TREA

Liquid crystal display apparatus having stepped section in glass substrate

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Information

  • Patent Grant
  • 6480254
  • Patent Number
    6,480,254
  • Date Filed
    Friday, September 22, 2000
    24 years ago
  • Date Issued
    Tuesday, November 12, 2002
    22 years ago
Information
Abstract
In a liquid crystal display apparatus, a glass substrate has connection terminals and a stepped section at an edge thereof. A liquid crystal display panel is mounted on the glass substrate and is electrically connected to the connection terminals. A flexible printed board has leads and an insulating layer partly covering the leads. The connection terminals are adhered by a conductive adhesive agent to the leads, so that the stepped section of the glass substrate receives an edge of the insulating layer.
Description




BACKGROUND OF THE INVENTION




1. Field of the Invention




The present invention relates to a liquid crystal display (LCD) apparatus, and more particularly, to the alignment of a flexible printed board with a glass substrate.




2. Description of the Related Art




Generally, an LCD apparatus is constructed by a glass substrate, an LCD panel mounted on the glass substrate, and a flexible printed board adhered to the glass substrate. The flexible printed board drives the LCD panel. Therefore, the flexible printed board has leads electrically connected to the LCD panel and an insulating layer partly covering the leads.




In a first prior art LCD apparatus, connection terminals are formed along edges of the glass substrate. The leads of the flexible printed board are connected to the connection terminals by a thermocompression bonding process using a thermosetting conductive adhesive agent. When connecting the leads of the flexible printed board to the connection terminals of the glass substrate, the conductive adhesive agent is heated while the flexible printed board is lowered under pressure until they are connected with each other. This will be explained later in detail.




In the above-described first prior art LCD apparatus, however, while the leads and the insulating layer are located respectively at different levels on the flexible printed board, the connection terminals of the glass substrate are on the same plane as the compression bonding surface at the time of the thermocompression bonding process, so that the insulating layer is inevitably located off the edge of the glass substrate. Therefore, the leads of the flexible printed board are left uncovered and exposed to the atomosphere, resulting in conductive contaminant adhered to the exposed leads, which may by turn give rise to a short-circuiting therein.




In a second prior art LCD apparatus (see-JP-A-5-72545 & JP-A-8-138774), an about 0.3 to 1.0 mm width beveled section is formed along the edge of the glass substrate. As a result, when the conductive adhesive agent is forced off the edge of the glass substrate by the thermocompression bonding process, squeezed adhesives is received in the beveled section. Therefore, the leads of the flexible printed board are completely covered by the adhesive agent, thus avoiding a short-circuit between the leads of the flexible printed board. This also will be explained later in detail.




In the above-described second prior art LCD apparatus, however, since it is difficult to closely control the flow of the conductive adhesive agent, and also the location of the edge of the insulating layer fluctuates, the exposed leads of the flexible printed board may not be covered satisfactorily. In addition, since the part of the conductive adhesive agent that is forced off will simply remain by chance on the beveled section of the glass substrate, when subjected to stress due to external force or made to become brittle for some reason or other, the part of the conductive adhesive agent can easily come off the beveled section of the glass substrate, to thereby affect the operation of the LCD apparatus as foreign objects blocking the back light.




SUMMARY OF THE INVENTION




It is an object of the present invention to provide an LCD apparatus and its manufacturing method that can effectively protect the exposed leads of the flexible printed board and suppress any possible production of a foreign object that can block the back light.




According to the present invention, in an LCD apparatus, a glass substrate has connection terminals and a stepped section at an edge thereof. An LCD panel is mounted on the glass substrate and is electrically connected to the connection terminals substrate. A flexible printed board has leads and an insulating layer partly covering the leads. The connection terminals are adhered by a conductive adhesive agent to the leads, so that the stepped section of the glass substrate receives an edge of the insulating layer.




Also, in a method for manufacturing an LCD panel apparatus, a glass substrate having connection terminals is prepared. Then, a stepped section is formed at an edge of the glass substrate and adjacent to the connection terminals. Then, an LCD is mounted on the glass substrate. In this case, the liquid crystal display panel is electrically connected to the connection terminals. Then, a conductive adhesive agent is coated on the connection terminals. Then, a flexible printed board having leads and an insulating layer partly covering the leads is placed on the glass substrate, so that the leads face the connection terminals, and an edge of the insulating layer faces the stepped section of the glass substrate. Then, pressure is applied to the flexible printed board and the glass substrate, so that the leads are electrically connected via the conductive adhesive agent to the connection terminals.




If the conductive adhesive agent is made of thermosetting conductive adhesive, the conductive adhesive agent is heated while the pressure is applied.




If the conductive adhesive agent is made of ultraviolet-ray-setting conductive adhesive, the conductive adhesive agent is irradiated with ultraviolet rays while the pressure is applied.











BRIEF DESCRIPTION OF THE DRAWINGS




The present invention will be more clearly understood from the description as set forth below, as compared with the prior art, with reference to the accompanying drawings, wherein:





FIG. 1

is a cross-sectional view illustrating a first prior art LCD apparatus;





FIG. 2

is a cross-sectional view illustrating a second prior art LCD apparatus;





FIGS. 3A

,


3


B,


3


C,


3


D and


3


E are cross-sectional views illustrating an embodiment of the method for manufacturing an LCD apparatus according to the present invention;





FIGS. 4A

,


4


B,


5


A and


5


B are cross-sectional views for explaining the dimensions of the stepped section of the LCD apparatus of

FIGS. 3A

,


3


B,


3


C,


3


D and


3


E; and





FIG. 5C

is a plan view of FIG.


5


B.











DESCRIPTION OF THE PREFERRED EMBODIMENT




Before the description of the preferred embodiment, prior art LCD apparatuses will be explained with reference to

FIGS. 1 and 2

.




In

FIG. 1

, which is a cross-sectional view illustrating a first prior art LCD apparatus, reference numeral


1


designates a glass substrate on which an LCD panel


2


is mounted. Note that thin film transistors (TFTs.), color filters and the like are formed on the LCD panel


2


. Also, a flexible printed board


3


as an external driving circuit section having leads


3




a


printed thereon and an insulating layer


3




b


partly covering the leads


3




a


is mounted on the glass substrate


1


, and is electrically connected to the LCD panel


2


. Note that the flexible printed board


3


is constructed by a tape carrier package (TCP).




In more detail, connection terminals


1




a


are formed along edges of the glass substrate


1


. The leads


3




a


of the flexible printed board


3


are connected to the connection terminals


1




a


by a thermocompression bonding process using a thermosetting conductive adhesive agent


4


. The conductive adhesive agent


4


is an anisotropic conductive adhesive agent adapted to realize electrical connection by means of resin filled with conductive granules, which resin will be molten and flow away when heated, leaving the conductive granules behind.




When connecting the leads


3




a


of the flexible printed board


3


to the connection terminals


1




a


of the glass substrate


1


, the electoconductive adhesive agent


4


is heated while the flexible printed board


3


is lowered under pressure until they are connected with each other.




In the LCD apparatus of

FIG. 1

, however, while the leads


3




a


and the insulating layer


3




b


are located respectively at different levels on the flexible printed board


3


, the connection terminals


1




a


of the glass substrate


1


are on the same plane as the compression bonding surface at the time of thermocompression bonding process, so that the insulating layer


3




b


is inevitably located off the edge of the glass substrate


1


. Therefore, the leads


3




a


of the flexible printed board


3


are left uncovered and exposed to the atmosphere as indicated by X in

FIG. 1

, resulting in conductive contaminant adhered to the exposed leads


3




a


, which may by turn give rise to a shortcircuiting therein.




In

FIG. 2

, which is a cross-sectional view illustrating a second prior art LCD apparatus (see-JP-A-5-72545 & JP-A-8-138774), an about 0.3 to 1.0 mm width beveled section


1




b


is formed along the edge of-the glass substrate


1


. As a result, when the conductive adhesive agent


4


is forced off the edge of the glass substrate


1


by the thermocompression bonding process, and the squeezed adhesives are received in the beveled section


1




b


. Therefore, the leads


3




a


of the flexible printed board


3


is completely covered by the adhesive agent


4


, thus avoiding the short-circuit between the leads


3




a


of the flexible printed board


3


.




In the LCD apparatus of

FIG. 2

, however, since it is difficult to closely control the flow of the conductive adhesive agent


4


, and also the edge location of the insulating layer


3




b


fluctuates, the exposed leads


3




a


of the flexible printed board


3


may not be covered satisfactorily. In addition, since the part of the conductive adhesive agent


4


that is forced off will simply remain by chance on the beveled section


1




b


of the glass substrate


1


as no means is provided to hold the part of the adhesive agent


1


there, when subjected to stress due to external force or made to become brittle for some reason or other, the part of the conductive adhesive agent


1


can easily come off the beveled section


1




b


of the glass substrate


1


, to thereby affect the operation of the LCD apparatus as foreign objects blocking the back light.




An embodiment of the method for manufacturing an LCD apparatus will be explained next with reference to

FIGS. 3A

,


3


B,


3


C


3


D and


3


E.




First, referring to

FIG. 3A

, a glass substrate


1


having connection terminals


1




a


thereon is polished to form a stepped section


1




b


having a depth D and a length L along the edge of the glass substrate


1


. Then, an LCD panel


2


is mounted on the glass substrate


1


. In this case, the LCD panel


2


is electrically connected to the connection terminals


1




a.






Note that the edge of the outer extremity


1




c


of the stepped section


1




b


may be appropriately beveled.




Next, referring to

FIG. 3B

, the glass substrate


1


is placed on a support table


5


. Then, a thermosetting anisotropic conductive adhesive agent


4


is provisionally-compression bonded onto the connection terminals


1




a


. Note that reference numeral


6


designates a compression bonding head. Next, referring to

FIG. 3C

, a flexible printed board


3


having leads


3




a


and an insulating layer


3




b


partly covering the leads


3




a


is positioned on the glass substrate


1


. In this case, the leads


3




a


face the conductive adhesive agent


4


, i.e., the connection terminal


1




a


and the edge of the insulating layer


3




b


faces the stepped section


1




b


of the glass substrate


1


.




Next, referring to

FIG. 3D

, the compression bonding head


6


is pressed against the aligned leads


3




a


of the flexible printed board


3


and the connection terminals


1




a


of the glass substrate


1


. Simultaneously, the conductive adhesive agent


4


is subjected to thermo-compression bonding at a temperature and pressure suitable for it to be thermoset in order to electrically connect the leads


3




a


to the connection terminals


1




a


. In this case, some of the resin of the conductive adhesive agent


4


is softened by the thermo-compression bonding process and flows onto the stepped section


1




b


of the glass substrate


1


. The resin within the stepped section


1




b


becomes hardened and is sandwiched by the glass substrate


1


and insulating layer


3




b


of the flexible printed board


3


.




Finally, referring to

FIG. 3E

, the compression bonding head


6


and the support table


5


are removed. Thus, when the leads


3




a


of the flexible printed board


3


are aligned with the connection terminals


1




a


of the glass substrate


1


, the stepped section


1




b


of the glass substrate


1


receives the insulating layer


3




b


of the flexible printed board


3


.




The depth D of the stepped section


1




b


is so selected as to appropriately receive any excess portion of the conductive adhesive agent


4


as well as receive the insulating layer


3




b


. For example, the depth D is dimensioned to be






20 μm ≦D ≦60 μm






On the other hand, the length L of the stepped section


1




b


is so selected as to appropriately conceal the exposed leads


3




a


and the edge of the insulating layer


3




b


. For example, the length L is dimensioned to be






0.3 mm ≦L ≦0.5 mm






The depth D of the stepped section


1




b


of the glass substrate


1


will be explained with reference to

FIGS. 4A and 4B

. Here, the thickness of the insulating layer


3




b


is about 5 to 20 μm, and the adhesive agent 4 is about 10 to 30 μm before the thermo-compressing bonding process.




If the depth D of the stepped section


1




b


is smaller than the thickness of the insulating layer


3




b


as illustrated in

FIG. 4A

, the leads


3




a


will be swerved between the edge of the stepped section


1




b


of the glass substrate


1


and the edge of the insulating layer


3




b


. As a result, the leads


3




a


of the flexible printed board


3


may be subjected to concentrated local stress after the thermo-compression bonding process. Therefore, the leads


3




a


of the flexible printed board


3


may become broken or fall into some other faulty conditions when the leads


3




a


of the flexible printed board


3


are subjected to additional stress due to external force such as vibration.




Thus, in order to avoid the generation of swerved portions of the leads


3




a


, the depth D is preferably larger than the thickness of the insulating layer


3




b


. For example, as stated above,






D≧20 μm






On the other hand, if the depth D of the stepped section


1




b


is larger than the thickness of the insulating layer


3




b


as illustrated in

FIG. 4B

, it will no longer be possible for the region of the adhesive agent


4


flowing out as a result of the thermo-compression bonding process to completely fill the stepped section


1




b


of the glass substrate


1


. As a result, a gap G will be formed between the insulating layer


3




b


and the glass substrate


1


to partly expose the leads


3




a


of the flexible printed board


3


through the gap G.




Thus, in order to avoid the generation of the gap G, the depth D is preferably smaller than thrice the thickness of the insulating layer


3




b


. For example, as stated above,






D≧60 μm






The length L of the stepped section


1




b


of the glass substrate


1


will be explained next with reference to

FIGS. 5A

,


5


B and


5


C. Here,

FIG. 5B

is an enlargement of the connection terminals


1




a


and the leads


3




a


of

FIG. 5A

, and

FIG. 5C

is a plan view of FIG.


5


B. Also, the precision of the thickness of the insulating layer


3




b


is ±0.1 to 0.2 mm.




As illustrated in

FIG. 5A

, if the length L of the stepped section


1




b


is too small, the insulating layer


3




b


serves as a dam of the stepped section


1




b


for blocking the flow path of the molten resin of the thermally softened adhesive agent


4


in the thermo-compression bonding process. As a result, as illustrated in

FIGS. 5B and 5C

, the conductive granules


4




a


of the conductive adhesive agent


4


may coagulate to short-circuit the exposed leads


3




a.






On the other hand, if the length L of the stepped section


1




b


is too large, the glass substrate


1


shows excessly large peripheral dimensions so that the LCD apparatus will be made too large for no good reason.




Now, the length L of the stepped section


1




b


is required to accommodate at least the minimal deviation of 0.2 mm for the insulating layer


3




b


and the distance of 0.1 mm between the end surface of the insulating layer


3




b


and the side wall of the stepped section


1




b


. On the other hand, it is not required to accommodate more than the maximal deviation of 0.4 mm for the insulating layer


3




b


and the distance of 0.1 mm between the end surface of the insulating layer


3




b


and the side wall of the stepped section


1




b.






In view of the above circumstances, as stated above, the length L of the stepped section


1




b


is preferably dimensioned to be 0.3 mm ≦L2 ≦0.5 mm.




In the above-described embodiment, the conductive adhesive agent


4


can be obtained by adding conductive granules to ultraviolet-ray-setting type resin. In this case, the conductive adhesive agent


4


containing ultraviolet-ray-setting type resin is applied in advance to the entire surface of the stepped section


1




b


to a thickness of about 10 to 30 μm. When electrically connecting the leads


3




a


of the flexible printed board


3


and the connection terminals


1




a


of the glass substrate


1


by means of the conductive adhesive agent


4


, ultraviolet rays are irradiated onto the conductive adhesive agent


4


while the latter is subjected to pressure applied by the compression bonding head


6


. As a result, the conductive adhesive agent


4


applied to the entire surface of the stepped section


1




b


is hardened so that the exposed leads


3




a


of the flexible printed board


3


are concealed by the stepped section


1




b.






As explained hereinabove, according to the present invention, since the leads of the flexible printed board would not be exposed to the outside, any short-circuiting can be reliably prevented from occurring to the leads due to the foreign objects adhering thereto. Also, any excess conductive adhesive agent is received by the stepped section and covers the corresponding edges of the leads the insulating layer of the flexible printed board to further protect the leads against short-circuiting due to the foreign objects adhering thereto. Further, since the forced-out conductive adhesive agent is accommodated on the stepped section, it would not be peeled off to block the back light as a foreign object to reduce the characteristics of the LCD apparatus.



Claims
  • 1. A method for manufacturing a liquid crystal display apparatus, comprising the steps of:preparing a glass substrate having connection terminals; forming a stepped section at an edge of said glass substrate and adjacent to said connection terminals, wherein said stepped section comprises a wall adjacent to said connection terminals and an excess adhesive receiving surface extending from a base of said wall in a direction away from said connection terminals and towards said edge of said glass substrate; mounting a liquid crystal display panel on said glass substrate, said liquid crystal display panel being electrically connected to said connection terminals; coating a conductive adhesive agent on said connection terminals after said liquid crystal display panel is mounted; placing a flexible printed board having leads and an insulating layer covering a covered portion of said leads on said glass substrate, so that an exposed portion of said leads face said connection terminals, and an edge of said insulating layer faces said stepped section of said glass substrate; and applying pressure to said flexible printed board and said glass substrate, so that a connection section of said exposed portion of said leads are electrically connected via said conductive adhesive agent to said connection terminals, wherein said excess adhesive receiving section receives any excess portion of said conductive adhesive agent.
  • 2. That method as set forth in claim 1, wherein said conductive adhesive agent is made of thermosetting conductive adhesive,said method further comprising a step of heating said conductive adhesive agent while said pressure is applied.
  • 3. The method as set forth in claim 1, wherein said conductive adhesive agent is made of ultraviolet-ray-setting conductive adhesive,said method further comprising a step of irradiating said conductive adhesive agent with ultraviolet rays while said pressure is applied.
  • 4. The method as set forth in claim 1, wherein said stepped section has a depth dimensioned to receive any excess portion of said conductive adhesive agent, said depth being larger than a thickness of said insulating layer.
  • 5. The method as set forth in claim 1, wherein said excess adhesive receiving surface has a length dimensioned to conceal a non-connection portion of said exposed portion of said leads and the edge of said insulating layer.
  • 6. The method as set forth in claim 1, wherein said stepped section has a depth dimensioned to be between approximately 20 μm and 60 μm and said excess adhesive receiving surface has a length dimensioned to be between approximately 0.3 mm and 0.5 mm.
  • 7. The method as set forth in claim 1, wherein said wall has a depth dimensioned to be between 20 μm and 60 μm and said excess adhesive receiving surface has a length dimensioned to be between approximately 0.3 mm and 0.5 mm.
  • 8. The method as set forth in claim 1, wherein said wall has a depth dimensioned to receive any excess portion of said conductive adhesive agent, said depth being larger than a thickness of said insulating layer.
Priority Claims (1)
Number Date Country Kind
10-055235 Mar 1998 JP
Parent Case Info

This is a divisional of application Ser. No. 09/262,867 U.S. Pat No. 6,172,730 filed Mar. 5, 1999, the disclosure of which is incorporated herein by reference.

US Referenced Citations (5)
Number Name Date Kind
4408836 Kikuno Oct 1983 A
4409836 Kikuno Oct 1983 A
4930876 Suzuki et al. Jun 1990 A
5317438 Suzuki et al. May 1994 A
5528403 Kawaguchi et al. Jun 1996 A
Foreign Referenced Citations (6)
Number Date Country
5-72545 Mar 1993 JP
6-235928 Aug 1994 JP
7-321152 Dec 1995 JP
8-76073 Mar 1996 JP
8-138774 May 1996 JP
9-127536 May 1997 JP
Non-Patent Literature Citations (3)
Entry
Patent Abstracts of Japan, vol. 095, No. 001, Feb. 28, 1995.
Patent Abstracts of Japan, vol. 096, No. 004, Apr. 30, 1996.
Patent Abstracts of Japan, vol. 014, No. 442 IP 1109, Sep. 20, 1990.