Patent Application
20240206058
Priority is claimed on Japanese Patent Application No. 2022-201141, filed on Dec. 16, 2022, the contents of which are incorporated herein by reference.
The present invention relates to a lamination flexible circuit device, a flexible capacitance sensor, a flexible actuator, and a flexible battery.
In apparatuses that interact with people, wearable devices, and robots, flexibility on the surfaces thereof is required from the viewpoint of comfort and safety. In devices and robots having a movable portion, it is preferable that the surface skin have stretch properties.
On the other hand, in these devices and robots, from the viewpoint of realizing multi-functionalization and downsizing of the system, it is important to realize a functional surface skin that can incorporate an electrical circuit without separating the flexible surface skin and the electrical circuit. For example, it is required to realize a functional surface skin that can incorporate a flexible wiring for electric power supply and/or a flexible wiring for communication, a flexible sensor electrode, a flexible electrode for an actuator, a flexible electrode for a battery, and the like.
In the related art, most flexible circuits (FSC; Flexible Stretchable Circuit) in which electrodes and wiring are flexible have a structure made of only a single layer.
In multilayer circuits, with respect to junctions between layers, via holes used for a multilayer FPC (Flexible Printed Circuit) are known.
Further, as an example of a flexible circuit, in a flexible capacitance sensor used as a touch sensor or the like, the position between electrodes spaced from each other and facing each other is changed, and thereby, predetermined sensing is enabled.
Here, the detection characteristic in a sensor is greatly affected by the change amount of a relative position such as a distance between laminated electrodes. Therefore, a structure is required which maintains the electrodes in a predetermined relative positional relationship and supports the electrodes to be promptly displaceable in response to a sensing amount.
Flexible sensors may have a structure in which a plurality of sensors are aligned on the same surface.
When downsizing is attempted while maintaining the detection characteristic in a sensor, it is conceivable that a plurality of sensors be laminated. Alternatively, in order to connect electrodes, wiring, or the like, it is known to use a via hole and connect the layers.
The Applicants have already filed an application regarding a capacitance sensor in Japanese Unexamined Patent Application, First Publication No. 2022-105964.
In flexible circuits (FSCs) in which electrodes and wiring are flexible, in a single layer structure, the area of wiring is increased when the circuit scale is increased, and it is difficult to realize downsizing. Therefore, it is conceivable that a multilayer structure be used for the flexible circuit. However, in the flexible circuit, a practical method for obtaining the multilayer structure that can prevent disconnection between layers at the time of application of a shear load has not been realized as yet.
As an example of connection between layers when obtaining the multilayer structure of the flexible circuit, a structure is known in which pressure bonding is performed by inserting a metal body such as a rivet or a snap button between layers. However, in such a structure, since the via hole or the like is a hard material while other portions in the flexible circuit have flexibility, there is a problem in that it is difficult to maintain flexibility of the entire flexible circuit, and there is a problem in that disconnection may occur or the like when a strong shear force is applied.
Further, in rigid FPCs that can use a via hole, bending deformation is possible, but such rigid FPCs do not have stretch properties. The FPC is required to have further flexibility as a flexible circuit since disconnection occurs when strong stress (a bending force or a shear force) is applied to the via portion.
Further, when obtaining the multilayer structure of the flexible circuit, it is difficult to downsize a structure using the conventionally used rigid FPC, a structure in which bonding using a solder is performed, or the like.
For example, in a flexible sensor as an example of a flexible circuit, in the case of a structure in which a plurality of sensors are aligned in the same layer, there is a problem in that when the number of electrodes is increased, the area required for the wiring connected to an individual electrode is increased. When the spacing of the wiring is decreased in order to downsize the sensor, since the S/N ratio is deteriorated, it is difficult to downsize the structure in which the plurality of sensors are aligned in the same layer.
Even in the case of the structure in which a plurality of sensors are laminated, the wiring is formed for each layer, and it is difficult to downsize the sensor. At the same time, when the spacing of the wiring is decreased, wiring crosstalk between the layers may occur, and there is a problem in that the wiring region increases in order to prevent wiring crosstalk.
Further, in the flexible sensor, when connecting the layers using the via hole, since the via hole is made of a hard material while other portions have flexibility, there is a problem in that disconnection may occur or the like when a strong shear force is applied at the time of detection or the like in the sensor.
An aspect of the present invention aims at providing a lamination flexible circuit device, a flexible capacitance sensor, a flexible actuator, and a flexible battery that can sufficiently prevent the occurrence of disconnection in a lamination flexible circuit, have a degree of freedom of wiring to the same extent as rigid FPCs which can use via holes, and enable downsizing and noise reduction.
A first aspect of the present invention is a lamination flexible circuit device formed of a plurality of laminated layers, the lamination flexible circuit device including: a first conductive portion: a second conductive portion arranged to face the first conductive portion: a first conductive wiring in a layer identical to the first conductive portion: a second conductive wiring in a layer identical to the second conductive portion; and a flexible base material having a dielectric property and elasticity and arranged between the first conductive portion and the second conductive portion, wherein a third conductive wiring connecting the first conductive portion or the first conductive wiring to the second conductive portion or the second conductive wiring between layers is arranged on the flexible base material.
A second aspect is the lamination flexible circuit device according to the first aspect described above which may include: a first layer including the first conductive portion and the first conductive wiring: and a second layer including the second conductive portion and the second conductive wiring, wherein at least one of the first layer and the second layer may be formed of a material identical to the flexible base material.
A third aspect is the lamination flexible circuit device according to the second aspect described above, wherein the flexible base material may be formed of a plurality of pillars extending in a lamination direction between the first layer and the second layer and arranged to be spaced from each other in a direction intersecting the lamination direction.
A fourth aspect is the lamination flexible circuit device according to the third aspect described above, wherein the third conductive wiring may penetrate through an inside of a pillar among the plurality of pillars in the lamination direction, and the third conductive wiring may be exposed to a surface of the pillar or may not be exposed to the surface of the pillar.
A fifth aspect is the lamination flexible circuit device according to the third aspect described above, wherein the third conductive wiring may extend in the lamination direction within a pillar among the plurality of pillars between the first layer and the second layer, and the third conductive wiring may be exposed to a surface of the pillar or may not be exposed to the surface of the pillar.
A sixth aspect is the lamination flexible circuit device according to the first aspect described above which may include a plurality of third conductive wirings each of which is the third conductive wiring and which are arranged to be spaced from each other in a direction intersecting a lamination direction, and the third conductive wiring that is connected to the first conductive portion or the second conductive portion may be arranged to be surrounded by the third conductive wiring that is not connected to the first conductive portion or the second conductive portion.
A seventh aspect is the lamination flexible circuit device according to the second aspect described above which may include a fourth conductive wiring that penetrates through at least one of the first layer and the second layer in a lamination direction.
An eighth aspect is the lamination flexible circuit device according to the second aspect described above, wherein a circuit board overlapping the first layer or the second layer in a lamination direction may be connected in the lamination direction to at least one of the first layer and the second layer.
A ninth aspect of the present invention is a capacitance sensor including the lamination flexible circuit device according to any one of the first to eighth aspects described above, wherein the first conductive portion has a section overlapping the second conductive portion when seen in a lamination direction, and a capacitance between the first conductive portion and the second conductive portion is detected.
A tenth aspect of the present invention is a flexible actuator including the lamination flexible circuit device according to any one of the first to eighth aspects described above, wherein the first conductive portion or the first conductive wiring has a section overlapping the second conductive portion or the second conductive wiring when seen in a lamination direction.
An eleventh aspect of the present invention is a flexible battery including the lamination flexible circuit device according to any one of the first to eighth aspects described above, wherein the first conductive portion has a section overlapping the second conductive portion when seen in a lamination direction, the first conductive portion is an anode, the second conductive portion is a cathode, and a separator layer is provided between the first conductive portion and the second conductive portion.
According to the first aspect described above, by connecting the laminated first electrode (first conductive portion) or the first conductive wiring to the second electrode (second conductive portion) or the second conductive wiring between layers by way of the third conductive wiring and by arranging the third conductive wiring on the flexible base material, it becomes possible to arrange the wiring through different layers. Further, it is possible to realize the same degree of flexibility in all of the first electrode (first conductive portion), the first conductive wiring, the second electrode (second conductive portion), the second conductive wiring, and the third conductive wiring, and deformation of all of these components with respect to a load applied to the lamination flexible circuit device can be of the same degree. Thereby, in the first electrode (first conductive portion), the first conductive wiring, the second electrode (second conductive portion), the second conductive wiring, and the third conductive wiring, resistance characteristics to a shear force generated by the external load applied to the lamination flexible circuit device or to disconnection due to deformation can be improved.
Further, it becomes possible to increase the distance between the wirings compared to the case where the wirings are arranged in the same layer, reduce the effect of noise, and prevent the decrease of the S/N ratio. At the same time, since the wiring can be arranged through different layers, the degree of freedom of layout between the wirings can be improved by removing a wiring to a different level or the like, and the lamination flexible circuit device can be downsized. Further, since a hard material such as the via hole is not used, resistance characteristics to a shear force generated by an applied external load or to disconnection due to deformation can be improved.
According to the second aspect described above, the flexible base material is made of the same material as any one of the first layer and the second layer, and thereby, uniform flexibility can be achieved at the interface or the boundary of the layer. Thereby, the degree of deformation corresponding to stress can be uniform without changing the flexibility at the interface or the boundary of the layer, and it is possible to prevent the occurrence of a non-uniform state with respect to variation in a relative position between the electrodes (conductive portions). Thereby, for example, when the lamination flexible circuit device is a flexible capacitance sensor, the capacitance change due to the relative displacement between the electrodes (conductive portions) can be set to a predetermined state, and deterioration of the sensor characteristic can be prevented.
At the same time, resistance characteristics to a shear force generated by the external load applied to the lamination flexible circuit device or to disconnection due to deformation can be improved.
According to the third aspect described above, by forming the pillar between the first layer and the second layer having electrodes (conductive portions), respectively, and connecting the first layer to the second layer, the position displacement between the electrodes (conductive portions) can be made large by the pillar even when the same external force is applied. Accordingly, for example, in the case of the flexible capacitance sensor, it is possible to prevent deterioration of the detection accuracy as a sensor. At the same time, the detection accuracy as a sensor can be improved. Further, by forming the third conductive wiring in the pillar, the resistance characteristic to disconnection caused by flexibility at the connection position of each layer being different can be improved. By forming the third conductive wiring in the pillar, it is possible to reduce the size and improve the detection accuracy as a sensor.
Further, by setting the arrangement of the pillar to a predetermined position in a direction along a facing surface of the electrodes (conductive portions), it is possible to easily enlarge the range of choice of the connection position between layers by the third conductive wiring in consideration of the arrangement of the pillar. Thereby, the degree of freedom of layout between the wirings can be improved, and the lamination flexible circuit device can be downsized. At the same time, it becomes possible to reduce the effect of noise and prevent the decrease of the S/N ratio.
According to the fourth aspect described above, since the third conductive wiring can follow the deformation of the pillar, resistance characteristics to a shear force generated by the external load applied to the lamination flexible circuit device or to disconnection due to deformation can be improved. At the same time, the width of the third conductive wiring can be increased in accordance with the peripheral size of the pillar, and resistance characteristics to disconnection due to deformation can be improved.
Further, by forming a conductive portion which becomes a GND shield around the pillar and electrically surrounding the third conductive wiring, the third conductive wiring can be a coaxial cable in the pillar, and low crosstalk can be achieved.
Further, by forming the third conductive wiring on the entire circumference of the pillar and connecting the third conductive wiring to a wiring that becomes a GND potential, the GND shield can be obtained. In particular, by arranging a wiring connected to an electrode along the lamination direction at the middle of the pillar, the third conductive wiring around the pillar can be electrically surrounded as a GND shield. Thereby, the conductive wiring can be a coaxial cable in the pillar, and low crosstalk can be achieved.
According to the fifth aspect described above, since the third conductive wiring can follow the deformation of the pillar, resistance characteristics to a shear force generated by the external load applied to the lamination flexible circuit device or to disconnection due to deformation can be improved. At the same time, the width of the third conductive wiring can be increased in accordance with the peripheral size of the pillar, and resistance characteristics to disconnection due to deformation can be improved.
Thereby, the conductive wiring can be a coaxial cable in the pillar, and low crosstalk can be achieved.
According to the sixth aspect described above, by surrounding the third conductive wiring connected to the electrode (conductive portion), that is, a signal line arranged in the lamination direction and connecting between the layers, with a conductive portion that is not connected to the signal line, shield effects for the surrounded signal line from a portion which is further spaced can be exerted, and it is possible to reduce the occurrence of crosstalk. Further, by surrounding the entire length in the circumferential direction with respect to the signal line, low crosstalk at an interlayer wiring layout location can be achieved by the wiring in the pillar becoming the coaxial cable.
Here, the surrounding arrangement does not need to surround the entire circumference physically continuously, may be located at a position at which the electric shield can be achieved, and physically includes an intermittently surrounding state in the circumferential direction. Further, the arrangement is similar in the lamination direction and may use physical separation, but continuity in which the electric shield can be achieved is required.
According to the seventh aspect described above, the conductive wirings connected to the electrode (conductive portion) or the conductive wiring includes the fourth conductive wiring that not only connects between layers but also penetrates through the first layer or the second layer in the lamination direction and connects between front and rear surfaces of the first layer or the second layer, and thereby, it is possible to further improve the degree of freedom of the wiring layout. The fourth conductive wiring and the third conductive wiring can be continuous with each other or can be connected via another wiring or an electrode.
According to the eighth aspect described above, by arranging the circuit board at a position overlapping each layer when seen in the lamination direction, the degree of freedom of the wiring layout can be enhanced compared to the case where the circuit board is arranged in the same layer. At the same time, the size of the contour can be decreased, and the lamination flexible circuit device can be downsized. Further, since it is possible to reduce the distance between the circuit board and the connected layer and decrease the length of the wiring, it becomes possible to prevent the occurrence of crosstalk.
According to the ninth aspect described above, it becomes possible to provide a flexible capacitance sensor that is capable of connecting the electrode or the wiring between layers, enables downsizing while improving the degree of freedom of the wiring layout, is capable of preventing the decrease of the S/N ratio, is capable of detecting a shear force, an external load in a three-axis direction, or a proximity state, and is capable of preventing the occurrence of disconnection simultaneously.
According to the tenth aspect described above, it becomes possible to provide a flexible actuator that is capable of connecting the electrode or the wiring between layers, enables downsizing while improving the degree of freedom of the wiring layout, is capable of preventing the decrease of the S/N ratio, is capable of detecting a shear force, an external load in a three-axis direction, or a proximity state, and is capable of preventing the occurrence of disconnection simultaneously.
According to the eleventh aspect described above, it becomes possible to provide a flexible battery that is capable of connecting the electrode or the wiring between layers, enables downsizing while improving the degree of freedom of the wiring layout, is capable of preventing the decrease of the S/N ratio, is capable of detecting a shear force, an external load in a three-axis direction, or a proximity state, and is capable of preventing the occurrence of disconnection simultaneously.
According to an aspect of the present invention, it becomes possible to provide advantages of providing a capacitance sensor that enables downsizing while improving the degree of freedom of the wiring layout, is capable of preventing the decrease of the S/N ratio, is capable of detecting a shear force, an external load in a three-axis direction, or a proximity state, and is capable of preventing the occurrence of disconnection simultaneously.
Hereinafter, a capacitance sensor according to a first embodiment of the present invention will be described with reference to the drawings.
The capacitance sensor (lamination flexible circuit device) 10 according to the present embodiment includes a first electrode support layer (first layer) 11, a second electrode (second conductive portion) 14, a first electrode (first conductive portion) 13, a second electrode support layer (second layer) 12, and a flexible base material 15A, as shown in
The first electrode support layer (first layer) 11 includes the first electrode (first conductive portion) 13. The second electrode support layer (second layer) 12 includes the second electrode (second conductive portion) 14 arranged to face the first electrode support layer 11. The flexible base material 15A connects the first electrode support layer 11 to the second electrode support layer 12 in a lamination direction.
The first electrode support layer 11, the second electrode support layer 12, and the flexible base material 15A are an elastomer layer which is a dielectric and is made of an elastically deformable elastomer. The first electrode support layer 11, the second electrode support layer 12, and the flexible base material 15A can be bonded by an adhesion layer (not shown) that is made of the same material as the elastomeric layer.
The first electrode support layer 11, the second electrode support layer 12, and the flexible base material 15A are a curable elastomer after application. For example, a thermosetting resin or the like can be preferably selected as a material of the first electrode support layer 11, the second electrode support layer 12, and the flexible base material 15A.
The first electrode support layer 11, the second electrode support layer 12, and the flexible base material 15A are formed to be elastically deformable by a flexible dielectric made of, for example, a gel of polyvinyl chloride (PVC), polyvinylidene fluoride (PVDF), polydimethylsiloxane (PDMS), a silicon-based resin, a urethane-based resin, an epoxy-based resin, a composite material thereof, or the like. A material that does not have reversibility with respect to a curing process described later can be preferably selected as the elastomer.
Both of the first electrode 13 and the second electrode 14 are made of an electric conductor having a stretch property.
The first electrode 13 and the second electrode 14 can be formed of a resin such as a silicon-based resin in which an electric conductor such as carbon, carbon nanofiber, or graphite is incorporated, a resin such as a silicon-based resin containing a metal conductive filler such as silver or copper or the like, a thiophene-based conductive polymer, a conductive resin such as polystyrene sulfonic acid (PSS), or a composite material thereof.
The first electrode 13 is formed in the first electrode support layer 11. The first electrode 13 may be included in a thickness direction of the first electrode support layer 11. The first electrode 13 may be formed to be exposed to any surface of the first electrode support layer 11. The first electrode 13 may be formed in a predetermined shape when forming the first electrode support layer 11. The first electrode 13 may be formed by incorporating a conductive material such as carbon powder, carbon nanofiber, or metal powder into the same material as the first electrode support layer 11.
In the first electrode 13, the formation shape and the formation position in a thickness direction of the first electrode support layer 11 or in an in-plane direction of the first electrode support layer 11 and the formation number can be set in advance in accordance with the sensor characteristic. For example, a plurality of first electrodes 13 may be arranged in the same layer in the first electrode support layer 11 and can be arranged, for example, at right and left positions as shown in
The first electrode support layer 11 has a first conductive wiring 13a and a first conductive wiring 13b in the same layer as the first electrode 13. Here, in
The second electrode 14 may be formed as a predetermined shape when forming the second electrode support layer 12 similarly to the first electrode 13.
For example, the second electrode 14 can be suitably arranged in the second electrode support layer 12 and can be arranged, for example, between the first electrodes 13 arranged on the right and left sides as shown in
The second electrode support layer 12 has a second conductive wiring 14a and a second conductive wiring 14b in the same layer as the second electrode 14. Here, in
A third conductive wiring 15a is arranged in the flexible base material 15A. The third conductive wiring 15a connects the first conductive wiring 13b to the second conductive wiring 14b between the layers. The third conductive wiring 15a penetrates through the flexible base material 15A in a lamination direction. The third conductive wiring 15a is connected at both ends to the first conductive wiring 13b and the second conductive wiring 14b.
The third conductive wiring 15a may be connected to the first electrode 13 or the second electrode 14. In the present embodiment, the third conductive wiring 15a may connect a conductive portion in the first electrode support layer 11 to a conductive portion in the second electrode support layer 12 between the layers of the portions. The connection target may be an electrode or may be a conductive wiring. Alternatively, it is also possible for another end located in a layer different from one end not to be connected to another conductive portion.
All of the third conductive wiring 15a, the first conductive wiring 13a, the first conductive wiring 13b, the second conductive wiring 14a, and the second conductive wiring 14b can be constituted of an electric conductor having a stretch property similar to those of the first electrode 13 and the second electrode 14.
In the capacitance sensor of the present embodiment, the first electrode support layer 11, the second electrode support layer 12, and the flexible base material 15A are prepared. Both of the first electrode support layer 11 and the second electrode support layer 12 can be formed in a substantially plate shape. The first electrode support layer 11, the second electrode support layer 12, and the flexible base material 15A can be molded by a predetermined mold or the like.
Further, the first electrode support layer 11, the second electrode support layer 12, and the flexible base material 15A can be made of the same material or can be made of a different material.
Further, the first electrode support layer 11, the first electrode 13, the first conductive wiring 13a, and the first conductive wiring 13b can be formed simultaneously at the time of molding. For example, a material including a conductive material corresponding to the first electrode 13, the first conductive wiring 13a, and the first conductive wiring 13b is applied in a mold recess and is cured before molding the first electrode support layer 11, then the first electrode support layer 11 is injected into the mold recess and is cured, and thereby, the first electrode support layer 11, the first electrode 13, the first conductive wiring 13a, and the first conductive wiring 13b can be simultaneously formed.
Alternatively, the first electrode 13, the first conductive wiring 13a, and the first conductive wiring 13b can be applied to the surface of the molded first electrode support layer 11, be cured, and thereby be formed. In this case, irregularities corresponding to the first electrode 13, the first conductive wiring 13a, and the first conductive wiring 13b can be formed on a mold for molding the first electrode support layer 11 at a position where the first electrode 13, the first conductive wiring 13a, and the first conductive wiring 13b are formed.
Alternatively, when the first electrode support layer 11 is formed, or after the first electrode support layer 11 is formed, a conductive material can be injected into a predetermined position at which the first electrode 13, the first conductive wiring 13a, and the first conductive wiring 13b are formed.
Similarly, the second electrode support layer 12, the second electrode 14, the second conductive wiring 14a, and the second conductive wiring 14b may be formed simultaneously. Alternatively, after the second electrode support layer 12 may be formed, the second conductive wiring 14a and the second conductive wiring 14b may be formed on the formed second electrode support layer 12. These components can be formed by a method similar to that of the first electrode support layer 11, the first electrode 13, the first conductive wiring 13a, and the first conductive wiring 13b.
Similarly, the flexible base material 15A and the third conductive wiring 15a may be formed simultaneously. After the flexible base material 15A may be formed, the third conductive wiring 15a may be formed on the formed flexible base material 15A. These components can be formed by a method similar to that of the first electrode support layer 11, the first electrode 13, the first conductive wiring 13a, and the first conductive wiring 13b.
Further, the same elastomer as the prepared first electrode support layer 11, the second electrode support layer 12, and the flexible base material 15A is applied to the interfaces of the first electrode support layer 11, the second electrode support layer 12, and the flexible base material 15A and is then cured. Thereby, the first electrode support layer 11, the second electrode support layer 12, and the flexible base material 15A can be bonded to each other, and the capacitance sensor 10 can be manufactured.
In the capacitance sensor 10 according to the present embodiment, as shown in
On the other hand, when the external load F is applied, an area in which the first electrode 13 located on the right side in
Similarly, when the external load F is applied, an area in which the first electrode 13 located on the left side in
At this time, all of the first electrode support layer 11, the second electrode support layer 12, and the flexible base material 15A are made of an elastomer of the same material. Therefore, all of the first electrode support layer 11, the second electrode support layer 12, and the flexible base material 15A have the same stress characteristic. Accordingly, the first electrode support layer 11, the second electrode support layer 12, and the flexible base material 15A do not have specificity of deformation such as locally different hardness or local softness. The first electrode support layer 11, the second electrode support layer 12, and the flexible base material 15A have a uniform degree of deformation.
Further, both an interface between the first electrode support layer 11 and the flexible base material 15A and an interface between the second electrode support layer 12 and the flexible base material 15A are capable of maintaining a state of having the same stress characteristic. Therefore, all of the first electrode support layer 11, the second electrode support layer 12, and the flexible base material 15A are similarly deformed with respect to the applied external load F. Accordingly, discontinuity in the deformation characteristic on the bonding surface does not occur. That is, all of the first electrode support layer 11, the second electrode support layer 12, and the flexible base material 15A are similarly deformed with respect to the applied external load F.
Thereby, it becomes possible to accurately detect the change in capacitance between the first electrode 13 and the second electrode 14. That is, the first electrode support layer 11, the second electrode support layer 12, and the flexible base material 15A are similarly deformed regardless of the presence or absence of the bonding surface with respect to the applied external load F. Thereby, it becomes possible to accurately detect the change in capacitance between the first electrode 13 and the second electrode 14.
Here, all of the first electrode 13, the second electrode 14, the third conductive wiring 15a, the first conductive wiring 13a, the first conductive wiring 13b, the second conductive wiring 14a, and the second conductive wiring 14b use the same elastomer as the first electrode support layer 11, the second electrode support layer 12, and the flexible base material 15A. Therefore, all of these components have almost the same stress characteristic. Further, since the interfaces between these components are formed of the same material and thereby have a uniform characteristic, stress concentration does not occur, and it is possible to enhance the peeling resistance property. At the same time, at the interfaces between these components, since the components are formed of elastomers having the same molecular structure, the bond is strong, and the components are not easily peeled from each other. Therefore, the degree of deformation when the external load F is applied is uniform. Accordingly, it is possible to prevent the occurrence of disconnection caused by the external load F. Thereby, it becomes possible to maintain a disconnection resistance characteristic required for the capacitance sensor 10.
In
In this case, the change in capacitance between the first electrode 13 and the second electrode 14 is detected by an interelectrode distance d.
Hereinafter, a capacitance sensor (lamination flexible circuit device) according to a second embodiment of the present invention will be described with reference to the drawings.
In a capacitance sensor 10 in the present embodiment, as shown in
The plurality of pillars 15 are formed along an in-plane direction of the first electrode support layer 11 and the second electrode support layer 12 and are spaced from each other. The pillars 15 can be formed integrally with the second electrode support layer 12. All of the pillars 15 can have the same height. The pillars 15 can have different heights depending on an in-plane position of the first electrode support layer 11 and the second electrode support layer 12. The heights of the pillars 15 can be changed to be inclined in one direction. The heights of the pillars 15 can be set in accordance with the sensor characteristic.
The first electrode 13 and the first conductive wiring 13a are formed in the first electrode support layer 11. The first electrode 13 and the first conductive wiring 13a may be included in the thickness direction of the first electrode support layer 11. The first electrode 13 and the first conductive wiring 13a may be formed to be exposed on the surface of the first electrode support layer 11 facing the second electrode support layer 12. A plurality of first electrodes 13 can be formed at a plurality of locations in the same layer.
The second electrode 14, the second conductive wiring 14a, and the second conductive wiring 14b are formed in the second electrode support layer 12. The second electrode 14, the second conductive wiring 14a, and the second conductive wiring 14b may be included in the thickness direction of the second electrode support layer 12. The second electrode 14, the second conductive wiring 14a, and the second conductive wiring 14b may be formed to be exposed on the surface of the second electrode support layer 12 facing the first electrode support layer 11. A plurality of second electrodes 14 can be formed at a plurality of locations in the same layer.
A third conductive wiring 15a penetrating in the lamination direction is arranged in a pillar 15 arranged at a predetermined in-plane position of the plurality of pillars. In the present embodiment, the third conductive wiring 15a is arranged at the middle of the pillar 15. That is, the third conductive wiring 15a penetrates along a center axis of the pillar 15. A first end and a second end of the third conductive wiring 15a are connected to the first conductive wiring 13a and the second conductive wiring 14b, respectively.
An area of end portions of the first conductive wiring 13a and the second conductive wiring 14b connected to the third conductive wiring 15a, as a connection position 13al, as shown in
An end portion of the pillar 15 is bonded to the opposing first electrode support layer 11. All of the end portions of the pillars 15 can be bonded to the first electrode support layer 11. Some of the end portions of the pillars 15 may not be bonded to the first electrode support layer 11. An adhesion layer may be formed between a bonding section of the end portion of the pillar 15 and the first electrode support layer 11. The adhesion layer can be formed on the entire bonding section in the end portion of the pillar 15. The adhesion layer can be formed on the bonding section of the pillar 15 in part of the end portion.
All of the first electrode support layer 11, the second electrode support layer 12, and the pillar 15 can be made of the same material. The first electrode support layer 11, the second electrode support layer 12, and the pillar 15 are formed of the same elastomer similarly to the first embodiment. All of the first electrode 13, the second electrode 14, the third conductive wiring 15a, the first conductive wiring 13a, the first conductive wiring 13b, the second conductive wiring 14a, and the second conductive wiring 14b use the same elastomer as the first electrode support layer 11, the second electrode support layer 12, and the flexible base material 15A.
In the present embodiment, the first electrode 13 is connected to a circuit board 19 via the first conductive wiring 13a, the third conductive wiring 15a, and the second conductive wiring 14b. The second electrode 14 is connected to the circuit board 19 via the second conductive wiring 14a.
The second conductive wiring 14b and the second conductive wiring 14a are arranged on the same surface of the second electrode support layer 12 and are connected to the circuit board 19 via a connection line (cable) 19a.
In the capacitance sensor 10 according to the present embodiment, as shown in
On the other hand, when an external load F facing leftward is applied in
Thereby, the capacitance formed of the first electrode 13 and the second electrode 14 is changed, and it becomes possible to measure the external load F by detecting this capacitance change.
Further, as shown in
At this time, in the capacitance sensor 10 according to the present embodiment, since bonding is achieved by the plurality of pillars 15 spaced from each other in the in-plane direction compared to the first embodiment in which the entire surface of the first electrode support layer 11 and the second electrode support layer 12 is bonded by the flexible base material 15A, the position change in the in-plane direction between the first electrode support layer 11 and the second electrode support layer 12 more easily occurs. That is, the sensitivity as the sensor characteristic can be improved.
At this time, all of the first electrode support layer 11, the second electrode support layer 12, and the pillar 15 are made of an elastomer of the same material. Further, the first electrode 13, the first conductive wiring 13a, the third conductive wiring 15a, and the second conductive wiring 14b are also made of a flexible conductive material of the same material. Therefore, all of the first electrode support layer 11, the second electrode support layer 12, and the pillar 15 have the same stress characteristic. Accordingly, the first electrode support layer 11, the second electrode support layer 12, and the pillar 15 do not have specificity of deformation such as locally different hardness or local softness. The first electrode support layer 11, the second electrode support layer 12, and the pillar 15 have a uniform degree of deformation.
That is, the first electrode support layer 11 and the second electrode support layer 12 are similarly deformed with respect to the applied external load F. Thereby, the first electrode 13, the first conductive wiring 13a, the third conductive wiring 15a, and the second conductive wiring 14b are also similarly deformed, and disconnection does not occur. It becomes possible to accurately detect the change in capacitance between the first electrode 13 and the second electrode 14.
The capacitance sensor 10 according to the present embodiment can also detect the change in capacitance between the first electrode 13 and the second electrode 14 by way of the variation of an interelectrode distance d similarly to the first embodiment.
In the present embodiment, it is possible to provide effects similar to those of the embodiment described above.
Hereinafter, a capacitance sensor (lamination flexible circuit device) according to a third embodiment of the present invention will be described with reference to the drawings.
In the capacitance sensor 10 in the present embodiment, as shown in
The first conductive wiring 13a is connected to a first electrode 13 arranged at a right end of
The third conductive wiring 15a is connected to a first electrode 13 arranged at the middle of
A third conductive wiring 15b is connected to a first electrode 13 arranged at the left end of
The third conductive wiring 15b is connected to one end portion of the fourth conductive wiring 16a in the same layer as a front surface of the second electrode support layer 12. A second conductive wiring 14c is connected to the other end portion of the fourth conductive wiring 16a in the same layer as a rear surface of the second electrode support layer 12.
The second conductive wiring 14c extends on the rear surface of the second electrode support layer 12 on a side spaced from the first electrode support layer 11. The second conductive wiring 14c is arranged in parallel with the second conductive wiring 14b and the first conductive wiring 13a. The second conductive wiring 14c, the second conductive wiring 14b, and the first conductive wiring 13a are located at positions that overlap one another when seen in the lamination direction.
All of the fourth conductive wiring 16a, the third conductive wiring 15a, the third conductive wiring 15b, the first conductive wiring 13a, the second conductive wiring 14b, and the second conductive wiring 14c can be constituted of an electric conductor having a stretch property similar to those of the first electrode 13 and the second electrode 14.
The second conductive wiring 14c, the second conductive wiring 14b, and the first conductive wiring 13a are formed at positions that overlap one another when seen in the lamination direction but are arranged to be spaced from one another since the layers differ from one another.
Further, two pairs of the second conductive wiring 14c, the second conductive wiring 14b, and the first conductive wiring 13a are formed in parallel with each other so as to correspond to each row of the first electrodes 13 formed in two rows.
In
In a capacitance sensor 010 shown in
However, in the capacitance sensor 010, all of a first conductive wiring 13a connected to the first electrode 13 at the right end, a conductive wiring 014b connected to the first electrode 13 at the middle, and a conductive wiring 014c connected to the first electrode 13 at the right end are arranged in the same layer as the first electrode 13. Accordingly, the conductive wiring 014b and the conductive wiring 014c are arranged in parallel with each other between the rows formed of the first electrode 13.
In the present embodiment, in the capacitance sensor 10 shown in
This is because in the capacitance sensor 010 shown in
Therefore, in the configuration shown in
In this way, in the present embodiment, downsizing of the capacitance sensor 10 can be easily performed. Further, since the wiring layout across the layers is enabled, it is possible to improve the degree of freedom of the wiring and increase the distance between the wirings, and reduction of crosstalk and improvement of the S/N ratio can be easily performed.
In the present embodiment, it is also possible to provide effects similar to those of the embodiments described above.
Hereinafter, a capacitance sensor (lamination flexible circuit device) according to a fourth embodiment of the present invention will be described with reference to the drawings.
In the capacitance sensor 10 in the present embodiment, as shown in
One end of a third conductive wiring 15a is connected to the first electrode 13 or the first conductive wiring 13a. Another end of the third conductive wiring 15a is connected to the second conductive wiring 14a. One end of another third conductive wiring 15b is connected to the first electrode 13 or the first conductive wiring 13a. Another end of the third conductive wiring 15b is connected to the second conductive wiring 14b.
The second conductive wiring 14a and the second conductive wiring 14b extend in a direction orthogonal to the plane of paper.
In the capacitance sensor 10 in the present embodiment, by sufficiently increasing the diameter of the pillar 15, the separation distance between the second conductive wiring 14a and the second conductive wiring 14b can be sufficiently increased, and thereby, it is possible to prevent the occurrence of crosstalk and sufficiently increase the S/N ratio. Further, since the third conductive wiring 15a and the third conductive wiring 15b that connect the layers can be arranged in a single pillar, it is possible to further improve the degree of freedom of the wiring layout.
The third conductive wiring 15a and the third conductive wiring 15b of the present embodiment may be spaced from each other to the degree in which crosstalk can be prevented, and each wiring diameter or the arrangement position in the cross-section of the pillar 15 is not particularly limited.
Further, the third conductive wiring 15a and the third conductive wiring 15b of the present embodiment can be arranged on surfaces facing each other in a pillar having a square column shape. Alternatively, the third conductive wiring 15a and the third conductive wiring 15b of the present embodiment can be arranged at corners facing each other. Further, if the pillar 15 has a large diameter, the third conductive wiring 15a and the third conductive wiring 15b of the present embodiment can be arranged on the same surface.
In the present embodiment, it is also possible to provide effects similar to those of the embodiments described above.
Hereinafter, a capacitance sensor (lamination flexible circuit device) according to a fifth embodiment of the present invention will be described with reference to the drawings.
In the capacitance sensor 10 in the present embodiment, as shown in
In the pillar 15 in which the entire cross-section is the third conductive wiring 15d, another end of the third conductive wiring 15d is connected to the second electrode 14 or the second conductive wiring 14b. Part of the other end of the third conductive wiring 15d may be connected to the second electrode 14 or the second conductive wiring 14b, and the entire surface of the other end of the third conductive wiring 15d can be connected to the second electrode 14 or the second conductive wiring 14b.
In the present embodiment, it is also possible to provide effects similar to those of the embodiments described above.
Hereinafter, a capacitance sensor (lamination flexible circuit device) according to a sixth embodiment of the present invention will be described with reference to the drawings.
In the capacitance sensor 10 in the present embodiment, as shown in
One end of the third conductive wiring 15a is connected to the first electrode 13 or the first conductive wiring 13a.
Another end of the third conductive wiring 15a is connected to the second conductive wiring 14b. The third conductive wiring 15a constitutes a signal line connected to the first electrode 13.
One end of the third conductive wiring 15e is connected to the first conductive wiring 13c. The third conductive wiring 15e is not connected to the first electrode 13. Another end of the third conductive wiring 15e is not connected to an electrical conductor in the same layer as the second conductive wiring 14b.
The first conductive wiring 13c is in a ground potential. Further, the third conductive wiring 15e connected to the first conductive wiring 13c is also in a ground potential. The third conductive wiring 15e is formed throughout the entire circumference of the pillar 15. The one end of the third conductive wiring 15e is spaced from the first electrode 13 or the first conductive wiring 13a so as not to be connected to the first electrode 13 or the first conductive wiring 13a. Further, the other end of the third conductive wiring 15e is spaced from the second conductive wiring 14b so as not to be connected to the second conductive wiring 14b.
The third conductive wiring 15e surrounds the entire circumference of the third conductive wiring 15a along the entire length of the third conductive wiring 15a. Further, the third conductive wiring 15e is in a ground potential. Thereby, the third conductive wiring 15e can act as a ground shield for the third conductive wiring 15a. Accordingly, it is possible to reduce crosstalk with respect to the third conductive wiring 15a as the signal line, improve noise resistance, and improve the S/N ratio.
A second conductive wiring that becomes a ground potential can be formed on the second electrode support layer 12 and be connected to the other end of the third conductive wiring 15e.
In the present embodiment, it is also possible to provide effects similar to those of the embodiments described above.
Hereinafter, a capacitance sensor (lamination flexible circuit device) according to a seventh embodiment of the present invention will be described with reference to the drawings.
In the capacitance sensor 10 in the present embodiment, as shown in
Another end of the third conductive wiring 15d is connected to the second electrode 14 or the second conductive wiring 14b. Part of the other end of the third conductive wiring 15d may be connected to the second electrode 14 or the second conductive wiring 14b, and the entire surface of the other end of the third conductive wiring 15d can be connected to the second electrode 14 or the second conductive wiring 14b.
A plurality of pillars 15 in which the entire cross-section is the third conductive wiring 15f are arranged to be spaced in the in-plane direction of the first electrode support layer 11 and the second electrode support layer 12 around the pillar 15 in which the entire cross-section is the third conductive wiring 15d.
One end of the third conductive wiring 15f is connected to the first conductive wiring 13c. Part of the one end of the third conductive wiring 15f may be connected to the first conductive wiring 13c, and the entire surface of the one end of the third conductive wiring 15f can be connected to the first conductive wiring 13c. The one end of the third conductive wiring 15f is not connected to the first electrode 13 or the first conductive wiring 13a. That is, the one end of the third conductive wiring 15f is spaced from the first electrode 13 or the first conductive wiring 13a. The first conductive wiring 13c is in a ground potential.
Another end of the third conductive wiring 15f is connected to a second conductive wiring 14e. Part of the other end of the third conductive wiring 15f may be connected to the second conductive wiring 14e, and the entire surface of the other end of the third conductive wiring 15f can be connected to the second conductive wiring 14e. The other end of the third conductive wiring 15f is not connected to the second electrode 14 or the second conductive wiring 14b. That is, the other end of the third conductive wiring 15f is spaced from the second electrode 14 or the second conductive wiring 14b. The second conductive wiring 14e is in a ground potential.
The pillars 15 in which the entire cross-section is the third conductive wiring 15f surround the entire circumference of the pillar 15 in which the entire cross-section is the third conductive wiring 15d along the entire length of the pillar 15 as the third conductive wiring 15d.
Further, all of the third conductive wirings 15f are in a ground potential. Thereby, the third conductive wiring 15f can act as a ground shield for the third conductive wiring 15d. Accordingly, it is possible to reduce crosstalk with respect to the third conductive wiring 15d as the signal line, improve noise resistance, and improve the S/N ratio.
Although the pillars 15 as the third conductive wiring 15f are spaced from one another, the distances are not particularly limited if the distances can provide a function as a ground shield for the third conductive wiring 15d.
Further, in the present embodiment, since it is not necessary to form the third conductive wiring 15a within the pillar 15, it becomes possible to reduce the manufacturing process while providing the function as a ground shield.
In
In the present embodiment, it is also possible to provide effects similar to those of the embodiments described above.
Hereinafter, a capacitance sensor (lamination flexible circuit device) according to an eighth embodiment of the present invention will be described with reference to the drawings.
In the capacitance sensor 10 of the present embodiment, as shown in
A wiring 19b is formed on the circuit board 19. A fourth conductive wiring 16a is connected to the wiring 19b. A third conductive wiring 15b is connected to the fourth conductive wiring 16a. The third conductive wiring 15b is connected to the first electrode 13 or the first conductive wiring 13a.
The third conductive wiring 15b is connected to the first electrode 13 or the first conductive wiring 13a of the present embodiment at a position which becomes an outline middle of the pillar 15 when seen in the lamination direction. The third conductive wiring 15b penetrates through the pillar 15 in the lamination direction and is connected to the fourth conductive wiring 16a formed on the second electrode support layer 12. The fourth conductive wiring 16a penetrates through the second electrode support layer 12 in the thickness direction. The fourth conductive wiring 16a extends in parallel with the third conductive wiring 15b. The extension directions of the fourth conductive wiring 16a and the third conductive wiring 15b match each other when seen in the lamination direction.
The third conductive wiring 15b is connected to one end portion of the fourth conductive wiring 16a in the same layer as a front surface of the second electrode support layer 12. The wiring 19b is connected to another end portion of the fourth conductive wiring 16a in the same layer as a front surface of the circuit board 19.
The wiring 19b is in contact with a rear surface of the second electrode support layer 12 on a side spaced from the first electrode support layer 11. The wiring 19b is arranged in parallel with the first conductive wiring 13a. The wiring 19b, the fourth conductive wiring 16a, the third conductive wiring 15b, and the first electrode 13 or first conductive wiring 13a are located at positions that overlap one another when seen in the lamination direction.
The capacitance sensor 10 of the present embodiment is formed to have a shorter wiring to the circuit board (measurement board) 19 as compared to a configuration connected to the circuit board 19 by a cable 19a as shown in
The circuit board 19 can be made of a rigid substrate. Alternatively, the circuit board 19 can be made of a flexible substrate.
In the present embodiment, it is also possible to provide effects similar to those of the embodiments described above.
Further, in the present embodiment, the second electrode support layer 12 can be omitted, and the other end of the third conductive wiring 15b can be directly connected to the wiring 19b of the circuit board 19.
Hereinafter, a capacitance sensor (lamination flexible circuit device) according to a ninth embodiment of the present invention will be described with reference to the drawings.
In the capacitance sensor 10 of the present embodiment, as shown in
The first electrode support layer 11 includes a first electrode 13. The second electrode support layer 12 includes a second electrode 14. The third electrode support layer 11B includes a first electrode 13B. The fourth electrode support layer 12B includes a second electrode 14B.
The capacitance sensor 10 includes a third conductive wiring 15a penetrating through the second electrode support layer 12 in a lamination direction, a third conductive wiring 15a penetrating through the third electrode support layer 11B in the lamination direction, and a third conductive wiring 15a penetrating through the fourth electrode support layer 12B in the lamination direction.
The third conductive wiring 15a connects between the layers. In the present embodiment, the arrangement of the first electrode 13, the second electrode 14, the first electrode 13B, the second electrode 14B, and the third conductive wiring 15a is not limited to this configuration. Further, the third conductive wiring 15a also includes a fourth conductive wiring 16a.
In the capacitance sensor 10 of the present embodiment, according to the multilayered structure, it is possible to realize a finer wiring layout and realize a downsized and high-density sensor as a whole.
In the present embodiment, it is also possible to provide effects similar to those of the embodiments described above.
Hereinafter, a capacitance sensor (lamination flexible circuit device) according to a tenth embodiment of the present invention will be described with reference to the drawings.
A capacitance sensor 20 in the present embodiment has a first electrode support layer 21, a second electrode support layer 22, a third electrode support layer 23, and a fourth electrode support layer 24, as shown in
The first electrode support layer 21 has a first electrode (first conductive portion) 25.
The second electrode support layer 22 has a second electrode (second conductive portion) 26. The third electrode support layer 23 has a third electrode (third conductive portion) 27. The fourth electrode support layer 24 has a fourth electrode (third conductive portion) 28.
The first electrode support layer 21, the second electrode support layer 22, the third electrode support layer 23, and the fourth electrode support layer 24 correspond to the first electrode support layer 11 and the second electrode support layer 12 of the first and second embodiments, are laminated on each other, and are bonded to each other by an adhesion layer. All of the first electrode support layer 21, the second electrode support layer 22, the third electrode support layer 23, the fourth electrode support layer 24, and the flexible base material are formed of the same elastomer similarly to the embodiments described above. Formation of the flexible base material and bonding of each electrode support layer are similar to those of the embodiments described above. The flexible base material and the third wiring electrode are not shown in the drawing. The flexible base material can be a pillar or can be another structure. Further, the configuration of the third wiring electrode can also be appropriately selected from the embodiments described above.
The first electrode support layer 21 and the second electrode support layer 22 constitute a proximity sensor. The third electrode support layer 23 and the fourth electrode support layer 24 constitute a three-axis force sensor. Here, the second electrode 26 constitutes a GND shield layer. The second electrode 26 can be formed on the entire surface of the first electrode support layer 21, the second electrode support layer 22, the third electrode support layer 23, and the fourth electrode support layer 24 so as to electrically shield the first electrode 25, the third electrode 27, and the fourth electrode 28. Thereby, the upper proximity sensor constituted of the first electrode support layer 21 and the second electrode support layer 22 and the three-axis force sensor constituted of the third electrode support layer 23 and the fourth electrode support layer 24 can perform proximity detection on the upper side of the capacitance sensor 20 and three-axis force detection of a vertical force Fz and shear forces Fx and Fy on the lower side of the capacitance sensor 20, respectively.
In the capacitance sensor 20 in the present embodiment, the electrode support layers corresponding to the electrodes can be formed separately from the same material, and each layer can be bonded by the same elastomer. Here, each electrode support layer can be formed as a configuration divided in the thickness direction for each electrode formed at a different position in the thickness direction of the capacitance sensor 20. That is, depending on the electrode position arranged according to the desired sensor characteristic needs, the layers can be separated into multiple stages and bonded. Thereby, it is possible to facilitate manufacturing of the capacitance sensor 20, improve sensor sensitivity, and improve peeling resistance.
At this time, electrodes having a different position in the thickness direction can be arranged in the same electrode support layer so as not to overlap each other in plan view.
Simultaneously, since it becomes easier to manufacture the capacitance sensor having a complex multilayer structure, it becomes possible to provide a configuration in which a sensor having a different characteristic is further added.
Here, it becomes easier to form a pillar between the electrode support layers as in the second embodiment as needed and improve the sensor characteristic.
In the capacitance sensor 20 in the present embodiment, since the layers and the adhesion layer between the layers are formed of the same elastomer, it is possible to provide effects similar to those of the embodiments described above. Further, according to the first electrode 25, it is possible to measure proximity data with the outside of the sensor, and according to the third electrode 27 and the fourth electrode 28, it is possible to measure a three-axis force of an applied load.
In this case, the second electrode 26 is a ground electrode for separating the proximity sensor and the three-axis force sensor described above and can provide GND shield effects.
Here, in a sensor that acquires the proximity by way of a change in a capacitance value and acquires pressure by way of a resistance value, a data acquisition circuit is required for each acquisition. On the other hand, in the present embodiment, both of the proximity and the three-axis force can be acquired by the capacitance sensor 20, which is one capacitance-type sensor. Accordingly, the capacitance sensor 20 in the present embodiment can provide effects such as decreasing the size of a measurement circuit and downsizing the system.
As another form, the first electrode 25 can be eliminated, and the second electrode 26 can be used as a self-capacity proximity sensor. In this case, it is possible to switch the timing of acquiring pressure by the third electrode 27 and the fourth electrode 28 and the timing of acquiring the proximity data by the second electrode 26 in a time division manner.
Hereinafter, a capacitance sensor (lamination flexible circuit device) according to an eleventh embodiment of the present invention will be described with reference to the drawings.
A capacitance sensor 30 in the present embodiment is formed on an arm sleeve 39 as shown in
The capacitance sensor 30 is formed integrally with the arm sleeve 39 having a cylindrical shape. The capacitance sensor 30 has flexibility in which deformation such as folding or bending is possible together with the arm sleeve 39. The arm sleeve 39 is made of a flexible material having stretch properties such as a resin sheet or a cloth.
The capacitance sensor 30 has a first electrode support layer 31 and a second electrode support layer 32.
The first electrode support layer 31 and the second electrode support layer 32 are laminated integrally with the arm sleeve 39.
The first electrode support layer 31 has a first electrode (first conductive portion) 33Aa, a first connector (first conductive portion) 33A, a first conductive wiring 33b, and a first connector (first conductive portion) 33B.
The second electrode support layer 32 has a second electrode (second conductive portion, second conductive wiring) 34a. A flexible base material 15A is formed between the first electrode support layer 31 and the second electrode support layer 32. In place of the flexible base material 15A, a pillar 15 may be formed between first electrode support layer 31 and the second electrode support layer 32.
The flexible base material 15A and the pillar 15 are not shown in the drawing.
The first electrode 33Aa is connected to the first connector 33A. One end of the first conductive wiring 33b is connected to the first connector 33B, and another end of the first conductive wiring 33b is connected to the third conductive wiring 35a. The third conductive wiring 35a is connected to the second electrode 34a. The first electrode 33A is connected to the first conductive wiring 33b. The first electrode 33Aa, the first connector 33A, the first conductive wiring 33b, and the first connector 33B are formed in the same layer.
The first electrode 33Aa and the second conductive wiring 34a are arranged to overlap each other when seen in the lamination direction of the first electrode support layer 31 and the second electrode support layer 32. The first electrode 33Aa and the second conductive wiring 34a are electrodes that detect a capacitance in the capacitance sensor. Similarly, a circuit board 19 or the like is connected to the first connector 33A and the first connector 33B.
The first electrode support layer 31 corresponds to first electrode support layer 11. The second electrode support layer 32 corresponds to the second electrode support layer 12. The first electrode 33 corresponds to the first electrode 13. The first electrode 33Aa corresponds to the first electrode 13. The first conductive wiring 33a corresponds to the first conductive wiring 13a or the like. The first conductive wiring 33b corresponds to the first conductive wiring 13b or the like. The second conductive wiring 34a corresponds to the second conductive wiring 14b or the like.
The first electrode 33Aa and the second conductive wiring 34a of the capacitance sensor 30 are located at a joint portion such as the elbow in the arm sleeve 39 mounted on the arm.
When an external force is applied to the arm sleeve 39, that is, for example, when a wearer bends the elbow, the arm sleeve 39 folds and deforms integrally with the elbow. Then, the capacitance sensor 30 folds as shown in
Further, the capacitance sensor 30 not only can measure the movement of the arm due to the bending of the elbow but also can measure a force of contact between the arm and the outside such as contact between the external environment and the arm or being touched by a person regardless of the bending of the elbow.
As the external load F in the measurement of the force of contact, it is conceivable that both of the force of contact between the arm and the outside and the force of the movement of the arm be applied to the arm sleeve 39. In this case, separation of contributing factors of the two forces may be performed.
When the separation of contributing factors of the two forces is performed, a method can be used in which another sensor such as a joint angle sensor is also used in addition to the capacitance sensor 30, and data from both sensors are used. Alternatively, when the separation of contributing factors of the two forces is performed, a method using machine learning can be used for the output data of the capacitance sensor 30.
The capacitance sensor 10 according to the present embodiment can also detect the change in capacitance between the first electrode 33Aa and the second electrode 34a by way of the variation of an interelectrode distance d similarly to the embodiments described above.
In the present embodiment, it is possible to provide effects similar to those of the embodiment described above.
Hereinafter, a flexible actuator (lamination flexible circuit device) according to a twelfth embodiment of the present invention will be described with reference to the drawings.
A flexible actuator 40 in the present embodiment includes, as shown in
The touch actuator sheet 49 is made of a flexible sheet formed in a glove shape. The fingertip 48 is made of a flexible sheet formed in a cup shape.
The touch actuator sheet 49 has a plurality of first electrodes 13 similarly to the third embodiment shown in
The fingertip 48 also has a plurality of first electrodes 13 similarly. Further, in the plurality of first electrodes 13, a circuit connected to the circuit board 19 is formed of a first conductive wiring 13a and a second conductive wiring 14a formed on the first electrode support layer 11 and the second electrode support layer 12, a third conductive wiring 15a formed between these layers, and a fourth conductive wiring 16a. The plurality of first electrodes 13 are in contact with the tip of wearer's finger.
In the touch actuator sheet 49 and the fingertip 48, the plurality of first electrodes 13 form an electrode array.
The flexible actuator 40 applies electrical stimulation directly to the skin and thereby generates fine tactile sense for the touch actuator sheet 49, the fingertip 48, the palm and the tip of a finger.
Here, by decreasing the area of the first electrode 13 and increasing the number of arrangements of the first electrode 13, it is possible to apply high-resolution stimulation to the skin. By applying high-resolution stimulation to the skin, it is possible to generate fine tactile sense.
In the flexible actuator 40, the touch actuator sheet 49 and the fingertip 48 can flexibly deform in accordance with the movement of the palm and the tip of a finger. Thereby, even when the touch actuator sheet 49 and the fingertip 48 deform, a contact state with the skin of the palm and the tip of a finger is maintained.
The flexible actuator 40 can be easily downsized by employing the wiring layout across the layers. High-resolution stimulation to the skin is realized, and it is possible to generate fine tactile sense.
In the present embodiment, it is also possible to provide effects similar to those of the embodiments described above.
Hereinafter, a flexible battery (lamination flexible circuit device) according to a thirteenth embodiment of the present invention will be described with reference to the drawings.
A flexible battery 50 in the present embodiment is formed integrally with the arm sleeve 39 together with the capacitance sensor 10 as shown in
The flexible battery 50 supplies electric power to the circuit board 19 for driving of the capacitance sensor 10.
The flexible battery 50 has a first electrode 13, a second electrode 14, and a separator layer 56.
The first electrode 13 is connected to a first conductive wiring 13a. The first conductive wiring 13a is connected to a third conductive wiring 15a. The third conductive wiring 15a is connected to a second conductive wiring 14a. The second conductive wiring 14a is connected to the circuit board 19. The second electrode 14 is connected to a second conductive wiring 14b. The second conductive wiring 14b is connected to the circuit board 19. The second conductive wiring 14a and the second conductive wiring 14b may be arranged in the same layer. The second conductive wiring 14a and the second conductive wiring 14b may be arranged in different layers within the second electrode support layer 12.
The flexible battery 50 in the present embodiment is, for example, an aqueous stretch zinc manganese dioxide (Zn—MnO2) secondary battery. The flexible battery 50 is a single polymer-based battery having stretch properties.
The first electrode 13 is a cathode (positive electrode). The second electrode 14 is an anode (negative electrode). The separator layer 56 is laminated between the first electrode 13 and the second electrode 14. The first electrode 13 may be an anode (negative electrode), and the second electrode 14 cathode (positive electrode) may be a cathode (positive electrode).
In the first electrode 13, a carbon conductive layer (collector) 13ct including carbon nanofibers and a Zn layer (electrolyte layer) 13zn including Zn particles and carbon black particles are laminated. In the second electrode 14, a carbon conductive layer (collector) 14an including carbon nanofibers and a MnO2 layer (electrolyte layer) 14 nm including MnO2 particles and carbon black particles are laminated.
The separator layer 56 is a porous film in which SIBS is an elastomer, a polymer, or a binder. The separator layer 56 is a stretch film having high porosity and electrical isolation performance. The separator layer 56 corresponds to the flexible base material 15A. When the carbon conductive layer (collector) 13ct is regarded as the first electrode support layer 11, and the carbon conductive layer (collector) 14an is regarded as the second electrode support layer 12, the Zn layer 13zn and the MnO2 layer 14nm may correspond to the flexible base material 15A.
The Zn layer 13zn and the MnO2 layer 14nm are in contact with front and rear surfaces of the separator layer 56, respectively. The carbon conductive layer 13ct, the Zn layer 13zn, the separator layer 56, the MnO2 layer 14nm, and the carbon conductive layer 14an constitute cells of the flexible battery 50.
In all of the cells of the flexible battery 50, each layer is formed by encapsulating the particles as the battery described above or the like in a biocompatible polymer which is a triblock thermoplastic copolymer, for example, a poly (styrene-isobutylene-styrene) SIBS. Thereby, the cells of the flexible battery 50 have sufficient flexibility.
In the arm sleeve 39, the flexible base material 15A and the pillar 15 can be arranged between the first electrode support layer 11 and the second electrode support layer 12 except a region corresponding to the flexible battery 50.
The flexible battery 50 can be located at a joint portion such as the elbow in the arm sleeve 39 mounted on the arm. Alternatively, the flexible battery 50 may be arranged at a position displaced from the elbow.
When an external force is applied to the arm sleeve 39, that is, for example, when a wearer bends the elbow, the arm sleeve 39 folds and deforms integrally with the elbow. Then, the flexible battery 50 folds as shown in
In the present embodiment, it is also possible to provide effects similar to those of the embodiments described above.
Further, in the present invention, individual configurations in the embodiments described above can be individually selected and suitably combined.
| Number | Date | Country | Kind |
|---|---|---|---|
| 2022-201141 | Dec 2022 | JP | national |
