in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding

Industry

CPC
H05K3/02

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K3/00Apparatus or processes for manufacturing printed circuits

Current Industry

H05K3/02in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Copper clad laminate film and electronic device including same
- Patent number 12,324,094
- Issue date Jun 3, 2025
- Toray Advanced Materials Korea Inc.
- Jong Hun Cheon
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Preparation method for copper clad laminate having low dielectric c...
- Patent number 12,311,646
- Issue date May 27, 2025
- JIANGMEN DEZHONGTAI ENGINEERING PLASTICS TECHNOLOGY CO., LTD.
- Yonghua Liang
- B32 - LAYERED PRODUCTS
Information Patent Grant
Wiring board, semiconductor device, and method of manufacturing wir...
- Patent number 12,317,416
- Issue date May 27, 2025
- Kioxia Corporation
- Tomonori Kawata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Subtractive method for manufacturing circuit board with fine interc...
- Patent number 12,309,938
- Issue date May 20, 2025
- Hsu-Tung Chen
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Temporary carrier and method for manufacturing coreless substrate t...
- Patent number 12,302,508
- Issue date May 13, 2025
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Material deposition method and material deposition apparatus
- Patent number 12,296,360
- Issue date May 13, 2025
- Intel Corporation
- Fanyi Zhu
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Production method for multilayer wiring board
- Patent number 12,302,504
- Issue date May 13, 2025
- Mitsui Mining & Smelting Co., Ltd.
- Yoshinori Matsuura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ceramic-cladded copper plate and method for manufacturing ceramic-c...
- Patent number 12,284,766
- Issue date Apr 22, 2025
- BYD Company Limited
- Wei Zhou
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electronic component mounting substrate, electronic component mount...
- Patent number 12,256,491
- Issue date Mar 18, 2025
- Sony Group Corporation
- Koji Aoyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metal foil with carrier
- Patent number 12,247,280
- Issue date Mar 11, 2025
- Mitsui Mining & Smelting Co., Ltd.
- Yukiko Kitabatake
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Copper-clad laminated plate, resin-clad copper foil, and circuit su...
- Patent number 12,233,621
- Issue date Feb 25, 2025
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Yuki Kitai
- B32 - LAYERED PRODUCTS
Information Patent Grant
Manufacturing method of continuous sheet for circuit board producti...
- Patent number 12,225,669
- Issue date Feb 11, 2025
- LG Chem, Ltd.
- Hyung Suk Oh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible devices incorporating electronically-conductive layers, in...
- Patent number 12,216,010
- Issue date Feb 4, 2025
- The University Court of the University of Edinburgh
- Philip James Walton Hands
- G01 - MEASURING TESTING
Information Patent Grant
Method for manufacturing dielectric sheet, method for manufacturing...
- Patent number 12,213,249
- Issue date Jan 28, 2025
- Sumitomo Electric Industries, Ltd.
- Shingo Kaimori
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Droplet actuator fabrication apparatus, systems, and related methods
- Patent number 12,201,980
- Issue date Jan 21, 2025
- Abbott Laboratories
- Andrew Fischer
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Grant
Package device
- Patent number 12,200,857
- Issue date Jan 14, 2025
- Innolux Corporation
- Yeong-E Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ground discontinuities for thermal isolation
- Patent number 12,193,142
- Issue date Jan 7, 2025
- International Business Machines Corporation
- Trevor Timpane
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Circuit board
- Patent number 12,177,978
- Issue date Dec 24, 2024
- Toppan Printing Co., Ltd.
- Jun Onohara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface-treated copper foil and copper clad laminate
- Patent number 12,168,834
- Issue date Dec 17, 2024
- Chang Chun Petrochemical Co., Ltd.
- Jian-Ming Huang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Metal foil with carrier and preparation method thereof
- Patent number 12,167,533
- Issue date Dec 10, 2024
- GUANGZHOU FANGBANG ELECTRONICS CO., LTD
- Zhi Su
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Wiring circuit board, producing method thereof, and wiring circuit...
- Patent number 12,167,544
- Issue date Dec 10, 2024
- Nitto Denko Corporation
- Ryosuke Sasaoka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Communication cable including a mosaic tape
- Patent number 12,142,390
- Issue date Nov 12, 2024
- Panduit Corp.
- Royal O. Jenner
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Reel mechanism and winding device for flexible copper clad laminate
- Patent number 12,120,828
- Issue date Oct 15, 2024
- AAC Technologies (Nanjing) Co., Ltd.
- Rui Pan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resin composition, prepreg, film with resin, metal foil with resin,...
- Patent number 12,098,257
- Issue date Sep 24, 2024
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Hirosuke Saito
- B32 - LAYERED PRODUCTS
Information Patent Grant
Method and apparatus for delivering power to semiconductors
- Patent number 12,088,208
- Issue date Sep 10, 2024
- Vicor Corporation
- Patrizio Vinciarelli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-coated liquid-crystal polymer film
- Patent number 12,089,327
- Issue date Sep 10, 2024
- Kuraray Co., Ltd.
- Kikuo Arimoto
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Circuit board producing apparatus
- Patent number 12,075,569
- Issue date Aug 27, 2024
- FUJIFILM Business Innovation Corp.
- Yasuo Matsumura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laminated film structure and method for manufacturing laminated fil...
- Patent number 12,069,809
- Issue date Aug 20, 2024
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Kazuya Shimada
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Surface-treated copper foil, copper-clad laminate and printed wirin...
- Patent number 12,063,747
- Issue date Aug 13, 2024
- Fukuda Metal Foil & Powder Co., Ltd.
- Takeshi Okamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing a metal-ceramic substrate, and metal-ceramic s...
- Patent number 12,058,816
- Issue date Aug 6, 2024
- Rogers Germany GmbH
- Andreas Meyer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
METHODS FOR PROMOTING SELECTIVE COPPER FOIL ADHESION IN A PRINTED C...
- Publication number 20250151205
- Publication date May 8, 2025
- Rockwell Collins, Inc.
- James B. Mayfield
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SIGNAL PROCESSING CIRCUIT AND MEASUREMENT SYSTEM
- Publication number 20250132076
- Publication date Apr 24, 2025
- ROHDE &SCHWARZ GMBH & CO. KG
- Stefan SOHR
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
GENERATION OF RANDOM SECURITY CIRCUIT PATTERNS FOR IN-SITU FABRICAT...
- Publication number 20250089174
- Publication date Mar 13, 2025
- International Business Machines Corporation
- Hongqing ZHANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING CIRCUIT BOARD
- Publication number 20250071909
- Publication date Feb 27, 2025
- HAESUNG DS CO., LTD.
- Soon-Chul KWON
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD HAVING AN EDGE CONTAINING CONDUCTIVE REGIONS
- Publication number 20250063664
- Publication date Feb 20, 2025
- Teradyne, Inc.
- Daniel L. Engel
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
STRETCHABLE, FABRIC SENSOR, WEARABLE ELECTRONIC DEVICE INCLUDING TH...
- Publication number 20250063654
- Publication date Feb 20, 2025
- Yale University
- LINA SANCHEZ-BOTERO
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ELECTRONIC DEVICE INCLUDING INTERPOSER
- Publication number 20250056723
- Publication date Feb 13, 2025
- Samsung Electronics Co., Ltd.
- Dohyeong PARK
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMMUNICATION CABLE INCLUDING A MOSAIC TAPE
- Publication number 20250037905
- Publication date Jan 30, 2025
- Panduit Corp.
- Royal O. Jenner
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240414850
- Publication date Dec 12, 2024
- Unimicron Technology Corp.
- Chin-Sheng Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
X-Y SHIELDING OF SIGNAL PATHS WITHIN PCBS
- Publication number 20240407105
- Publication date Dec 5, 2024
- International Business Machines Corporation
- Kyle Indukummar Giesen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING CONDUCTIVE CIRCUIT BOARD AND CONDUCTIVE CI...
- Publication number 20240365473
- Publication date Oct 31, 2024
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- YU-HSIEN LIAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COPPER CLAD LAMINATE AND PRINTED WIRING BOARD
- Publication number 20240349422
- Publication date Oct 17, 2024
- SONY GROUP CORPORATION
- Kenji UEDA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING CURED RE...
- Publication number 20240329525
- Publication date Oct 3, 2024
- Asahi Kasei Kabushiki Kaisha
- Tomohiro YORISUE
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
THERMOSETTING COMPOSITION, RESIN SHEET, METAL FOIL WITH RESIN, META...
- Publication number 20240301173
- Publication date Sep 12, 2024
- Panasonic Intellectual Property Management Co., Ltd.
- Kouichi AOKI
- B32 - LAYERED PRODUCTS
Information Patent Application
Flexible Interconnect Circuits And Methods Of Fabrication Thereof
- Publication number 20240292527
- Publication date Aug 29, 2024
- CelLink Corporation
- Jean-Paul Ortiz
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING THE PRINTED CIRCUIT BOARD EMBEDDED WITH WAF...
- Publication number 20240292544
- Publication date Aug 29, 2024
- DAEDUCK ELECTRONICS CO., LTD.
- Seon-Kyu CHANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic device and manufacturing method thereof
- Publication number 20240274543
- Publication date Aug 15, 2024
- InnoLux Corporation
- Yan-Tang DAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD STRUCTURE WITH EMBEDDED CERAMIC SUBSTRATE AND MANUFAC...
- Publication number 20240276636
- Publication date Aug 15, 2024
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- Yu-Hsien LIAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD
- Publication number 20240268027
- Publication date Aug 8, 2024
- ROLLS-ROYCE DEUTSCHLAND LTD & CO KG
- Stanley Buchert
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR PRODUCING WIRING CIRCUIT BOARD AND WIRING CIRCUIT BOARD
- Publication number 20240260177
- Publication date Aug 1, 2024
- Nitto Denko Corporation
- Kenya TAKIMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CERAMIC COPPER CIRCUIT BOARD AND SEMICONDUCTOR DEVICE USING SAME
- Publication number 20240260182
- Publication date Aug 1, 2024
- Kabushiki Kaisha Toshiba
- Hiromasa KATO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Metal Foil for Circuit Board, Metal Foil with Carrier, Copper-Clad...
- Publication number 20240244755
- Publication date Jul 18, 2024
- Qiang GAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for preparing novel material layer structure of high-frequen...
- Publication number 20240244757
- Publication date Jul 18, 2024
- LongKai LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SURFACE-TREATED COPPER FOIL, COPPER-CLAD LAMINATE AND PRINTED WIRIN...
- Publication number 20240215172
- Publication date Jun 27, 2024
- Fukuda Metal Foil & Powder Co., Ltd.
- Takeshi OKAMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ROLL FILM, METHOD FOR PRODUCING ROLL FILM, METHOD FOR PRODUCING COP...
- Publication number 20240199829
- Publication date Jun 20, 2024
- AGC Inc.
- Seigo KOTERA
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
A PROCESS FOR ELECTROCHEMICAL DEPOSITION OF COPPER WITH DIFFERENT C...
- Publication number 20240183052
- Publication date Jun 6, 2024
- Atotech Deutschland GmbH & Co. KG
- Peter HAACK
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
TRANSPARENT CONDUCTING FILM AND METHOD FOR FORMING TRANSPARENT COND...
- Publication number 20240188220
- Publication date Jun 6, 2024
- Resonac Corporation
- Shigeru YAMAKI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD ASSEMBLY AND METHOD OF MANUFACTURING THE SAME, PACKAG...
- Publication number 20240147629
- Publication date May 2, 2024
- HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd.
- CHANG-HE ZHU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METAL RESIDUE REMOVING LIQUID, METAL RESIDUE REMOVING METHOD, AND M...
- Publication number 20240117280
- Publication date Apr 11, 2024
- Tokyo Ohka Kogyo Co., Ltd.
- Ivan Ryzhii
- C11 - ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES FATTY ACIDS...
Information Patent Application
AUTOMATIC PROCESSING METHOD FOR PRINTED CIRCUIT BOARD DATA AND ELEC...
- Publication number 20240114624
- Publication date Apr 4, 2024
- ISCOOLLAB CO., LTD.
- YAN-MEI JIANG
- G06 - COMPUTING CALCULATING COUNTING

in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Copper clad laminate film and electronic device including same

Preparation method for copper clad laminate having low dielectric c...

Wiring board, semiconductor device, and method of manufacturing wir...

Subtractive method for manufacturing circuit board with fine interc...

Temporary carrier and method for manufacturing coreless substrate t...

Material deposition method and material deposition apparatus

Production method for multilayer wiring board

Ceramic-cladded copper plate and method for manufacturing ceramic-c...

Electronic component mounting substrate, electronic component mount...

Metal foil with carrier

Copper-clad laminated plate, resin-clad copper foil, and circuit su...

Manufacturing method of continuous sheet for circuit board producti...

Flexible devices incorporating electronically-conductive layers, in...

Method for manufacturing dielectric sheet, method for manufacturing...

Droplet actuator fabrication apparatus, systems, and related methods

Package device

Ground discontinuities for thermal isolation

Circuit board

Surface-treated copper foil and copper clad laminate

Metal foil with carrier and preparation method thereof

Wiring circuit board, producing method thereof, and wiring circuit...

Communication cable including a mosaic tape

Reel mechanism and winding device for flexible copper clad laminate

Resin composition, prepreg, film with resin, metal foil with resin,...

Method and apparatus for delivering power to semiconductors

Metal-coated liquid-crystal polymer film

Circuit board producing apparatus

Laminated film structure and method for manufacturing laminated fil...

Surface-treated copper foil, copper-clad laminate and printed wirin...

Method for producing a metal-ceramic substrate, and metal-ceramic s...

Patents Applicationslast 30 patents

METHODS FOR PROMOTING SELECTIVE COPPER FOIL ADHESION IN A PRINTED C...

SIGNAL PROCESSING CIRCUIT AND MEASUREMENT SYSTEM

GENERATION OF RANDOM SECURITY CIRCUIT PATTERNS FOR IN-SITU FABRICAT...

METHOD OF MANUFACTURING CIRCUIT BOARD

CIRCUIT BOARD HAVING AN EDGE CONTAINING CONDUCTIVE REGIONS

STRETCHABLE, FABRIC SENSOR, WEARABLE ELECTRONIC DEVICE INCLUDING TH...

ELECTRONIC DEVICE INCLUDING INTERPOSER

COMMUNICATION CABLE INCLUDING A MOSAIC TAPE

CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF

X-Y SHIELDING OF SIGNAL PATHS WITHIN PCBS

METHOD FOR MANUFACTURING CONDUCTIVE CIRCUIT BOARD AND CONDUCTIVE CI...

COPPER CLAD LAMINATE AND PRINTED WIRING BOARD

PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING CURED RE...

THERMOSETTING COMPOSITION, RESIN SHEET, METAL FOIL WITH RESIN, META...

Flexible Interconnect Circuits And Methods Of Fabrication Thereof

METHOD OF MANUFACTURING THE PRINTED CIRCUIT BOARD EMBEDDED WITH WAF...

Electronic device and manufacturing method thereof

CIRCUIT BOARD STRUCTURE WITH EMBEDDED CERAMIC SUBSTRATE AND MANUFAC...

CIRCUIT BOARD

METHOD FOR PRODUCING WIRING CIRCUIT BOARD AND WIRING CIRCUIT BOARD

CERAMIC COPPER CIRCUIT BOARD AND SEMICONDUCTOR DEVICE USING SAME

Metal Foil for Circuit Board, Metal Foil with Carrier, Copper-Clad...

Method for preparing novel material layer structure of high-frequen...

SURFACE-TREATED COPPER FOIL, COPPER-CLAD LAMINATE AND PRINTED WIRIN...

ROLL FILM, METHOD FOR PRODUCING ROLL FILM, METHOD FOR PRODUCING COP...

A PROCESS FOR ELECTROCHEMICAL DEPOSITION OF COPPER WITH DIFFERENT C...

TRANSPARENT CONDUCTING FILM AND METHOD FOR FORMING TRANSPARENT COND...

CIRCUIT BOARD ASSEMBLY AND METHOD OF MANUFACTURING THE SAME, PACKAG...

METAL RESIDUE REMOVING LIQUID, METAL RESIDUE REMOVING METHOD, AND M...

AUTOMATIC PROCESSING METHOD FOR PRINTED CIRCUIT BOARD DATA AND ELEC...