Light absorption and filtering properties of vertically oriented semiconductor nano wires

Information

  • Patent Grant
  • 9601529
  • Patent Number
    9,601,529
  • Date Filed
    Thursday, February 26, 2015
    9 years ago
  • Date Issued
    Tuesday, March 21, 2017
    7 years ago
Abstract
A nanowire array is described herein. The nanowire array comprises a substrate and a plurality of nanowires extending essentially vertically from the substrate; wherein: each of the nanowires has uniform chemical along its entire length; a refractive index of the nanowires is at least two times of a refractive index of a cladding of the nanowires. This nanowire array is useful as a photodetector, a submicron color filter, a static color display or a dynamic color display.
Description
BACKGROUND OF THE INVENTION

Nanostructures often exhibit fascinating physical properties not present in their bulk counterparts. Optical properties of nanostructures have been one of the recent research focuses. Tuning optical properties of nanostructures would facilitate their applications in the semiconductor, optics, and consumer electronics industry. In one example, optical properties of nanostructures can be controlled by their chemical composition. Chemical doping can change electronic structures of the materials semiconductor nanostructures are composed of, which in turn changes their interaction with light. In another example, arranging nanostructures into a regular lattice can yield optical properties individual nanostructures lack. However, these conventional approaches often require complex chemical synthesis or post-synthesis manipulation, and thus are less robust against minute variations of conditions and cannot easily and accurately position nanostructures in a functional device. In contrast, the approach described herein overcomes these problems of the conventional approaches by harnessing small physical sizes of nanostructures and a top-down fabrication process (i.e., part of a piece of bulk material is removed until desired nanostructures are achieved).


BRIEF SUMMARY OF THE INVENTION

Described herein is a nanowire array, comprising a substrate and a plurality of nanowires extending essentially perpendicularly from the substrate; wherein: a refractive index of the nanowires is at least two times of a refractive index of a cladding of the nanowires. Preferably a number density of the nanowires is at most about 1.8/μm2.


The nanowire array can be fabricated using a method comprising: (a) coating the substrate with a resist layer; (b) generating a pattern of dots in the resist layer using a lithography technique; (c) developing the pattern in the resist layer; (d) depositing a mask layer; (e) lifting off the resist layer; (f) forming the nanowires by dry etching the substrate; (g) optionally removing the mask player; wherein shapes and sizes of the dots determine the cross-sectional shapes and sizes of the nanowires.


The nanowire array can be used as a photodetector, a submicron color filter, a static color display or a dynamic color display.





BRIEF DESCRIPTION OF THE DRAWINGS


FIG. 1A shows a perspective schematic of a nanowire array.



FIG. 1B shows a cross sectional schematic of the nanowire array of FIG. 1A.



FIGS. 2A-2D are SEM images of an exemplary nanowire array.



FIG. 3A shows measured reflectance spectra of nanowire arrays with nanowires of a series of different radii.



FIG. 3B shows simulated reflectance spectra of the nanowire arrays of FIG. 3A.



FIG. 3C shows dip positions in measured and simulated reflectance spectra of nanowire arrays, as functions of the radii of the nanowires thereon.



FIG. 4A-4C show a major transverse component of the H1,1 mode at different wavelengths, near a nanowire in an nanowire array.



FIG. 4D shows a schematic illustration of possible pathways of white light normally incident on the nanowire array.



FIG. 5A shows simulated effective refractive indexes (neff) of the H1,1 modes, as a function of wavelength, of three nanowire arrays with different nanowire radii.



FIG. 5B shows simulated absorption spectra of the nanowire arrays of FIG. 5A.



FIG. 5C compares a simulated absorption spectrum of the substrate in a nanowire array, a simulated absorption spectrum of the nanowires (of 45 nm radius) in the nanowire array, and a simulated reflectance spectrum of the entire nanowire array.



FIG. 6 shows a schematic top view of four pixels of the dynamic color display comprising a nanowire array according to an embodiment.



FIGS. 7A and 7B show schematics of two exemplary apparatuses for measuring reflectance spectra of the nanowire array.





DETAILED DESCRIPTION OF THE INVENTION

Described herein is a nanowire array, according to an embodiment, comprising a substrate and a plurality of nanowires extending essentially perpendicularly from the substrate; wherein a refractive index of the nanowires is at least two times of a refractive index of a cladding of the nanowires. A number density of the nanowires preferably is at most about 1.8/μm2.


According to an embodiment, a nanowire array comprises a substrate and a plurality of nanowires extending essentially perpendicularly from the substrate; wherein the nanowire array is operable as a submicron color filter. A “submicron color filter” as used herein means that an optical filter that allows light of certain wavelengths to pass through and optical elements in the filter are less than a micron at least in one dimension.


According an embodiment, a nanowire array comprises a substrate and a plurality of nanowires extending essentially perpendicularly from the substrate; wherein the nanowires do not substantially couple. The term “substantially couple” as used herein means the nanowires collectively interact with incident light such that spectral properties (e.g., reflectance spectrum) of the nanowire array are distinct from spectral properties of individual nanowire in the nanowire array. The term “the nanowires do not substantially couple” as used herein means one nanowire does not affect the properties of a neighboring nanowire. For example, when the pitch of the nanowires is changed and there is no color change of the light absorbed or reflected by the nanowire, then the nanowires do not substantially couple.


According an embodiment, a nanowire array comprises a substrate and a plurality of nanowires extending essentially perpendicularly from the substrate; the nanowire array does not appear black to naked eye. The term “naked eye” as used herein means human visual perception that is unaided by enhancing equipment. The term “the nanowire array does not appear black to naked eye” as used herein means that the reflected visible light from the nanowire is substantially zero, which could happen under certain conditions based on the nanowire length, radius and pitch, as well as the optical properties of the substrate.


According to an embodiment, a nanowire as used herein means a structure that has a size constrained to at most 1000 nm in two dimensions and unconstrained in the other dimension. An array as used herein means a systematic arrangement of objects such as a grid. The term “nanowires extending essentially perpendicularly from the substrate” as used herein means that angles between the nanowires and the substrate are from 85° to 90°. Cladding as used herein means a substance surrounding the nanowires, which can be vacuum, air, water, etc. A refractive index of the nanowires as used herein means a ratio of the speed of light in vacuum relative to that in the nanowires. A number density of the nanowires as used herein means that an average number of nanowires per unit area of the substrate.


According to an embodiment, each of the nanowires in the nanowire array has an essentially uniform chemical composition from one end of the nanowire to an opposite end of the nanowire in a longitudinal direction of the nanowire.


According to an embodiment, chemical composition of the nanowires as used herein means the simplest whole number ratio of atoms of each element present in the nanowires. The term “essentially uniform chemical composition” as used herein means that the ratio of atoms varies at most 3%, preferably at most 1%. A longitudinal direction of the nanowire as used herein means a direction pointing from one end of the nanowire farthest from the substrate to one end of the nanowire nearest to the substrate.


According to an embodiment, each of the nanowires in the nanowire array is single crystalline, multi-crystalline or amorphous. That the nanowire is single crystalline as used herein means that the crystal lattice of the entire nanowire is continuous and unbroken throughout the entire nanowire, with no grain boundaries therein. That the nanowire is multi-crystalline as used herein means that the nanowire comprises grains of crystals separated by grain boundaries. That the nanowire is amorphous as used herein means that the nanowire has a disordered atomic structure.


According to an embodiment, the nanowires in the nanowire array are composed of a semiconductor or an electrically insulating material. A conductor can be a material with essentially zero band gap. The electrical conductivity of a conductor is generally above 103 S/cm. A semiconductor can be a material with a finite band gap up to about 3 eV and general has an electrical conductivity in the range of 103 to 10−8 S/cm. An electrically insulating material can be a material with a band gap greater than about 3 eV and generally has an electrical conductivity below 10−8 S/cm.


According to an embodiment, the nanowires in the nanowire array, comprise one or more materials selected from the group consisting of Si, Ge, GaN, GaAs, SiO2, and Si3N4.


According to an embodiment, radii of the nanowires in the nanowire array are from 10 to 1000 nm; lengths of the nanowires are from 0.01 to 10 μm.


According to an embodiment, the nanowires and the substrate in the nanowire array have substantially the same chemical composition. The term “same chemical composition” as used herein means that the substrate and the nanowires are identical materials. The term “substantially same” here means the chemical composition differs by no more than 3%, preferably by no more than 1%.


According to an embodiment, the nanowires and the substrate in the nanowire array are single crystalline and the lattices of the nanowires and the lattice of the substrate are continuous at interfaces therebetween. Namely, there is no grain boundary at the interfaces between the nanowires and the substrate.


According to an embodiment, the nanowires in the nanowire array are arranged in a predetermined pattern such as a rectangular grid, a square grid, concentric circle, hexagonal grid.


According to an embodiment, a distance of a nanowire to a nearest neighbor of the nanowire along a direction parallel to the substrate (also known as “pitch” or “pitch distance”) is at least 800 nm, preferably at most 10000 nm.


According to an embodiment, a reflectance spectrum of the nanowire array has a dip; the dip position shifts to shorter wavelength with decreasing radii of the nanowires; and the dip position is independent from a distance of a nanowire to a nearest neighbor of the nanowire along a direction parallel to the substrate. A reflectance spectrum as used herein means a ratio of the intensity of reflected light at a certain wavelength to the intensity of incident light at the same wavelength, as a function of wavelength. A “dip” in a reflectance spectrum as used herein means that a region in the reflectance spectrum wherein the reflectance is smaller than the reflectance in surrounding regions of the reflectance spectrum. The “dip position” as used herein means the wavelength in the dip at which the reflectance is a minimum.


According to an embodiment, a reflectance spectrum of the nanowire array is independent from incident angles of illumination.


According to an embodiment, an incident angle as used herein means the angle between a ray of light incident on the substrate and the line perpendicular to the substrate at the point of incidence.


According to an embodiment, a method of fabricating the nanowire array comprises: (a) coating the substrate with a resist layer; (b) generating a pattern of dots in the resist layer using a lithography technique; (c) developing the pattern in the resist layer; (d) depositing a mask layer; (e) lifting off the resist layer; (f) forming the nanowires by dry etching the substrate; (g) optionally removing the mask player; wherein shapes and sizes of the dots determine the cross-sectional shapes and sizes of the nanowires.


According to an embodiment, a resist layer as used herein means a thin layer used to transfer a pattern to the substrate which the resist layer is deposited upon. A resist layer can be patterned via lithography to form a (sub)micrometer-scale, temporary mask that protects selected areas of the underlying substrate during subsequent processing steps. The resist is generally proprietary mixtures of a polymer or its precursor and other small molecules (e.g. photoacid generators) that have been specially formulated for a given lithography technology. Resists used during photolithography are called photoresists. Resists used during e-beam lithography are called e-beam resists. “Dots” as used herein means discrete regions. A lithography technique can be photolithography, e-beam lithography, holographic lithography. Photolithography is a process used in microfabrication to selectively remove parts of a thin film or the bulk of a substrate. It uses light to transfer a geometric pattern from a photo mask to a light-sensitive chemical photo resist, or simply “resist,” on the substrate. A series of chemical treatments then engraves the exposure pattern into the material underneath the photo resist. In complex integrated circuits, for example a modern CMOS, a wafer will go through the photolithographic cycle up to 50 times. E-beam lithography is the practice of scanning a beam of electrons in a patterned fashion across a surface covered with a film (called the resist), (“exposing” the resist) and of selectively removing either exposed or non-exposed regions of the resist (“developing”). The purpose, as with photolithography, is to create very small structures in the resist that can subsequently be transferred to the substrate material, often by etching. It was developed for manufacturing integrated circuits, and is also used for creating nanotechnology artifacts. Holographic lithography (also known as Interference lithography) is a technique for patterning regular arrays of fine features, without the use of complex optical systems or photomasks. The basic principle is the same as in interferometry or holography. An interference pattern between two or more coherent light waves is set up and recorded in a recording layer (photoresist). This interference pattern consists of a periodic series of fringes representing intensity minima and maxima. Upon post-exposure photolithographic processing, a photoresist pattern corresponding to the periodic intensity pattern emerges. A mask layer as used herein means a layer that protects an underlying portion of the substrate from being etched. “Dry etching” as used herein means an etching technique without using a liquid etchant.


According to an embodiment, a method using the nanowire array 1 as a photodetector comprises: shining light on the nanowire array; measuring photocurrent on the nanowires; measuring photocurrent on the substrate; comparing the photocurrent on the nanowires to the photocurrent on the substrate. A photodetector as used herein means a sensor of light.


According to an embodiment, a method using the nanowire array as a static color display comprises: determining locations and radii of the nanowires from an image to be displayed; fabricating the nanowires with the determined radii at the determined locations on the substrate; shining white light on the nanowire array.


According to an embodiment, a dynamic color display comprises the nanowire array, an array of independently addressable white light sources on a side of the substrate opposite the nanowires, wherein each white light source corresponds to and is aligned in the substrate plane with one of the nanowires. “Independently addressable white light sources” as used herein mean that each source can be controlled, adjusted, turned on or off, independently from other sources. “White light” as used herein means a combination of visible light of different wavelengths in equal proportions.


According to an embodiment, the white light sources in the dynamic color display are white LEDs. LEDs are also known as light-emitting diodes. There are two primary ways of producing whitelight using LEDs. One is to use individual LEDs that emit three primary colors—red, green, and blue—and then mix all the colors to form white light. The other is to use a phosphor material to convert monochromatic light from a blue or UV LED to broad-spectrum white light, much in the same way a fluorescent light bulb works.


According to an embodiment, in the dynamic color display, a first group of the nanowires have a first radius, a second group of the nanowires have a second radius, and a third group of the nanowires have a third radius, wherein the first group of the nanowires only allow red light to pass, the second group of the nanowires only allow green light to pass, and the third group of the nanowires only allow blue light to pass.


According to an embodiment, a submicron color filter comprising the nanowire array, wherein each nanowire is placed on a photodetector, wherein only incident light with wavelengths in a dip of a reflectance spectrum of each nanowire is allowed reach the photodetector below. A method using the submicron color filter comprises shining white light on the nanowire array, detecting transmitted light below the nanowires.


According to an embodiment, a ratio of a radius of the nanowires to a pitch of the nanowires is at most 0.5.


EXAMPLES


FIGS. 1A and 1B show schematics of a nanowire array 100, according to an embodiment. The nanowire array 100 comprises a substrate 110 and a plurality of nanowires 120 extending essentially vertically from the substrate 110 (e.g. angles between the nanowires 120 and the substrate 110 are from 85° to 90°). Each nanowire 120 preferably has uniform chemical composition along its entire length. Each nanowire 120 is single crystalline, multi-crystalline or amorphous. The nanowires 120 preferably are made of a suitable semiconductor or an electrically insulating materials, examples of which include Si, Ge, GaN, GaAs, SiO2, Si3N4, etc. A ratio of the refractive index (i.e., refractive index contrast) of the nanowires 120 and the refractive index of a cladding 130 (i.e., materials surround the nanowires 120) is preferably at least 2, more preferably at least 3. Radii of the nanowires 120 preferably are from 10 to 1000 nm, more preferably from 20 to 80 nm, most preferably from 45 to 75 nm. Lengths of the nanowires 120 are preferably from 0.01 to 10 μm, more preferably 0.1 to 5 μm. The nanowires 120 and the substrate 110 preferably have substantially the same chemical composition. Crystal lattices of the nanowires 120 and the substrate 110, if both are single crystalline, are preferably continuous at interfaces therebetween. The nanowires 120 can have the same or different shape and size. The nanowires 120 can be arranged in any suitable pattern, examples of which include a rectangular grid, a square grid, a hexagonal grid, concentric rings, etc. A distance between a nanowire 120 of the nanowire array 100 to a nearest neighbor nanowire of the nanowire array 100 along a direction parallel to the substrate is also known as “pitch” or “pitch distance”. A ratio of the radius of the nanowires 120 to the pitch should not be too high, i.e., preferably at most 0.5, more preferably at most 0.1. If this ratio is too high, the nanowires 120 substantially couple to each other (i.e., the nanowires 120 collectively interact with incident light such that spectral properties (e.g., reflectance spectrum) of the nanowire array 100 are distinct from spectral properties of individual nanowire 120 in the nanowire array 100) and the nanowire array 100 appears black to naked eyes and cannot function as color filters or displays. Preferably, the number density of the nanowires 120 (average number of nanowires 120 per unit area on the substrate 110) is thus at most about 1.8/μm2. Preferably, the pitch of the nanowires 120 is at least 500 nm.



FIGS. 2A-2D show exemplary scanning electron microscope (SEM) images of the nanowire array 100. In these exemplary SEM images, 10,000 nanowires 120 consisting of silicon are arranged in a 100 μm×100 μm square grid on the substrate 110 consisting of silicon, wherein a distance of one nanowire to a nearest neighbor nanowire of the nanowire array 100 along a direction parallel to the substrate is about 1 μm. The length of the nanowires 120 are about 1 μm. The radius of the nanowires 120 is about 45 nm.



FIG. 3A shows measured reflectance spectra of five nanowire arrays 100, each of which consists 10,000 nanowires 120 consisting of silicon arranged in a 100 μm×100 μm square grid on the substrate 110 consisting of silicon, wherein the pitch of these nanowire arrays 100 and the length of the nanowires 120 are about 1 μm. These five nanowire arrays 100 are identical except that the nanowires 120 thereof have uniform radii of 45 nm, 50 nm, 55 nm, 60 nm, 65 nm and 70 nm, respectively. Under white light illumination, these nanowire arrays 100 appear to be different colors (e.g., red, green, blue, cyan, etc.) to naked eyes. The reflectance spectrum of each of these nanowire arrays 100 shows one dip, i.e., incident light at wavelengths within the dip is reflected at a lesser proportion compared to incident light at wavelengths outside the dip. Positions of the dip dictates the apparent colors of the nanowire arrays 100. For example, if the position of the dip is between 700 and 635 nm, the nanowire array 100 appears cyan; if the position of the dip is between 560 and 490 nm, the nanowire array 100 appears magenta; if the position of the dip is between 490 and 450 nm, the nanowire 100 appears yellow. Position of the dip progressively shifts to shorter wavelength from about 770 nm in the nanowire array 100 with the largest nanowires 120 (70 nm in radius) to about 550 nm in the nanowire array 100 with the smallest nanowires 120 (45 nm in radius). The positions of the dips in these five nanowire arrays 100 range across the entire visible spectrum. The position of the dip is independent from the pitch of the nanowire array 100, which indicates that the dips are not due to diffractive or coupling effects. Although diffractive and coupling effects are not required, the nanowire array 100 can function when such effects are present. The nanowire array 100 preferably has a pitch greater than 800 nm so that diffractive and coupling effects do not dominate. The magnitude of the dips decreases with increasing pitches because greater pitch leads to lower number density of the nanowires 120. FIG. 3A also illustrates that magnitudes of the dips increase with the positions of the dips in wavelength, due to strong material dispersion of the substrate material above its bandgap (i.e., the refractive index of the substrate 110 increases at wavelengths above the bandgap of the material thereof while the effective refractive index of a guided mode in the nanowires 120 remains close to the refractive index of air, which leads to higher refractive index contrast between the guided mode and the substrate 110 and thus stronger reflectance in the dip, i.e., smaller magnitude of the dip, at shorter wavelengths). For a nanowire array with thicker nanowires, more than one dip may be present in its reflectance spectrum and the nanowire array may appear in a combination of colors.


The reflectance spectra can be measured with focused or collimated incident illumination. In an exemplary measurement as shown in FIG. 7A, incident white light from a light source 810 is focused by 20× objective lens 830 (numerical aperture=0.5); reflected light is collected by the same objective lens 830 and partially reflected by a beam splitter 820 to a spectrometer 850. An iris 840 is used at the image plane of the objective lens 830 to reject any light other than light reflected by the nanowire array 100. In another exemplary measurement as shown in FIG. 7B, incident white light from a light source 815 is collimated by a lens 835 and directed to the nanowire array 100 through a beam splitter 825; reflected light is collected by a 10× objective lens 865 to a spectrometer 855. An iris 845 is used at the image plane of the objective lens 865 to reject any light other than light reflected by the nanowire array 100. A silver mirror can used to measure absolute intensity of reflected light, which is used to calculate (i.e., normalize) the reflectance spectra. The reflectance spectra are found to be essentially independent from the incident angle, which indicates that the reflectance spectra are dominated by coupling dynamics between normal component of the incident light and the nanowire array 100.



FIG. 3B shows simulated reflectance spectra of the five nanowire arrays 100 in FIG. 3A using the finite difference time domain (FDTD) method. The FDTD method is a method of numerically simulating propagation of light in a structure and can be used to predict detailed characteristics of the propagation. The simulated reflectance spectra are quantitatively in good agreement with the measured reflectance spectra of FIG. 3A, with respect to the dip position as a function of nanowire radius. Compared to the measured reflectance spectra, simulated spectra have shallower dips, which could be due to a reflectivity difference between roughened substrate surface in actual nanowire arrays and ideally flat substrate surface presumed in the simulation. Lumerical's (Lumerical Solutions, Inc.) FDTD and MODE solvers were used to perform the simulation. Two dimensional models were constructed in MODE solver by simply specifying nanowire radius, pitch and material properties. A periodic boundary condition is then imposed in the substrate plane. These modes were used to study the evolution of the fundamental mode of the nanowires 120 as a function of wavelength. Full three dimensional models were constructed in Lumerical's FDTD solver by specifying complete nanowire geometry along with pitch and material properties. Periodic boundary conditions in the substrate plane and absorbing boundary conditions along the z axis (normal direction of the substrate 110) were imposed. A plane wave pulse source of the appropriate bandwidth was launched along the z axis and monitors placed to compute the total absorbed, transmitted and reflected fluxes as a function of wavelength. The nanowires 120 and the substrate 110 were assumed to be silicon in the simulation.



FIG. 3C shows the positions of the dips as a function of radii of the nanowires 120 in both of the measured and simulated reflectance spectra, which shows an essentially linear dependence on the nanowire radii. The essentially linear dependence indicates a strong correlation or agreement between the measured and simulated reflectance spectra.


Wavelength selective reflection of the nanowire array 100 as shown in FIGS. 3A and 3B originates from strong wavelength dependence of field distribution of the fundamental guided mode (HE1,1 mode) of each nanowire 120. The fundamental guided mode as used herein means the guided mode with the lowest frequency. The guided mode of a nanowire 120 as used herein means a mode whose field decays monotonically in the transverse direction (directions parallel to the substrate 110) everywhere external to the nanowire 120 and which does not lose power to radiation. Symmetry prevents efficient interaction between the nanowire 120 and other guided mode, and the nanowire 120 is too small to support higher order HE1,m modes (guided modes with higher frequency). FIGS. 4A-4C show a major transverse component (e.g. Ey) (a field component perpendicular to the direction of propagation of the mode) of the H1,1 mode at different wavelengths. At wavelengths in the dip of the reflectance spectrum, the field distribution of the HE1,1 mode of each nanowire 120 is characterized by a transverse field that is partially contained in the nanowire 120 and partially extends into the cladding 130, as shown in FIG. 4A. Incident light at these wavelengths can efficiently excite the HE1,1 mode and be guided by the nanowire 120 to the substrate 110 or be absorbed by the nanowire 120. The large refractive index contrast between the nanowire 120 and the cladding leads to non-negligible longitudinal field component (Ez) (i.e., field component parallel to the direction of propagation of the mode) which has significant overlap with the nanowire 120; since the modal absorption is proportional to the spatial density of electromagnetic energy, which includes Ez, incident light at these wavelengths can both efficiently couple to (i.e., a significant portion of the incident light propagates inside the nanowire 120) and be absorbed by the nanowire 120. At wavelengths well below the dip of the reflectance spectrum, the field distribution of the HE1,1 mode of each nanowire 120 is characterized by a transverse field essentially confined in the nanowire 120 due to large refractive index contrast between the nanowire 120 and the cladding, as shown in FIG. 4B. Incident light at these wavelengths cannot efficiently excite the HE1,1 mode and thus cannot be efficiently guided or absorbed by the nanowire 120; incident light at these wavelengths is substantially reflected by an interface of the substrate 110 and the cladding 130. At wavelengths well above the dip of the reflectance spectrum, the field distribution of the HE1,1 mode of each nanowire 120 is characterized by a transverse field essentially expelled from the nanowire 120, as shown in FIG. 4C. Incident light at these wavelengths can efficiently excite the HE1,1 mode but the HE1,1 mode at these wavelengths cannot be efficiently guided or absorbed by the nanowire 120; incident light at these wavelengths is substantially reflected by an interface of the substrate 110 and the cladding. FIG. 4D shows schematic illustration of possible pathways of white light normally incident on the nanowire array 100. Light of wavelengths beyond the dip in the reflectance spectrum is reflected by the substrate 110; light of wavelengths in the dip is guided by the nanowire 120 to transmitted through the substrate 110 or absorbed by the nanowire 120.


The position of the dip of the reflectance spectrum is determined by the radius of the nanowire 120. FIG. 5A shows simulated effective refractive indexes (neff) of the H1,1 modes, as a function of wavelength, of three nanowire arrays 100 with different nanowire radii (45 nm, 55 nm and 70 nm in traces 501, 502 and 503, respectively), wherein neff are obtained by the FDTD method over a 1 μm by 1 μm unit cell under periodic boundary conditions, the material of the nanowire arrays 100 is assumed to be silicon, the cladding is assumed to be air, and length of the nanowires 120 is assumed to be 1 μm. When light propagates in a medium that comprises materials of different indices of refraction, the light behaves as if it propagates in a uniform medium with a uniform index of refraction whose value is some intermediate of those of the materials. This uniform index is referred to as the effective refractive index. A periodic boundary condition is a set of boundary conditions that are often used to model a large system as an infinite periodic tile of a small unit cell.


In each trace, neff increases sharply and approaches nSi (refractive index of silicon) for wavelengths shorter than the corresponding dip position in FIG. 3A. The dip occurs where neff asymptotes to nair (refractive index of air). neff as a function of wavelength (also called a dispersion curve) shifts to longer wavelength with increasing nanowire radius.



FIG. 5B shows simulated absorption spectra (obtained by the FDTD method) of the nanowire arrays 100 of FIG. 5A (traces 511, 512 and 513 corresponding to nanowire arrays with nanowires of 45 nm, 55 nm and 70 nm radii, respectively). For blue light (<500 nm) over 90% of the H1,1 mode can be absorbed in a 1 μm length of the nanowire. FIG. 5C compares a simulated absorption spectrum 521 of the substrate 110 in the nanowire array 100 with nanowires 120 of 45 nm radius (corresponding to traces 501 and 511), a simulated absorption spectrum 523 of the nanowires 120 of 45 nm radius in this nanowire array 100, and a simulated reflectance spectrum 522 of this nanowire array 100. The dip in the reflectance spectrum 522 is slightly redshifted relative to the peak in the absorption spectrum 523 of the nanowires 120, which indicates that the long wavelength edge of the dip arises more from coupling to the substrate 110. Nonetheless, this shows that the guided light is in fact absorbed in the nanowires 120, and so the shape of the reflectance spectrum 523 and the amount of light absorbed in the nanowires 120 can be controlled by altering the length thereof. The light absorbed by the substrate 110 (see trace 521) can be enhanced or diminished by the nanowires 120 relative to light absorption of a planar substrate, depending on whether the nanowires 120 absorb or merely couple to the substrate 110. The fact that the filtering characteristics of the nanowire array 100 are related to absorption in different parts thereof can lead to useful applications in optoelectronic devices.


A method of fabricating the nanowire array 100 includes (a) coating the substrate 110 with a resist layer (e.g. e-beam resist, photo resist, etc.); (b) generating a pattern of dots in the resist layer using a lithography technique (e.g. photolithography, e-beam lithography, holographic lithography, etc.); (c) developing the pattern in the resist layer; (d) depositing a mask layer (e.g. Al, Cr, SiO2, Si3N4, Au, Ag, etc.); (e) lifting off the resist layer; (f) forming the nanowires 120 by dry etching the substrate 110; (g) optionally removing the mask player; wherein shapes and sizes of the dots determine the cross-sectional shapes and sizes of the nanowires 120. The resist can be poly(methyl methacrylate) (available from MicroChem located in Newton, Mass.). The mask layer can be aluminum deposited by a suitable technique such as e-beam evaporation, thermal evaporation, sputtering, etc. The mask layer can be about 40 nm thick. The substrate 110 can be a single crystalline silicon wafer. Dry etching can be conducted in an inductively coupled plasma-reactive ion etcher (such as those available from Surface Technology Systems, located at Redwood City, Calif.). An exemplary dry etching process includes alternating etch and deposition steps at room temperature, wherein 60 sccm of SF6 and 160 sccm of C4F8 gases were used therein, respectively. The mask layer can be removed using a suitable etchant (e.g. Type A aluminum etchant available from Transene Company Inc. located in Danvers, Mass.) or solvent (e.g. acid, base, or organic solvent). SEM images can be taken in an SEM such as Zeiss Ultra55 available from Carl Zeiss NTS located at Peabody, Mass.


A method using the nanowire array 100 as a photodetector comprises: shining light on the nanowire array 100; measuring photocurrent on the nanowires 120; measuring photocurrent on the substrate 110; comparing the photocurrent on the nanowires 120 to the photocurrent on the substrate 110.


The nanowire array 100 can also be used as a submicron color filter. For example, each of the nanowires 120 in the nanowire array 100 can be placed on a photodetector. Only incident light with wavelengths in the dip of the reflectance spectrum of a nanowire can reach the photodetector below this nanowire. A method using the nanowire array 100 as a submicron color filter comprises shining white light on the nanowire array 100, detecting transmitted light below the nanowires 120.


A method using the nanowire array 100 as a static color display comprises: determining locations and radii of nanowires from an image to be displayed; fabricating the nanowires with the determined radii at the determined locations on the substrate; shining white light on the nanowire array. The word “static” here means that the display can only show one fixed image. By appropriate choice of individual nanowire placement and radius in the nanowire array 100, the nanowire array 100 can display a color image under white light illumination.


The nanowire array can also be used in a dynamic color display. The word “dynamic” here means that the display can display different images at different times. The dynamic color display, according to one embodiment, comprises the nanowire array 100, an array of independently addressable white light sources on a side of the substrate 110 opposite the nanowires 120, wherein each white light source corresponds to and is aligned in the substrate plane with one of the nanowires 120. The nanowires 120 can have predetermined radii and thus only allow light of desired wavelengths from the light sources to pass. For example, FIG. 6 shows a schematic top view of four pixels of the dynamic color display. Nanowires 715, 725, 735 and 745 respectively correspond to and are aligned with white light sources 710, 720, 730 and 740. The white light sources can be white LEDs. The nanowire 715 has a radius of about 45 nm and only allows red light to pass. The nanowires 725 and 735 have a radius of about 60 nm and only allows green light to pass. The nanowire 745 has a radius of about 70 nm and only allows blue light to pass. The independently addressable white light sources can be replaced by a scanning white light beam.


While various aspects and embodiments have been disclosed herein, other aspects and embodiments will be apparent to those skilled in the art. The various aspects and embodiments disclosed herein are for purposes of illustration and are not intended to be limiting, with the true scope and spirit being indicated by the following claims.

Claims
  • 1. A nanowire array, comprising a substrate and a plurality of nanowires extending essentially perpendicularly from the substrate, wherein a ratio of a radius of the nanowires to a pitch of the nanowires is at most 0.5, wherein radii of the nanowires are from 10 to 1000 nm; lengths of the nanowires are from 0.01 to 10 μm.
  • 2. A nanowire array of claim 1; wherein: a refractive index of the nanowires is at least two times of a refractive index of a cladding of the nanowires.
  • 3. A nanowire array of claim 1, wherein a number density of the nanowires is at most about 1.8/μm2.
  • 4. The nanowire array of claim 1, wherein each of the nanowires is single crystalline, multi-crystalline or amorphous.
  • 5. The nanowire array of claim 1, wherein the nanowires are composed of a semiconductor.
  • 6. The nanowire array of claim 1, wherein the nanowires comprise one or more materials selected from the group consisting of Si, Ge, GaN, GaAs, SiO2, and Si3N4.
  • 7. The nanowire array of claim 1, wherein the nanowires and the substrate are single crystalline and the lattices of the nanowires and the lattice of the substrate are continuous at interfaces therebetween.
  • 8. The nanowire array of claim 1, wherein the nanowires are arranged in a predetermined pattern.
  • 9. The nanowire array of claim 1, wherein a distance of a nanowire to a nearest neighbor of the nanowire along a direction parallel to the substrate is at least 800 nm.
  • 10. The nanowire array of claim 1, wherein a reflectance spectrum thereof has a dip; the dip position shifts to shorter wavelength with decreasing radii of the nanowires; and the dip position is independent from a distance of a nanowire to a nearest neighbor of the nanowire along a direction parallel to the substrate.
  • 11. The nanowire array of claim 1, wherein a reflectance spectrum thereof is independent from incident angles of illumination.
  • 12. A method of fabricating the nanowire array of claim 1, comprising: generating a pattern of dots in a resist layer using a lithography technique;forming the nanowires by etching the substrate;wherein shapes and sizes of the dots determine the cross-sectional shapes and sizes of the nanowires.
  • 13. The method of claim 12, further comprising: coating the substrate with the resist layer;developing the pattern in the resist layer;depositing a mask layer; lifting off the resist layer; andoptionally removing the mask player.
  • 14. The method of claim 12, wherein the etching is dry etching.
  • 15. A method using the nanowire array of claim 1 as a photodetector comprises: shining light on the nanowire array;measuring photocurrent on the nanowires;measuring photocurrent on the substrate;comparing the photocurrent on the nanowires to the photocurrent on the substrate.
  • 16. A method using the nanowire array of claim 1 as a static color display comprises: determining locations and radii of the nanowires from an image to be displayed;fabricating the nanowires with the determined radii at the determined locations on the substrate;shining white light on the nanowire array.
  • 17. A color filter comprising the nanowire array of claim 1, wherein each nanowire is placed on a photodetector, wherein only incident light with wavelengths in a dip of a reflectance spectrum of each nanowire is allowed reach the photodetector below.
  • 18. A method using the color filter of claim 17 comprises shining white light on the nanowire array, detecting transmitted light below the nanowires.
  • 19. The nanowire array of claim 1, wherein the nanowires are composed of an electrically insulating material.
  • 20. The nanowire array of claim 1, wherein the nanowire array is operable as a submicron color filter.
  • 21. The nanowire array of claim 1, wherein at least one nanowire among the plurality of nanowires has a dip in a reflectance spectrum of the at least one nanowire, wherein a light of a wavelength in the dip incident on the at least one nanowire is guided by the at least one nanowire to be transmitted through the substrate.
  • 22. The nanowire array of claim 21, wherein the dip is at an IR wavelength.
  • 23. The nanowire array of claim 21, wherein the nanowire array is operable as an infrared light filter.
  • 24. The nanowire array of claim 21, wherein the at least one nanowire comprises GaAs.
  • 25. The nanowire array of claim 21, wherein the at least one nanowire has a diameter of between about 70 nm and about 500 nm.
  • 26. A dynamic display comprises the nanowire array of claim 21.
  • 27. A photodetector comprising the nanowire array of claim 21.
  • 28. The nanowire array of claim 21, wherein the nanowire array is operable as a light filter.
  • 29. The nanowire array of claim 21, wherein the nanowires do not substantially couple.
  • 30. A dynamic color display comprises a nanowire array comprising a substrate and a plurality of nanowires extending essentially perpendicularly from the substrate, the nanowire array being operable as a color filter; an array of independently addressable white light sources on a side of the substrate opposite the nanowires, wherein each white light source corresponds to and is aligned in the substrate plane with one of the nanowires.
  • 31. The dynamic color display of claim 30, wherein the white light sources are white LEDs or a scanning white light beam.
  • 32. The dynamic color display of claim 30, wherein a first group of the nanowires have a first radius, a second group of the nanowires have a second radius, and a third group of the nanowires have a third radius, wherein the first group of the nanowires only allow red light to pass, the second group of the nanowires only allow green light to pass, and the third group of the nanowires only allow blue light to pass.
CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of U.S. application Ser. No. 12/910,664, filed Oct. 22, 2010, which claims the benefit of U.S. Provisional Application No. 61/357,429, filed Jun. 22, 2010. This application is related to the disclosures of U.S. patent application Ser. No. 12/204,686, filed Sep. 4, 2008 (now U.S. Pat. No. 7,646,943, issued Jan. 12, 2010), Ser. No. 12/648,942, filed Dec. 29, 2009 (now U.S. Pat. No. 8,229,255, issued Jul. 24, 2012), Ser. No. 13/556,041, filed Jul. 23, 2012, Ser. No. 12/270,233, filed Nov. 13, 2008 (now U.S. Pat. No. 8,274,039, issued Sep. 25, 2012), Ser. No. 13/925,429, filed Jun. 24, 2013, Ser. No. 13/570,027, filed Aug. 8, 2012 (now U.S. Pat. No. 8,471,190, issued Jun. 25, 2013), Ser. No. 12/472,264, filed May 26, 2009 (now U.S. Pat. No. 8,269,985, issued Sep. 18, 2012), Ser. No. 13/621,607, filed Sep. 17, 2012 (now U.S. Pat. No. 8,514,411, issued Aug. 20, 2013), Ser. No. 13/971,523, filed Aug. 20, 2013 (now U.S. Pat. No. 8,810,808, issued Aug. 19, 2014), Ser. No. 12/472,271, filed May 26, 2009 (now abandoned), Ser. No. 12/478,598, filed Jun. 4, 2009 (now U.S. Pat. No. 8,546,742, issued Oct. 1, 2013), Ser. No. 14/021,672, filed Sep. 9, 2013, Ser. No. 12/573,582, filed Oct. 5, 2009 (now U.S. Pat. No. 8,791,470, issued Jul. 29, 2014), Ser. No. 14/274,448, filed May 9, 2014, Ser. No. 12/575,221, filed Oct. 7, 2009 (now U.S. Pat. No. 8,384,007, issued Feb. 26, 2013), Ser. No. 12/633,323, filed Dec. 8, 2009 (now U.S. Pat. No. 8,735,797, issued May 27, 2014), Ser. No. 14/068,864, filed Oct. 31, 2013, Ser. No. 14/281,108, filed May 19, 2014, Ser. No. 13/494,661, filed Jun. 12, 2012 (now U.S. Pat. No. 8,754,359, issued Jun. 17, 2014), Ser. No. 12/633,318, filed Dec. 8, 2009 (now U.S. Pat. No. 8,519,379, issued Aug. 27, 2013), Ser. No. 13/975,553, filed Aug. 26, 2013 (now U.S. Pat. No. 8,710,488, issued Apr. 29, 2014), Ser. No. 12/633,313, filed Dec. 8, 2009, Ser. No. 12/633,305, filed Dec. 8, 2009 (now U.S. Pat. No. 8,299,472, issued Oct. 30, 2012), Ser. No. 13/543,556, filed Jul. 6, 2012 (now U.S. Pat. No. 8,766,272, issued Jul. 1, 2014), Ser. No. 14/293,164, filed Jun. 2, 2014, Ser. No. 12/621,497, filed Nov. 19, 2009 (now abandoned), Ser. No. 12/633,297, filed Dec. 8, 2009 (now U.S. Pat. No. 8,889,455, issued Nov. 18, 2014), Ser. No. 12/982,269, filed Dec. 30, 2010, Ser. No. 12/966,573, filed Dec. 13, 2010 (now U.S. Pat. No. 8,866,065, issued Oct. 21, 2014), Ser. No. 12/967,880, filed Dec. 14, 2010 (now U.S. Pat. No. 8,748,799, issued Jun. 10, 2014), Ser. No. 14/291,888, filed May 30, 2014 Ser. No. 12/966,514, filed Dec. 13, 2010, Ser. No. 12/974,499, filed Dec. 21, 2010 (now U.S. Pat. No. 8,507,840, issued Aug. 13, 2013), Ser. No. 12/966,535, filed Dec. 13, 2010 (now U.S. Pat. No. 8,890,271, issued Nov. 18, 2014), Ser. No. 12/910,664, filed Oct. 22, 2010, Ser. No. 12/945,492, filed Nov. 12, 2010, Ser. No. 13/047,392, filed Mar. 14, 2011 (now U.S. Pat. No. 8,835,831, issued Sep. 16, 2014), Ser. No. 14/450,812, filed Aug. 4, 2014, Ser. No. 13/048,635, filed Mar. 15, 2011 (now U.S. Pat. No. 8,835,905, issued Sep. 16, 2014), Ser. No. 13/106,851, filed May 12, 2011, Ser. No. 13/288,131, filed Nov. 3, 2011, Ser. No. 14/334,848, filed Jul. 18, 2014, Ser. No. 14/032,166, filed Sep. 19, 2013, Ser. No. 13/543,307, filed Jul. 6, 2012, Ser. No. 13/963,847, filed Aug. 9, 2013, Ser. No. 13/693,207, filed Dec. 4, 2012, 61/869,727, filed Aug. 25, 2013, Ser. No. 14/322,503, filed Jul. 2, 2014, and Ser. No. 14/311,954, filed Jun. 23, 2014, Ser. No. 14/459,398, filed Aug. 14, 2014, Ser. No. 14/487,375, filed Sep. 16, 2014, Ser. No. 14/501,983 filed Sep. 30, 2014, Ser. No. 14/503,598, filed Oct. 1, 2014, Ser. No. 14/516,162, filed Oct. 16, 2014, Ser. No. 14/563,781, filed Dec. 8, 2014 are each hereby incorporated by reference in their entirety.

US Referenced Citations (499)
Number Name Date Kind
1918848 Land Jul 1933 A
3903427 Pack Sep 1975 A
4017332 James Apr 1977 A
4292512 Miller Sep 1981 A
4316048 Woodall Feb 1982 A
4357415 Hartman Nov 1982 A
4387265 Dalal Jun 1983 A
4394571 Jurisson Jul 1983 A
4400221 Rahilly Aug 1983 A
4443890 Eumurian Apr 1984 A
4513168 Borden Apr 1985 A
4531055 Shepherd, Jr. Jul 1985 A
4620237 Traino Oct 1986 A
4678772 Segal Jul 1987 A
4827335 Saito May 1989 A
4846556 Haneda Jul 1989 A
4857973 Yang Aug 1989 A
4876586 Dyck Oct 1989 A
4880613 Satoh Nov 1989 A
4896941 Hayashi Jan 1990 A
4950625 Nakashima Aug 1990 A
4971928 Fuller Nov 1990 A
4972244 Buffet Nov 1990 A
4990988 Lin Feb 1991 A
5071490 Yokota Dec 1991 A
5081049 Green Jan 1992 A
5096520 Faris Mar 1992 A
5124543 Kawashima Jun 1992 A
5217911 Denda Jun 1993 A
5247349 Olego Sep 1993 A
5272518 Vincent Dec 1993 A
5311047 Chang May 1994 A
5347147 Jones Sep 1994 A
5362972 Yazawa Nov 1994 A
5374841 Goodwin Dec 1994 A
5391896 Wanlass Feb 1995 A
5401968 Cox Mar 1995 A
5449626 Hezel Sep 1995 A
5468652 Gee Nov 1995 A
5602661 Schadt Feb 1997 A
5612780 Rickenbach Mar 1997 A
5671914 Kalkhoran Sep 1997 A
5696863 Kleinerman Dec 1997 A
5723945 Schermerhorn Mar 1998 A
5747796 Heard May 1998 A
5767507 Unlu Jun 1998 A
5798535 Huang Aug 1998 A
5844290 Furumiya Dec 1998 A
5853446 Carre Dec 1998 A
5857053 Kane Jan 1999 A
5877492 Fujieda Mar 1999 A
5880495 Chen Mar 1999 A
5885881 Ojha Mar 1999 A
5900623 Tsang May 1999 A
5943463 Unuma Aug 1999 A
5968528 Deckner Oct 1999 A
6013871 Curtin Jan 2000 A
6033582 Lee Mar 2000 A
6037243 Ha Mar 2000 A
6046466 Ishida Apr 2000 A
6074892 Bowers Jun 2000 A
6100551 Lee Aug 2000 A
6270548 Campbell Aug 2001 B1
6301420 Greenaway Oct 2001 B1
6326649 Chang Dec 2001 B1
6388243 Berezin May 2002 B1
6388648 Clifton May 2002 B1
6407439 Hier Jun 2002 B1
6459034 Muramoto Oct 2002 B2
6463204 Ati Oct 2002 B1
6542231 Garrett Apr 2003 B1
6563995 Keaton May 2003 B2
6566723 Vook May 2003 B1
6680216 Kwasnick Jan 2004 B2
6709929 Zhang Mar 2004 B2
6720594 Rahn Apr 2004 B2
6771314 Bawolek Aug 2004 B1
6805139 Savas Oct 2004 B1
6812473 Amemiya Nov 2004 B1
6904187 Fischer et al. Jun 2005 B2
6927145 Yang Aug 2005 B1
6960526 Shah Nov 2005 B1
6967120 Jang Nov 2005 B2
6969899 Yaung Nov 2005 B2
6987258 Mates Jan 2006 B2
6996147 Majumdar Feb 2006 B2
7052927 Fletcher May 2006 B1
7064372 Duan Jun 2006 B2
7105428 Pan Sep 2006 B2
7106938 Baek et al. Sep 2006 B2
7109517 Zaidi Sep 2006 B2
7153720 Augusto Dec 2006 B2
7163659 Stasiak Jan 2007 B2
7192533 Bakkers Mar 2007 B2
7208783 Palsule Apr 2007 B2
7230286 Cohen Jun 2007 B2
7235475 Kamins Jun 2007 B2
7241434 Anthony Jul 2007 B2
7253017 Roscheisen Aug 2007 B1
7254151 Lieber Aug 2007 B2
7262400 Yaung Aug 2007 B2
7265328 Mouli Sep 2007 B2
7272287 Bise Sep 2007 B2
7285812 Tang Oct 2007 B2
7306963 Linden Dec 2007 B2
7307327 Bahl Dec 2007 B2
7311889 Awano Dec 2007 B2
7326915 Kaluzhny Feb 2008 B2
7330404 Peng Feb 2008 B2
7335962 Mouli Feb 2008 B2
7336860 Cyr Feb 2008 B2
7339110 Mulligan et al. Mar 2008 B1
7358583 Reznik Apr 2008 B2
7381966 Starikov Jun 2008 B2
7388147 Mulligan Jun 2008 B2
7416911 Heath Aug 2008 B2
7446025 Cohen Nov 2008 B2
7462774 Roscheisen Dec 2008 B2
7471428 Ohara Dec 2008 B2
7491269 Legagneux Feb 2009 B2
7507293 Li Mar 2009 B2
7521322 Tang Apr 2009 B2
7524694 Adkisson Apr 2009 B2
7582857 Gruev Sep 2009 B2
7598482 Verhulst Oct 2009 B1
7622367 Nuzzo Nov 2009 B1
7626685 Jin Dec 2009 B2
7646138 Williams Jan 2010 B2
7646943 Wober Jan 2010 B1
7647695 MacNutt Jan 2010 B2
7649665 Kempa Jan 2010 B2
7655860 Parsons Feb 2010 B2
7663202 Wang Feb 2010 B2
7692860 Sato Apr 2010 B2
7704806 Chae Apr 2010 B2
7713779 Firon May 2010 B2
7719678 Kamins May 2010 B2
7719688 Kamins May 2010 B2
7732769 Snider Jun 2010 B2
7732839 Sebe Jun 2010 B2
7736954 Hussain Jun 2010 B2
7740824 Godfried Jun 2010 B2
7790495 Assefa Sep 2010 B2
7888155 Chen Feb 2011 B2
7902540 Cohen Mar 2011 B2
7948555 Kwon et al. May 2011 B2
8030729 Quitoriano Oct 2011 B2
8035184 Dutta Oct 2011 B1
8049203 Samuelson Nov 2011 B2
8063450 Wernersson Nov 2011 B2
8067299 Samuelson Nov 2011 B2
8067736 Gruss Nov 2011 B2
8084728 Tsang Dec 2011 B2
8093675 Tsunemi Jan 2012 B2
8118170 Sato Feb 2012 B2
8143658 Samuelson Mar 2012 B2
8154127 Kamins Apr 2012 B1
8193524 Bjoerk Jun 2012 B2
8208776 Tokushima Jun 2012 B2
8212138 Landis Jul 2012 B2
8222705 Ogino Jul 2012 B2
8242353 Karg Aug 2012 B2
8269985 Wober Sep 2012 B2
8274039 Wober Sep 2012 B2
8299472 Yu Oct 2012 B2
8330090 Agarwal Dec 2012 B2
8384007 Yu Feb 2013 B2
8455857 Samuelson Jun 2013 B2
8471190 Wober Jun 2013 B2
8514411 Wober Aug 2013 B2
8546742 Wober Oct 2013 B2
8748799 Wober Jun 2014 B2
8766272 Yu et al. Jul 2014 B2
8791470 Wober Jul 2014 B2
8810808 Wober Aug 2014 B2
8835831 Yu et al. Sep 2014 B2
8866065 Wober Oct 2014 B2
20020003201 Yu Jan 2002 A1
20020020846 Pi Feb 2002 A1
20020021879 Lee Feb 2002 A1
20020071468 Sandstrom Jun 2002 A1
20020104821 Bazylenko Aug 2002 A1
20020109082 Nakayama Aug 2002 A1
20020117675 Mascarenhas Aug 2002 A1
20020130311 Lieber Sep 2002 A1
20020172820 Majumdar Nov 2002 A1
20030003300 Korgel Jan 2003 A1
20030006363 Campbell Jan 2003 A1
20030077907 Kao Apr 2003 A1
20030089899 Lieber May 2003 A1
20030103744 Koyama Jun 2003 A1
20030132480 Chau Jul 2003 A1
20030160176 Vispute Aug 2003 A1
20030189202 Li Oct 2003 A1
20030227090 Okabe Dec 2003 A1
20040011975 Nicoli Jan 2004 A1
20040021062 Zaidi Feb 2004 A1
20040026684 Empedocles Feb 2004 A1
20040058058 Shchegolikhin Mar 2004 A1
20040065362 Watabe Apr 2004 A1
20040075464 Samuelson Apr 2004 A1
20040095658 Buretea May 2004 A1
20040109666 Kim Jun 2004 A1
20040114847 Fischer et al. Jun 2004 A1
20040118337 Mizutani Jun 2004 A1
20040118377 Bloms Jun 2004 A1
20040122328 Wang Jun 2004 A1
20040124366 Zeng Jul 2004 A1
20040155247 Benthien Aug 2004 A1
20040156610 Charlton Aug 2004 A1
20040160522 Fossum Aug 2004 A1
20040180461 Yaung Sep 2004 A1
20040213307 Lieber Oct 2004 A1
20040217086 Kawashima Nov 2004 A1
20040223681 Block Nov 2004 A1
20040241965 Merritt Dec 2004 A1
20040252957 Schmidt et al. Dec 2004 A1
20040261840 Schmit Dec 2004 A1
20050009224 Yang Jan 2005 A1
20050035381 Holm Feb 2005 A1
20050082676 Andry Apr 2005 A1
20050087601 Gerst Apr 2005 A1
20050095699 Miyauchi May 2005 A1
20050109388 Murakami May 2005 A1
20050116271 Kato Jun 2005 A1
20050133476 Islam Jun 2005 A1
20050161662 Majumdar Jul 2005 A1
20050164514 Rauf Jul 2005 A1
20050190453 Dobashi Sep 2005 A1
20050201704 Ellwood Sep 2005 A1
20050218468 Owen Oct 2005 A1
20050224707 Guedj Oct 2005 A1
20050242409 Yang Nov 2005 A1
20050284517 Shinohara Dec 2005 A1
20060011362 Tao Jan 2006 A1
20060027071 Barnett Feb 2006 A1
20060038990 Habib Feb 2006 A1
20060113622 Adkisson Jun 2006 A1
20060115230 Komoguchi et al. Jun 2006 A1
20060121371 Wu Jun 2006 A1
20060146323 Bratkovski Jul 2006 A1
20060162766 Gee Jul 2006 A1
20060180197 Gui Aug 2006 A1
20060208320 Tsuchiya et al. Sep 2006 A1
20060257071 Bise Nov 2006 A1
20060260674 Tran Nov 2006 A1
20060273262 Sayag Dec 2006 A1
20060273389 Cohen Dec 2006 A1
20060284118 Asmussen Dec 2006 A1
20070012980 Duan Jan 2007 A1
20070012985 Stumbo Jan 2007 A1
20070023799 Boettiger Feb 2007 A1
20070025504 Tumer Feb 2007 A1
20070029545 Striakhilev Feb 2007 A1
20070052050 Dierickx Mar 2007 A1
20070076481 Tennant Apr 2007 A1
20070082255 Sun Apr 2007 A1
20070099292 Miller May 2007 A1
20070104441 Ahn May 2007 A1
20070107773 Fork May 2007 A1
20070108371 Stevens May 2007 A1
20070114622 Adkisson May 2007 A1
20070120254 Hurkx May 2007 A1
20070126037 Ikeda Jun 2007 A1
20070137697 Kempa Jun 2007 A1
20070138376 Naughton Jun 2007 A1
20070138380 Adkisson Jun 2007 A1
20070138459 Wong Jun 2007 A1
20070139740 Igura Jun 2007 A1
20070140638 Yang Jun 2007 A1
20070145512 Rhodes Jun 2007 A1
20070148599 True Jun 2007 A1
20070152248 Choi Jul 2007 A1
20070155025 Zhang Jul 2007 A1
20070164270 Majumdar Jul 2007 A1
20070170418 Bowers Jul 2007 A1
20070172623 Kresse Jul 2007 A1
20070172970 Uya Jul 2007 A1
20070187787 Ackerson Aug 2007 A1
20070196239 Vink Aug 2007 A1
20070200054 Reznik Aug 2007 A1
20070205483 Williams Sep 2007 A1
20070217754 Sasaki Sep 2007 A1
20070228421 Shioya Oct 2007 A1
20070238265 Kurashina Oct 2007 A1
20070238285 Borden Oct 2007 A1
20070241260 Jaeger Oct 2007 A1
20070246689 Ge Oct 2007 A1
20070248958 Jovanovich Oct 2007 A1
20070272828 Xu Nov 2007 A1
20070278500 Lin Dec 2007 A1
20070285378 Lankhorst Dec 2007 A1
20070290193 Tucker Dec 2007 A1
20070290265 Augusto Dec 2007 A1
20080001498 Muller Jan 2008 A1
20080006319 Bettge Jan 2008 A1
20080029701 Onozawa Feb 2008 A1
20080036038 Hersee Feb 2008 A1
20080044984 Hsieh Feb 2008 A1
20080047601 Nag Feb 2008 A1
20080047604 Korevaar Feb 2008 A1
20080055451 Kanbe Mar 2008 A1
20080065451 For Mar 2008 A1
20080073742 Adkisson Mar 2008 A1
20080079022 Yamamoto Apr 2008 A1
20080079076 Sheen Apr 2008 A1
20080083963 Hsu Apr 2008 A1
20080088014 Adkisson Apr 2008 A1
20080090401 Bratkovski Apr 2008 A1
20080092938 Majumdar Apr 2008 A1
20080096308 Santori Apr 2008 A1
20080108170 Adkisson May 2008 A1
20080116537 Adkisson May 2008 A1
20080128760 Jun Jun 2008 A1
20080137188 Sato et al. Jun 2008 A1
20080143906 Allemand et al. Jun 2008 A1
20080145965 Reznik Jun 2008 A1
20080149914 Samuelson Jun 2008 A1
20080149944 Samuelson Jun 2008 A1
20080157253 Starikov Jul 2008 A1
20080166883 Liu Jul 2008 A1
20080169017 Korevaar Jul 2008 A1
20080169019 Korevaar Jul 2008 A1
20080173615 Kim Jul 2008 A1
20080178924 Kempa Jul 2008 A1
20080188029 Rhodes Aug 2008 A1
20080191278 Maekawa Aug 2008 A1
20080191298 Lin Aug 2008 A1
20080211945 Hong Sep 2008 A1
20080218740 Williams Sep 2008 A1
20080224115 Bakkers Sep 2008 A1
20080225140 Raynor Sep 2008 A1
20080233280 Blanchet Sep 2008 A1
20080237568 Kobayashi Oct 2008 A1
20080246020 Kawashima Oct 2008 A1
20080246123 Kamins Oct 2008 A1
20080248304 Hanrath Oct 2008 A1
20080251780 Li Oct 2008 A1
20080258747 Kluth Oct 2008 A1
20080260225 Szu Oct 2008 A1
20080264478 Ahn Oct 2008 A1
20080266556 Kamins Oct 2008 A1
20080266572 Kamins Oct 2008 A1
20080271783 Murakami Nov 2008 A1
20080277646 Kim Nov 2008 A1
20080283728 Inoue Nov 2008 A1
20080283883 Shim Nov 2008 A1
20080297281 Ayazi Dec 2008 A1
20080311693 Maxwell Dec 2008 A1
20080311712 Anwar Dec 2008 A1
20090001498 Wang Jan 2009 A1
20090020150 Atwater Jan 2009 A1
20090020687 Lehmann et al. Jan 2009 A1
20090032687 Lapstun Feb 2009 A1
20090046362 Guo Feb 2009 A1
20090046749 Mizuuchi Feb 2009 A1
20090050204 Habib Feb 2009 A1
20090052029 Dai et al. Feb 2009 A1
20090057650 Lieber Mar 2009 A1
20090072145 Peczalski Mar 2009 A1
20090104160 Young Apr 2009 A1
20090120498 Yamazaki May 2009 A1
20090121136 Gruss May 2009 A1
20090127442 Lee May 2009 A1
20090146198 Joe Jun 2009 A1
20090151782 Ko Jun 2009 A1
20090152664 Klem Jun 2009 A1
20090153961 Murakami Jun 2009 A1
20090165844 Dutta Jul 2009 A1
20090173976 Augusto Jul 2009 A1
20090179225 Fertig Jul 2009 A1
20090179289 Park Jul 2009 A1
20090188552 Wang Jul 2009 A1
20090189144 Quitoriano Jul 2009 A1
20090189145 Wang Jul 2009 A1
20090194160 Chin Aug 2009 A1
20090199597 Danley Aug 2009 A1
20090201400 Zhang Aug 2009 A1
20090206405 Doyle Aug 2009 A1
20090223558 Sun Sep 2009 A1
20090224245 Umezaki Sep 2009 A1
20090224349 Gambino Sep 2009 A1
20090230039 Hoenig Sep 2009 A1
20090233445 Lee Sep 2009 A1
20090242018 Ahn Oct 2009 A1
20090243016 Kawahara Oct 2009 A1
20090244514 Jin Oct 2009 A1
20090260687 Park Oct 2009 A1
20090261438 Choi Oct 2009 A1
20090266418 Hu Oct 2009 A1
20090266974 Verhulst Oct 2009 A1
20090272423 Niira Nov 2009 A1
20090278998 El-Ghoroury Nov 2009 A1
20090289320 Cohen Nov 2009 A1
20090305454 Cohen Dec 2009 A1
20100006817 Ohlsson Jan 2010 A1
20100019252 Bratkovski Jan 2010 A1
20100019296 Cha Jan 2010 A1
20100019355 Kamins Jan 2010 A1
20100025710 Yamada Feb 2010 A1
20100078055 Vidu Apr 2010 A1
20100090341 Wan Apr 2010 A1
20100101633 Park Apr 2010 A1
20100104494 Meng Apr 2010 A1
20100110433 Nedelcu et al. May 2010 A1
20100116976 Wober May 2010 A1
20100126573 Youtsey May 2010 A1
20100127153 Agarwal May 2010 A1
20100132779 Hong Jun 2010 A1
20100133986 Kim Jun 2010 A1
20100136721 Song Jun 2010 A1
20100148221 Yu Jun 2010 A1
20100163714 Wober Jul 2010 A1
20100163941 Jung Jul 2010 A1
20100178018 Augusto Jul 2010 A1
20100186809 Samuelson Jul 2010 A1
20100187404 Klem Jul 2010 A1
20100200065 Choi Aug 2010 A1
20100207103 Farrow Aug 2010 A1
20100218816 Guha Sep 2010 A1
20100229939 Shen Sep 2010 A1
20100230653 Chen Sep 2010 A1
20100237454 Fujisawa Sep 2010 A1
20100240104 Zhang Sep 2010 A1
20100244108 Kohnke Sep 2010 A1
20100244169 Maeda Sep 2010 A1
20100249877 Naughton Sep 2010 A1
20100258184 Laughlin Oct 2010 A1
20100276572 Iwabuchi Nov 2010 A1
20100277607 Choi Nov 2010 A1
20100282314 Coakley Nov 2010 A1
20100295019 Wang Nov 2010 A1
20100302440 Wober Dec 2010 A1
20100304061 Ye Dec 2010 A1
20100308214 Wober Dec 2010 A1
20100313952 Coakley Dec 2010 A1
20100319763 Park Dec 2010 A1
20100320444 Dutta Dec 2010 A1
20110018424 Takada Jan 2011 A1
20110036396 Jayaraman Feb 2011 A1
20110037133 Su Feb 2011 A1
20110049572 Jeon et al. Mar 2011 A1
20110050042 Choi Mar 2011 A1
20110057231 Jeon et al. Mar 2011 A1
20110057234 Jeon et al. Mar 2011 A1
20110057286 Jeon et al. Mar 2011 A1
20110080508 Katsuno Apr 2011 A1
20110084212 Clark Apr 2011 A1
20110127490 Mi Jun 2011 A1
20110133060 Yu Jun 2011 A1
20110133160 Yu Jun 2011 A1
20110135814 Miyauchi Jun 2011 A1
20110139176 Cheung Jun 2011 A1
20110146771 Chuang Jun 2011 A1
20110147870 Ang Jun 2011 A1
20110180894 Samuelson Jul 2011 A1
20110195577 Kushibiki Aug 2011 A1
20110220191 Flood Sep 2011 A1
20110226937 Yu Sep 2011 A1
20110248315 Nam Oct 2011 A1
20110249219 Evans Oct 2011 A1
20110249322 Wang Oct 2011 A1
20110253982 Wang Oct 2011 A1
20110272014 Mathai Nov 2011 A1
20110297214 Kim Dec 2011 A1
20110309237 Seo et al. Dec 2011 A1
20110309240 Yu et al. Dec 2011 A1
20110309331 Yu Dec 2011 A1
20110315988 Yu Dec 2011 A1
20110316106 Kim Dec 2011 A1
20120006390 Huo et al. Jan 2012 A1
20120009714 Mouli Jan 2012 A1
20120014837 Fehr et al. Jan 2012 A1
20120029328 Shimizu Feb 2012 A1
20120031454 Fogel Feb 2012 A1
20120060905 Fogel Mar 2012 A1
20120075513 Chipman et al. Mar 2012 A1
20120153124 Yu Jun 2012 A1
20120192939 Tamboli et al. Aug 2012 A1
20120196383 Nitkowski et al. Aug 2012 A1
20120196401 Graham Aug 2012 A1
20120240999 Yoshida Sep 2012 A1
20120258563 Ogino Oct 2012 A1
20120280345 Zhu Nov 2012 A1
20120298843 Yu Nov 2012 A1
20120313078 Fukui Dec 2012 A1
20120318336 Hekmatshoar-Tabari et al. Dec 2012 A1
20120322164 Lal Dec 2012 A1
20130000704 Fogel Jan 2013 A1
20130020620 Wober Jan 2013 A1
20130037100 Platzer Bjorkman Feb 2013 A1
20130112256 Yu May 2013 A1
20130125965 Hazeghi et al. May 2013 A1
20130174904 Yamasaki Jul 2013 A1
20130220406 Day Aug 2013 A1
20130341749 Yu et al. Dec 2013 A1
20140045209 Chou Feb 2014 A1
20140096816 Atwater et al. Apr 2014 A1
20140117401 Herner May 2014 A1
Foreign Referenced Citations (71)
Number Date Country
1624925 Jun 2005 CN
1306619 Mar 2007 CN
100350429 Nov 2007 CN
101221993 Jul 2008 CN
101459185 Jun 2009 CN
100568516 Dec 2009 CN
101675522 Mar 2010 CN
101681941 Mar 2010 CN
103201858 Jul 2013 CN
1367819 Dec 2003 EP
0809303 Sep 2006 EP
2923651 May 2009 FR
2348399 Apr 2000 GB
359013708 Jan 1984 JP
59198413708 Jan 1984 JP
2000324396 Nov 2000 JP
2002151715 May 2002 JP
2005252210 Sep 2005 JP
2005328135 Nov 2005 JP
2007134562 May 2007 JP
2007152548 Jun 2007 JP
2007184566 Jul 2007 JP
2007520877 Jul 2007 JP
2007201091 Aug 2007 JP
2007317961 Dec 2007 JP
2008288585 Nov 2008 JP
2009506546 Feb 2009 JP
2009236914 Oct 2009 JP
2012543250 Apr 2013 JP
2013513253 Apr 2013 JP
2013513254 Apr 2013 JP
I318418 May 2004 TW
I228782 Mar 2005 TW
200535914 Nov 2005 TW
200536048 Nov 2005 TW
200742115 Apr 2007 TW
200810100 Feb 2008 TW
200814308 Mar 2008 TW
200845402 Nov 2008 TW
200847412 Dec 2008 TW
200915551 Apr 2009 TW
200941716 Oct 2009 TW
I320235 Feb 2010 TW
201027730 Jul 2010 TW
201034172 Sep 2010 TW
201044610 Dec 2010 TW
201140859 Nov 2011 TW
8603347 Jun 1986 WO
0002379 Jan 2000 WO
02069623 Sep 2002 WO
03107439 Dec 2003 WO
03107439 Dec 2003 WO
2005064337 Jul 2005 WO
2007000879 Jan 2007 WO
2008069565 Jun 2008 WO
2008079076 Jul 2008 WO
2008079076 Jul 2008 WO
2008131313 Oct 2008 WO
2008135905 Nov 2008 WO
2008135905 Nov 2008 WO
2008135905 Nov 2008 WO
2008143727 Nov 2008 WO
20080131313 Dec 2008 WO
2009099841 Aug 2009 WO
2009116018 Sep 2009 WO
2009137241 Nov 2009 WO
2010014099 Feb 2010 WO
2010019887 Feb 2010 WO
2010039631 Apr 2010 WO
2010067958 Aug 2010 WO
2011074457 Jun 2011 WO
Non-Patent Literature Citations (220)
Entry
Kim, Y.S. et al., “ITO/AU/ITO multilayer thin films for transparent conducting electrode applications”, Applied Surface Science, vol. 254 (2007), pp. 1524-1527.
Philipp, H.R. et al., “Optical Constants of Silicon in the Region 1 to 10 ev”, Physical Review, vol. 120, No. 1, pp. 37-38.
Office Action for U.S. Appl. No. 13/543,307 mailed Apr. 17, 2015.
Office Action issued on Mar. 18, 2015 in Chinese Application No. 201180066970.6.
Office Action issued Mar. 19, 2015 in Chinese Application No. 201180065814.8.
Office Action for U.S. Appl. No. 13/693,207 mailed May 7, 2015.
Office Action for U.S. Appl. No. 13/288,131 mailed Apr. 17, 2015.
Office Action issued Apr. 3, 2015 in Chinese Application No. 201180051048.X.
Office Action issued May 15, 2015 in U.S. Appl. No. 14/274,448.
Office Action for U.S. Appl. No. 12/982,269 mailed May 22, 2015.
Philipp, H.R. et al., “Optical Constants of Silicon in the Region 1 to 10 ev”, Physical Review, vol. 120, No. 1, pp. 37-38, Oct. 1, 1960.
Kosonocky, et al., 160×244 Element PtSi Schottky-Barrier IR-CCD Image Sensor, IEEE Transactions on Electron Devices, vol. Ed-32, No. 8, Aug. 1985.
Office Action issued May 22, 2015 in Taiwanese Application No. 099142971.
Office Action mailed May 26, 2015 in Japanese Application No. 2014 138265.
Office Action for U.S. Appl. No. 14/068,864 mailed Jun. 15, 2015.
Office Action issued on May 5, 2015 in Chinese Application No. 201410264248.9.
Office Action issued Jul. 9, 2015 in Taiwanese Application No. 102124069.
A. Gu et al., “Design and growth of III-V nanowire solar cell arrays on low cost substrates,” Conf. Record, 35rd IEEE Photovoltaic Specialists Conference, Honolulu, Jun. 2010, pp. 20-25.
Office Action issued Jun. 23, 2015 in Chinese Application No. 201310284409.6.
Office Action issued Aug. 12, 2015 in Chinese Application No. 201180054442.9.
Office Action mailed Sep. 30, 2015 in Japanese Application No. 2014-094365.
Office Action for U.S. Appl. No. 12/966,514 mailed Nov. 2, 2015.
Office Action for U.S. Appl. No. 12/633,313 mailed Oct. 21, 2015.
Office Action for U.S. Appl. No. 13/963,847 mailed Sep. 1, 2015.
Office Action for U.S. Appl. No. 12/945,492 mailed Sep. 9, 2015.
Office Action for U.S. Appl. No. 14/459,398 mailed Sep. 16, 2015.
Office Action for U.S. Appl. No. 14/274,448 mailed Aug. 26, 2015.
Office Action for U.S. Appl. No. 13/288,131 mailed Oct. 22, 2015.
Office Action for U.S. Appl. No. 14/450,812 mailed Oct. 28, 2015.
Office Action for U.S. Appl. No. 12/945,429 mailed Sep. 4, 2015.
Office Action dated Oct. 6, 2015 in Taiwanese Application No. 100141376.
Office Action dated Sep. 11, 2015 in Taiwanese Application No. 103143553.
International Search Report and Written Opinion mailed Nov. 27, 2015 in International Application No. PCT/US2015/038999.
CMOS image sensor pixel microlens array optimization using FDTD Solutions, http://www.lumerical—com/fdtd—microlens/cmos—image—sensor—pixel—microlens.php, pp. 1-2, Jun. 25, 2008.
Adler, Nanowire Lawns Make for Sheets of Image Sensors, NewScientist.com, Jul. 28, 2008.
Babinec et al., High-Flux, Low-Power Diamond Nanowire Single-Photon Source Arrays: An Enabling Material for Optical and Quantum Computing and Cryptography, obtained on Jul. 22, 2010 at URL: http://otd.harvard.edu/technologies/tech.php?case=3702.
Baillie et al., ‘Zero-space microlenses for CMOS image sensors: optical modeling and lithographic process development’, Publication Date May 2004, http://adsabs.harvard.edu/abs/2004SPIE.5377..953B, pp. 1-2.
Barclay et al., Chip-Based Microcavities Coupled to NV Centers in Single Crystal Diamond, Applied Physics Letters, Nov. 12, 2009, vol. 95, Issue 19.
Brouri et al., Photon Antibunching in the Flurescence of Individual Colored Centers in Diamond, Optics Letters, Sep. 1, 2000, vol. 25, Issue 17.
Chung, Sung-Wook et al. Silicon Nanowire Devices. Applied Physics Letters, vol., 76, No. 15 (Apr. 10, 2000), pp. 2068-2070.
CMOS image sensor pixel optical efficiency and optical crosstalk optimization using FDTD Solutions www.lumerical.com/fdtd—microlens/cmos—image—sensor—pixel—microlens.php, Mar. 19, 2009.
Deptuch et al., Vertically Integrated Circuits at Fermilab, IEEE Transactions on Nuclear Science, Aug. 2010, vol. 54, Issue 4, pp. 2178-2186.
Ekroll, On the Nature of Simultaneous Color Contrast, Dissertation, University of Kiel, 2005.
Fan et al., Large-Scale, Heterogeneous Integration of Nanowire Arrays for Image Sensor Circuitry, Proceedings of the National Academy of Sciences (PNAS) of the United States of America, Aug. 12, 2008, vol. 105, No. 32.
Fang et al., Fabrication of Slantingly-Aligned Silicon Nanowire Arrays for Solar Cell Applications, Nanotechnology, vol. 19, No. 25. 2008.
Furumiya, et al. ‘High-sensitivity and no-crosstalk pixel technology for embedded CMOS image sensor’; IEEE Electron Device Letters, vol. 48, No. 10, Oct. 2001.
Gadelrab et al., The Source-Gated Amorphous Silicon Photo-Transistor, IEEE Transactions on Electron Devices, Oct. 1997, vol. 44, No. 10, pp. 1789-1794.
Gambino et al., ‘CMOS Imager with Copper Wiring and Lightpipe,’ Electron Devices Meeting, 2006. IEDM '06, International Publication Date: Dec. 11-13, 2006, pp. 1-4.
Garnett et al., Light Trapping in Silicon Nanowire Solar Cells, Nanoletters, Jan. 28, 2010, vol. 10, No. 3, pp. 1082-1087.
Ge et al., Orientation-Controlled Growth of Single-Crystal Silicon-Nanowire Arrays, Advanced Materials, Jan. 18, 2005, vol. 17, No. 1, pp. 56-61.
Guillaumee, et al.; Polarization Sensitive Silicon Photodiodes Using Nanostructured Metallic Grids, Applied Physics Letters 94, 2009.
Hanrath et al., Nucleation and Growth of Germanium Nanowires Seeded by Organic Monolayer-Coated Gold Nanocrystals, J. Am. Chem. Soc., Feb. 20, 2002, vol. 124, No. 7, pp. 1424-1429.
Hanrath et al., Supercritical Fluid-Liquid-Solid (SFLS) Synthesis of Si and Ge Nanowires Seeded by Colloidal Metal Nanocrystals, Advanced Materials, Mar. 4, 2003, vol. 15, No. 5, pp. 437-440.
Hochbaum et al., Controlled Growth of Si Nanowire Arrays for Device Integration, Nano Letters, Mar. 2005, vol. 5, No. 3, pp. 457-460.
Holmes et al., Control of Thickness and Orientation of Solution-Grown Silicon Nanowires, Science, Feb. 25, 2000, vol. 287, No. 5457, pp. 1471-1473.
Hsu, et al. ‘Light Guide for Pixel Crosstalk Improvement in Deep Submicron CMOS Image Sensor’; IEEE Electron Device Letters, vol. 25, No. 1, Jan. 2004.
International Preliminary Report on Patentability for PCT International Application No. PCT/US2010/035722, mailed Nov. 3, 2011.
International Preliminary Report on Patentability for PCT International Patent Application No. PCT/U62009/055963, mailed Mar. 17, 2011.
International Search Report and Written Opinion for PCT International Application No. PCT/US2010/035722, mailed Jul. 20, 2010.
International Search Report and Written Opinion for PCT International Application No. PCT/US2010/035726, mailed Jul. 21, 2010.
International Search Report and Written Opinion for PCT International Patent Application No. PCT/US2009/055963, mailed Oct. 15, 2009.
International Search Report and Written Opinion for PCT International Patent Application No. PCT/US2009/063592, mailed Jan. 13, 2010.
International Search Report and Written Opinion for PCT International Patent Application No. PCT/US2010/035727, mailed Sep. 27, 2010.
International Search Report and Written Opinion for PCT International Patent Application No. PCT/US2010/051435, mailed Dec. 3, 2010.
International Search Report and Written Opinion for PCT International Patent Application No. PCT/US2010/051446, mailed Jan. 3, 2011.
International Search Report and Written Opinion for PCT International Patent Application No. PCT/US2010/057227, mailed Jan. 26, 2011.
International Search Report and Written Opinion for PCT International Patent Application No. PCT/US2010/059468, mailed Feb. 11, 2011.
International Search Report and Written Opinion for PCT International Patent Application No. PCT/US2010/059491, mailed Feb. 9, 2011.
International Search Report and Written Opinion for PCT International Patent Application No. PCT/US2010/059501, mailed Feb. 15, 2011.
International Search Report and Written Opinion for PCT International Patent Application No. PCT/US2010/059504, mailed Apr. 7, 2011.
International Search Report and Written Opinion for PCT International Patent Application No. PCT/US2011/060348, mailed Mar. 9, 2012.
International Search Report and Written Opinion for PCT International Patent Application No. PCT/US2011/064635, mailed Apr. 13, 2012.
International Search Report and Written Opinion for PCT International Patent Application No. PCT/US2011/066097, mailed Mar. 12, 2012.
International Search Report and Written Opinion for PCT International Patent Application No. PCT/US2011/067712, mailed May 3, 2012.
Jin-Kon Kim; ‘New Functional Nanomaterials Based on Block Copolymers’ http://www.ziu.edu.cn/adver/subjectizyhd/jz0707061313.html, Jul. 11, 2007.
Juan et al., High Aspect Ratio Polymide Etching Using an Oxygen Plasma Generated by Electron Cyclotron Resonance Source, Journal of Vacuum Science and Technology, Jan./Feb. 1994, vol. 12, No. 1., pp. 422-426.
Junger, et al., Polarization- and wavelength-sensitive sub-wavelength structures fabricated in the metal layers of deep submicron CMOS processes, Proc. of SPIE, vol. 7712, 2010.
Kalkofen et al., Atomic Layer Deposition of Boron Oxide as Dopant Source for Shallow Dopant Source for Shallow Doping Silicon, Meeting Abstract 943, 217th ECS Meeting MP2010-O1 , Apr. 25-30, 2010 Vancouver Canada, El—Advanced Gate Stack, Source / Drain, and Channel Engineering for Si-Based CMOS 6: New Materials, Processes,and Equipment.
Kane, Why Nanowires Make Great Photodetectors, EurekAlert.com article, Apr. 25, 2007.
Kempa, Thomas J. et al. Single and Tandem Axial p-i-n Nanowire Photovoltaic Devices, Nano Letters, 2008, vol. 8, No. 10, 3456-3460.
Kim et al., Electronic Structure of Vertically Aligned Mn-Doped CoFe2O4 Nanowires and Their Application as Humidity Sensors and Photodetectors, Journal of Physical Chemistry C, Apr. 7, 2009.
Law et al., Semiconductor Nanowires and Nanotubes, Annu. Rev. Mater. Res., 2004, vol. 34, pp. 83-122.
Lee et al., Vertical Pillar-Superlattice Array and Graphene Hybrid Light Emitting Diodes, Nano Letters, 2010, vol. 10, pp. 2783-2788.
Lin et al., Fabrication of Nanowire Anisotropic Conductive Film for Ultra-fine Pitch Flip Chip Interconnection, Electronic Components and Technology Conference, Jun. 20, 2005, 55th Proceedings, pp. 66-70.
Lin et al., Reducing Dark Current in a High-Speed Si-Based Interdigitated Trench-Electrode MSM Photodetector, IEEE Transactions on Electron Devices, May 2003, vol. 50, No. 5, pp. 1306-1313.
Loncar et al., Diamond Nanotechnology, SPIE Newsroom, May 18, 2010, obtained at url: http://spie.org/x40194.xml?ArticleID=x40194.
Loose et al., CMOS Detector technology, Scientific Technology, Scientific Detector Workshop, Sicily 2005, Experimental Astronomy, vol. 19, Issue 1-3, pp. 111-134.
Lu et al., Growth of Single Crystal Silicon Nanowires in Supercritical Solution from Tethered Gold Particles on a Silicon Substrate, NanoLetters, Jan. 2003, vol. 3, No. 1, pp. 93-99.
Lugstein et al., Ga/Au Alloy Catalyst for Single Crystal Silicon-Nanowire Epitaxy, Applied Physics Letters, Jan. 8, 2007, vol. 90, No. 2, pp. 023109-1-023109-3.
Madou, Properties and Growth of Silicon, Including Crystalline Silicon, Fundamentals of Microfabrication, 2nd Ed., Press, 2002, pp. 125-204. CRC.
Makarova et al., Fabrication of High Density, High-Aspect-Ratio Polyimide Nanofilters, Journal of Vacuum Science and Technology, Nov./Dec. 2009, vol. 27, No. 6., pp. 2585-2587.
Morales et al., A Laser Ablation Method for the Synthesis of Crystalline Semiconductor Nanowires, Science, Jan. 9, 1998, vol. 279, pp. 208-211.
N. L. Dmitruk, et al.; ‘Modeling and Measurement of Optical Response of 1D Array of Metallic Nanowires for Sensing and Detection Application’; 26th International Conference on Microelectronics (MIEL 2008), NIS, Serbia, May 11-14, 2008.
Nguyen et al., Deep Reactive Ion etching of Polyimide for Microfluidic Applications, Journal of the Korean Physical Society, Sep. 2007, vol. 51, No. 3, pp. 984-988.
Ozgur Yavuzcetin, et al.; ‘Index-tuned Anti-reflective Coating using a Nanostructured Metamaterial’; http://www.umass.edu/research/rld/bioportal/vuewtech.php?tid=40, Feb. 28, 2007.
Pain et al., A Back-Illuminated Megapixel CMOS Image Sensor, IEEE Workshop on Charge-Coupled Devices and Advanced Image Sensors, Karuizawa, Japan, Jun. 9-11, 2005, Jet Propulsion Laboratory, National Aeronautics and Space Administration, Pasadena California.
Parraga et al., Color and Luminance Information in Natural Scenes, Journal of Optical Society of America A, Optics, Image, Science and Vision, Jun. 1998, vol. 15, No. 6.
Reynard Corporation; ‘Anti-Reflection Coatings (AR)’, http://www.reynardcorp.com/coating—anti—reflection.php, dowwnloaded Jun. 4, 2009.
Rosfjord et al., Nanowire Single-Photon Detector with an Integrated Optical Cavity and Anti-Reflection Coating, Optics Express: The International Electronic Journal of Optics; Jan. 23, 2006, vol. 14, No. 2, pp. 527-534.
Rugani, First All-Nanowire Sensor, Technology Review, Aug. 13, 2008, Published by MIT.
Rutter, Diamond-Based Nanowire Devices Advance Quantum Science, SEAS Communications, Feb. 14, 2010, obtained at url:http://news.harvard.edu/gazette/story/2010/02/digging-deep-into-diamonds/.
Sarkar et al., Integrated polarization-analyzing CMOS image sensor for detecting incoming light ray direction, Sensors Application Symposium (SAS), Mar. 29, 2012, p. 194-199, 1010 IEEE.
Schmidt et al., Realization of a Silicon Nanowire Vertical Surround-Gate Field-Effect Effect Transistor, Small, Jan. 2006, vol. 2, No. 1, pp. 85-88.
Shimizu et al., Homoepitaxial Growth of Vertical Si Nanowires on Si(100) Substrate using Anodic Aluminum Oxide Template, (abstract only), Materials Research Society, Fall 2007.
Shockley, et al., Detailed Balance Limit of Efficiency of p-n Junction Solar Cells, J. of Appl. Physics, vol. 32, No. 3, Mar. 1961, 10 pages.
Song et al., Vertically Standing Ge Nanowires on GaAs(110) Substrates, Nanotechnology 19, Feb. 21, 2008.
Thelander et al., Nanowire-Based One-Dimensional Electronics, Materials Today, Oct. 2006, vol. 9, No. 10, pp. 28-35.
Trentler, Timothy J. et al. Solution-Liquid-Solid Growth of Cyrstalline III-V Semiconductors: An Analogy to Vapor Liquid-Solid Growth. vol. 270(5243), Dec. 15, 1995, pp. 1791-1794.
Tseng, et al. Crosstalk improvement technology applicable to 0.14m CMOS image sensor; IEEE International Electron Devices Meeting, Dec. 13-15, 2004; IEDM Technical Digest, pp. 997-1000.
Verheijen, Marcel A. et al. Growth Kinetics of Heterostructured GaP-GaAs Nanowires. J. Am, Chem. Soc. 2006, 128, 1353-1359.
Wagner et al., Vapor-Liquid-Solid Mechanism of Single Crystal Growth, Applied Physics Letters, Mar. 1, 1964, vol. 4, No. 5, pp. 89-90.
Wang, Introduction to Nanotechnology—Where Opportunities arise & Great Future Being Built from Small Things, Fall 2008.
Wong et al., Lateral Nanoconcentrator Nanowire Multijunction Photovoltaic Cells, GCEP Progress report, Apr. 20, 2009, pp. 1-18.
Ye et al., Fabrication Techniques of High Aspect Ratio Vertical Lightpipes Using a Dielectric Photo Mask, SPIE, Proceedings, Feb. 2010, vol. 7591.
Zhang et al., Ultrahigh Responsivity Visible and Infrared Detection Using Silicon Nanowire Phototransistors, Nanoletters, May 14, 2010, vol. 10, No. 6, pp. 2117-2120.
Baomin, et al., Nanotechology 23 (2012) 194003, 7 pages.
International Preliminary Report and Written Opinion re PCT/US2010/059468, mailed Jun. 21, 2012.
International Preliminary Report and Written Opinion re PCT/US2010/059491, mailed Jun. 21, 2012.
International Preliminary Report and Written Opinion re PCT/US2010/059496, mailed Jun. 21, 2012.
International Search Report and Written Opinion re PCT/US2011/57325, mailed Jun. 22, 2012.
Jeong, et al., Nano Lett. 2012, 12, 2971-2976.
Jeong et al., J. Vac. Sci. Technol. A 30(6), Nov./Dec. 2012.
Office Action issued on Mar. 3, 2014 in Chinese Application No. 200980142671.9.
U.S. Final Office Action for U.S. Appl. No. 12/966,514, mailed Mar. 19, 2013, 50 pages.
U.S. Final Office Action for U.S. Appl. No. 13/494,661, mailed Mar. 7, 2013, 10 pages.
U.S. Office Action for U.S. Appl. No. 12/573,582, Examiner Robert Huber, dated Jun. 28, 2012.
U.S. Office Action for U.S. Appl. No. 13/494,661 by Examiner Thanh X. Luu, notification date Nov. 7, 2012.
Canadian Office Action of Canadian Application No. 3,676,376, dated Oct. 11, 2013.
Catrysse, et al., An Integrated Color Pixel in 0.18pm CMOS Technology, Proceedings IEDM 2001, pp. 559-562.
Choi et al., Optimization of sidewall roughness in silica waveguides to reduce propagation losses, May 2001, Lasers and Electro-Optics, 2001. CLEO '01. Technical Digest. Summaries of papers presented at the Conference on, pp. 175-176.
Geyer et al., Model for the Mass Transport during Metal-Assisted Chemical Etching with Contiguous Metal Films as Catalysts, J. Phys. Chem. C 2012, 116, 13446-13451.
Hopkins, Addressing sidewall roughness using dry etching silicon and Si02, Jul. 1, 2004, ElectroIQ, vol. 47, Issue 7.
International Preliminary Search Report on Patentability of PCT/US2011/057325, mailed May 2, 2013 (9 pages).
Mei-Ling Kuo et al. “Realization of a near-perfect antireflection coating for silicon solar energy utilization” (Nov. 1, 2008, vol. 33, No. 21, Optics Letters).
Mukhopadhyay, When PDMS Isn't the Best, American Chemical Society, May 1, 2007.
Seo, et. al., “Multicolored vertical silicon nanowires,” Nano Letters, vol. 11 issue 4, pp. 1851-1856, 2010.
Taiwanese Office Action of Taiwan Patent Application No. 099116881, issued Jul. 18, 2013 (8 pages).
U.S. Office Action for U.S. Appl. No. 12/633,313, dated Aug. 1, 2013, 20 pages.
U.S. Office Action for U.S. Appl. No. 12/966,514, dated Aug. 15, 2013, 17 pages.
U.S. Office Action for U.S. Appl. No. 12/966,535, mailed Jun. 14, 2013, 22 pages.
U.S. Office Action for U.S. Appl. No. 12/966,573, dated Aug. 6, 2013, 13 pages.
U.S. Office Action for U.S. Appl. No. 13/048,635, mailed Jun. 6, 2013, 24 pages.
Office Action issued on Jan. 28, 2014 in Taiwanese Application No. 100146327.
Office Action issued on Mar. 17, 2014 in Korean Application No. 10-2013-7018243.
U.S. Office Action for U.S. Appl. No. 12/910,664, mailed Feb. 26, 2014.
U.S. Office Action for U.S. Appl. No. 12/966,514, mailed Feb. 25, 2014.
Office Action issued on Jun. 19, 2014 in Taiwanese Application No. 099133891.
U.S. Office Action for U.S. Appl. No. 12/945,492 mailed May 13, 2014.
U.S. Office Action for U.S. Appl. No. 12/982,269 mailed Jun. 11, 2014.
U.S. Office Action for U.S. Appl. No. 13/106,851 mailed May 29, 2014.
U.S. Office Action for U.S. Appl. No. 13/556,041 mailed Jun. 12, 2014.
U.S. Office Action for U.S. Appl. No. 14/021,672 mailed May 9, 2014.
U.S. Office Action for U.S. Appl. No. 12/633,313 mailed Aug. 1, 2014.
U.S. Office Action for U.S. Appl. No. 13/693,207 mailed Oct. 9, 2014.
U.S. Office Action for U.S. Appl. No. 12/966,514 mailed Sep. 23, 2014.
Office Action issued on Jun. 24, 2014 in Taiwanese Application No. 098129911.
University of California San Diego, Class ECE 183 Lab 1, 2013.
Office Action issued on Oct. 29, 2014 in Korean Application No. 10-2013-7020107.
U.S. Office Action for U.S. Appl. No. 13/925,429 mailed Nov. 4, 2014.
Corrected Notice of Allowability issued on Oct. 14, 2014 in U.S. Appl. No. 12/966,535.
Notice of Allowance issued on Dec. 1, 2014 in U.S. Appl. No. 12/910,664.
U.S. Office Action for U.S. Appl. No. 13/543,307 mailed Dec. 24, 2014.
U.S. Office Action for U.S. Appl. No. 14/274,448 mailed Dec. 5, 2014.
International Search Report and Written Opinion for International Application No. PCT/US2014/056558 mailed Dec. 12, 2014.
Office Action issued on Nov. 11, 2014 in Taiwanese Application No. 098129911.
Notice of Allowance issued Jan. 30, 2015 in U.S. Appl. No. 14/487,375.
International Search Report and Written Opinion for International Application No. PCT/US2014/050544 mailed Jan. 9, 2015.
Office Action for U.S. Appl. No. 12/982,269, mailed Jan. 15, 2015.
Office Action for U.S. Appl. No. 12/945,492 mailed Jan. 16, 2015.
Office Action issued Feb. 23, 2015 in U.S. Appl. No. 13/925,429.
Office Action issued on Jan. 16, 2015 in Chinese Application No. 201180054442.9.
Bernstein et al. “Modern Physics”, Chapter 14, Section 6, pp. 420-421, 2000 by Prentice-Hall Inc.
Office Action for U.S. Appl. No. 14/281,108 mailed Apr. 6, 2015.
Office Action for U.S. Appl. No. 13/963,847 mailed Mar. 12, 2015.
Office Action for U.S. Appl. No. 12/966,514 mailed Mar. 10, 2015.
Office Action issued on Mar. 4, 2015 in U.S. Appl. No. 13/556,041.
Office Action for U.S. Appl. No. 14/450,812 mailed Apr. 1, 2015.
Office Action for U.S. Appl. No. 12/633,313 mailed Apr. 9, 2015.
Office Action for U.S. Appl. No. 14/450,812 mailed Jul. 23, 2015.
Office Action for U.S. Appl. No. 14/293,164 mailed Aug. 14, 2015.
Office Action mailed Mar. 29, 2016 in Japanese Application No. 2014-138265.
International Preliminary Report on Patentability issued on Mar. 22, 2016 in International Application PCT/US2014/056558.
Decision issued on Jan. 30, 2016 in Taiwanese Application 099142971.
Office Action issued Apr. 21, 2016 in U.S. Appl. No. 14/322,503.
Office Action issued Apr. 14, 2016 in U.S. Appl. No. 14/704,143.
Office Action issued Apr. 27, 2016 in U.S. Appl. No. 14/291,888.
Office Action issued Apr. 6, 2016 in Taiwanese Application 100149997.
Decision issued Mar. 28, 2016 in Taiwanese Application 103143553.
Office Action issued Apr. 27, 2016 in Chinese Application 201410265340.7.
Office Action issued Apr. 29, 2016 in Chinese Application 201301284409.6.
Office Action issued Jun. 29, 2016 in Chinese Application 201280030352.0.
Office Action issued Jun. 16, 2016 in Taiwanese Application 100138526.
Office Action issued Jun. 17, 2016 in Chinese Application 201410264248.9.
Notice of Allowance mailed Aug. 30, 2016 in U.S. Appl. No. 14/291,888.
Office Action issued Aug. 22, 2016 in U.S. Appl. No. 14/450,812.
Office Action issued Oct. 22, 2015 in Taiwanese Application No. 103139449.
Office Action issued Oct. 16, 2015 in Taiwanese Application No. 103145582.
Office Action issued on Nov. 25, 2015 in Japanese Application No. 2015-005091.
Office Action issued Nov. 17, 2015 in Taiwanese Application 103102171.
Office Action issued Nov. 20, 2015 in Taiwanese Application 104108370.
Office Action issued on Nov. 27, 2015 in Taiwanese Application No. 100138526.
International Search Report and Written Opinion mailed Jan. 8, 2016 in International Application No. PCT/US2015/055728.
Office Action issued Jan. 4, 2016 in U.S. Appl. No. 14/311,954.
Office Action issued Jan. 5, 2016 in U.S. Appl. No. 14/291,888.
Office Action issued Nov. 9, 2015 in U.S. Appl. No. 14/503,598.
Office Action issued Jan. 4, 2016 in U.S. Appl. No. 14/293,164.
Office Action issued Jan. 7, 2016 in U.S. Appl. No. 14/322,503.
Office Action issued Jan. 14, 2016 in U.S. Appl. No. 14/459,398.
Office Action issued Dec. 28, 2015 in Taiwanese Application No. 102149110.
Office Action issued Dec. 25, 2015 in Chinese Application No. 201410264248.9.
Office Action issued Dec. 30, 2015 in Taiwanese Application No. 104123757.
International Search Report and Written Opinion mailed Nov. 27, 2015 in International Application PCT/US2015/038999.
Office Action issued Jan. 15, 2016 in Chinese Application No. 201180066970.6.
International Preliminary Report on Patentability issued Feb. 9, 2016 in International Application PCT/US2014/050544.
International Search Report and Written Opinion mailed Feb. 9, 2016 in International Application PCT/US2015/55710.
Office Action issued Feb. 25, 2016 in Chinese Application No. 201180051048.X.
Office Action issued Feb. 1, 2016 in Taiwanese Application 102124069.
Office Action issued Feb. 6, 2016 in Chinese Application No. 201180054442.9.
Office Action issued Feb. 4, 2016 in U.S. Appl. No. 14/274,448.
Office Action issued Mar. 7, 2016 in U.S. Appl. No. 14/450,812.
Related Publications (1)
Number Date Country
20150171244 A1 Jun 2015 US
Provisional Applications (1)
Number Date Country
61357429 Jun 2010 US
Continuations (1)
Number Date Country
Parent 12910664 Oct 2010 US
Child 14632739 US