characterised by the electroplating method; means therefor

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H05K3/241

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K3/00Apparatus or processes for manufacturing printed circuits

Current Industry

H05K3/241characterised by the electroplating method; means therefor

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Methods and systems of forming metal interconnect layers using engi...
- Patent number 12,165,881
- Issue date Dec 10, 2024
- Rashid Mavliev
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Circuit board with heat dissipation function
- Patent number 12,052,827
- Issue date Jul 30, 2024
- Hong Heng Sheng Electronical Technology (HuaiAn)Co., Ltd.
- Pan Tang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing wiring board, and wiring board
- Patent number 12,028,989
- Issue date Jul 2, 2024
- Toyota Jidosha Kabushiki Kaisha
- Kazuaki Okamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer substrate and a manufacturing method of the multilayer s...
- Patent number 11,923,123
- Issue date Mar 5, 2024
- Murata Manufacturing Co., Ltd.
- Kazutaka Muraoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pattern forming method
- Patent number 11,800,648
- Issue date Oct 24, 2023
- Konica Minolta, Inc.
- Masayuki Ushiku
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Planar coil element and method for producing planar coil element
- Patent number 11,785,724
- Issue date Oct 10, 2023
- SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.
- Hiroshi Ueda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and systems of forming metal interconnect layers using engi...
- Patent number 11,756,800
- Issue date Sep 12, 2023
- Rashid Mavliev
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Reaction products of amine monomers and polymers containing saturat...
- Patent number 11,732,374
- Issue date Aug 22, 2023
- Rohm and Haas Electronic Materials LLC
- Lingli Duan
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Flexible printed circuit board and method of manufacturing flexible...
- Patent number 11,696,401
- Issue date Jul 4, 2023
- Sumitomo Electric Industries, Ltd.
- Koji Nitta
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board
- Patent number 11,678,439
- Issue date Jun 13, 2023
- Macronix International Co., Ltd.
- Pei-Chi Hu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing a circuit board with embedded nickel resistor
- Patent number 11,665,831
- Issue date May 30, 2023
- HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
- Jian Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible printed circuit board and method of manufacturing flexible...
- Patent number 11,659,662
- Issue date May 23, 2023
- Sumitomo Electric Industries, Ltd.
- Koji Nitta
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board and manufacturing method thereof
- Patent number 11,653,454
- Issue date May 16, 2023
- Sumitomo Electric Printed Circuits, Inc.
- Kohei Okamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board with heat dissipation function and method for manufac...
- Patent number 11,582,871
- Issue date Feb 14, 2023
- Hong Heng Sheng Electronical Technology (HuaiAn) Co., Ltd
- Pan Tang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrochemical three-dimensional printing and soldering
- Patent number 11,535,947
- Issue date Dec 27, 2022
- University of South Florida
- Arash Takshi
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Method for manufacturing wiring substrate
- Patent number 11,523,515
- Issue date Dec 6, 2022
- Ibiden Co., Ltd.
- Shinichiro Ichikawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing wiring board, and wiring board
- Patent number 11,490,528
- Issue date Nov 1, 2022
- Toyota Jidosha Kabushiki Kaisha
- Kazuaki Okamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method of copper foil and circuit board assembly for...
- Patent number 11,466,379
- Issue date Oct 11, 2022
- Nan Ya Plastics Corporation
- Shih-Ching Lin
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Mask structure and manufacturing method thereof
- Patent number 11,366,381
- Issue date Jun 21, 2022
- Unimicron Technology Corp.
- Pu-Ju Lin
- G01 - MEASURING TESTING
Information Patent Grant
Method of fabricating circuit board
- Patent number 11,304,310
- Issue date Apr 12, 2022
- Macronix International Co., Ltd.
- Pei-Chi Hu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrochemical three-dimensional printing and soldering
- Patent number 11,214,884
- Issue date Jan 4, 2022
- University of South Florida
- Arash Takshi
- B33 - ADDITIVE MANUFACTURING TECHNOLOGY
Information Patent Grant
Plating hanger device having shock-absorbing structure
- Patent number 11,219,131
- Issue date Jan 4, 2022
- NEOPMC CO., LTD.
- Min-Su Bae
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Printed wiring board and manufacturing method thereof
- Patent number 11,140,784
- Issue date Oct 5, 2021
- Sumitomo Electric Printed Circuits, Inc.
- Kohei Okamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Producing method of wired circuit board
- Patent number 11,091,850
- Issue date Aug 17, 2021
- Nitto Denko Corporation
- Yuu Sugimoto
- G11 - INFORMATION STORAGE
Information Patent Grant
Micro power distribution boxes and methods of manufacturing same us...
- Patent number 11,083,088
- Issue date Aug 3, 2021
- Molex, LLC
- Victor Zaderej
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Planar coil element and method for producing planar coil element
- Patent number 11,083,092
- Issue date Aug 3, 2021
- SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.
- Hiroshi Ueda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coil pattern, method for forming same, and chip device including same
- Patent number 11,069,472
- Issue date Jul 20, 2021
- MODA-INNOCHIPS CO., LTD.
- In Kil Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for fabricating electrode structure
- Patent number 10,927,470
- Issue date Feb 23, 2021
- Electronics and Telecommunications Research Institute
- Woo-Seok Cheong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wired circuit board and production method thereof
- Patent number 10,808,329
- Issue date Oct 20, 2020
- Nitto Denko Corporation
- Yuu Sugimoto
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method and apparatus for electrolytically depositing a deposition m...
- Patent number 10,774,437
- Issue date Sep 15, 2020
- Atotech Deutschland GmbH
- Dominik Britz
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF ELECTROPLATING STRESS-FREE COPPER FILM
- Publication number 20240328023
- Publication date Oct 3, 2024
- Suzhou Shinhao Materials LLC
- Yun ZHANG
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATING APPARATUS
- Publication number 20240314936
- Publication date Sep 19, 2024
- EBARA CORPORATION
- Tsubasa ISHII
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD FOR MAKING THE SAME
- Publication number 20240284592
- Publication date Aug 22, 2024
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- CHENG-YU CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD STRUCTURE WITH EMBEDDED CERAMIC SUBSTRATE AND MANUFAC...
- Publication number 20240276636
- Publication date Aug 15, 2024
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- Yu-Hsien LIAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE AND METHOD FOR MANUFACTURING WIRING SUBSTRATE
- Publication number 20240049398
- Publication date Feb 8, 2024
- IBIDEN CO., LTD.
- Toshiki FURUTANI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD TO WHICH 3D FORMED ELECTROMAGNETIC SHIELDING FILM IS...
- Publication number 20240040760
- Publication date Feb 1, 2024
- 3M Innovative Properties Company
- Chao Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS AND SYSTEMS OF FORMING METAL INTERCONNECT LAYERS USING ENGI...
- Publication number 20230369065
- Publication date Nov 16, 2023
- Rashid Mavliev
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20230335479
- Publication date Oct 19, 2023
- Samsung Electro-Mechanics Co., Ltd.
- Chan Hoon KO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD AND CIRCUIT BOARD MODULE WITH DOCKING STRUCTURE AND M...
- Publication number 20230328900
- Publication date Oct 12, 2023
- Unimicron Technology Corp.
- Shih-Lian Cheng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING FLEXIBLE...
- Publication number 20230247763
- Publication date Aug 3, 2023
- Sumitomo Electric Industries, Ltd.
- Koji NITTA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD WITH HEAT DISSIPATION FUNCTION
- Publication number 20230139231
- Publication date May 4, 2023
- Hong Heng Sheng Electronical Technology (HuaiAn)Co.,Ltd.
- PAN TANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTROCHEMICAL THREE-DIMENSIONAL PRINTING AND SOLDERING
- Publication number 20230129434
- Publication date Apr 27, 2023
- University of South Florida
- Arash Takshi
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
CIRCUIT BOARD WITH HEAT DISSIPATION FUNCTION AND METHOD FOR MANUFAC...
- Publication number 20230007780
- Publication date Jan 5, 2023
- Hong Heng Sheng Electronical Technology (HuaiAn)Co.,Ltd.
- PAN TANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING CONDUCTIVE PATTERN, TOUCH SENSOR, ELECTROMA...
- Publication number 20230007784
- Publication date Jan 5, 2023
- FUJIFILM CORPORATION
- Shinichi KANNA
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ELECTRICAL CONNECTORS
- Publication number 20220396077
- Publication date Dec 15, 2022
- Hewlett-Packard Development Company, L.P.
- Paul David Schweitzer
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
METHOD FOR MANUFACTURING WIRING BOARD, AND WIRING BOARD
- Publication number 20220304162
- Publication date Sep 22, 2022
- Toyota Jidosha Kabushiki Kaisha
- Kazuaki OKAMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20220181245
- Publication date Jun 9, 2022
- Samsung Electro-Mechanics Co., Ltd.
- Chan Hoon KO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD
- Publication number 20220183162
- Publication date Jun 9, 2022
- Macronix International Co., Ltd.
- Pei-Chi HU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF FABRICATING CIRCUIT BOARD
- Publication number 20220117093
- Publication date Apr 14, 2022
- Macronix International Co., Ltd.
- Pei-Chi HU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD WITH EMBEDDED ELECTRONIC COMPONENT AND METHOD FOR MAN...
- Publication number 20220071020
- Publication date Mar 3, 2022
- HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd.
- JIAN WANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF ELECTROPLATING STRESS-FREE COPPER FILM
- Publication number 20220064813
- Publication date Mar 3, 2022
- Suzhou Shinhao Materials LLC
- Yun ZHANG
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PRINTED WIRING BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20210392754
- Publication date Dec 16, 2021
- SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.
- Kohei OKAMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PLANAR COIL ELEMENT AND METHOD FOR PRODUCING PLANAR COIL ELEMENT
- Publication number 20210329795
- Publication date Oct 21, 2021
- SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.
- Hiroshi UEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF CIRCUIT BOARD ASSEMBLY FOR HIGH FREQUENCY S...
- Publication number 20210259113
- Publication date Aug 19, 2021
- Nan Ya Plastics Corporation
- SHIH-CHING LIN
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD FOR MANUFACTURING WIRING SUBSTRATE
- Publication number 20210235584
- Publication date Jul 29, 2021
- IBIDEN CO., LTD.
- Shinichiro ICHIKAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING FLEXIBLE...
- Publication number 20210219424
- Publication date Jul 15, 2021
- Sumitomo Electric Industries, Ltd.
- Koji NITTA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PATTERN FORMING METHOD
- Publication number 20210084769
- Publication date Mar 18, 2021
- Konica Minolta, Inc.
- Masayuki USHIKU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING WIRING BOARD, AND WIRING BOARD
- Publication number 20210084774
- Publication date Mar 18, 2021
- Toyota Jidosha Kabushiki Kaisha
- Kazuaki OKAMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGH ASPECT RATIO ELECTROPLATED STRUCTURES AND ANISOTROPIC ELECTROP...
- Publication number 20200232112
- Publication date Jul 23, 2020
- Hutchinson Technology Incorporated
- Douglas P. Riemer
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
MICRO POWER DISTRIBUTION BOXES AND METHODS OF MANUFACTURING SAME US...
- Publication number 20200196451
- Publication date Jun 18, 2020
- Molex, LLC
- Victor ZADEREJ
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

characterised by the electroplating method; means therefor

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Methods and systems of forming metal interconnect layers using engi...

Circuit board with heat dissipation function

Method for manufacturing wiring board, and wiring board

Multilayer substrate and a manufacturing method of the multilayer s...

Pattern forming method

Planar coil element and method for producing planar coil element

Methods and systems of forming metal interconnect layers using engi...

Reaction products of amine monomers and polymers containing saturat...

Flexible printed circuit board and method of manufacturing flexible...

Circuit board

Method for manufacturing a circuit board with embedded nickel resistor

Flexible printed circuit board and method of manufacturing flexible...

Printed wiring board and manufacturing method thereof

Circuit board with heat dissipation function and method for manufac...

Electrochemical three-dimensional printing and soldering

Method for manufacturing wiring substrate

Method for manufacturing wiring board, and wiring board

Manufacturing method of copper foil and circuit board assembly for...

Mask structure and manufacturing method thereof

Method of fabricating circuit board

Electrochemical three-dimensional printing and soldering

Plating hanger device having shock-absorbing structure

Printed wiring board and manufacturing method thereof

Producing method of wired circuit board

Micro power distribution boxes and methods of manufacturing same us...

Planar coil element and method for producing planar coil element

Coil pattern, method for forming same, and chip device including same

Apparatus for fabricating electrode structure

Wired circuit board and production method thereof

Method and apparatus for electrolytically depositing a deposition m...

Patents Applicationslast 30 patents

METHOD OF ELECTROPLATING STRESS-FREE COPPER FILM

PLATING APPARATUS

PRINTED CIRCUIT BOARD AND METHOD FOR MAKING THE SAME

CIRCUIT BOARD STRUCTURE WITH EMBEDDED CERAMIC SUBSTRATE AND MANUFAC...

WIRING SUBSTRATE AND METHOD FOR MANUFACTURING WIRING SUBSTRATE

CIRCUIT BOARD TO WHICH 3D FORMED ELECTROMAGNETIC SHIELDING FILM IS...

METHODS AND SYSTEMS OF FORMING METAL INTERCONNECT LAYERS USING ENGI...

PRINTED CIRCUIT BOARD

CIRCUIT BOARD AND CIRCUIT BOARD MODULE WITH DOCKING STRUCTURE AND M...

FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING FLEXIBLE...

CIRCUIT BOARD WITH HEAT DISSIPATION FUNCTION

ELECTROCHEMICAL THREE-DIMENSIONAL PRINTING AND SOLDERING

CIRCUIT BOARD WITH HEAT DISSIPATION FUNCTION AND METHOD FOR MANUFAC...

METHOD OF MANUFACTURING CONDUCTIVE PATTERN, TOUCH SENSOR, ELECTROMA...

ELECTRICAL CONNECTORS

METHOD FOR MANUFACTURING WIRING BOARD, AND WIRING BOARD

PRINTED CIRCUIT BOARD

CIRCUIT BOARD

METHOD OF FABRICATING CIRCUIT BOARD

CIRCUIT BOARD WITH EMBEDDED ELECTRONIC COMPONENT AND METHOD FOR MAN...

METHOD OF ELECTROPLATING STRESS-FREE COPPER FILM

PRINTED WIRING BOARD AND MANUFACTURING METHOD THEREOF

PLANAR COIL ELEMENT AND METHOD FOR PRODUCING PLANAR COIL ELEMENT

MANUFACTURING METHOD OF CIRCUIT BOARD ASSEMBLY FOR HIGH FREQUENCY S...

METHOD FOR MANUFACTURING WIRING SUBSTRATE

FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING FLEXIBLE...

PATTERN FORMING METHOD

METHOD FOR MANUFACTURING WIRING BOARD, AND WIRING BOARD

HIGH ASPECT RATIO ELECTROPLATED STRUCTURES AND ANISOTROPIC ELECTROP...

MICRO POWER DISTRIBUTION BOXES AND METHODS OF MANUFACTURING SAME US...