices under test (loaded printed circuit boards) can be tested using a non-multiplexed test which is easier to understand and easier to program than is a multiplexed test. A non-multiplexed system reduces the time and training required for a programmer to become proficient in programming such a test system. Also, because multiplexed test systems are subject to resource conflicts, test programs must be written prior to the initiation of test fixture construction. Executing these two activities sequentially increases the time-to-test and thereby the time-to-volume production. With a non-multiplexed system, only the computer aided design (CAD) data for the device to be tested is necessary prior to fixture construction. As such, test programming and fixture construction can proceed in parallel. In addition, the embodiments disclosed herein provide increased drive capabilities over other non-multiplexed systems. Drive capabilities for non-multiplexed test systems have been increased over the capabilities previously available.
Further, embodiments described herein are capable of using low cost commodity components rather than custom or special purpose components. This capability means that the test system manufacturer can avoid the time and expense of developing custom integrated circuits for use on the test head of a test system. Using commodity integrated circuits reduces component lead times and inventory expenses. This results in an overall lowering of the total cost of the system and avoids non-recurring costs.
In a representative implementation, the output of the driver stage (the stimulus circuit 110) consists of low-cost power MOSFETs driven by a standard MOSFET drive chip. These parts are normally used in high-volume switching power supplies resulting in a high degree of toughness at low cost. Ferrite beads are used to round the corner of the resulting output signal. This wave shaping results in output signals that are well matched to the requirements of board test systems. The receiver is a low cost RS-485 chip. Again, a tough component is obtainable at a low cost. High speed comparators used in previous designs are not as tolerant of electrostatic discharge (ESD) and high voltages. Comparators place more emphasis on accuracy than is necessary for board tests. The drive level is set by changing the supply voltage for the upper output MOSFET. This voltage could be set, for example, by an 8-bit digital to analogue converter (DAC) driving a linear voltage regulator. This arrangement also provides current limiting. By using several different parts rather than a single custom integrated circuit. Parts constructed on different semiconductor technologies can be used which can result in higher performance.
Representative embodiments disclosed provide the capability of testing different logic families using the same components. If a particular logic family uses 3.3 volts, then the test system needs to drive the device under test to 3.3 volts, if on the other hand the logic family uses 2.5 volts then the test system needs to drive the device under test to 2.5 volts. The digital to analogue converters (DACs) in the first and second voltage sources 115,160 may be used as appropriate to set the “drive high/low drive” voltages. The use of the voltage regulator provides an inexpensive buffer that is thermally protected and works well for the present purposes.
The representative embodiments, which have been described in detail herein, have been presented by way of example and not by way of limitation. It will be understood by those skilled in the art that various changes may be made in the form and details of the described embodiments resulting in equivalent embodiments that remain within the scope of the appended claims.