Claims
- 1. A multi-layer circuit comprising
a first circuit layer; a second circuit layer; and a liquid crystalline polymer bond ply disposed between the first and the second circuit layers, wherein
the liquid crystalline polymer bond ply is formed by treating a film comprising a liquid crystalline polymer with an amount of heat and pressure effective to produce a liquid crystalline polymer bond ply with an in-plane coefficient of thermal expansion of 0 to about 50 ppm/° C.; and further wherein the multi-layer circuit board is formed by laminating the first circuit layer, the second circuit layer, and the film at a temperature from 0° C. to about 15° C. less than the melt temperature of the liquid crystalline polymer bond ply.
- 2. The multi-layer circuit of claim 1 wherein at least one of the circuit layers comprises a dielectric layer supporting at least one conductive layer.
- 3. The multi-layer circuit of claim 3 wherein the conductive layer is copper.
- 4. The multi-layer circuit of claim 3 wherein the dielectric layer comprises a resin selected from the group consisting of polybutadiene, polyphenylene ether, epoxy, polytetrafluoroethylene, liquid crystalline polymers, and combinations comprising at least one of the foregoing.
- 5. The multi-layer circuit of claim 1, wherein the liquid crystalline polymer is a copolymer of hydroxy benzoate/hydroxy naphthoate.
- 6. The multi-layer circuit of claim 1, wherein the liquid crystalline polymer bond ply has a thickness of about 10 to about 200 micrometers.
- 7. The multi-layer circuit of claim 1, wherein laminating is at a temperature of 0° C. to about 10° C. less than the melt temperature of the liquid crystalline polymer bond ply.
- 8. The multi-layer circuit of claim 1, wherein the film comprising a liquid crystalline polymer has a melt temperature of about 250° C. to about 350° C.
- 9. The multi-layer circuit of claim 1, wherein the film comprising a liquid crystalline polymer is treated at a temperature from about 280° C. to about 330° C. and a pressure from about 0.5 Mpa to about 1.4 Mpa.
- 10. A method of manufacturing a liquid crystalline bond ply comprising heating a film comprising a liquid crystalline polymer at a temperature and pressure effective to produce a liquid crystalline polymer bond ply with an in-plane coefficient of thermal expansion of 0 to about 50 ppm/° C.
- 11. The method of claim 10, wherein the liquid crystalline polymer is a copolymer of hydroxy benzoate/hydroxy naphthoate.
- 12. The method of claim 10, wherein the liquid crystalline polymer bond ply has a thickness of about 10 to about 200 micrometers.
- 13. The method of claim 10, wherein the liquid crystalline polymer has a melt temperature of about 250° C. to about 350° C.
- 14. The method of claim 10, wherein the film is treated at a temperature of about 280° C. to about 330° C. and a pressure of about 0.5 Mpa to about 1.4 Mpa.
- 15. A liquid crystalline polymer bond ply produced by a method comprising heating a film comprising a liquid crystalline polymer at a temperature and a pressure effective to produce a liquid crystalline polymer bond ply with an in-plane coefficient of thermal expansion of 0 to about 50 ppm/° C.
- 16. The liquid crystalline polymer bond ply of claim 15, wherein the liquid crystalline polymer is a copolymer of hydroxy benzoate/hydroxy naphthoate.
- 17. The liquid crystalline polymer bond ply of claim 15, wherein the liquid crystalline polymer bond ply has a thickness of about 10 to about 200 micrometers.
- 18. The liquid crystalline polymer bond ply of claim 15, wherein the liquid crystalline polymer has a melt temperature of about 250° C. to about 350° C.
- 19. The liquid crystalline polymer bond ply of claim 15, wherein the film comprising a liquid crystalline polymer is treated at a temperature of about 280° C. to about 330° C. and a pressure of about 0.5 Mpa to about 1.4 Mpa.
- 20. A multi-layer circuit comprising
a first conductive metal layer; a first circuit layer comprising a first dielectric layer and a first conductive circuit layer; a first liquid crystalline polymer bond ply disposed between the conductive metal layer and the first conductive circuit layer of the first circuit layer; a second conductive metal layer; and a second liquid crystalline polymer bond ply disposed between the dielectric layer of the first circuit layer and the second conductive metal layer, wherein
the liquid crystalline polymer bond plies are formed by treating a film comprising a liquid crystalline polymer with an amount of heat and pressure effective to produce a liquid crystalline polymer bond ply with an in-plane coefficient of thermal expansion of 0 to about 50 ppm/° C.; and further wherein the multi-layer circuit board is formed by laminating the layers and the treated films at a temperature from 0° C. to about 15° C. less than the melt temperature of the liquid crystalline polymer bond plies.
CROSS REFERENCE TO RELATED APPLICATIONS
[0001] This application claims the benefits of U.S. Provisional Patent application Serial No. 60/255,597 filed Dec. 14, 2000, which is fully incorporated herein by reference.
Provisional Applications (1)
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Number |
Date |
Country |
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60255597 |
Dec 2000 |
US |