Patent Grant
9701563
The area of laser processing of materials encompasses a wide variety of applications that involve cutting, drilling, milling, welding, melting, etc. and different types of materials. Among these applications, one that is of particular interest is cutting or separating different types of substrates such as multi-layered composite fusion drawn glass substrates.
From process development and cost perspectives there are many opportunities for improvement in cutting and separation of composite glass substrates. It is of great interest to have a faster, cleaner, cheaper, more repeatable and more reliable method of glass separation than is currently practiced in the market today. Among several alternative technologies, laser separation has been successfully demonstrated using different approaches. The techniques range from: 1) actual removal of material between the boundaries of the desired part (or parts) and its matrix; 2) creation of defects within the bulk of the material to weaken or seed it with cracking initiation points along the perimeter of the desired profile followed by a secondary breaking step; and 3) propagation of an initial crack by thermal stress separation. These laser cutting processes have demonstrated the potential economic and technical advantages such as precision, good edge finish, and low residual stress compared to competing technologies (mechanical scribing and breaking, high pressure water jet and ultrasonic milling, etc).
There is nevertheless a continuing need for an improved process for cutting and separating multi-layered composite fusion drawn glass substrates.
The present application relates to the production of cut composite glass articles with finished edges, and the method of cutting the articles with one or more lasers.
In one embodiment, a method of laser processing a fusion formed glass composite workpiece includes focusing a pulsed laser beam into a laser beam focal line oriented along the beam propagation direction and directed into the fusion formed glass composite workpiece, the laser beam focal line generating an induced absorption within the workpiece, and the induced absorption producing a defect line along the laser beam focal line within the workpiece. The method also includes translating the workpiece and the laser beam relative to each other along a contour, thereby forming a plurality of defect lines within the workpiece, the defect lines being spaced apart by a distance between 0.5 micron and 20 microns. The laser beam focal line can have a length in a range of between 0.01 mm and about 100 mm. More preferably, the focal line length can be in a range of between about 0.1 mm and about 10 mm. Even more preferably, the laser beam focal line has a length in a range of between about 0.1 mm and about 1 mm. The pulsed laser beam can have an average laser energy measured, at the material, greater than 40 μJ per mm thickness of material. In another embodiment, a glass article is made by the above method.
In another embodiment, a glass article includes a glass composite having a first surface, a second surface, and at least one edge having a plurality of defect lines extending at least 250 microns between the first and second surfaces. Each of the defect lines has a diameter less than or equal to about 5 microns. The glass composite can be a fusion formed glass composite. The spacing of adjacent defect lines can be between 0.1 micron and 20 microns. The glass article can include three layers, with the outermost layers including a first composition with a coefficient of thermal expansion CTE1, and a thickness TH1; an inner layer situated between the outermost layers and including a second composition that is different from the first composition and has a coefficient of thermal expansion CTE2, and a thickness TH2; and wherein CTE1 can be greater than CTE2. The outermost glass layers can be under compressive stress, and the inner layer can be under tensile stress, and the ratio of TH2 to TH1 can be between 4 and 20. The glass article can have a central tension of the inner layer greater than 5 megapascals (MPa), and the defect lines can extend the full thickness of the edge. The edge can have an Ra surface roughness less than about 0.5 micron, and the edge can have subsurface damage up to a depth less than or equal to about 75 microns.
The combination of the fusion formed composite glass sheets and the laser cutting methods described below yields a composite glass article with superior edge strength, 4-point bend strength, and surface finish with negligible debris and minimum damage to part edges that preserves strength.
The present disclosure extends to:
A method of laser processing a fusion formed glass composite workpiece, the method comprising:
focusing a pulsed laser beam into a laser beam focal line oriented along the beam propagation direction and directed into the fusion formed glass composite workpiece, the laser beam focal line generating an induced absorption within the workpiece, and the induced absorption producing a defect line along the laser beam focal line within the workpiece; and
translating the workpiece and the laser beam relative to each other along a contour, thereby forming a plurality of defect lines within the workpiece, the defect lines being spaced apart by a distance between 0.5 micron and 20 microns.
The present disclosure extends to:
A glass article comprising: a glass composite having a first surface, a second surface, and at least one edge having a plurality of defect lines extending at least 250 microns between the first and second surfaces, the defect lines each having a diameter less than or equal to about 5 microns.
The foregoing will be apparent from the following more particular description of example embodiments, as illustrated in the accompanying drawings in which like reference characters refer to the same parts throughout the different views. The drawings are not necessarily to scale, emphasis instead being placed upon illustrating exemplary embodiments.
FIGS. 3B1-4 illustrate various possibilities to process the substrate by differently positioning the laser beam focal line relative to the substrate or workpiece.
A description of example embodiments follows.
Embodiments described herein relate to methods for cutting and separating arbitrary shapes of thin substrates of transparent materials, particularly tailored composite fusion drawn glass sheets. The materials should preferably be substantially transparent to the selected laser wavelength (i.e., absorption less than about 10% and preferably less than about 1% per mm of material depth). The laser method can be tailored for manual separation of the parts from the panel or full laser separation by thermal stressing the desired profile. The self-separation method involves the utilization of an ultra-short pulse laser that can be followed by a CO2 laser (coupled with high pressure air flow) for fully automated separation.
A goal of the cutting is to provide precision cutting and separation of arbitrary shapes articles both with and without internal holes or slots out of thin substrate of composite glass. The process separates parts in a controllable fashion with negligible debris and minimum defects and low subsurface damage to the edges of the separated parts. Minimal defects and low subsurface damage at the edges of the separated part preserves part strength and prevents part failure upon external impacts. The laser method is well suited to materials that are transparent to the selected laser wavelength. Demonstrations of the cutting method have been made using composite sheets of between 0.7 mm and 1.2 mm in sheet thickness, but it is conceived that composite sheets of any thickness may be cut using the disclosed method.
Subsurface damage, which includes small microcracks and material modifications caused by a cutting process and which are oriented roughly perpendicular to a cut surface, is a concern for the edge strength of glass or other brittle materials.
As used herein, subsurface damage refers to the maximum size (e.g. length, width, diameter) of structural imperfections in the perimeter surface of the part separated from the substrate or material subjected to laser processing in accordance with the present disclosure. Since the structural imperfections extend from the perimeter surface, subsurface damage may also be regarded as the maximum depth from the perimeter surface in which damage from laser processing in accordance with the present disclosure occurs. The perimeter surface of the separated part may be referred to herein as the edge or the edge surface of the separated part. The structural imperfections may be cracks or voids and represent points of mechanical weakness that promote fracture or failure of the part separated from the substrate or material. By minimizing the size of subsurface damage, the present method improves the structural integrity and mechanical strength of separated parts.
The depth of subsurface damage can be measured by using a confocal microscope to look at the cut surface, the microscope having an optical resolution of a few nm. Surface reflections are ignored, while cracks are probed within the material, the cracks showing up as bright lines. The microscope is focused into the material until there are no more “sparks,” collecting images at regular intervals. The images are manually processed by looking for cracks and tracing them through the depth of the glass to determine a maximum depth (typically measured in microns) of subsurface damage. There are typically many thousands of microcracks, so typically only the largest microcracks are measured. This process is typically repeated on about 5 locations of a cut edge. Although the microcracks are roughly perpendicular to the cut surface, any cracks that are directly perpendicular to the cut surface may not be detected by this method.
With the methods described herein, sub-surface damage is minimized and limited to a small region in the vicinity of the edge. Sub-surface damage may be limited to a depth relative to the surface of an edge of 100 μm or less, or 75 μm or less, or 60 μm or less, or 50 μm or less, and the cuts may produce only low debris. Cutting of a transparent material with a laser in accordance with the present disclosure may also be referred to herein as drilling or laser drilling or laser processing.
The fundamental step of the laser method is to create a fault line that delineates the desired shape of a part and establishes a path of least resistance for crack propagation and hence separation and detachment of the shaped part from its surrounding substrate matrix. The fault line consists of a series of closely spaced defect lines (also referred to herein as perforations, holes, or damage tracks) that are formed by a laser. The laser separation method can be tuned and configured to enable manual or mechanical separation, partial separation or total separation of glass parts of desired shapes out of the original substrate.
In the first step the material (e.g. object or workpiece) to be processed is irradiated with an ultra-short pulsed laser beam that is condensed into a high aspect ratio line focus (referred to herein as a laser beam focal line) that penetrates the substrate. Within this volume of high energy density laser irradiation, the material is modified via nonlinear effects. It is important to note that optical intensity above a critical threshold is needed to induce nonlinear absorption. Below the critical intensity threshold, the material is transparent to the laser radiation and remains in its original state. By scanning the laser over a desired line or path we create a fault line (a few microns wide) consisting of a series of defect lines. The fault line defines the perimeter or shape of a part to be separated in a subsequent processing step.
The selection of a laser source is predicated on the ability to induce nonlinear absorption in transparent materials, including fusion formed glass composite workpieces. Nonlinear absorption includes multi-photon absorption (MPA). MPA is the simultaneous absorption of multiple (two or more) photons of identical or different frequencies in order to excite a material from a lower energy state (usually the ground state) to a higher energy state (excited state). The excited state may be an excited electronic state or an ionized state. The energy difference between the higher and lower energy states of the material is equal to the sum of the energies of the two or more photons. MPA is a nonlinear process that is generally several orders of magnitude weaker than linear absorption. It differs from linear absorption in that the strength of MPA depends on the square or higher power of the light intensity, thus making it a nonlinear optical process. At ordinary light intensities, MPA is negligible. If the light intensity (energy density) is extremely high (above the critical threshold), such as in the region of focus of a laser source (particularly a pulsed laser source) including the laser beam focal line described herein, MPA becomes appreciable and leads to measurable effects in the material within the region where the energy density of the light source is sufficiently high. Within the focal region, the energy density may also be sufficiently high to result in ionization.
At the atomic level, the ionization of individual atoms has discrete energy requirements. Several elements commonly used in glass (e.g., Si, Na, K) have relatively low ionization energies (˜5 eV). Without the phenomenon of MPA, a wavelength of about 248 nm would be required to create linear ionization at ˜5 eV. With MPA, ionization or excitation between states separated in energy by ˜5 eV can be accomplished with wavelengths longer than 248 nm. For example, photons with a wavelength of 532 nm have an energy of ˜2.33 eV, so two photons with wavelength 532 nm can induce a transition between states separated in energy by ˜4.66 eV in two-photon absorption (TPA), for example. Thus, atoms and bonds can be selectively excited or ionized in the regions of a material where the energy density of the laser beam is sufficiently high to induce nonlinear TPA of a laser wavelength having half the required excitation energy, for example.
MPA can result in a local reconfiguration and separation of the excited atoms or bonds from adjacent atoms or bonds. The resulting modification in the bonding or configuration can result in non-thermal ablation and removal of matter from the region of the material in which MPA occurs. This removal of matter creates a structural defect (e.g. a defect line, damage line, or “perforation”) that mechanically weakens the material and renders it more susceptible to cracking or fracturing upon application of mechanical or thermal stress. By controlling the placement of perforations, a contour or path along which cracking occurs can be precisely defined and precise micromachining of the material can be accomplished. The contour defined by a series of perforations may be regarded as a fault line and corresponds to a region of structural weakness in the material. In one embodiment, micromachining includes separation of a part from the material processed by the laser, where the part has a precisely defined shape or perimeter determined by a closed contour of perforations formed through MPA effects induced by the laser. As used herein, the term closed contour refers to a perforation path formed by the laser line, where the path intersects with itself at some location. An internal contour is a path formed where the resulting shape is entirely surrounded by an outer portion of material.
The preferred laser is an ultrashort pulsed laser (pulse durations on the order tens of picoseconds or shorter) that can be operated in pulse mode or burst mode. In pulse mode, a series of nominally identical single pulses is emitted from the laser and directed to the workpiece. In pulse mode, the repetition rate of the laser is determined by the spacing in time between the pulses. In burst mode, bursts of pulses are emitted from the laser, where each burst includes two or more pulses (of equal or different amplitude). In burst mode, pulses within a burst are separated by a first time interval (which defines a pulse repetition rate for the burst) and the bursts are separated by a second time interval (which defines a burst repetition rate), where the second time interval is typically much longer than the first time interval. As used herein (whether in the context of pulse mode or burst mode), time interval refers to the time difference between corresponding parts of a pulse or burst (e.g. leading edge-to-leading edge, peak-to-peak, or trailing edge-to-trailing edge). Pulse and burst repetition rates are controlled by the design of the laser and can typically be adjusted, within limits, by adjusting operating conditions of the laser. Typical pulse and burst repetition rates are in the kHz to MHz range.
The laser pulse duration (in pulse mode or for pulses within a burst in burst mode) may be 10−10 s or less, or 10−11 s or less, or 10−12 s or less, or 10−13 s or less. In the exemplary embodiments described herein, the laser pulse duration is greater than 10−15.
The perforations may be spaced apart and precisely positioned by controlling the velocity of a substrate or stack relative to the laser through control of the motion of the laser and/or the substrate or stack. As an example, in a thin transparent substrate moving at 200 mm/sec exposed to a 100 kHz series of pulses (or bursts of pulses), the individual pulses would be spaced 2 microns apart to create a series of perforations separated by 2 microns. This defect line (perforation) spacing is sufficiently close to allow for mechanical or thermal separation along the contour defined by the series of perforations. Distance between adjacent defect lines along the direction of the fault lines can, for example, be in the range from 0.25 μm to 50 μm, or in the range from 0.50 μm to about 20 μm, or in the range from 0.50 μm to about 15 μm, or in the range from 0.50 μm to 10 μm, or in the range from 0.50 μm to 3.0 μm or in the range from 3.0 μm to 10 μm.
Once the fault line with vertical defects is created, separation can occur via: 1) manual or mechanical stress on or around the fault line; the stress or pressure should create tension that pulls both sides of the fault line apart to break the areas that are still bonded together; 2) using a heat source, create a stress zone around the fault line to put the vertical defect line in tension and induce partial or total self-separation. In both cases, separation depends on several of the process parameters, such as laser scan speed, laser power, parameters of lenses, pulse width, repetition rate, etc.
Fusion formed glass composite sheets can be made by a multi-layer fusion draw system. As shown in
The present disclosure is concerned with separation of parts (also referred to herein as articles) from composite glass sheets, such as those with tailored core and cladding regions of the type shown in
Representative core glass compositions comprise: about 60 mol % to about 75 mol % SiO2, about 2 mol % to about 11 mol % Al2O3, 0 mol % to about 11 mol % B2O3, 0 mol % to about 1 mol % Na2O, about 1 mol % to about 18 mol % K2O, 0 mol % to about 7 mol % MgO, 0 mol % to about 9 mol % CaO, about 1 mol % to about 8 mol % SrO, 0 mol % to about 4 mol % BaO, and, about 3 mol % to about 16 mol % R′O, wherein R′O comprises the combined mol % of MgO, CaO, SrO, and BaO in the composition. A specific core glass composition is shown in Table 2.
Laser drilling and separation of fusion formed glass composite sheets shown in
The laser cutting method relies on the material transparency to the laser wavelength in the linear intensity regime, or low laser intensity, which allows maintenance of high surface quality and reduced subsurface damage created by the area of high intensity around the laser focus. An edge of a workpiece can have subsurface damage up to a depth less than or equal to about 75 microns, for example, by using the methods described herein. One of the key enablers of this process is the high aspect ratio of the defect created by the ultra-short pulsed laser. It allows creation of a defect line that extends from the top to the bottom surfaces of the material to be cut. In principle, the defect line can be created by a single pulse or a single burst of pulses and if desired, additional pulses or bursts can be used to form the defect line or to increase the extension of the affected area (e.g. depth and width).
The method to cut and separate transparent materials is essentially based on creating a fault line in the material to be processed with an ultra-short pulsed laser, where the fault consists of a series of defect lines arranged to define the desired perimeter of a part to be separated from the material. Depending on the material properties (absorption, CTE, stress, composition, etc.) and laser parameters chosen for processing the material, the creation of a fault line alone may suffice to induce self-separation. In this case, no secondary separation processes, such as tension/bending forces, heating, or CO2 laser, are necessary.
In some cases, a fault line created along a contour defined by a series of perforations or defect lines is not enough to separate the part spontaneously and a secondary step may be necessary. If so desired, a second laser can be used to create thermal stress to separate the part, for example. In the case of fusion formed glass composites, we found that separation can be achieved, after the creation of a fault line, by application of mechanical force or by using a CO2 laser to create thermal stress to effect separation of the part. Another option is to have the CO2 laser only start the separation and finish the separation manually. The optional CO2 laser separation is achieved with a defocused cw laser emitting at 10.6 microns with power adjusted by controlling its duty cycle. Focus change (i.e., extent of defocusing) is used to vary the induced thermal stress by varying the spot size. Defocused laser beams include those laser beams that produce a spot size larger than a minimum, diffraction-limited spot size on the order of the size of the laser wavelength. For example, defocused spot sizes of about 7 mm, 2 mm and 20 mm can be used for CO2 lasers, for example, whose diffraction-limited spot size is much smaller given the emission wavelength of 10.6 microns.
There are several methods to create the defect line. The optical method of forming the line focus can take multiple forms, using donut shaped laser beams and spherical lenses, axicon lenses, diffractive elements, or other methods to form the linear region of high intensity. The type of laser (picosecond, femtosecond, etc.) and wavelength (IR, green, UV, etc.) can also be varied, as long as sufficient optical intensities are reached to create breakdown of the substrate or workpiece material in the region of focus in the substrate material or fusion formed glass composite workpiece through nonlinear optical effects.
In the present application, an ultra-short pulsed laser is used to create a high aspect ratio vertical defect line in a consistent, controllable and repeatable manner. The details of the optical setup that enables the creation of this vertical defect line are described below, and in U.S. Application No. 61/752,489 filed on Jan. 15, 2013, the entire contents of which are incorporated by reference as if fully set forth herein. The essence of this concept is to use an axicon lens element in an optical lens assembly to create a region of high aspect ratio, taper-free microchannels using ultra-short (picoseconds or femtosecond duration) Bessel beams. In other words, the axicon condenses the laser beam into a high intensity region of cylindrical shape and high aspect ratio (long length and small diameter) in the substrate material. Due to the high intensity created with the condensed laser beam, nonlinear interaction of the electromagnetic field of the laser and the substrate material occurs and the laser energy is transferred to the substrate to effect formation of defects that become constituents of the fault line. However, it is important to realize that in the areas of the material where the laser energy intensity is not high (e.g., glass volume of substrate surrounding the central convergence line), the material is transparent to the laser and there is no mechanism for transferring energy from the laser to the material. As a result, nothing happens to the glass or workpiece when the laser intensity is below the nonlinear threshold.
Turning to
As
The defect line is a microscopic (e.g., >100 nm and <0.5 micron in diameter) elongated “hole” (also referred to herein as perforations or damage tracks) in a substantially transparent material that is created using a one or more high energy pulses or one or more bursts of high energy pulses. The perforations represent regions of the substrate material modified by the laser. The laser-induced modifications disrupt the structure of the substrate material and constitute sites of mechanical weakness. Structural disruptions include compaction, melting, dislodging of material, rearrangements, and bond scission. The perforations extend into the interior of the substrate material and have a cross-sectional shape consistent with the cross-sectional shape of the laser (generally circular). The average diameter of the perforations may be in the range from 0.1 μm to 50 μm, or in the range from 1 μm to 20 μm, or in the range from 2 μm to 10 μm, or in the range from 0.1 μm to 5 μm. In some embodiments, the perforation is a “through hole”, which is a hole or an open channel that extends from the top to the bottom of the substrate material. In some embodiments, the perforation may not be a continuously open channel and may include sections of solid material dislodged from the substrate material by the laser. The dislodged material blocks or partially blocks the space defined by the perforation. One or more open channels (unblocked regions) may be dispersed between sections of dislodged material. The diameter of the open channels is <1000 nm, or <500 nm, or <400 nm, or <300 nm or in the range from 10 nm to 750 nm, or in the range from 100 nm to 500 nm. The disrupted or modified area (e.g, compacted, melted, or otherwise changed) of the material surrounding the holes in the embodiments disclosed herein, preferably has diameter of <50 μm (e.g, <10 μm).
Individual perforations can be created at rates of several hundred kilohertz (several hundred thousand perforations per second), for example. With relative motion between the laser source and the material, the perforations can be placed adjacent to one another (spatial separation varying from sub-micron to several or even tens of microns as desired). This spatial separation (pitch) can be selected to facilitate separation of the material or workpiece. In some embodiments, the defect line is a “through hole”, which is a hole or an open channel that extends from the top to the bottom of the substantially transparent material. The defect line formation is not only local, but extends over the entire length of section 2c of the induced absorption. The length of section 2c (which corresponds to the length of the overlapping of laser beam focal line 2b with substrate 1) is labeled with reference L. The average diameter or extent of the section of the induced absorption 2c (or the sections in the material of substrate 1 undergoing the defect line formation) is labeled with reference D. This average extent D basically corresponds to the average diameter δ of the laser beam focal line 2b, that is, an average spot diameter in a range of between about 0.1 micron and about 5 microns. Spot diameter D of a Bessel beam can be written as D=(2.4048λ)/(2πB), where λ, is the laser beam wavelength and B is a function of the axicon angle.
As
Representative optical assemblies 6, which can be applied to generate the focal line 2b, as well as a representative optical setup, in which these optical assemblies can be applied, are described below. All assemblies or setups are based on the description above so that identical references are used for identical components or features or those which are equal in their function. Therefore only the differences are described below.
To ensure high quality (regarding breaking strength, geometric precision, roughness and avoidance of re-machining requirements) of the surface of the separated part along which separation occurs, the individual focal lines positioned on the substrate surface along the line of separation should be generated using the optical assembly described below (hereinafter, the optical assembly is alternatively also referred to as laser optics). The roughness of the separated surface (or cut edge) is determined primarily by the spot size or the spot diameter of the focal line. Roughness of a surface can be characterized, for example, by an Ra surface roughness parameter defined by the ASME B46.1 standard. As described in ASME B46.1, Ra is the arithmetic average of the absolute values of the surface profile height deviations from the mean line, recorded within the evaluation length. In alternative terms, Ra is the average of a set of absolute height deviations of individual features (peaks and valleys) of the surface relative to the mean.
In order to achieve a small spot size of, for example, 0.5 micron to 2 microns in case of a given wavelength λ of laser 3 (interaction with the material of substrate 1), certain requirements must usually be imposed on the numerical aperture of laser optics 6. These requirements are met by laser optics 6 described below.
In order to achieve the required numerical aperture, the optics must, on the one hand, dispose of the required opening for a given focal length, according to the known Abbé formulae (N.A.=n sin (theta), n: refractive index of the glass or composite workpiece to be processed, theta: half the aperture angle; and theta=arctan (DL/2f); DL: aperture diameter, f: focal length). On the other hand, the laser beam must illuminate the optics up to the required aperture, which is typically achieved by means of beam widening using widening telescopes between the laser and focusing optics.
The spot size should not vary too strongly for the purpose of a uniform interaction along the focal line. This can, for example, be ensured (see the embodiment below) by illuminating the focusing optics only in a small, circular area so that the beam opening and thus the percentage of the numerical aperture only vary slightly.
According to
As illustrated in
Lens 7 is centered on the central beam and is designed as a non-corrected, bi-convex focusing lens in the form of a common, spherically cut lens. The spherical aberration of such a lens may be advantageous. As an alternative, aspheres or multi-lens systems deviating from ideally corrected systems, which do not form an ideal focal point but a distinct, elongated focal line of a defined length, can also be used (i.e., lenses or systems which do not have a single focal point). The zones of the lens thus focus along a focal line 2b, subject to the distance from the lens center. The diameter of aperture 8 across the beam direction is approximately 90% of the diameter of the beam bundle (defined by the distance required for the intensity of the beam to decrease to 1/e2 of the peak intensity) and approximately 75% of the diameter of the lens 7 of the optical assembly 6. The focal line 2b of a non-aberration-corrected spherical lens 7 generated by blocking out the beam bundles in the center is thus used.
One potential disadvantage of this type of a focal line formed by lens 7 and the system shown in
In the case shown in
It is particularly advantageous to position the focal line 2b in such a way that at least one of surfaces 1a, 1b is covered by the focal line, so that the section of induced absorption 2c starts at least on one surface of the substrate. In this way it is possible to achieve virtually ideal cuts while avoiding ablation, feathering and particulation at the surface.
However, the depicted layout is subject to the following restrictions: Since the region of focal line 2b formed by axicon 9 begins within axicon 9, a significant part of the laser energy is not focused into the section of induced absorption 2c of focal line 2b, which is located within the material, in the situation where there is a separation between axicon 9 and the substrate or glass composite workpiece material. Furthermore, length l of focal line 2b is related to the beam diameter through the refractive indices and cone angles of axicon 9. This is why, in the case of relatively thin materials (several millimeters), the total focal line is much longer than the substrate or glass composite workpiece thickness, having the effect that much of the laser energy is not focused into the material.
For this reason, it may be desirable to use an optical assembly 6 that includes both an axicon and a focusing lens.
It is therefore advantageous if the focal line is formed at a certain distance from the laser optics, and if the greater part of the laser radiation is focused up to a desired end of the focal line. As described, this can be achieved by illuminating a primarily focusing element 11 (lens) only circularly (annularly) over a particular outer radial region, which, on the one hand, serves to realize the required numerical aperture and thus the required spot size, and, on the other hand, however, the circle of diffusion diminishes in intensity after the required focal line 2b over a very short distance in the center of the spot, as a basically circular spot is formed. In this way, the defect line formation is stopped within a short distance in the required substrate depth. A combination of axicon 10 and focusing lens 11 meets this requirement. The axicon acts in two different ways: due to the axicon 10, a usually round laser spot is sent to the focusing lens 11 in the form of a ring, and the asphericity of axicon 10 has the effect that a focal line is formed beyond the focal plane of the lens instead of a focal point in the focal plane. The length l of focal line 2b can be adjusted via the beam diameter on the axicon. The numerical aperture along the focal line, on the other hand, can be adjusted via the distance Z1 (axicon-lens separation) and via the cone angle of the axicon. In this way, the entire laser energy can be concentrated in the focal line.
If the defect line formation is intended to continue to the back side of the substrate, the circular (annular) illumination still has the advantage that (1) the laser power is used optimally in the sense that most of the laser light remains concentrated in the required length of the focal line and (2) it is possible to achieve a uniform spot size along the focal line—and thus a uniform separation of part from substrate along the focal line—due to the circularly illuminated zone in conjunction with the desired aberration set by means of the other optical functions.
Instead of the plano-convex lens depicted in
In order to generate very short focal lines 2b using the combination of an axicon and a lens depicted in
As shown in
The optical assembly 6 depicted in
In the depicted example, it is possible to achieve a length of the focal line 1 of less than 0.5 mm using a typical laser beam diameter of 2 mm, a focusing lens 11 with a focal length f=25 mm, a collimating lens with a focal length f′=150 mm, and choosing distances Z1a=Z1b=140 mm and Z2=15 mm.
Laser and Optical System:
For the purpose of cutting fusion formed glass composite workpieces, a process was developed that uses a 1064 nm picosecond laser in combination with line-focus beam forming optics to create lines of defect lines in the glass composite. A glass composite with up to 0.7 mm thickness was positioned so that it was within the region of the focal line produced by the optics. With a focal line about 1 mm in length, and a picosecond laser that produces output power of about 24 W or more at a repetition rate of 200 kHz (about 120 μJ/pulse in pulse mode or about 120 μJ/burst in burst mode) measured at the glass composite workpiece, the optical intensities in the focal line region can easily be high enough to create non-linear absorption in the glass composite workpiece. The pulsed laser beam can have an average laser energy measured, at the composite material, greater than 40 μJ per mm thickness of material. This “average laser energy” can also be referred to as an average, per-pulse, linear energy density, or an average energy per laser pulse per mm thickness of material. A region of damaged, ablated, vaporized, or otherwise modified material within the glass workpiece was created that approximately followed the linear region of high intensity.
The ultrashort (pulse durations on the order tens of picoseconds or shorter) laser can be operated in pulse mode or burst mode. In pulse mode, a series of nominally identical single pulses is emitted from the laser and directed to the substrate. In pulse mode, the repetition rate of the laser is determined by the spacing in time between the pulses. In burst mode, bursts of pulses are emitted from the laser, where each burst includes two or more pulses (of equal or different amplitude). In burst mode, pulses within a burst are separated by a first time interval (which defines a pulse repetition rate for the burst) and the bursts are separated by a second time interval (which defines a burst repetition rate), where the second time interval is typically much longer than the first time interval. As used herein (whether in the context of pulse mode or burst mode), time interval refers to the time difference between corresponding parts of a pulse or burst (e.g. leading edge-to-leading edge, peak-to-peak, or trailing edge-to-trailing edge). Pulse and burst repetition rates are controlled by the design of the laser and can typically be adjusted, within limits, by adjusting operating conditions of the laser. Typical pulse and burst repetition rates are in the kHz to MHz range. The laser pulse duration (in pulse mode or for pulses within a burst in burst mode) may be 10−10 s or less, or 10−11 s or less, or 10−12 s or less, or 10−13 s or less. In the exemplary embodiments described herein, the laser pulse duration is greater than 10−15.
More specifically, as illustrated in
The required energy to modify the material can be described in terms of the burst energy—the energy contained within a burst (each burst 500 contains a series of pulses 500A), or in terms of the energy contained within a single laser pulse (many of which may comprise a burst). For these applications, the energy per burst (per millimeter of the material to be cut) can be from 10-2500 μJ, or from 20-1500 μJ, or from 25-750 μJ, or from 40-2500 μJ, or from 100-1500 μJ, or from 200-1250 μJ, or from 250-1500 μJ, or from 250-750 μJ. The energy of an individual pulse within the burst will be less, and the exact individual laser pulse energy will depend on the number of pulses 500A within the burst 500 and the rate of decay (e.g, exponential decay rate) of the laser pulses with time as shown in
The use of lasers capable of generating such pulse bursts is advantageous for cutting or modifying transparent materials, for example glass. In contrast with the use of single pulses spaced apart in time by the repetition rate of a single-pulsed laser, the use of a burst pulse sequence that spreads the laser energy over a rapid sequence of pulses within burst 500 allows access to larger timescales of high intensity interaction with the material than is possible with single-pulse lasers. While a single-pulse can be expanded in time, conservation of energy dictates that as this is done, the intensity within the pulse must drop as roughly one over the pulse width. Hence if a 10 psec single pulse is expanded to a 10 nsec pulse, the intensity drops by roughly three orders of magnitude. Such a reduction can reduce the optical intensity to the point where non-linear absorption is no longer significant and the light-material interaction is no longer strong enough to allow for cutting. In contrast, with a burst pulse laser, the intensity during each pulse or sub-pulse 500A within the burst 500 can remain very high—for example three pulses 500A with pulse duration Td 10 psec that are spaced apart in time by a separation Tp of approximately 10 nsec still allows the intensity within each pulse to be approximately three times higher than that of a single 10 psec pulse, while the laser is allowed to interact with the material over a timescale that is three orders of magnitude larger. This adjustment of multiple pulses 500A within a burst thus allows manipulation of timescale of the laser-material interaction in ways that can facilitate greater or lesser light interaction with a pre-existing plasma plume, greater or lesser light-material interaction with atoms and molecules that have been pre-excited by an initial or previous laser pulse, and greater or lesser heating effects within the material that can promote the controlled growth of defect lines (perforations). The amount of burst energy required to modify the material will depend on the substrate material composition and the length of the line focus used to interact with the substrate. The longer the interaction region, the more the energy is spread out, and the higher the burst energy that will be required.)
A defect line or a hole is formed in the material when a single burst of pulses strikes essentially the same location on the glass. That is, multiple laser pulses within a single burst can produce a single defect line or a hole location in the glass. Of course, if the glass is translated (for example by a constantly moving stage) or the beam is moved relative to the glass, the individual pulses within the burst cannot be at exactly the same spatial location on the glass. However, they are well within 1 μm of one another—i.e., they strike the glass at essentially the same location. For example, they may strike the glass at a spacing sp where 0<sp≦500 nm from one another. For example, when a glass location is hit with a burst of 20 pulses the individual pulses within the burst strike the glass within 250 nm of each other. Thus, in some embodiments 1 nm<sp<250 nm. In in some embodiments 1 nm<sp<100 nm.
Hole or Damage Track Formation:
If the substrate has sufficient stress (e.g. with ion exchanged glass), then the part will spontaneously separate along the path of perforated damage (fault line) traced out by the laser process. However, if there is not a lot of stress inherent to the substrate, then the picosecond laser will simply form defect lines (damage tracks) in the composite workpiece. These defect lines generally take the form of holes with interior dimensions (diameters) 0.5-1.5 microns.
The defect lines may or may not perforate the entire thickness of the material, and may or may not be a continuous opening throughout the depth of the material.
It is also possible to perforate workpieces comprising stacked sheets of glass. In this case, the defect line length needs to be longer than the stack height.
The lateral spacing (pitch) between the holes (defect lines, perforations) is determined by the pulse rate of the laser as the substrate is translated underneath the focused laser beam. Only a single picosecond laser pulse or burst is usually necessary to form an entire hole, but multiple pulses or bursts may be used if desired. To form holes at different pitches, the laser can be triggered to fire at longer or shorter intervals. For cutting operations, the laser triggering generally is synchronized with the stage driven motion of the workpiece beneath the beam, so laser pulses are triggered at a fixed interval, such as every 1 micron, or every 5 microns. Distance, or periodicity, between adjacent defect lines along the direction of the fault line can be greater than 0.1 micron and less than or equal to about 20 microns in some embodiments, for example. More preferably, the spacing is between 0.5 micron and 3.0 microns. Even more preferably, the spacing can be between 0.5 micron and 1.0 micron. The exact spacing between adjacent defect lines is determined by the material properties that facilitate crack propagation from perforated hole to perforated hole, given the stress level in the substrate. However, in contrast to cutting a substrate, it is also possible to use the same method to only perforate the material. In the methods described herein, the holes or defect lines can be separated by larger spacings (e.g., a 7 micron pitch or greater).
The laser power and lens focal length (which determines the focal line length and hence power density) are particularly important parameters to ensure full penetration of the glass and low surface and sub-surface damage.
In general, the higher the available laser power, the faster the material can be cut with the above process. The process(s) disclosed herein can cut glass at a cutting speed of 0.25 m/sec, or faster. A cut speed (or cutting speed) is the rate the laser beam moves relative to the surface of the substrate material (e.g., glass) while creating multiple defect lines holes. High cut speeds, such as, for example 400 mm/sec, 500 mm/sec, 750 mm/sec, 1 m/sec, 1.2 m/sec, 1.5 m/sec, or 2 m/sec, or even 3.4 m/sec to 4 m/sec are often desired in order to minimize capital investment for manufacturing, and to optimize equipment utilization rate. The laser power is equal to the burst energy multiplied by the burst repetition frequency (rate) of the laser. In general, to cut glass materials at high cutting speeds, the defect lines are typically spaced apart by 1-25 μm, in some embodiments the spacing is preferably 3 μm or larger—for example 3-12 μm, or for example 5-10 μm.
For example, to achieve a linear cutting speed of 300 mm/sec, 3 μm hole pitch corresponds to a pulse burst laser with at least 100 kHz burst repetition rate. For a 600 mm/sec cutting speed, a 3 μm pitch corresponds to a burst-pulsed laser with at least 200 kHz burst repetition rate. A pulse burst laser that produces at least 40 μJ/burst at 200 kHz, and cuts at a 600 mm/s cutting speed needs to have a laser power of at least 8 Watts. Higher cut speeds require accordingly higher laser powers.
For example, a 0.4 m/sec cut speed at 3 μm pitch and 40 μJ/burst would require at least a 5 W laser, a 0.5 m/sec cut speed at 3 μm pitch and 40 μJ/burst would require at least a 6 W laser. Thus, preferably the laser power of the pulse burst ps laser is 6 W or higher, more preferably at least 8 W or higher, and even more preferably at least 10 W or higher. For example, in order to achieve a 0.4 m/sec cut speed at 4 μm pitch (defect line spacing, or damage tracks spacing) and 100 μJ/burst, one would require at least a 10 W laser, and to achieve a 0.5 m/sec cut speed at 4 μm pitch and 100 μJ/burst, one would require at least a 12 W laser. For example, to achieve a cut speed of 1 m/sec at 3 μm pitch and 40 μJ/burst, one would require at least a 13 W laser. Also, for example, 1 m/sec cut speed at 4 μm pitch and 400 μJ/burst would require at least a 100 W laser.
The optimal pitch between defect lines (damage tracks) and the exact burst energy is material dependent and can be determined empirically. However, it should be noted that raising the laser pulse energy or making the damage tracks at a closer pitch are not conditions that always make the substrate material separate better or with improved edge quality. A pitch that is too small (for example <0.1 micron, or in some exemplary embodiments <1 μm, or in other embodiments <2 μm) between defect lines (damage tracks) can sometimes inhibit the formation of nearby subsequent defect lines (damage tracks), and often can inhibit the separation of the material around the perforated contour. An increase in unwanted micro cracking within the glass may also result if the pitch is too small. A pitch that is too long (e.g. >50 μm, and in some glasses >25 μm or even >20 μm) may result in “uncontrolled microcracking”—i.e., where instead of propagating from defect line to defect line along the intended contour, the microcracks propagate along a different path, and cause the glass to crack in a different (undesirable) direction away from the intended contour. This may ultimately lower the strength of the separated part since the residual microcracks constitute flaws that weaken the glass. A burst energy for forming defect lines that is too high (e.g., >2500 μJ/burst, and in some embodiments >500 μJ/burst) can cause “healing” or re-melting of previously formed defect lines, which may inhibit separation of the glass. Accordingly, it is preferred that the burst energy be <2500 μJ/burst, for example, <500 μJ/burst. Also, using a burst energy that is too high can cause formation of microcracks that are extremely large and create structural imperfections that can reduce the edge strength of the part after separation. A burst energy that is too low (e.g. <40 μJ/burst) may result in no appreciable formation of defect lines within the glass, and hence may necessitate especially high separation force or result in a complete inability to separate along the perforated contour.
Typical exemplary cutting rates (speeds) enabled by this process are, for example, 0.25 m/sec and higher. In some embodiments, the cutting rates are at least 300 mm/sec. In some embodiments, the cutting rates are at least 400 mm/sec, for example, 500 mm/sec to 2000 mm/sec, or higher. In some embodiments the picosecond (ps) laser utilizes pulse bursts to produce defect lines with periodicity between 0.5 μm and 13 μm, e.g. between 0.5 and 3 μm. In some embodiments, the pulsed laser has laser power of 10 W-100 W and the material and/or the laser beam are translated relative to one another at a rate of at least 0.25 m/sec; for example, at the rate of 0.25 m/sec to 0.35 m/sec, or 0.4 m/sec to 5 m/sec. Preferably, each pulse burst of the pulsed laser beam has an average laser energy measured at the workpiece greater than 40 μJ per burst per mm thickness of workpiece. Preferably, each pulse burst of the pulsed laser beam has an average laser energy measured at the workpiece greater of less than 2500 μJ per burst per mm thickness of workpiece, and preferably lass than about 2000 μJ per burst per mm thickness of workpiece, and in some embodiments less than 1500 μJ per burst per mm thickness of workpiece; for example, not more than 500 μJ per burst per mm thickness of workpiece.
We discovered that much higher (5 to 10 times higher) volumetric pulse energy density (μJ/μm3) is required for perforating alkaline earth boroaluminosilicate glasses with low or no alkali content. This can be achieved, for example, by utilizing pulse burst lasers, preferably with at least 2 pulses per burst and providing volumetric energy densities within the alkaline earth boroaluminosilicate glasses (with low or no alkali) of about 0.05 μJ/μm3 or higher, e.g., at least 0.1 μJ/μm3, for example 0.1-0.5 μJ/μm3.
Accordingly, it is preferable that the laser produces pulse bursts with at least 2 pulses per burst. For example, in some embodiments the pulsed laser has a power of 10 W-150 W (e.g., 10 W-100 W) and produces pulse bursts with at least 2 pulses per burst (e.g., 2-25 pulses per burst). In some embodiments the pulsed laser has a power of 25 W-60 W, and produces pulse bursts with at least 2-25 pulses per burst, and periodicity or distance between the adjacent defect lines produced by the laser bursts is 2-10 μm. In some embodiments, the pulsed laser has a power of 10 W-100 W, produces pulse bursts with at least 2 pulses per burst, and the workpiece and the laser beam are translated relative to one another at a rate of at least 0.25 m/sec. In some embodiments, the workpiece and/or the laser beam are translated relative to one another at a rate of at least 0.4 m/sec.
For example, for cutting 0.7 mm thick non-ion exchanged Corning code 2319 or code 2320 Gorilla® glass, it is observed that pitches of 3-7 μm can work well, with pulse burst energies of about 150-250 μJ/burst, and burst pulse numbers that range from 2-15, and preferably with pitches of 3-5 μm and burst pulse numbers (number of pulses per burst) of 2-5.
At 1 m/sec cut speeds, the cutting of Eagle XG® glass typically requires utilization of laser powers of 15-84 W, with 30-45 W often being sufficient. In general, across a variety of glass and other transparent materials, applicants discovered that laser powers between 10 W and 100 W are preferred to achieve cutting speeds from 0.2-1 m/sec, with laser powers of 25-60 W being sufficient (or optimum) for many glasses. For cutting speeds of 0.4 m/sec to 5 m/sec, laser powers should preferably be 10 W-150 W, with burst energy of 40-750 μJ/burst, 2-25 bursts per pulse (depending on the material that is cut), and defect line separation (pitch) of 3 to 15 μm, or 3-10 μm. The use of picosecond pulse burst lasers would be preferable for these cutting speeds because they generate high power and the required number of pulses per burst. Thus, according to some exemplary embodiments, the pulsed laser produces 10 W-100 W of power, for example 25 W to 60 W, and produces pulse bursts at least 2-25 pulses per burst and the distance between the defect lines is 2-15 μm; and the laser beam and/or workpiece are translated relative to one another at a rate of at least 0.25 m/sec, in some embodiments at least 0.4 m/sec, for example 0.5 m/sec to 5 m/sec, or faster.
Cutting and separating shapes of a plate:
The creation of articles with or without holes or slots is highly desired, from larger composite glass sheets as shown in
Fault lines were traced by the picosecond laser alone, or by a combination of a picosecond laser followed by a CO2 laser, to release the perimeter and/or internal holes or slots. It is important to notice that the introduction of release lines and the path traced by the defocused CO2 laser is carefully planned to avoid issues, such as:
Avoid coincident start/stop position. In general, the slow acceleration/deceleration of the moving stages can be enough to create a punctual stress source that will later crack or even shatter the part.
Stopping or “parking” the defocused CO2 laser on any spot over the traced contour—most commonly this may melt the surface and/or create micro-cracks. The path of the CO2 laser should be planned to start and finish outside the contour to be released.
Exemplary picosecond laser conditions were: 1064 nm wavelengths, 4 pulses per burst, power level 100%, 200 kHz repetition rate. Exemplary CO2 laser conditions were: 10.6 micron wavelength, 2 passes of the laser at 20 m/min, focus at 28.5 mm, 100% power, 17 microsecond pulses at 20 kHz repetition rate.
Further processing of the extracted articles via acid etching can yield very high edge strength articles as compared to the as-laser-cut sheets. In some instances the as-cut sheets may be strong enough for particular application, while it is generally desired to have higher edge strength for many applications.
Parts (articles) were then subjected to a standard acid etch treatment (e.g., a solution of 1.5 M HF and 0.9 M H2SO4) to reduce or remove completely the surface defects induced by the laser cutting method. The edge strength data was then plotted in a Weibull plot shown in
Cutting Glass On-the-Draw
Mechanical scoring and breaking is the traditional glass cutting approach for a continuous fusion glass manufacturing process. Although fast, achieving 1 m/s for straight cuts, this process is highly limited when it comes to cutting contour glass shapes as it becomes extremely challenging for such applications due to slow speed, glass edge chipping, high roughness of the cut edge, etc. These applications require multiple grinding and polishing steps in order to reduce subsurface damage (SSD), as well as washing steps, which not only add the cost to the process due to higher capital requirements and higher costs due to low yields, but are also simply not capable of meeting the technical requirements.
More recently, a carbon dioxide (CO2) laser score and break approach has been developed for cutting display glass compositions. This technique relies on mechanical (or laser) crack initiation followed by a CO2 laser crack propagation. Most often, a CO2 laser radiation at the wavelength of 10.6 microns is used as a precision heat source followed by a coolant jet to create the thermal shock and propagate the crack along the straight line traversed by the CO2 laser. The difficulties for this approach lie in its inability to successfully control and propagate such cracks, especially along contours. Although straight cutting by either a mechanical or a laser score and break techniques might work well for some applications, the ever increasing demands for highly precise, clean and flexible glass cutting solutions needed.
One example of the difficulties of mechanical and CO2 scoring is the liquid crystal display (LCD) glass fusion process. In the LCD fusion process, a continuous ribbon of thin flat glass is formed, emanating from a high draw tower. This thin glass is formed between 0.050 mm and 2 mm thick and between 24″ and 150″ wide. This ribbon of glass is scored by a mechanical scoring wheel similar to scoring or cutting glass windows. This scored glass is then mechanically bent and broken of the ribbon to establish a sheet 24″-150″ wide by 24″-150″ tall at the bottom of the draw tower. This sheet has a very rough section on the right and left sides of the sheet. Mechanical scoring can only be performed in the quality area of the glass sheet, and not in the thicker beaded section of the glass sheet. Then a robot will grip the sheet of glass, bend it, and break the scored sheet from the ribbon of glass. This breaking action causes a high amplitude vibration up the ribbon into the draw tower which causes forming flatness variations in the final sheet. It also causes rubicons since the vibration will run a micro-crack up the draw. Mechanically scoring and breaking glass produces glass chips that are very light like a leaf, but these glass chips are 10-200 microns in size and 3-20 microns thick. These glass chips float up the draw tower and attach to the surface of the sheet, and some of these particles, called clam shell glass chips, attach permanently to the ribbon glass surface, which results in a rejected section of glass.
This glass sheet is then moved from the ribbon area to a secondary cut area, where the glass sheet is placed on another machine called a vertical bead scoring machine, and the beaded section of the glass or non-quality area is then mechanically scored, and then the beaded section is mechanically broken off of the parent sheet. Again, tiny clam shell glass chips fly off the sheet onto the defect area, resulting in a rejected section of glass.
All the sheets are then packed in some cases into crates and shipped to a finishing location. Again, clam shell glass chips migrate from the edge of the glass to the surface and result in rejected sections of glass. This crate of glass is unloaded and placed in a finishing line, where the sheet is mechanically or CO2 scored and mechanically broken into a slightly smaller sheet of glass, but this scoring process is much more precise than the precise score machines. Again, more clam shell glass chips fly onto the glass surface, resulting in rejected sections of these glass sheets.
The sheet is next moved to edge grinders that rough and fine grind the thin glass sheets to a final length and width. Then, the sheet is moved to another grinder that will grind the four corners. Next, the sheet moves to an inline washer that cleans the surface of most loose particles except the clam shell particles.
The laser glass cutting technology disclosed herein cuts glasses, including thin glass, extremely accurately, extremely fast and without creating glass chips. The technology can perforate glass with extremely small holes (e.g. <1 micron) and short pitch spacing (e.g., 1 micron). Also, the glass can be perforated at extremely high speeds (e.g. 1-2 meters/sec). In test cases, no chips have been observed on the edge of the glass. The laser process can perforate and separate small glass articles like a cell phone size (70 mm×150 mm) shape out of a larger sheet of glass. This perforating and separating process of thin glass leaves behind an edge with an Ra surface roughness less than 400 nm and sub-surface micro-cracks at depths limited to 60 microns or less. This edge quality is close to the quality of a ground sheet of glass. Given this capability, hot glass can be laser cut at the fusion draw process that makes thin glass sheet.
The methods described herein offer a glass cutting solution for display glass compositions for both online and off-line glass cutting needs. Online, these methods can be applied for both cutting and bead removal of the glass sheet as it comes from the draw, particularly at the area known as the Bottom of the Draw (BOD), where glass starts cooling down from its forming temperature. The methods described herein provide a glass cutting solution that can provide a full-body (full-thickness) perforation through the whole thickness of the glass sheet. A series of full-thickness perforations can form a fault line that, upon sheet separation along the fault line, can form a very precise and controllable cut in the glass sheet.
Glass stresses may also be of particular concern for some applications, particularly for applications with glass sheets or laminated glass sheets that have high stresses. Cutting of sheets under such circumstances with traditional methods presents significant difficulties. For example, significant amounts of stress are induced during the drawing of LCD glass sheets during the fusion draw process. The stress at the sheet and bead interface is even larger during glass cooling because of the differential thickness between sheet and bead and the different associated cooling rates. The stress level can be significantly larger for the case of fusion drawn laminated sheets (>300 MPa), where the viscosity and CTE differences between adjacent sheet layers result in very high outer layer compressive stress. This high compressive stress layer property can significantly improve the glass strength of the laminated glass sheet. However, cutting of the glass sheet by traditional methods can be difficult in sheets with high stress levels.
As is understood in the art, LCD glass sheets made with the fusion draw process have high stresses that are induced as the glass is cooled from above its softening point to much below its strain point. The stress is also significantly higher at the glass bead interface due to differences in thicknesses and thermal mass. The stresses are much higher (>300 MPa) for the case of laminated glass sheets, where the mismatch in CTE and viscosity of glass layers can induce high compressive stresses needed for strengthened glass applications. These high levels of stress make it very difficult to cut the glass sheets at temperatures that are much below the strain point of the glass (<300 C).
Methods and different embodiments are disclosed to cut the sheets and separate beads from the sheet using the laser technology which entails single shot penetration through the thickness of the glass sheet. Methods disclosed herein allow for laser-based cutting of the sheet at the draw and separation of beads to improve the manufacturing efficiency of fusion draw process. Furthermore, in some embodiments, single layer sheets and laminated sheets can be cut at high temperatures (close to the annealing point of the glass), making the induced stress much smaller. The ability to cut sheets at high temperature and then post-process the sheet through prescribed temperature profiles can also accommodate sheets with lower glass compaction, lower residual stresses, the possibility to eliminate the cost of separate finishing steps, the ability to process glasses of higher strain point, and increased production throughput due to the glass staying at the annealing temperature longer.
The glass sheet 1470′ is then translated to furnace 1971b, also held at the annealing temperature of the glass. The glass beads 1466 are separated using the laser beams 1974, which are configured to undergo vertical translation 1974 to laser score the glass sheet 1470′ adjacent to the beads 1466. The horizontal and vertical cutting steps can include applying tensile or bending stresses along the laser-damaged contours to separate the glass from the draw and to separate the glass beads from the cut glass sheet 1470′ if necessary. The stresses can be applied using robotics, for example.
Following removal of the glass beads, the cut glass sheet 1470′ is translated to a third furnace 1971c, where heat sources 1980 undergo vertical translation 1982 to deliver heat to the cut edges of the glass plate 1470′. The heat is applied to smooth and round the cut vertical edges, and while not shown in
The glass sheet 1464 can be a laminated sheet, where the sheet is comprised of multiple layers, each having different material properties such as CTE, etc. Such a laminated sheet can be formed by using a double-isopipe draw tower in which each isopipe is used for providing glass for a different layer of the laminate. The difference in CTE between glass layers of the laminate results in a significant amount of stress being introduced as the glass sheet cools from above the softening point to much below the strain point. For example, compressive stress of greater than 400 MPa can be induced on the surface of the laminate sheet surface by having CTE difference between the inner and surface layers larger than 60×10−7/C, with the ratio of the thickness of the inner layer to the total laminate thickness ranging between 0.8 and 1 (see, e.g., Tandon et al., U.S. Patent Application Number 20110318555, the entirety of which is incorporated herein by reference).
In cases in which the glass sheet 1464 is a laminate, the furnaces 1971a and 1971b can be configured to hold the laminate at a temperature that is between the annealing temperatures of two layers of the laminate. For applications where high surface compressive stresses are required (e.g. laminated glasses for high strength applications), providing time at the annealing temperature will reduce the stress magnitude, facilitating cutting using the laser beams 1974. In these cases, high stresses can still be achieved in a finished glass sheet by quenching the glass during the post-cutting cooling.
In other embodiments, laser perforations are made with the glass in the draw, with a certain separation between defect lines, at a temperature above the annealing point of the glass. This has no significant impact on glass strength at this draw location. However, this can result in the glass sheet spontaneously separating or separating with only weak external perturbations when CTE stress is developed (e.g., for laminated glass) at downstream locations on the draw. Spontaneous separation, or separation with weak external perturbations, can be useful for removal of glass beads and for glass collection.
The ability to cut sheets at high temperature and then post-process the sheet through prescribed temperature profile can also allow for sheets with lower glass compaction and lower residual stresses. Such ability can also eliminate the cost of separate finishing steps, allow processing of glasses with higher strain points, and increase production throughput due to the glass staying at the annealing temperature longer.
The glass separation along a full-thickness cut is controlled by the pitch between two defect lines. A typical exemplary pitch for cutting many display glass compositions is about 1-5 microns (e.g., 2-5 microns). However, a pitch of up to 8 microns (5-8 microns) has also been shown to provide a good quality cut. The ability to control the pitch is also important since it determines the cutting speed, which is also affected by laser pulse frequency or burst repetition rate, the number of pulses within a burst mode and the average energy per pulse and/or per burst.
When a micro-crack around a defect line is oriented toward an adjacent defect line, glass cutting is facilitated because the micro-crack is aligned with the fault line and guides the direction of separation. In such cases, a larger pitch (for example 3 to 50 microns, such as 3 to 20 microns) between the defect lines may suffice for full glass separation, thus simplifying processing (since fewer defect lines are required to effect separation). Alternatively, in some glass types, where micro-cracks are not formed or are not oriented toward and adjacent defect line, a smaller pitch (0.1 to 3 microns, e.g., between 1 and 3 microns) between the holes (or defect lines) may be required for clean separation.
The relevant teachings of all patents, published applications and references cited herein are incorporated by reference in their entirety.
While exemplary embodiments have been described herein, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the scope of the invention encompassed by the appended claims.
This application claims the benefit of U.S. Provisional Application No. 61/917,226 filed on Dec. 17, 2013 as well as the benefit of U.S. Provisional Application No. 62/023,322 filed on Jul. 11, 2014, the entire disclosures of which are incorporated herein by reference.
| Number | Name | Date | Kind |
|---|---|---|---|
| 1790397 | Woods et al. | Jan 1931 | A |
| 2682134 | Stookey | Jun 1954 | A |
| 2749794 | O'Leary | Jun 1956 | A |
| 3647410 | Heaton et al. | Mar 1972 | A |
| 3695497 | Dear | Oct 1972 | A |
| 3695498 | Dear | Oct 1972 | A |
| 3729302 | Heaton | Apr 1973 | A |
| 3775084 | Heaton | Nov 1973 | A |
| 4226607 | Domken | Oct 1980 | A |
| 4441008 | Chan | Apr 1984 | A |
| 4546231 | Gresser et al. | Oct 1985 | A |
| 4646308 | Kafka et al. | Feb 1987 | A |
| 4764930 | Bille et al. | Aug 1988 | A |
| 4891054 | Bricker | Jan 1990 | A |
| 4907586 | Bille et al. | Mar 1990 | A |
| 4918751 | Pessot et al. | Apr 1990 | A |
| 4929065 | Hagerty et al. | May 1990 | A |
| 5035918 | Vyas | Jul 1991 | A |
| 5040182 | Spinelli et al. | Aug 1991 | A |
| 5104210 | Tokas | Apr 1992 | A |
| 5108857 | Kitayama et al. | Apr 1992 | A |
| 5112722 | Tsujino et al. | May 1992 | A |
| 5114834 | Nachshon | May 1992 | A |
| 5265107 | Delfyett, Jr. | Nov 1993 | A |
| 5400350 | Galvanauskas | Mar 1995 | A |
| 5434875 | Rieger et al. | Jul 1995 | A |
| 5436925 | Lin et al. | Jul 1995 | A |
| 5553093 | Ramaswamy et al. | Sep 1996 | A |
| 5574597 | Kataoka et al. | Nov 1996 | A |
| 5586138 | Yokoyama | Dec 1996 | A |
| 5696782 | Harter et al. | Dec 1997 | A |
| 5736709 | Neiheisel | Apr 1998 | A |
| 5776220 | Allaire et al. | Jul 1998 | A |
| 6016223 | Suzuki et al. | Jan 2000 | A |
| 6016324 | Rieger et al. | Jan 2000 | A |
| 6038055 | Hänsch et al. | Mar 2000 | A |
| 6055829 | Witzmann et al. | May 2000 | A |
| 6078599 | Everage et al. | Jun 2000 | A |
| 6156030 | Neev | Dec 2000 | A |
| 6160835 | Kwon | Dec 2000 | A |
| 6186384 | Sawada | Feb 2001 | B1 |
| 6210401 | Lai | Apr 2001 | B1 |
| 6256328 | Delfyett et al. | Jul 2001 | B1 |
| 6259151 | Morrison | Jul 2001 | B1 |
| 6259512 | Mizouchi | Jul 2001 | B1 |
| 6272156 | Reed et al. | Aug 2001 | B1 |
| 6301932 | Allen et al. | Oct 2001 | B1 |
| 6322958 | Hayashi | Nov 2001 | B1 |
| 6339208 | Rockstroh et al. | Jan 2002 | B1 |
| 6373565 | Kafka et al. | Apr 2002 | B1 |
| 6381391 | Islam et al. | Apr 2002 | B1 |
| 6396856 | Sucha et al. | May 2002 | B1 |
| 6407360 | Choo et al. | Jun 2002 | B1 |
| 6438996 | Cuvelier | Aug 2002 | B1 |
| 6445491 | Sucha et al. | Sep 2002 | B2 |
| 6449301 | Wu et al. | Sep 2002 | B1 |
| 6484052 | Visuri et al. | Nov 2002 | B1 |
| 6489589 | Alexander | Dec 2002 | B1 |
| 6501578 | Bernstein et al. | Dec 2002 | B1 |
| 6552301 | Herman et al. | Apr 2003 | B2 |
| 6573026 | Aitken et al. | Jun 2003 | B1 |
| 6592703 | Habeck et al. | Jul 2003 | B1 |
| 6635849 | Okawa et al. | Oct 2003 | B1 |
| 6635850 | Amako et al. | Oct 2003 | B2 |
| 6720519 | Liu et al. | Apr 2004 | B2 |
| 6729161 | Miura et al. | May 2004 | B1 |
| 6800237 | Yamamoto et al. | Oct 2004 | B1 |
| 6800831 | Hoetzel | Oct 2004 | B1 |
| 6958094 | Ohmi et al. | Oct 2005 | B2 |
| 6992026 | Fukuyo et al. | Jan 2006 | B2 |
| 7009138 | Amako et al. | Mar 2006 | B2 |
| 7353829 | Wachter et al. | Apr 2008 | B1 |
| 7511886 | Schultz et al. | Mar 2009 | B2 |
| 7535634 | Savchenkov et al. | May 2009 | B1 |
| 7633033 | Thomas et al. | Dec 2009 | B2 |
| 7642483 | You et al. | Jan 2010 | B2 |
| 7726532 | Gonoe | Jun 2010 | B2 |
| 8104385 | Hayashi et al. | Jan 2012 | B2 |
| 8118971 | Hori et al. | Feb 2012 | B2 |
| 8132427 | Brown et al. | Mar 2012 | B2 |
| 8168514 | Garner et al. | May 2012 | B2 |
| 8245539 | Lu et al. | Aug 2012 | B2 |
| 8245540 | Abramov et al. | Aug 2012 | B2 |
| 8269138 | Garner et al. | Sep 2012 | B2 |
| 8283595 | Fukuyo et al. | Oct 2012 | B2 |
| 8292141 | Cox et al. | Oct 2012 | B2 |
| 8296066 | Zhao et al. | Oct 2012 | B2 |
| 8327666 | Harvey et al. | Dec 2012 | B2 |
| 8341976 | Dejneka et al. | Jan 2013 | B2 |
| 8347651 | Abramov et al. | Jan 2013 | B2 |
| 8358888 | Ramachandran | Jan 2013 | B2 |
| 8444906 | Lee et al. | May 2013 | B2 |
| 8448471 | Kumatani et al. | May 2013 | B2 |
| 8518280 | Hsu et al. | Aug 2013 | B2 |
| 8549881 | Brown et al. | Oct 2013 | B2 |
| 8584354 | Cornejo et al. | Nov 2013 | B2 |
| 8584490 | Garner et al. | Nov 2013 | B2 |
| 8592716 | Abramov et al. | Nov 2013 | B2 |
| 8604380 | Howerton et al. | Dec 2013 | B2 |
| 8607590 | Glaesemann et al. | Dec 2013 | B2 |
| 8616024 | Cornejo et al. | Dec 2013 | B2 |
| 8635887 | Black et al. | Jan 2014 | B2 |
| 8680489 | Martinez et al. | Mar 2014 | B2 |
| 8685838 | Fukuyo et al. | Apr 2014 | B2 |
| 8697228 | Carre et al. | Apr 2014 | B2 |
| 8720228 | Li | May 2014 | B2 |
| 8826696 | Brown et al. | Sep 2014 | B2 |
| 8852698 | Fukumitsu | Oct 2014 | B2 |
| 8887529 | Lu et al. | Nov 2014 | B2 |
| 8916798 | Plüss | Dec 2014 | B2 |
| 8943855 | Gomez et al. | Feb 2015 | B2 |
| 8971053 | Kariya et al. | Mar 2015 | B2 |
| 9138913 | Arai et al. | Sep 2015 | B2 |
| 9227868 | Matsumoto et al. | Jan 2016 | B2 |
| 9290407 | Barefoot et al. | Mar 2016 | B2 |
| 9296066 | Hosseini et al. | Mar 2016 | B2 |
| 9324791 | Tamemoto | Apr 2016 | B2 |
| 9327381 | Lee et al. | May 2016 | B2 |
| 9446590 | Chen et al. | Sep 2016 | B2 |
| 9481598 | Bergh et al. | Nov 2016 | B2 |
| 20020046997 | Nam et al. | Apr 2002 | A1 |
| 20020082466 | Han | Jun 2002 | A1 |
| 20020097486 | Yamaguchi et al. | Jul 2002 | A1 |
| 20020110639 | Bruns | Aug 2002 | A1 |
| 20030006221 | Hong et al. | Jan 2003 | A1 |
| 20050024743 | Camy-Peyret | Feb 2005 | A1 |
| 20050098548 | Kobayashi et al. | May 2005 | A1 |
| 20050115938 | Sawaki et al. | Jun 2005 | A1 |
| 20050274702 | Deshi | Dec 2005 | A1 |
| 20060011593 | Fukuyo | Jan 2006 | A1 |
| 20060109874 | Shiozaki et al. | May 2006 | A1 |
| 20060127679 | Gulati | Jun 2006 | A1 |
| 20060227440 | Gluckstad | Oct 2006 | A1 |
| 20060289410 | Morita et al. | Dec 2006 | A1 |
| 20070111390 | Komura et al. | May 2007 | A1 |
| 20070111480 | Maruyama et al. | May 2007 | A1 |
| 20070119831 | Kandt | May 2007 | A1 |
| 20070132977 | Komatsuda | Jun 2007 | A1 |
| 20070138151 | Tanaka et al. | Jun 2007 | A1 |
| 20070177116 | Amako | Aug 2007 | A1 |
| 20070202619 | Tamura et al. | Aug 2007 | A1 |
| 20070298529 | Maeda et al. | Dec 2007 | A1 |
| 20080000884 | Sugiura et al. | Jan 2008 | A1 |
| 20080099444 | Misawa et al. | May 2008 | A1 |
| 20090013724 | Koyo et al. | Jan 2009 | A1 |
| 20090176034 | Ruuttu et al. | Jul 2009 | A1 |
| 20090183764 | Meyer | Jul 2009 | A1 |
| 20090250446 | Sakamoto | Oct 2009 | A1 |
| 20090294419 | Abramov et al. | Dec 2009 | A1 |
| 20090294422 | Lubatschowski et al. | Dec 2009 | A1 |
| 20090324899 | Feinstein et al. | Dec 2009 | A1 |
| 20100025387 | Arai et al. | Feb 2010 | A1 |
| 20100029460 | Shojiya et al. | Feb 2010 | A1 |
| 20100032087 | Takahashi et al. | Feb 2010 | A1 |
| 20100086741 | Bovatsek et al. | Apr 2010 | A1 |
| 20100089631 | Sakaguchi et al. | Apr 2010 | A1 |
| 20100089882 | Tamura | Apr 2010 | A1 |
| 20100102042 | Garner | Apr 2010 | A1 |
| 20100129603 | Blick et al. | May 2010 | A1 |
| 20100147813 | Lei et al. | Jun 2010 | A1 |
| 20100252540 | Lei et al. | Oct 2010 | A1 |
| 20100252959 | Lei et al. | Oct 2010 | A1 |
| 20100276505 | Smith | Nov 2010 | A1 |
| 20100279067 | Sabia et al. | Nov 2010 | A1 |
| 20100287991 | Brown | Nov 2010 | A1 |
| 20100326138 | Kumatani et al. | Dec 2010 | A1 |
| 20110049765 | Li et al. | Mar 2011 | A1 |
| 20110088324 | Wessel | Apr 2011 | A1 |
| 20110100401 | Fiorentini | May 2011 | A1 |
| 20110132881 | Liu | Jun 2011 | A1 |
| 20110183116 | Hung et al. | Jul 2011 | A1 |
| 20110240611 | Sandström et al. | Oct 2011 | A1 |
| 20110277507 | Lu et al. | Nov 2011 | A1 |
| 20110318555 | Bookbinder et al. | Dec 2011 | A1 |
| 20120017642 | Teranishi et al. | Jan 2012 | A1 |
| 20120047951 | Dannoux et al. | Mar 2012 | A1 |
| 20120048604 | Cornejo et al. | Mar 2012 | A1 |
| 20120061440 | Roell | Mar 2012 | A1 |
| 20120064306 | Kang et al. | Mar 2012 | A1 |
| 20120103018 | Lu et al. | May 2012 | A1 |
| 20120131962 | Mitsugi et al. | May 2012 | A1 |
| 20120135607 | Shimoi et al. | May 2012 | A1 |
| 20120135608 | Shimoi et al. | May 2012 | A1 |
| 20120145331 | Gomez et al. | Jun 2012 | A1 |
| 20120196071 | Cornejo et al. | Aug 2012 | A1 |
| 20120234049 | Bolton | Sep 2012 | A1 |
| 20120234807 | Sercel et al. | Sep 2012 | A1 |
| 20120255935 | Kakui et al. | Oct 2012 | A1 |
| 20120299219 | Shimoi et al. | Nov 2012 | A1 |
| 20120302139 | Darcangelo et al. | Nov 2012 | A1 |
| 20130019637 | Sol et al. | Jan 2013 | A1 |
| 20130034688 | Koike et al. | Feb 2013 | A1 |
| 20130044371 | Rupp et al. | Feb 2013 | A1 |
| 20130068736 | Mielke et al. | Mar 2013 | A1 |
| 20130075480 | Yokogi et al. | Mar 2013 | A1 |
| 20130091897 | Fugii et al. | Apr 2013 | A1 |
| 20130122264 | Fujii et al. | May 2013 | A1 |
| 20130126573 | Hosseini et al. | May 2013 | A1 |
| 20130129947 | Harvey et al. | May 2013 | A1 |
| 20130133367 | Abramov et al. | May 2013 | A1 |
| 20130143416 | Norval | Jun 2013 | A1 |
| 20130149434 | Oh et al. | Jun 2013 | A1 |
| 20130149494 | Koike et al. | Jun 2013 | A1 |
| 20130167590 | Teranishi et al. | Jul 2013 | A1 |
| 20130174607 | Wootton et al. | Jul 2013 | A1 |
| 20130174610 | Teranishi et al. | Jul 2013 | A1 |
| 20130180285 | Kariya | Jul 2013 | A1 |
| 20130189806 | Hoshino | Jul 2013 | A1 |
| 20130192305 | Black et al. | Aug 2013 | A1 |
| 20130209731 | Nattermann et al. | Aug 2013 | A1 |
| 20130220982 | Thomas et al. | Aug 2013 | A1 |
| 20130221053 | Zhang | Aug 2013 | A1 |
| 20130224439 | Zhang et al. | Aug 2013 | A1 |
| 20130228918 | Chen et al. | Sep 2013 | A1 |
| 20130247615 | Boek et al. | Sep 2013 | A1 |
| 20130266757 | Giron et al. | Oct 2013 | A1 |
| 20130270240 | Kondo | Oct 2013 | A1 |
| 20130280495 | Matsumoto | Oct 2013 | A1 |
| 20130288010 | Akarapu et al. | Oct 2013 | A1 |
| 20130291598 | Saito et al. | Nov 2013 | A1 |
| 20130312460 | Kunishi et al. | Nov 2013 | A1 |
| 20130323469 | Abramov et al. | Dec 2013 | A1 |
| 20130334185 | Nomaru | Dec 2013 | A1 |
| 20130340480 | Nattermann et al. | Dec 2013 | A1 |
| 20140027951 | Srinivas et al. | Jan 2014 | A1 |
| 20140034730 | Lee | Feb 2014 | A1 |
| 20140042202 | Lee | Feb 2014 | A1 |
| 20140047957 | Wu | Feb 2014 | A1 |
| 20140102146 | Saito et al. | Apr 2014 | A1 |
| 20140110040 | Cok | Apr 2014 | A1 |
| 20140113797 | Yamada et al. | Apr 2014 | A1 |
| 20140133119 | Kariya et al. | May 2014 | A1 |
| 20140141217 | Gulati et al. | May 2014 | A1 |
| 20140147623 | Shorey et al. | May 2014 | A1 |
| 20140147624 | Streltsov et al. | May 2014 | A1 |
| 20140165652 | Saito | Jun 2014 | A1 |
| 20140174131 | Saito et al. | Jun 2014 | A1 |
| 20140199519 | Schillinger et al. | Jul 2014 | A1 |
| 20140216108 | Wiegel et al. | Aug 2014 | A1 |
| 20140290310 | Green | Oct 2014 | A1 |
| 20140320947 | Egerton et al. | Oct 2014 | A1 |
| 20140333929 | Sung et al. | Nov 2014 | A1 |
| 20140361463 | DeSimone et al. | Dec 2014 | A1 |
| 20150038313 | Hosseini | Feb 2015 | A1 |
| 20150075221 | Kawaguchi et al. | Mar 2015 | A1 |
| 20150075222 | Mader | Mar 2015 | A1 |
| 20150110442 | Zimmel et al. | Apr 2015 | A1 |
| 20150118522 | Hosseini | Apr 2015 | A1 |
| 20150136743 | Hosseini | May 2015 | A1 |
| 20150140241 | Hosseini | May 2015 | A1 |
| 20150140735 | Hosseini | May 2015 | A1 |
| 20150151380 | Hosseini | Jun 2015 | A1 |
| 20150158120 | Courvoisier et al. | Jun 2015 | A1 |
| 20150165548 | Marjanovic et al. | Jun 2015 | A1 |
| 20150165560 | Hackert et al. | Jun 2015 | A1 |
| 20150165562 | Marjanovic et al. | Jun 2015 | A1 |
| 20150165563 | Manley et al. | Jun 2015 | A1 |
| 20150166391 | Marjanovic et al. | Jun 2015 | A1 |
| 20150166393 | Marjanovic et al. | Jun 2015 | A1 |
| 20150166394 | Marjanovic et al. | Jun 2015 | A1 |
| 20150166395 | Marjanovic et al. | Jun 2015 | A1 |
| 20150166396 | Marjanovic et al. | Jun 2015 | A1 |
| 20150166397 | Marjanovic et al. | Jun 2015 | A1 |
| 20150183679 | Saito | Jul 2015 | A1 |
| 20150232369 | Marjanovic et al. | Aug 2015 | A1 |
| 20150299018 | Bhuyan et al. | Oct 2015 | A1 |
| 20150360991 | Grundmueller et al. | Dec 2015 | A1 |
| 20150367442 | Bovatsek et al. | Dec 2015 | A1 |
| 20160008927 | Grundmueller et al. | Jan 2016 | A1 |
| 20160009066 | Nieber et al. | Jan 2016 | A1 |
| 20160023922 | Addiego et al. | Jan 2016 | A1 |
| 20160031745 | Ortner et al. | Feb 2016 | A1 |
| 20160060156 | Krueger et al. | Mar 2016 | A1 |
| 20160280580 | Bohme | Sep 2016 | A1 |
| 20160290791 | Buono et al. | Oct 2016 | A1 |
| Number | Date | Country |
|---|---|---|
| 2388062 | Jul 2000 | CN |
| 1283409 | Nov 2006 | CN |
| 101502914 | Aug 2009 | CN |
| 201357287 | Dec 2009 | CN |
| 101637849 | Feb 2010 | CN |
| 201471092 | May 2010 | CN |
| 102672355 | Sep 2012 | CN |
| 102898014 | Jan 2013 | CN |
| 102923939 | Feb 2013 | CN |
| 103013374 | Apr 2013 | CN |
| 103143841 | Jun 2013 | CN |
| 203021443 | Jun 2013 | CN |
| 103273195 | Sep 2013 | CN |
| 103316990 | Sep 2013 | CN |
| 103359947 | Oct 2013 | CN |
| 103359948 | Oct 2013 | CN |
| 103531414 | Jan 2014 | CN |
| 103746027 | Apr 2014 | CN |
| 203509350 | Apr 2014 | CN |
| 104344202 | Feb 2015 | CN |
| 102672355 | May 2015 | CN |
| 2231330 | Jan 1974 | DE |
| 102006035555 | Jan 2008 | DE |
| 102012010635 | Nov 2013 | DE |
| 102012110971 | May 2014 | DE |
| 102013223637 | May 2015 | DE |
| 270897 | Feb 1992 | EP |
| 0609978 | Aug 1994 | EP |
| 656241 | Dec 1998 | EP |
| 938946 | Sep 1999 | EP |
| 949541 | Oct 1999 | EP |
| 1159104 | Aug 2004 | EP |
| 1609559 | Dec 2005 | EP |
| 1043110 | Aug 2006 | EP |
| 2133170 | Dec 2009 | EP |
| 2202545 | Jun 2010 | EP |
| 2574983 | Apr 2013 | EP |
| 2754524 | Jul 2014 | EP |
| 2781296 | Sep 2014 | EP |
| 2783784 | Oct 2014 | EP |
| 2859984 | Apr 2015 | EP |
| 2989294 | Oct 2013 | FR |
| 1242172 | Aug 1971 | GB |
| 2481190 | Jan 2015 | GB |
| 1179770 | Jul 1989 | JP |
| 06318756 | Nov 1994 | JP |
| 6318756 | Nov 1994 | JP |
| 9106243 | Apr 1997 | JP |
| 11197498 | Jul 1999 | JP |
| 11269683 | Oct 1999 | JP |
| 11330597 | Nov 1999 | JP |
| 11347758 | Dec 1999 | JP |
| 2001138083 | May 2001 | JP |
| 2002210730 | Jul 2002 | JP |
| 2002228818 | Aug 2002 | JP |
| 2003025085 | Jan 2003 | JP |
| 2003114400 | Apr 2003 | JP |
| 2003154517 | May 2003 | JP |
| 2003181668 | Jul 2003 | JP |
| 2003238178 | Aug 2003 | JP |
| 2004209675 | Jul 2004 | JP |
| 2005104819 | Apr 2005 | JP |
| 2005205440 | Aug 2005 | JP |
| 2005288503 | Oct 2005 | JP |
| 2005288503 | Oct 2005 | JP |
| 3775250 | May 2006 | JP |
| 3775410 | May 2006 | JP |
| 2006130691 | May 2006 | JP |
| 2006248885 | Sep 2006 | JP |
| 2007021548 | Feb 2007 | JP |
| 2007196277 | Aug 2007 | JP |
| 2007253203 | Oct 2007 | JP |
| 4592855 | Dec 2010 | JP |
| 2011049398 | Mar 2011 | JP |
| 4672689 | Apr 2011 | JP |
| 2011517299 | Jun 2011 | JP |
| 4880820 | Feb 2012 | JP |
| 2012024782 | Feb 2012 | JP |
| 2012031018 | Feb 2012 | JP |
| 2012159749 | Aug 2012 | JP |
| 2013007842 | Jan 2013 | JP |
| 2013043808 | Mar 2013 | JP |
| 2013075802 | Apr 2013 | JP |
| 2013091578 | May 2013 | JP |
| 5274085 | Aug 2013 | JP |
| 5300544 | Sep 2013 | JP |
| 2013187247 | Sep 2013 | JP |
| 2013203630 | Oct 2013 | JP |
| 2013203631 | Oct 2013 | JP |
| 2013223886 | Oct 2013 | JP |
| 2012015366 | Feb 2002 | KR |
| 2009057161 | Jun 2009 | KR |
| 1020621 | Mar 2011 | KR |
| 1120471 | Mar 2012 | KR |
| 2012074508 | Jul 2012 | KR |
| 2013031380 | Mar 2013 | KR |
| 1269474 | May 2013 | KR |
| 2013124646 | Nov 2013 | KR |
| 1344368 | Dec 2013 | KR |
| 2014022980 | Feb 2014 | KR |
| 2014022981 | Feb 2014 | KR |
| 2014064220 | May 2014 | KR |
| 201226345 | Jul 2012 | TW |
| 9929243 | Jun 1999 | WO |
| 9963900 | Dec 1999 | WO |
| 2004110693 | Dec 2004 | WO |
| 2006073098 | Jul 2006 | WO |
| 2007094160 | Aug 2007 | WO |
| 2008080182 | Jul 2008 | WO |
| 2008128612 | Oct 2008 | WO |
| 2009114375 | Sep 2009 | WO |
| 2010035736 | Apr 2010 | WO |
| 2010111609 | Sep 2010 | WO |
| 2010129459 | Nov 2010 | WO |
| 2011025908 | Mar 2011 | WO |
| 2011056781 | May 2011 | WO |
| 2012006736 | Jan 2012 | WO |
| 2012075072 | Jun 2012 | WO |
| 2012108052 | Aug 2012 | WO |
| 2012166753 | Dec 2012 | WO |
| WO 2013016157 | Jan 2013 | WO |
| 2013022148 | Feb 2013 | WO |
| 2013043173 | Mar 2013 | WO |
| 2013138802 | Sep 2013 | WO |
| 2013150990 | Oct 2013 | WO |
| 2013153195 | Oct 2013 | WO |
| 2014028022 | Feb 2014 | WO |
| 2014079478 | May 2014 | WO |
| 2014079570 | May 2014 | WO |
| 2014064492 | May 2014 | WO |
| 2014079478 | May 2014 | WO |
| 2014079570 | May 2014 | WO |
| 2014085663 | Jun 2014 | WO |
| 2014111385 | Jul 2014 | WO |
| 2014111794 | Jul 2014 | WO |
| 2014161534 | Oct 2014 | WO |
| 2014161535 | Oct 2014 | WO |
| 2015077113 | May 2015 | WO |
| 2015095088 | Jun 2015 | WO |
| 2015095090 | Jun 2015 | WO |
| 2015095146 | Jun 2015 | WO |
| 2015127583 | Sep 2015 | WO |
| 2016010954 | Jan 2016 | WO |
| Entry |
|---|
| Corning Inc., “Corning® 1737 AMLCD Glass Substrates Material Information”, issued Aug. 2002. |
| Corning Inc., “Corning® Eagle2000 TM AMLCD Glass Substrates Material Information”, issued Apr. 2005. |
| International Search Report, issued in connection with corresponding PCT application No. PCT/US2014/070434, Apr. 14, 2015. |
| E. Vanagas et al., “Glass Cuttlng by Femtosecond Pulsed Radiation”, J. Microlith., Microfa., Microsyst., 3(2) 358-363, 2004. |
| M. K. Bhuyan, et al., High aspect ratio taper-free microchannel fabrication using femtosecond Bessel beams, Jan. 18, 2010 / vol. 18, No. 2 / Optics Express 566. |
| Design of Detractivephase Axicon Illuminated by a Gaussian-Profile Beam, Zhangg Uo-Qing, D Ongb I-Zhen,Y Angg Uo-Zhen, and Gu Ben-Yuan, vol. 6, No. 5 Acta Physica Sinica May 1996, pp. 354. |
| High-resolution optical coherence tomography over a large depth range with an axicon lens, Zhihua Ding, Hungwu Ren, Yonghua Zhao, J. Stuart Nelson, and Zhongping Chen, Feb. 15, 2002 / vol. 27, No. 4 / Optics Letters 243. |
| Ilya Golub, Fresnel axicon, 1890 Optics Letters / vol. 31, No. 12 /Jun. 15, 2006. |
| Rieko Arimoto, et al., Imaging properties of axicon in a scanning optical system; Nov. 1, 1992 / vol. 31, No. 31 / Applied Optics 6653. |
| D. Zeng, et al., Characteristic analysis of a refractive axicon system for optical trepanning; Optical Engineering 45(9), 094302 Sep. 2006. |
| Pavel Polynkin, et al., Extended filamcntation with temporally chirped femtosecond Bessel-Gauss beams in air, Jan. 19, 2009 / vol. 17, No. 2 / Optics Express 575. |
| O.G. Kosareva, et al. Formation of extended plasma channels in a condensed medium upon axicon focusing of a femtosecond laser pulse, Quantum Electronics, 35(11), 1013-1014 (2005). |
| Kruger, et al., “Laser micrornachining of barium aluminum borosilicate glass with pulse durations between 20 fs and 3 ps,” , Applied Surface Science, 127-129(1998), 892-898. |
| Perry, et al., “Ultreshort-Pulse Laser Machining,” submitted to ICA of Lasers and Electro-Optics, Preprint Nov. 16-19, 1998, Pub. Jan. 22, 1999, International Congress on Applications of Lasers and Electro-Optics. |
| Herman, et al., “Laser Micromachining of ‘transparent’ fused silica with 1ps pulses and pulse trains”, SPIE Conference, San Jose, CA, Jan. 1999, vol. 3616—0277-786X/99. |
| Yoshino, et al., “Micromachining with a High Repetition Rate Femtosecond Fiber Laser,” Journal of laser Micro/Nanoengineering vol. 3, No. 3, 2008. |
| Abramov et al., “Laser separation of chemically strengthened glass”, Physics Procedia, 5 (2010), 285-290. |
| Bagchi, “Fast Ion Beams From Intense, Fennosecond Laser Irradiated Nanostructured Surfaces,” Appl. Phys. B88: 167-173(2007). |
| Bhuyan, “Laser micro and nanostructiring using femtosecond Bessel beams.” Eur. Phys. J Special Topics 199: 101-110 (2011). |
| Bhuyan. “Ultrafast Bessel beams for high aspect ratio taper free micromachining of glass.” Nonlinear Optics and Applications IV, Proc of SPIE vol. 7728:7228I V-1-7228IV-8 (2010.). |
| Bhuyan, “Single-shot high aspect ratio bulk nanostructuring of fused silica using chirp-controlled ultrafast laser Bessel beams.” Applied Physics Letters 10-4, 021107-1-021107-4 (2014). |
| Courvoisier, “Applications of femtosecond Bessel beams to laser ablation.” Appl Phys A, 112:29-34, (2013). |
| Courvoisier, “Surface nanoprocessing with nondiffracting femtosecond Bessel beams.” Optics Letters, vol. 34, No. 20, 3163-3165, Oct. 15, 2009. |
| Stoian, “Spatial and temporal laser pulse design for material processing on ultrafast scales.” Appl. Phys. A, 114:119-127, (2014). |
| Velpula, “Ultralast imaging of free carriers: controlled excitation with chirped ultrafast laser Bessel beams.” Prof of SPIE vol. 8967, : 896711-1-896711-8, (2014.). |
| Abramov et al., “Laser separation of chemically strengthened glass”; Physics Procedia 5 (2010) 285-290, Elsevier.; doi: 10.1016/j.phpro.2010.08.054. |
| Arimoto et al., “Imaging properties of axicon in a scanning optical system”; Applied Optics, Nov. 1, 1992, vol. 31, No. 31, pp. 6653-6657. |
| Bhuyan et al., “High aspect ratio nanochannel machining using single shot femtosecond Bessel beams”; Applied Physics Letters 97, 081102 (2010); doi: 10.1063/1.3479419. |
| Bhuyan et al., “High aspect ratio taper-free microchannel fabrication using femtosecond Bessel beams”; Optics Express (2010) vol. 18, No. 2, pp. 566-574. |
| Cubeddu et al., “A compact time-resolved reflectance system for dual-wavelength multichannel assessment of tissue absorption and scattering”; Part of the SPIE Conference on Optical Tomography and Spectroscopy of Tissue III, San Jose, CA (Jan. 1999), SPIE vol. 3597, 0277-786X/99, pp. 450-455. |
| Cubeddu et al., “Compact tissue oximeter based on dual-wavelength multichannel time-resolved reflectance”; Applied Optics, vol. 38, No. 16, Jun. 1, 1999, pp. 3670-3680. |
| Ding et al., “High-resolution optical coherence tomography over a large depth range with an axicon lens”; Optic Letters, vol. 27, No. 4, pp. 243-245, Feb. 15, 2002, Optical Society of America. |
| “EagleEtch” Product Brochure, EuropeTec USA Inc., pp. 1-8, Aug. 1, 2014. |
| Girkin et al., “Macroscopic multiphoton biomedical imaging using semiconductor saturable Bragg reflector modelocked Lasers”; Part of the SPIE Conference on Commercial and Biomedical Applications of Ultrafast Lasers, San Jose, CA (Jan. 1999), SPIE vol. 3616, 0277-786X/99, pp. 92-98. |
| Glezer et al., “Ultrafast-laser driven micro-explosions in transparent materials”; Applied Physics Letters, vol. 71 (1997), pp. 882-884. |
| Golub, I., “Fresnel axicon”; Optic Letters, vol. 31, No. 12, Jun. 15, 2006, Optical Society of America, pp. 1890-1892. |
| Herman et al., “Laser micromachining of ‘transparent’ fused silica with 1-ps pulses and pulse trains”; Part of the SPIE Conference on Commercial and Biomedical Applications of Ultrafast Lasers, San Jose, CA (Jan. 1999), SPIE vol. 3616, 0277-786X/99, pp. 148-155. |
| Kosareva et al., “Formation of extended plasma channels in a condensed medium upon axicon focusing of a femtosecond laser pulse”; Quantum Electronics 35 (11) 1013-1014 (2005), Kvantovaya Elektronika and Turpion Ltd.; doi: 10.1070/QE2005v035n11ABEH013031. |
| Krüger et al., “Femtosecond-pulse visible laser processing of transparent materials”; Applied Surface Science 96-98 (1996) 430-438. |
| Krüger et al., “Laser micromachining of barium aluminium borosilicate glass with pluse durations between 20 fs and 3 ps”; Applied Surface Science 127-129 (1998) 892-898. |
| Krüger et al., “Structuring of dielectric and metallic materials with ultrashort laser pulses between 20 fs and 3 ps”; SPIE vol. 2991, 0277-786X/97, pp. 40-47. |
| Lapczyna et al., “Ultra high repetition rate (133 MHz) laser ablation of aluminum with 1.2-ps pulses”; Applied Physics A 69 [Suppl.], S883-S886, Springer-Verlag (1999); doi: 10.1007/s003399900300. |
| Perry et al., “Ultrashort-pulse laser machining”; UCRL-JC-132159 Rev 1., Jan. 22, 1999, pp. 1-24. |
| Perry et al., “Ultrashort-pulse laser machining”; UCRL-ID-132159, Sep. 1998, pp. 1-38. |
| Perry et al., “Ultrashort-pulse laser machining of dielectric materials”; Journal of Applied Physics, vol. 85, No. 9, May 1, 1999, American Institute of Physics, pp. 6803-6810. |
| “Pharos High-power femtosecond laser system” product brochure; Light Conversion, Vilnius, LT; Apr. 18, 2011, pp. 1-2. |
| Polynkin et al., “Extended filamentation with temporally chirped femtosecond Bessel-Gauss beams in air”; Optics Express, vol. 17, No. 2, Jan. 19, 2009, OSA, pp. 575-584. |
| Serafetinides et al., “Ultra-short pulsed laser ablation of polymers”; Applied Surface Science 180 (2001) 42-56. |
| Sundaram et al., “Inducing and probing non-thermal transitions in semiconductors using femtosecond laser pulses”; Nature Miracles, vol. 1, Dec. 2002, Nature Publishing Group (2002), pp. 217-224. |
| Vanagas et al., “Glass cutting by femtosecond pulsed irradiation”; J. Micro/Nanolith. MEMS MOEMS. 3(2), 358-363 (Apr. 1, 2004); doi: 10.1117/1.1668274. |
| Varel et al., “Micromachining of quartz with ultrashort laser pulses”; Applied Physics A 65, 367-373, Springer-Verlag (1997). |
| Yoshino et al., “Micromachining with a high repetition rate femtosecond fiber laser”; JLMN-Journal of Laser Micro/Nanoengineering vol. 3, No. 3 (2008), pp. 157-162. |
| Zeng et al. “Characteristic analysis of a refractive axicon system for optical trepanning”; Optical Engineering 45(9), 094302 (Sep. 2006), pp. 094302-1-094302-10. |
| Zhang et al., “Design of diffractive-phase axicon illuminated by a Gaussian-profile beam”; Acta Physica Sinica (overseas edition), vol. 5, No. 5 (May 1996) Chin. Phys. Soc., 1004-423X/96/05050354-11, pp. 354-364. |
| Abakians, H. et al.; Evaporative Cutting of a Semitransparent Body With a Moving CW Laser; Journal of Heat Transfer; Nov. 1988; pp. 924-930; vol. 110; ASME. |
| Ahmed, F. et al.; Display glass cutting by femtosecond laser induced single shot periodic void array; Applied Physics A Material Science & Processing; Jun. 3, 2008; pp. 189-192; vol. 93; Springer-Verlag. |
| Bagchi, S. et al.; Fast ion beams from intense, femtosecond laser irradiated nanostructured surfaces; Applied Physics B Lasers and Optics; Jun. 27, 2007; pp. 167-173; vol. 88; Springer-Verlag. |
| Bhuyan, M.K. et al.; Femtosecond non-diffracting Bessel beams and controlled nanoscale ablation; ResearchGate Conference Paper; Sep. 2011; pp. 1-4. |
| Bhuyan, M.K. et al.; Laser micro- and nanostructuring using femtosecond Bessel beams; The European Physical Journal Special Topics; Dec. 7, 2011; pp. 101-110; vol. 1999; EDP Sciences, Springer-Verlag. |
| Bhuyan, M.K. et al.; Single-shot high aspect ratio bulk nanostructuring of fused silica using chirp-controlled ultrafast laser Bessel beams; Applied Physics Letters; Jan. 14, 2014; pp. 021107-1-021107-4; vol. 104; AIP Publishing LLC. |
| Bhuyan, M.K. et al.; Ultrafast Bessel beams for high aspect ratio taper free micromachining of glass; Nonlinear Optics and Applications IV; 2010; pp. 77281V-1-77281V-8; vol. 7728; SPIE. |
| Case Design Guidelines for Apple Devices; Sep. 13, 2013; pp. 1-58; Apple Inc. |
| Chiao, R. Y. et al.; Self-Trapping of Optical Beams; Physical Review Letters; Oct. 12, 1964; pp. 479-482; vol. 13, No. 15. |
| Corning Eagle AMLCD Glass Substrates Material Information; Apr. 2005; pp. MIE 201-1-MIE 201-3; Corning Incorporated. |
| Corning 1737 AMLCD Glass Substrates Material Information; Aug. 2002; pp. MIE 101-1-MIE 101-3; Corning Incorporated. |
| Couairon, A. et al.; Femtosecond filamentation in transparent media; ScienceDirect Physical Reports; Feb. 6, 2007; pp. 47-189; vol. 441; Elsevier B.V. |
| Courvoisier, F. et al.; Applications of femtosecond Bessel beams to laser ablation; Applied Physics A Materials Science & Processing; Sep. 6, 2012; pp. 29-34; vol. 112; Springer-Verlag. |
| Courvoisier, F. et al.; Surface nanoprocessing with nondiffracting femtosecond Bessel beams; Optics Letters; Oct. 15, 2009; pp. 3163-3165; vol. 34, No. 20; Optical Society of America. |
| Dong, M. et al.; On-axis irradiance distribution of axicons illuminated by spherical wave; ScienceDirect Optics & Laser Technology; Sep. 2007; pp. 1258-1261; vol. 39; Elsevier Ltd. |
| Duocastella, M. et al.; Bessel and annular beams for materials processing; Laser & Photonics Reviews; 2012; pp. 607-621; vol. 6, No. 5. |
| Durnin, J.; Exact solutions for nondiffracting beams. I. The scalar theory; J. Opt. Soc. Am. A; Apr. 1987; pp. 651-654; vol. 4, No. 4; Optical Society of America. |
| Eaton, S. et al.; Heat accumulation effects in femtosecond laser-written waveguides with variable repetition rate; Optics Express; Jun. 13, 2005; pp. 4708-4716; vol. 13, No. 12; Optical Society of America. |
| Gattass, R. et al.; Micromachining of bulk glass with bursts of femtosecond laser pulses at variable repetition rates; Optics Express; Jun. 12, 2006; pp. 5279-5284; vol. 14, No. 12; Optical Society of America. |
| Gori, F. et al.; Analytical derivation of the optimum triplicator; Optics Communications; Dec. 1, 1998; pp. 13-16; vol. 157; Elsevier B.V. |
| Honda, M. et al.; A Novel Polymer Film that Controls Light Transmission; Progress in Pacific Polymer Science 3; 1994; pp. 159-169; Springer-Verlag Berlin Heidelberg. |
| Hu, Z. et al.; 5-Axis Laser Cutting Interference Detection and Correction Based on STL Model; Chinese Journal of Lasers; Dec. 2009; pp. 3313-3317; vol. 36, No. 12. |
| Huang, Z. et al.; Laser etching of glass substrates by 1064 nm laser irradiation; Applied Physics A Materials Science & Processing; Jun. 6, 2008; pp. 159-163; vol. 93; Springer-Verlag. |
| Juodkazis, S. et al.; Laser-Induced Microexplosion Confined in the Bulk of a Sapphire Crystal: Evidence of Multimegabar Pressures; Physical Review Letters; Apr. 28, 2006; pp. 166101-1-166101-4; vol. 96; The American Physical Society. |
| Karlsson, S. et al.; The Technology of Chemical Glass Strengthening—A Review; Glass Technology—European Journal of Glass Science and Technology Part A; Apr. 2010; pp. 41-54; vol. 51, No. 2. |
| Levy, U. et al.; Design, fabrication, and characterization of circular Dammann gratings based on grayscale lithography; Optics Letters; Mar. 15, 2010; pp. 880-882; vol. 35, No. 6; Optical Society of America. |
| Liu, X. et al.; Laser Ablation and Micromachining with Ultrashort Laser Pulses; IEEE Journal of Quantum Electronics; Oct. 1997; p. 1706-1716; vol. 33, No. 10; IEEE. |
| Maeda, K. et al.; Optical performance of angle dependent light control glass; Optical Materials Technology for Energy Efficiency and Solar Energy Conversion X; 1991; pp. 138-148; vol. 1536; SPIE. |
| Mbise, G. et al.; Angular selective window coatings; theory and experiments; J. Phys. D: Appl. Phys.; 1997; pp. 2103-2122; vol. 30; IOP Publishing Ltd. |
| McGloin, D. et al.; Bessel beams: diffraction in a new light; Contemporary Physics; Jan.-Feb. 2005; pp. 15-28; vol. 46; Taylor & Francis Ltd. |
| Merola, F. et al.; Characterization of Bessel beams generated by polymeric microaxicons; Measurement Science and Technology; May 15, 2012; pp. 1-10; vol. 23; IOP Publishing Ltd. |
| Mirkhalaf, M. et al.; Overcoming the brittleness of glass through bio-inspiration and micro-architecture; Nature Communications; Jan. 28, 2014; pp. 1-9; Macmillan Publishers Limited. |
| Romero, L. et al.; Theory of optimal beam splitting by phase gratings. II. Square and hexagonal gratings; J. Opt. Soc. Am. A; Aug. 2007; pp. 2296-2312; vol. 24, No. 8; Optical Society of America. |
| Salleo, A. et al.; Machining of transparent materials using an IR and UV nanosecond pulsed laser; Applied Physics A Materials Science & Processing; Sep. 20, 2000; pp. 601-608; vol. 71; Springer-Verlag. |
| Serafetinides, A. et al.; Polymer Ablation by Ultra-Short Pulsed Lasers; Proceedings of SPIE; 2000; pp. 409-415. |
| Shah, L. et al.; Micromachining with a High Repetition Rate Femtosecond Fiber Laser; JLMN-Journal of Laser Micro/Nanoengineering; Nov. 2008; pp. 157-162; vol. 3, No. 3. |
| Shealy, D. et al.; Geometric optics-based design of laser beam shapers; Opt. Eng.; Nov. 2003; pp. 3123-3138; vol. 42, No. 11; Society of Photo-Optical Instrumentation Engineers. |
| Thiele, E.; Relation between Catalytic Activity and Size of Particle; Industrial and Engineering Chemistry; Jul. 1939; pp. 916-920; vol. 31, No. 7. |
| Toytman, I. et al.; Optical breakdown in transparent media with adjustable axial length and location; Optic Express; Nov. 22, 2010; pp. 24688-24698; vol. 18, No. 24; Optical Society of America. |
| Velpula, P. et al.; Ultrafast imaging of free carriers: controlled excitation with chirped ultrafast laser Bessel beams; Laser Applications in Microelectronic and Optoelectronic Manufacturing (LAMOM) XIX; Proc. Of SPIE; 2014; pp. 896711-1-896711-8; vol. 8967; SPIE. |
| Wang, Z. et al.; Investigation on CO2 laser irradiation inducing glass strip peeling for microchannel formation; Biomicrofluidics; Mar. 12, 2012; pp. 012820-1-012820-12; vol. 6; American Institute of Physics. |
| Ra & RMS: Calculating Surface Roughness; Harrison Eelectropolishing; 2012. |
| Wu, W. et al.; Optimal Orientation of the Cutting Head for Enhancing Smoothness Movement in Three-Dimensional Laser Cutting; Chinese Journal of Lasers; Jan. 2013; pp. 0103005-1-0103005-7, vol. 10, No. 1. |
| GT ASF Grown Sapphire Cover and Touch Screen Material; www.gtat.com; 2012; pp. 1-2; GTAT Corporation. |
| Xu, H. et al.; Optimization of 3D laser cutting head orientation based on minimum energy consumption; Int J Adv Manuf Technol; Jun. 28, 2014; pp. 1283-1291; vol. 74; Springer-Verlag London. |
| Yan, Y. et al.; Fiber structure to convert a Gaussian beam to higher-order optical orbital angular momentum modes; Optics Letters; Aug. 15, 2012; pp. 3294-3296; vol. 37, No. 16; Optical Society of America. |
| Number | Date | Country | |
|---|---|---|---|
| 20150166391 A1 | Jun 2015 | US |
| Number | Date | Country | |
|---|---|---|---|
| 61917226 | Dec 2013 | US | |
| 62023322 | Jul 2014 | US |
