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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/49109outside the semiconductor or solid-state body

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Method of forming a packaged semiconductor device having enhanced w...
- Patent number 12,300,582
- Issue date May 13, 2025
- Amkor Technology Singapore Holding Pte Ltd.
- Pedro Joel Rivera-Marty
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Siliconized heterogeneous optical engine
- Patent number 12,292,605
- Issue date May 6, 2025
- Rockley Photonics Limited
- Seungjae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 12,255,127
- Issue date Mar 18, 2025
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Hidekazu Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,237,250
- Issue date Feb 25, 2025
- Samsung Electronics Co., Ltd.
- Dongkyu Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,166,007
- Issue date Dec 10, 2024
- Samsung Electronics Co., Ltd.
- Byeonguk Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,165,960
- Issue date Dec 10, 2024
- Rohm Co., Ltd.
- Hiroaki Matsubara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting device package
- Patent number 12,119,437
- Issue date Oct 15, 2024
- Samsung Electronics Co., Ltd.
- Soonwon Jeong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
LED assembly
- Patent number 11,949,050
- Issue date Apr 2, 2024
- Epistar Corporation
- Tzer-Perng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die stack having bent wires and vertical wires and a...
- Patent number 11,908,825
- Issue date Feb 20, 2024
- SK hynix Inc.
- Jeong Hyun Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a packaged semiconductor device having enhanced w...
- Patent number 11,862,539
- Issue date Jan 2, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Pedro Joel Rivera-Marty
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices with package-level configurability
- Patent number 11,848,323
- Issue date Dec 19, 2023
- Micron Technology, Inc.
- James E. Davis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,824,036
- Issue date Nov 21, 2023
- Kioxia Corporation
- Akihiro Iida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging structure and packaging method of digital circuit
- Patent number 11,791,232
- Issue date Oct 17, 2023
- THE 13TH RESEARCH INSTITUTE OF CHINA ELECTRONICS TECHNOLOGY GROUP CORPORATION
- Bo Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including semiconductor chips
- Patent number 11,791,303
- Issue date Oct 17, 2023
- Samsung Electronics Co., Ltd.
- Hyungu Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,699,641
- Issue date Jul 11, 2023
- Rohm Co., Ltd.
- Hiroaki Matsubara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Configurable, power supply voltage referenced single-ended signalin...
- Patent number 11,689,246
- Issue date Jun 27, 2023
- RAMBUS INC.
- John W. Poulton
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor package including semiconductor chips
- Patent number 11,569,193
- Issue date Jan 31, 2023
- Samsung Electronics Co., Ltd.
- Hyungu Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
LED assembly with omnidirectional light field
- Patent number 11,543,081
- Issue date Jan 3, 2023
- Epistar Corporation
- Hong-Zhi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Noble metal-coated silver wire for ball bonding and method for prod...
- Patent number 11,456,271
- Issue date Sep 27, 2022
- TANAKA DENSHI KOGYO K.K.
- Jun Chiba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
LED assembly for omnidirectional light applications
- Patent number 11,450,791
- Issue date Sep 20, 2022
- Epistar Corporation
- Tzer-Perng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor light emitting device
- Patent number 11,417,812
- Issue date Aug 16, 2022
- Rohm Co., Ltd.
- Dai Miyazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a packaged semiconductor device having enhanced w...
- Patent number 11,410,916
- Issue date Aug 9, 2022
- Amkor Technology Singapore Holding Pte Ltd.
- Pedro Joel Rivera-Marty
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting device
- Patent number 11,367,994
- Issue date Jun 21, 2022
- Nichia Corporation
- Takuya Hashimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-die integrated circuit packages and methods of manufacturing...
- Patent number 11,328,984
- Issue date May 10, 2022
- Texas Instruments Incorporated
- You Chye How
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including processor chip and memory chip
- Patent number 11,309,300
- Issue date Apr 19, 2022
- Samsung Electronics Co., Ltd.
- Kil-Soo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low profile transducer module
- Patent number 11,267,698
- Issue date Mar 8, 2022
- Infineon Technologies AG
- Horst Theuss
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Light source device
- Patent number 11,262,060
- Issue date Mar 1, 2022
- Lite-On Opto Technology (Changzhou) Co., Ltd.
- Hsin-Wei Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 11,189,549
- Issue date Nov 30, 2021
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Hidekazu Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plurality of lead frames electrically connected to inductor chip
- Patent number 11,177,198
- Issue date Nov 16, 2021
- Rohm Co., Ltd.
- Hiroaki Matsubara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gas sensor package
- Patent number 11,125,734
- Issue date Sep 21, 2021
- Samsung Electronics Co., Ltd.
- Inho Choi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250239559
- Publication date Jul 24, 2025
- Mitsubishi Electric Corporation
- Takashi TSUBAKIDANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250201755
- Publication date Jun 19, 2025
- Samsung Electronics Co., Ltd.
- Kihong Jeong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20250183126
- Publication date Jun 5, 2025
- Panasonic Intellectual Property Management Co., Ltd.
- Hidekazu NAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT AND DEVICE INCLUDING THE ELECTRONIC COMPONENT
- Publication number 20250183220
- Publication date Jun 5, 2025
- Canon Kabushiki Kaisha
- YU KATASE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250167084
- Publication date May 22, 2025
- Dongkyu Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A PACKAGED SEMICONDUCTOR DEVICE HAVING ENHANCED W...
- Publication number 20250167080
- Publication date May 22, 2025
- Amkor Technology Singapore Holding Pte. Ltd.
- Pedro Joel Rivera-Marty
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20250167092
- Publication date May 22, 2025
- Advanced Semiconductor Engineering, Inc.
- Yung-Li LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTELLIGENT POWER MODULE ARRANGEMENT
- Publication number 20250118634
- Publication date Apr 10, 2025
- Infineon Technologies Austria AG
- Chang Young PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIREBOND MULTICHIP PACKAGE
- Publication number 20250112197
- Publication date Apr 3, 2025
- MEDIATEK INC.
- Yu-Liang Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250062199
- Publication date Feb 20, 2025
- ROHM CO., LTD.
- Hiroaki MATSUBARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240347499
- Publication date Oct 17, 2024
- Samsung Electronics Co., Ltd.
- Hongjin KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PASSIVE ELEMENT AND ELECTRONIC DEVICE
- Publication number 20240282866
- Publication date Aug 22, 2024
- SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
- Kento KAWASAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240234402
- Publication date Jul 11, 2024
- ROHM CO., LTD.
- Isamu NISHIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Light-Receiving Element and Light Receiving Circuit
- Publication number 20240222532
- Publication date Jul 4, 2024
- Nippon Telegraph and Telephone Corporation
- Atsushi Kanda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A PACKAGED SEMICONDUCTOR DEVICE HAVING ENHANCED W...
- Publication number 20240203839
- Publication date Jun 20, 2024
- Amkor Technology Singapore Holding Pte. Ltd
- Pedro Joel Rivera-Marty
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Die Attach with Adhesive Layer C...
- Publication number 20240194628
- Publication date Jun 13, 2024
- STATS ChipPAC Pte Ltd.
- YongMoo Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDABLE PILLARS FOR WIRE BONDS IN A SEMICONDUCTOR PACKAGE
- Publication number 20240194630
- Publication date Jun 13, 2024
- Micron Technology, Inc.
- See Hiong LEOW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240164118
- Publication date May 16, 2024
- RENESAS ELECTRONICS CORPORATION
- Kazuaki TSUCHIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240145413
- Publication date May 2, 2024
- SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
- Makoto NISHIHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240136347
- Publication date Apr 25, 2024
- ROHM CO., LTD.
- Isamu NISHIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIELECTRIC INTERPOSER WITH ELECTRICAL-CONNECTION CUT-IN
- Publication number 20240128182
- Publication date Apr 18, 2024
- Micron Technology, Inc.
- Chin Hui Chong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDS FOR GALVANIC ISOLATION DEVICE
- Publication number 20240113155
- Publication date Apr 4, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Jeffrey Alan West
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Comprising a Leadframe Adapted for Higher Curr...
- Publication number 20240112993
- Publication date Apr 4, 2024
- Infineon Technologies Austria AG
- Stefan Schwab
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING MEMORY DIE STACK HAVING CLOCK SIGNA...
- Publication number 20240038295
- Publication date Feb 1, 2024
- Samsung Electronics Co., Ltd.
- Youngdo Um
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230411366
- Publication date Dec 21, 2023
- KIOXIA Corporation
- Masayuki MIURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Semiconductor Module and Manufacturing Method
- Publication number 20230317684
- Publication date Oct 5, 2023
- Hitachi Energy Switzerland AG
- Harald Beyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING SEMICONDUCTOR CHIPS
- Publication number 20230154886
- Publication date May 18, 2023
- Samsung Electronics Co., Ltd.
- Hyungu KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADFRAME PACKAGE WITH METAL INTERPOSER
- Publication number 20230134332
- Publication date May 4, 2023
- MEDIATEK INC.
- Chu-Chia Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A PACKAGED SEMICONDUCTOR DEVICE HAVING ENHANCED W...
- Publication number 20230026949
- Publication date Jan 26, 2023
- Amkor Technology Singapore Holding Pte. Ltd.
- Pedro Joel Rivera-Marty
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LED ASSEMBLY
- Publication number 20230012204
- Publication date Jan 12, 2023
- EPISTAR CORPORATION
- TZER-PERNG CHEN
- H01 - BASIC ELECTRIC ELEMENTS

outside the semiconductor or solid-state body

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method of forming a packaged semiconductor device having enhanced w...

Siliconized heterogeneous optical engine

Semiconductor device and method for manufacturing the same

Semiconductor package

Semiconductor package

Semiconductor device

Light emitting device package

LED assembly

Semiconductor die stack having bent wires and vertical wires and a...

Method of forming a packaged semiconductor device having enhanced w...

Semiconductor devices with package-level configurability

Semiconductor device

Packaging structure and packaging method of digital circuit

Semiconductor package including semiconductor chips

Semiconductor device

Configurable, power supply voltage referenced single-ended signalin...

Semiconductor package including semiconductor chips

LED assembly with omnidirectional light field

Noble metal-coated silver wire for ball bonding and method for prod...

LED assembly for omnidirectional light applications

Semiconductor light emitting device

Method of forming a packaged semiconductor device having enhanced w...

Light emitting device

Multi-die integrated circuit packages and methods of manufacturing...

Semiconductor package including processor chip and memory chip

Low profile transducer module

Light source device

Semiconductor device and method for manufacturing the same

Plurality of lead frames electrically connected to inductor chip

Gas sensor package

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

ELECTRONIC COMPONENT AND DEVICE INCLUDING THE ELECTRONIC COMPONENT

SEMICONDUCTOR PACKAGE

METHOD OF FORMING A PACKAGED SEMICONDUCTOR DEVICE HAVING ENHANCED W...

ELECTRONIC DEVICE

INTELLIGENT POWER MODULE ARRANGEMENT

WIREBOND MULTICHIP PACKAGE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE

PASSIVE ELEMENT AND ELECTRONIC DEVICE

SEMICONDUCTOR DEVICE

Light-Receiving Element and Light Receiving Circuit

METHOD OF FORMING A PACKAGED SEMICONDUCTOR DEVICE HAVING ENHANCED W...

Semiconductor Device and Method of Die Attach with Adhesive Layer C...

BONDABLE PILLARS FOR WIRE BONDS IN A SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

DIELECTRIC INTERPOSER WITH ELECTRICAL-CONNECTION CUT-IN

WIRE BONDS FOR GALVANIC ISOLATION DEVICE

Semiconductor Device Comprising a Leadframe Adapted for Higher Curr...

SEMICONDUCTOR PACKAGE INCLUDING MEMORY DIE STACK HAVING CLOCK SIGNA...

SEMICONDUCTOR DEVICE

Power Semiconductor Module and Manufacturing Method

SEMICONDUCTOR PACKAGE INCLUDING SEMICONDUCTOR CHIPS

LEADFRAME PACKAGE WITH METAL INTERPOSER

METHOD OF FORMING A PACKAGED SEMICONDUCTOR DEVICE HAVING ENHANCED W...

LED ASSEMBLY