BRIEF DESCRIPTION OF THE DRAWINGS
The objectives, shape, structure, device and characteristics of the present invention will now be described in more detail hereinafter with reference to the accompanying drawings that show various embodiments of the invention, in which:
FIG. 1 is a schematic view of a prior art heat dissipating device;
FIG. 2 is a perspective view of a first preferred embodiment of the present invention;
FIG. 3 is an exploded view of a first preferred embodiment of the present invention;
FIG. 4 is a schematic view of an assembly of a first preferred embodiment of the present invention;
FIG. 5 is a cross-sectional view of a first preferred embodiment of the present invention;
FIG. 6 is a schematic view of an application according to a first preferred embodiment of the present invention; and
FIG. 7 is a schematic view of a second preferred embodiment of the present invention.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
The structure, technical measures and effects of the present invention will now be described in more detail hereinafter with reference to the accompanying drawings that show various embodiments of the invention.
Referring to FIGS. 2 to 5 for a liquid-cooling heat dissipating device for dissipating heat by a casing of the present invention, the device installs a casing 10 in any shape, and the casing 10 of this embodiment is a rectangular casing, and both sides of the casing 10 are secured to a cover panel 11, and the cover panel 11 comes with a ventilation hole 111, and each wall at the periphery of the casing 10 includes a liquid flow channel 12, and the liquid flow channels 12 wind around the periphery of the casing 10 and are formed integrally with the casing 10, and a heat dissipating fin 13 is integrally formed on the wall of the casing 10.
Further, the casing 10 has a gap 14 disposed at a predetermined position of the casing 10, and the gap 14 has a panel 15 therein, and a protruding ear 151 is protruded outward separately from both ends of the panel 15, and the protruding ears 151 separately have a lock hole 152, such that the protruding ears 151 can be secured onto the edge of casing 10 on both sides of the gap 14 by a screw rod 153 passed through the lock hole 152, and the panel 15 can be embedded into the gap 14 of the casing 10, and the panel 15 installs a cold connector 155 and a hot connector 154. This embodiment adopts one cold connector 155 and one hot connector 154, wherein the hot connector 154 is connected to an end of the liquid flow channel 12, and the cold connector 155 is connected to a cold water outlet 21 of a water tank 20 through a pipeline 16, and the water tank 20 is used for storing a liquid (which is water in this embodiment), and the water tank 20 can install a pump (not shown in the figure) for expediting the liquid flow. Further, the water tank 20 comes with a cold water inlet 22, and the cold water inlet 22 is connected to another end of the liquid flow channel 12.
The cold and hot connectors 155, 154 are coupled to a water-cooling connector 30 through a pipeline 16, and the water-cooling connector 30 can be installed in the casing 10 (as shown in FIG. 7) or outside the casing 10 (as shown in FIG. 6). The casing 10 further includes a decorative panel 17 thereon for the decoration purpose.
Referring to FIG. 6, the water-cooling connector 30 is installed at a heat source (such as a processor chip) on a casing 40 of an independent electronic device, such that the liquid heated by the heat source can be sent to the liquid flow channel 12 through the pipeline 16 and the hot connector 154 and dissipated quickly to the outside through the heat dissipating fin 13 on the wall of the casing 10, and the heated liquid is returned to the water tank 20 through the cold water inlet 22 and the liquid flow channel 12, and then sent to the water-cooling connector 30 through the cold water outlet 21, cold connector 155 and pipeline 16 for repeated cycles, so as to dissipate heat produced by a heat source quickly to the outside, and the electronic equipment such as a computer or other electronic equipments can be operated at a more stable ambient temperature and applied to any electronic equipment.
Referring to FIG. 7, the water-cooling connector 30 is installed directly at a heat source (such as a processor) in the casing 10 (which could be a computer chassis), such that the liquid heated by the heat source is flowed into the liquid flow channel 12 through the pipeline 16 and the hot connector 154, and sent to the heat dissipating fin 13 between the liquid flow channels 12, so that the heat can be dissipated quickly to the outside, and then the liquid is returned to the water tank 20 through the liquid flow channels 12 and the cold water inlet 22, and then to the water-cooling connector 30 through the cold water outlet 21, cold connector 155 and pipeline 16 for repeated cycles, so as to dissipate the heat produced by the heat source to the outside quickly, and thus the heat will not remain at the heat source and in the casing 10.
In summation of the description above, the design of the present invention can improve the heat dissipating efficiency and overcome the shortcomings of the present invention and thus the present invention is duly submitted for the patent application. While the invention has been described by means of specific embodiments, modifications and variations could be made by those skilled in the art without departing from the scope and spirit of the invention set forth in the claims.
Patent Application
20070297138
