The present invention relates to a lamp incorporating solid-state light sources such as light-emitting diodes (LEDs), and a process for producing a lamp.
The present invention is an improvement on the subject matter of International Patent No. PCT/AU03/00724, the entire subject matter of which is incorporated herein by reference.
Solid-state light sources, such as light emitting diodes (LEDs), are often proposed as the light sources of the future for both specialist and general lighting applications. Recent improvements in the efficiency and the colours and intensity of illumination produced by such devices has led to their increasing adoption for many lighting applications. Even though LEDs are not yet as efficient as fluorescent light sources, their extremely long lifetime has led to their widespread use in non-domestic lighting applications.
In order to obtain a sufficient intensity of light for many applications, lamps have been developed that include many individual LEDs grouped together to provide a high intensity light beam that has the appearance of being produced by a single light source. Because the divergence of the light beam produced by each individual LED is relatively small, the LEDs can be arranged in slightly different orientations (e.g., on a non-planar surface) to provide a composite light beam having a relatively large angular divergence suitable for general lighting applications, as described in International Patent No. PCT/AU03/00724. Unfortunately, existing processes for producing such lamps are time consuming, difficult, and consequently expensive. In particular, the making of electrical connections to the individual light sources in such lamps can involve non-standard assembly processes that can be quite cumbersome. For example, electrical connections to LEDs have previously been made using wire bonding machines. However, this can be difficult when these connections are to be made between connection points that are not in the same horizontal plane, such as when the LEDs are mounted on a non-planar surface, because wire bonding machines are not readily suited to making such connections.
A further difficulty of existing lamps incorporating solid-state light sources is the heat generated by these devices, which in the case of standard LEDs is of the order of one Watt per square millimetre. Standard LEDs typically produce about 100 milliwatts of heat, which, when the LEDs are packaged individually, is quite manageable. Even in densely packed arrays with many such LEDs, the heat dissipation issue can be successfully addressed. However, larger LEDs with areas exceeding one square millimetre are now becoming commonplace, and each of these LEDs can generate more than one Watt of heat. Because this heat is generated in a small physical volume, and the surface area of each LED is small, the temperature of each LED can rise dramatically unless this heat can be effectively dissipated. In general, LEDs operate less efficiently as the temperature of the active region increases. There is also a strong body of evidence to suggest that LEDs are degraded by extended operation at high temperatures.
It is desired to provide a lamp, a process for producing a lamp, an electrically conductive sheet, and an array of electrically conductive receptacles that alleviate one or more difficulties of the prior art, or at least that provide a useful alternative.
In accordance with the present invention, there is provided a process for producing a lamp, including forming one or more electrical connectors having a predetermined shape for making electrical connections to one or more light source assemblies mounted at predetermined locations on a non-planar support.
The present invention also provides a process for producing a lamp, including:
The present invention also provides a process for producing a plurality of lamps, including:
The present invention also provides a light source assembly produced by any of the above processes.
The present invention also provides a lamp assembly produced by any of the above processes.
The present invention also provides a lamp produced by any of the above processes.
The present invention also provides a lamp production system having components for executing the steps of any of the above processes.
The present invention also provides an electrically conductive sheet including a plurality of electrical connectors interconnected by joining portions, said electrical connectors adapted to make electrical connections to one or more light source assemblies mounted at predetermined locations on a non-planar support.
The present invention also provides an array of electrically conductive receptacles for receiving respective light sources, said receptacles interconnected by receptacle joining portions.
Preferred embodiments of the present invention are hereinafter described, by way of example only, with reference to the accompanying drawings, wherein:
FIGS. 1 to 3 are perspective, side, and plan views, respectively, of a lamp assembly according to one preferred embodiment of the invention;
FIGS. 32 to 34 are perspective, side, and plan views, respectively, of a further alternative lamp assembly;
A lamp includes a lamp assembly 100, as shown in FIGS. 1 to 3, including nine light source assemblies 1200 mounted on an electrically conductive light source support 1406. Each of the light source assemblies 1200 contains a light source, being a light-emitting diode (LED) that emits a beam of light from its surface when electric current is passed through the LED. Each LED is preferably of a type having a relatively large active area (e.g., in the range 0.5-1.5 mm2), requiring an operating current which can be up to 350-400 mA; however, smaller area LEDs can alternatively be used.
The LEDs are mounted on the concave side of each light source assembly 1200 and are therefore not visible in FIGS. 1 to 3. In the arrangement shown, the light source assemblies 1200 are mounted on the convex outer surface of the support 1406 with their base part directed towards the concave inner side of the light source support 1406. Consequently, the light beams generated by the LEDs point in different directions, providing uniform illumination over a relatively wide divergence angle suitable for many lighting applications.
The lamp 100 is made by executing a lamp production process, as shown in
As shown in
After the cup array 600 has been formed, an array 900 of contact loops or rings 902 is formed at step 504 by stamping, etching, laser cutting, or some other form of machining, or whichever method was used to form the cup array 600, except that the sheet metal from which the contact rings 902 are formed is thinner that that used in the cups 602 because the contact rings 902 do not need to conduct heat. As shown in
The outer dimensions of each contact ring 902 are the same as those of the rim 804 and contact tab 810 of each cup 602. Although the cup rims 804 and contact loops or rings 902 are shown having a generally keyhole-like shape comprising a circular annular loop with a sharply-defined outwardly projecting contact area 810,1102, other shapes can be alternatively used, although it is preferred that the cup rims and contact loops have at least the same outer shape so that they can be easily aligned relative to each other. For example, alternative embodiments can be devised in which the annular cup rims and contact loops are not circular in shape, but could alternatively be oval, square, or rectangular annular loops, for example. Furthermore, although it is preferred that the loops are closed, it can be envisaged that the loops could be open loops including a small gap.
At step 506, an array (not shown) of loop or ring-shaped insulators 1302 having the same dimensions (with the possible exception of thickness) and orientation as the contact rings 602 is formed from a sheet of electrically insulating material such as Polyimide. Alternatively, the sheet of insulation can be formed as an array of circular holes having the same diameter as the inner diameter of the contact rings 602. In either case, excess insulation is trimmed from the assembly in a later operation, as described below.
The steps for producing the cup assembly 1200 from the cup array 600, the contact ring array 900, and the insulator array are as follows. At step 508, the insulators 1302 of the insulator array are permanently attached to respective rims 804 of the cup array 600, and at step 510, the contact rings 902 of the contact ring array 900 are permanently attached to the insulators 1302 of the insulator array. These attachments are achieved using a standard adhesive such as a pressure sensitive thermosetting type. The result is that the contact rings 902 lie over, and are electrically insulated from, the rims 804 of the cups 602.
Alternatively, insulators can be formed by wiping the rims 804 of the cups with a pad saturated with a suitable liquid phase insulator, or by direct screen printing. Suitable insulation materials include uncured epoxy which can be polymerised at relatively low temperatures, or semi-cured thermosetting epoxy. In this case, the contact ring array 900 can be applied to the insulators while they are uncured or semi-cured so that the curing process bonds the contact rings 902 to the rims 804 of the cups 602 via the insulation.
At step 512, the joining portions 1004 of the contact ring array 900 are cut to separate the contact rings 902 from the array 900. At step 514, an LED 1202 is attached to the base 802 of each cup 602 by a conductive adhesive. Each LED 1202 includes two terminals or contacts for providing electrical current to the LED 1202. At step 516, one or more electrical contacts of a first polarity are electrically connected to the contact tab 1102 of the corresponding contact ring 902 by first gold wires 1204, and one or more contacts of a second polarity are connected to the inside surface of the corresponding cup 602 by second gold wires 1206. The gold wire connections 1204, 1206 are formed by standard wire bonding methods. The result of these steps is referred to as an intermediate cup assembly.
Alternatively, if each LED 1202 includes a contact pad on its underside, it will be apparent that the second bonding wires 1206 between the LED chips and the cups are not required, because in such a case the conductive adhesive that attaches the LED die 1202 to the cup 602 provides an electrical connection of the second polarity.
At step 518, the LEDs 1202 and corresponding contact wires 1204, 1206 are encapsulated in an optically transparent medium 1208 to protect the LEDs 1202 and bonding wires 1204, 1206. As shown in
The encapsulation 1208 is formed by a standard moulding method such as transfer moulding, book moulding or plate moulding, using a thermosetting encapsulant. The mould (not shown) used to form the encapsulants 1208 includes an array of mould cavities dimensioned to receive a composite array of cups 602, insulators 1302, and contact rings 902, complete with attached LEDs 1202 and bonding wires 1204, 1206.
In an alternative embodiment, a contact ring 3000 is formed having an inner opening that is not completely circular, but rather is truncated on the part of the opening near the contact area 3002 of the contact ring 3000, as shown in
In either case, the encapsulation material is selected to have high thermal conductivity, high electrical resistivity, a low coefficient of thermal expansion, high transmission of visible light, high refractive index, high tolerance to near-UV radiation, good temperature stability and low water absorption. Moulding processes that use material other than thermosetting material are generally less desirable for various reasons. In particular, thermoplastic moulding may cause delicate components to fail by subjecting them to excessive pressure and/or thermal budget (i.e., temperature/time combination). To address this difficulty, the array of encapsulants 1208 can alternatively be pre-formed and then attached to each intermediate cup assembly. This greatly increases the range of suitable encapsulant materials because the pre-formed modules can be produced from a wider range of materials and processes requiring high temperatures and/or pressures.
Each cup assembly 1200 of the resulting array of cup assemblies 1200 is then separated from the array at step 520 by cutting the sheet metal joining portions 704 of the cup array 900, the contact ring joining portions 1004, and any excess insulation, along the cutting path 706. At step 522, the individual cup assemblies 1200 are then attached to a tape handling system. This completes the cup assembly process 402.
Each cup assembly 1200 constitutes an individually operable light source that is easy to handle and can be used in a variety of applications in addition to the lamp described herein. Because the two contact regions of the LED 1202 are electrically connected to the cup body 602 and the contact ring 902, respectively, further electrical connections necessary for providing power to the LED 1202 can be made easily by applying electrical contacts to the cup body 602 and the contact ring 902. Unlike the electrical connections made to the contact areas of the LED 1202, these contacts can be made with macroscopic connectors and do not need to be located with great precision. The cup assemblies 1200 are robust because the gold contact wires 1204, 1206 and the LED 1202 are protected by the encapsulant 1208.
A cup assembly 1200 provides light when an electrical current passes through the LED 1202. This is achieved by impressing electrical energy of an appropriate first polarity on the contact tab 1102 of the contact ring 24, and simultaneously applying electrical energy of a second, opposite polarity to the electrically conductive cup 602.
The cup assemblies 1200 provide an effective means of both electrical and thermal conduction through the body of the cup 602. It is important that the heat generated by the action of electrical current flowing through the cup assembly 1200 be effectively conducted away from the LED 1202 for a number of reasons. For example, the efficiency of light generation in the LED 1200 decreases with increasing temperature. Moreover, high temperatures may also cause failures of lamp assembly components; for example, by fracturing the bonding wires 1204, 1206, or detaching the LED chip 1202 from the cup base 802 by virtue of different rates of thermal expansion. Even if there is no catastrophic failure of the cup assembly 1200, the efficiency of the LED 1202 may be permanently degraded by operation at excessively high temperatures.
In light of the above, it is desirable to mount the cup assemblies 1200 on a support that is thermally conductive to provide a thermally conductive path along which excess heat can be conducted away, and that is also electrically conductive in order to simplify electrical connection to the cup assemblies 1200.
Returning to
The lead frame 1402 includes a central portion or support 1406 that is deformed out of the plane of the array 1400 so that the central portion 1406 is non-planar and is curved like a dome or part of a spherical shell. The deformation can be performed simultaneously with removal of the portions 1404 (e.g., by stamping), or can be performed in a separate step.
At step 406, two partitions 1500 are cut through the domed central portion or support 1406, dividing it into three support portions 1502, 1504, 1506, as shown in
The cutting of the two partitions 1500 and the nine holes 1522 is performed by machining with a laser beam or other precision cutting process. Each lamp lead frame 1402 is positioned on a table equipped with a multiple axis indexing system, and the cutting tool is operated and moved or rotated in synchronism with the indexing system to produce the partitions 1500 which correspond to the contact lead configuration of the lamp lead frame 1402.
At step 408, three circular openings or holes 1522 are also cut into each of the support portions 1502, 1504, 1506 for receiving respective cup assemblies 1200, as shown in the left-hand support portion 1502 in
In the described embodiment, the cup assemblies 1200 are oriented so that each cup 602 is directly attached and electrically connected to the support portions 1502, 1504, 1506, and light emitted from the cup assemblies 1200 is directed upwards (i.e., generally towards from the viewer in
By mounting the cup assemblies 1200 directly on the support portions 1502, 1504, 1506 using an electrically conductive attachment medium, electrical connections are made between each support portion and the cups 602 (or contact rings 602, if oriented oppositely as described above) of the cup assemblies 1200 mounted on that support portion. Thus electric current can be supplied to each LED 1202 via a first electrical connection to either of the contact leads for the support portion on which the corresponding cup assembly 1200 is mounted, and via a second electrical connection made to the contact ring 602 of that cup assembly 1200. Alternatively, the cup assemblies 1200 can be mounted in the opposite orientation, with the contact rings 602 making the electrical connection to the support portions 1502, 1504, 1506 and a second electrical connection is then made to the cup 602.
As described in International Patent No. PCT/AU03/00724, the second electrical connection could be made using a wire bonder to bond fine (≈25 μm diameter) gold wire to the cup 1200. However, although this wire is sufficient for carrying the relatively small electric current required by a small-area LED (e.g., 20-50 mA), the larger current (e.g., 350-400 mA) required by each of the large-area LEDs 1202, if used in the lamp, requires a gold wire having a cross-sectional area at least 8-20 times larger or, equivalently, at least 3-5 times larger in diameter, or an equivalent number of gold wires used in parallel to make each connection. However, it is expensive to use more gold per item. Aluminium, on the other hand, is not as expensive as gold, but it is not as good a conductor, so that an aluminum bonding wire would need to have a larger diameter than a gold bonding wire carrying the same current. When used with large area LEDs 1202, aluminium wires with sufficient current carrying capacity would have a diameter large enough to make effective bonding difficult to achieve. The installation of multiple parallel wires is time consuming, inconvenient, and expensive.
In the described embodiments, the second electrical connections are made by electrical connectors having predetermined shapes to make electrical connections to the cups 602 of the cup assemblies 1200 mounted on the curved support portions 1502, 1504, 1506. At step 412, an array 1600 of electrical connectors 1602, 1604 is formed from a metal sheet, as shown in
As shown in
At step 414, the annular connectors 1602, 1604 are separated from the array and from each other by removing the tie bars 1706 and shearing the outer joining portions 1708. As shown in
As shown in
At step 415, the contact tabs 1804 to 1908 of the annular connectors 1602, 1604 (except for the inwardly projecting contact tab 1802) are deformed out of the plane of the connectors 1602, 1604, as described below. At step 416, the annular connectors 1602, 1604 are placed concentrically over the curved support portion 1406 of the lamp lead frame 1402 after cup assemblies 1200 have been attached, and the deformed contact tabs 1804 to 1908 make electrical connections as described below.
As shown in
The outwardly projecting contact tabs 1804 of the inner annular connector 1702 at angular positions of 2:00 and 4:00 are deformed downwards at a right angle to the plane of the inner annular connector 1702 to contact the right-hand outer curved support portion 1506. The other outwardly projecting contact tabs 1802 at 12 and 6 o'clock are deformed downwards at a smaller angle (≈30°) and these and the undeformed inwardly projecting contact tab 1806 are positioned such that they correspond with the location, orientation and position in three-dimensional space of the cup contact tabs 810 of the three cup assemblies 1200 attached to the central curved support portion 1504.
Referring now to the contact tabs 1902 to 1908 of the outer annular connector 1704, each of the six inwardly projecting contact tabs 1902, 1904 is deformed upwards to form a step-like shape, and these respectively contact the outwardly directed cup contact tabs 810 of the six cup assemblies mounted on the two outermost curved support portions 1502, 1506.
The first pair of outwardly projecting contact tabs 1906 at respective angular positions of 12:00, and 6:00 are deformed downwards to form a right-angle with the plane of the outer annular connector 1704 to contact the contact leads connected to the central curved support portion 1504.
Finally, the second pair of outwardly projecting contact tabs 1908 at respective angular positions of 1:30 and 4:30 are also deformed downwards to form a right-angle with the plane of the outer annular connector 1704, but these contact the terminal 1520.
The contact tabs 1802 to 1908 are connected electrically to their respective targets by conductive adhesive, soldering, welding, or other suitable means of establishing reliable electrical connection.
At step 418, the outer annular connector 1704 is cut in two to form a left-hand portion 104 and a right-hand portion 106, using a laser cutting tool to remove partition portions 102 in order to complete the desired electrical connections in the lamp assembly 100.
It will be apparent from the above that the components of the lamp assembly 100 are electrically connected as follows, bearing in mind that the contact lead joining portions 1514 shown in FIGS. 1 to 3 will be removed in a later step. Referring to
From there, the current flow is into the right-hand portion 106 of the inner annular connector 1702 via the two contact tabs 1804. The current then flows through this portion 106 of the inner annular connector 1702 and into the cups 602 of the cup assemblies 1200 mounted on the central curved support portion 1504. Once again, the current flows through the LEDs mounted in these cup assemblies 1200, and out through the electrically conductive curved support portion 1504 itself. Electrical access to the central curved support portion 1504 is provided by the corresponding contact leads 1510, and the current flows through these and out into the left-hand portion 104 of the outer annular connector 1704 via the deformed contact tabs 1906. The current then flows through this portion 104 of the outer annular connector 1704 and into the cup assemblies 1200 mounted on the left-hand curved support 1502, through these cup assemblies, through the electrically conductive left-hand curved support 1502, and finally leaving the lamp assembly 100 from the left-hand contact leads 1508. It will be apparent that the direction of current flow depends upon which LED contact is connected to the cup 602 of each cup assembly 1200.
Thus the lamp assembly 100 includes nine cup assemblies 1200 which are arranged in three series-connected groups of three parallel-connected assemblies 1200 with one termination at the terminal contact 1518, and the other at the left-hand contact leads 1508 of the left-hand curved support portion 1502. Each group of three cup assemblies 1200 connected in parallel and connected to one of the curved support portions 1502, 1504, 1506 can be controlled independently of the other two groups by supplying appropriate electrical potentials to respective contact leads 1508, 1510, 1512.
In an alternative embodiment, pre-cut pieces of wire or thin sheet metal 3202, 3204 with a relatively large cross-sectional area similar to that of the annular connectors described above, as shown in FIGS. 32 to 34, are used as the electrical connectors instead of the annular contacts described above. These connectors 3202, 3204 are formed in a predetermined shape by pre-cutting to a desired length using a laser cutting tool, stamping, etching, or other means, followed by deformation to the desired shape. Each of the resulting connectors 3202, 3204 is then positioned with both ends in simultaneous position for attaching to the lamp assembly. Attachment is performed by laser spot welding or other suitable means.
As shown in FIGS. 32 to 34, connection of the supply terminal 1510 to the three respective cup assemblies attached to the right-hand curved support portion 1512 is achieved by installing three long conductors 3202. These long conductors 3202 make connections equivalent to those made by the outwardly projecting contact tabs 1908 and the inwardly projecting contact tabs 1904 shown in FIGS. 1 to 3. Similarly, six short conductors 3204 are installed to connect the cup assemblies 1200 attached to the left-hand curved support portion 1508 and the central curved support portion 1510, and are electrically equivalent to contact tabs 1902, 1906, and 1802, 1804, 1806, respectively. Thus the two embodiments are electrically identical.
After the array of lamp assemblies 100 has been prepared, as represented by the single lamp assembly 100 shown in FIGS. 1 to 3, at step 420 an optical package 2000 is applied to the curved support 1406 and cup assemblies 1200 of each lamp assembly 100, as shown in
At step 422, each lamp assembly 100 and its optical package 2000 is separated from the array, and the contact leads 1508, 1510, 1512 are separated by removing the joining portions 1514, and are formed perpendicular to the lead frame 1402. At step 424, the contact leads 1508, 1510, 1512 of each lamp assembly 100 are clamped between a cover 2102 and a base 2104 of an outer package 2100, as shown in FIGS. 21 to 27. The outer package 2100 is pre-formed by another process and placed around the lamp lead frame 1402 and optical package assembly 2000, as shown in
Returning to
The material and process used to manufacture the outer package 2100 is determined largely by the physical properties required of the package 2100. The material of which the outer package 2100 is made may be ceramic in nature; aluminium nitride (AlN) is preferred as it provides excellent thermal conductivity, but is difficult to work. Alternatively, aluminium dioxide (Al2O3) or a plastic material can be used, depending upon the thermal requirements. For example, a lamp using only LED chips requiring about 50 milliamps each requires only minor heat sinking due to the relatively small amount of heat to be dissipated. For the embodiments described above, this might be equivalent to about one Watt of electrical energy, and a plastic moulding should provide a satisfactory outer package. However, if larger LED chips are used, then the amount of heat to be dissipated could be equivalent to approximately ten Watts, and will therefore require a thermal path with high conductivity such as that provided by a ceramic material.
The cover 2102 and base 2104 of the outer package 2100 are sealed together with sealing material 2106 to hold the lamp lead frame 1402 firmly between them. The sealing material can be semi-cured epoxy, but other materials commonly used to secure ceramic packages can alternatively be used.
In an alternative embodiment, a lamp lead frame 3500 includes an electrically conductive curved support 3508 cut into twelve separated portions, each having an opening for receiving a corresponding cup assembly 1200, as shown in
The common contact leads 3504 are attached to a shared circular ring contact 3506 by contact arms 3510. The circular ring contact 3506 is also attached to the contact ring 902 of each cup assembly 1200, thereby establishing an electrical connection between the common contact leads 3504 and a contact of a first polarity on the LED chip 1202 inside each of the cup assemblies 1200. The LED contact pad of a second polarity is connected to the cup 602 which in turn is in electrical contact with its respective contact lead 3502.
In yet a further alternative embodiment, a lamp lead frame 3600 includes an electrically conductive curved support 3602 having twelve openings for receiving respective cup assemblies 1200, as shown in
This arrangement therefore establishes an electrical connection between LED contact pads of a first polarity and the common contact leads 3606. Connections of a second respective polarity are made between the contact rings 902 of the cup assemblies 1200 and the respective contact leads 3604 by a first contact lead frame including parts 3608, 3610, 3612, and a second contact lead frame including parts 3614, 3616, 3618. These two contact lead frames are initially formed in a single piece and are shaped and formed to match the relative locations in three-dimensional space of the corresponding contact regions of the respective cup assemblies. To allow a separate electrical circuit to be established for each cup assembly 1200, partitions 3620 are subsequently made by cutting the contact lead frames with a laser cutting tool after the contact lead frames have been attached.
As described above, the cup assemblies 1200 described herein are not only useful with the lamp assemblies described herein, but can be used in a wide variety of other arrangements and applications. For example, the cup assemblies 1200 can be mounted in a metal cored printed circuit board (MCPCB). The MCPCB has a circuit of tracks on one side of the board which are electrically insulated from the metal core, and which can be electrically connected by standard means to the contact area 1102 of the contact ring 902 to make a first connection. A second electrical connection is established between the all of the cups 602 on the MCPCB and the metal core of the MCPCB. The metal core performs two functions: it not only provides a means of making electrical contact with the cup assemblies 1200, but also acts as a heat sink for the LEDs 1202 which are in close thermal contact with it.
Many modifications will be apparent to those skilled in the art without departing from the scope of the present invention as herein described with reference to the accompanying drawings.
Number | Date | Country | Kind |
---|---|---|---|
2003901114 | Mar 2003 | AU | national |
2003902895 | Jun 2003 | AU | national |
Filing Document | Filing Date | Country | Kind |
---|---|---|---|
PCT/AU04/000283 | 3/5/2004 | US |
Number | Date | Country | |
---|---|---|---|
20070087643 A1 | Apr 2007 | US |