Claims
- 1. A lead-free solder alloy composition containing Sn, Ag and Bi, with respective concentrations set such that said lead-free solder alloy has a melting temperature lower than a predetermined heat-resistant temperature of a work to be soldered, wherein said lead-free solder alloy composition contains Ag with an amount of approximately 3.1 wt %, Bi with an amount of approximately 10.0 wt %, and Sn with an amount of approximately 86.9 wt %.
- 2. A lead-free solder alloy composition containing Sn, Ag and Bi, with respective concentrations set such that said lead-free solder alloy has a melting temperature lower than a predetermined heat-resistant temperature of a work to be soldered, wherein said lead-free solder alloy composition contains Ag with an amount of 3.0 wt %, Bi with an amount of 15.0 wt %, and Sn with an amount of 82.0 wt %.
- 3. A lead-free solder alloy composition containing Sn, Ag and Bi, with respective concentrations set such that said lead-free solder alloy has a melting temperature lower than a predetermined heat-resistant temperature of a work to be soldered, wherein said lead-free solder alloy composition contains Ag with an amount of 2.8 wt %, Bi with an amount of 20.0 wt %, and Sn with an amount of 77.2 wt %.
Priority Claims (2)
Number |
Date |
Country |
Kind |
6-235734 |
Sep 1994 |
JP |
|
7-059561 |
Mar 1995 |
JP |
|
Parent Case Info
This is a Division of application Ser. No. 08/526,929 filed Sep. 12, 1995, now U.S. Pat. No. 6,184,475. The disclosure of the prior application is hereby incorporated by reference herein in its entirety.
US Referenced Citations (22)
Foreign Referenced Citations (10)
Number |
Date |
Country |
612578 |
Sep 1994 |
EP |
0 629 466 |
Dec 1994 |
EP |
59 151 407 |
Aug 1984 |
JP |
61009992 |
Jan 1986 |
JP |
63177995 |
Jul 1988 |
JP |
03013293 |
Jan 1991 |
JP |
03230894 |
Oct 1991 |
JP |
04063491 |
Feb 1992 |
JP |
6-238479 |
Aug 1994 |
JP |
7-1179 |
Jan 1995 |
JP |