Long-acting heat pipe and corresponding manufacturing method

Information

  • Patent Grant
  • 8919427
  • Patent Number
    8,919,427
  • Date Filed
    Monday, April 21, 2008
    16 years ago
  • Date Issued
    Tuesday, December 30, 2014
    9 years ago
Abstract
A heat pipe includes a metal tube, a heat-absorption part, a capillary and working fluid. The metal tube has a chamber formed therein. A vapor channel and a liquid channel communicating with the vapor channel are formed in the chamber. The heat-absorption part corresponds to a portion of the vapor channel and the liquid channel. The capillary is arranged in the vapor channel and in the liquid channel of the heat-absorption part. The working fluid fills the chamber.
Description
BACKGROUND

1. Field of the Invention


The present invention relates to a heat pipe, and more specifically, to a long-acting heat pipe and a corresponding manufacturing method.


2. Description of the Related Art


With the operation speed of CPU (central processing unit) of computer increasing continuously, heat generated from the CPU is increased also. Conventional heat-dissipating devices composed of aluminum extruded heat sinks and fans do not satisfy needs of the current CPU. Thus heat pipes with higher thermal conductivity are designed gradually by manufacturers. The heat pipes cooperate with the heat sinks for solving effectively current heat-dissipating problems. However, the heat-conducting speed and the thermal conductivity of the heat pipes are greatly limited by the inner structure and the amount of working fluid thereof. If having excessive working fluid filled thereinto, vapor channel of the heat pipes will be decreased to greatly limit the thermal conductivity thereof. If having less working fluid, the heat pipes are trend to be dried out and damaged. Therefore, the present inventions improve the conventional heat pipes and the corresponding manufacturing methods based upon the above reasons.


A typical heat pipe having a vapor channel and a liquid channel, which is disclosed in TW Patent Publication No. 200720614, includes a metal tube, a capillary, working fluid, and a vapor-liquid two phases shunt board. The capillary is configured for forming at least two chambers spaced to each other in the metal tube. The working fluid is filled in the metal tube. The vapor-liquid two-phases shunt board is arranged on a surface of the capillary arranged in the middle of the metal tube, and the surface of the capillary faces toward the chambers.


However, although the typical heat pipe having the vapor channel and the liquid channel includes the vapor channel and the liquid channel separated from the vapor channel, the vapor channel is formed in the periphery of the liquid channel. If one end of the heat pipe is heated, the vapor flowing direction and the liquid reflowing direction in the heat-absorption part are opposite to those in the heat-dissipation part. Thus the vapor moving upwards and the liquid moving downwards disturb to each other, to decrease the thermal conductivity thereof. Furthermore, the heat pipe transmits the liquid from the heat-dissipation part to the heat-absorption part by the capillary action of the capillary, thus the thermal conductivity thereof will be decreased with increasing the transmitting length.


Furthermore, the method for manufacturing the typical heat pipe, coats the capillary around the shunt board, inserts the above compositive structure into the metal tube, then fills the working fluid into the metal tube, and finally degasses and seals the metal tube. However, the outer diameter of the heat pipe is generally small, thus it is difficult to coat the capillary around the shunt board. It is more difficult to insert the above compositive structure into the metal tube to contact with the inner surface of the metal tube. The typical heat pipe and the corresponding manufacturing method should be improved.


BRIEF SUMMARY

An object of the present invention is to provide a long-acting heat pipe and a corresponding manufacturing method. The present invention forms a vapor channel and a liquid channel in a metal tube, and transmits cooled liquid from the liquid channel to one end of the heat-absorption part by vapor, thus may avoid drying out the heat pipe, increase greatly the virtual working length of the heat pipe, avoid the limit by the capillary force of the capillary, improve the heat-conducting speed and the thermal conductivity of the heat pipe, and increase the yield rate for manufacturing the heat pipe.


A long-acting heat pipe in accordance with the present invention is provided.


The heat pipe includes a metal tube, a heat-absorption part, a capillary, and working fluid. The metal tube has a chamber formed therein. A vapor channel and a liquid channel communicating with the vapor channel are formed in the chamber. The heat-absorption part corresponds to a portion of the vapor channel and the liquid channel. The capillary is arranged in the vapor channel and in the liquid channel of the heat-absorption part. The working fluid fills the chamber.


A method for manufacturing a long-acting heat pipe in accordance with the present invention is provided. The method includes:


a) providing a metal tube having a vapor channel and a liquid channel communicated with the vapor channel therein;


b) sealing an end of the metal tube by a welding device;


c) inserting a mandrel into the vapor channel and defining a gap between an outer surface of the mandrel and the vapor channel;


d) filling metal powder into the gap and the liquid channel;


e) sintering the metal powder to form a capillary arranged in the vapor channel and the liquid channel;


f) taking out the mandrel; and


g) filling working fluid into the metal tube, and degassing and sealing the metal tube.





BRIEF DESCRIPTION OF THE DRAWINGS

These and other features and advantages of the various embodiments disclosed herein will be better understood with respect to the following description and drawings, in which like numbers refer to like parts throughout, and in which:



FIG. 1 is a schematic, sectional view of a heat pipe of the present invention;



FIG. 2 is a schematic, sectional view of the heat pipe along 2-2 in FIG. 1;



FIG. 3 is a manufacturing flow chart of the heat pipe of the present invention;



FIG. 4 is a schematic, sectional view of the heat pipe based on a mandrel inserted into a vapor channel;



FIG. 5 is a schematic, sectional view of the heat pipe after a sintering process;



FIG. 6 is a schematic, sectional view of the heat pipe based on the mandrel taken out from the vapor channel;



FIG. 7 is a schematic, using-state view of the heat pipe used in an electronic heat-generating element;



FIG. 8 is a schematic, sectional view of a heat pipe in accordance with another exemplary embodiment of the present invention;



FIG. 9 is a schematic, sectional view of a heat pipe in accordance with other exemplary embodiment of the present invention; and



FIG. 10 is a schematic, sectional view of a heat pipe in accordance with other exemplary embodiment of the present invention.





DETAILED DESCRIPTION

Reference will now be made to the drawings to describe exemplary embodiments of the present writing data method, in detail. The following description is given by way of example, and not limitation.



FIGS. 1 and 2 are respectively, a schematic, sectional view of a heat pipe of the present invention and a schematic, sectional view along a line 2-2 of FIG. 1. The present invention provides a long-acting heat pipe. The long-acting heat pipe includes a metal tube 10, a heat-absorption part 15, a heat-dissipation part 16, a capillary 20 and working fluid 30. The metal tube 10 has a chamber 11 defined therein. A vapor channel 12 and a liquid channel 13 communicating with the vapor channel 12 are formed in the chamber 11. In this exemplary embodiment, the length of the liquid channel 13 is shorter than the length of the vapor channel 12, thus connecting areas 14 are formed at the front and back ends of the vapor channel 12 respectively. The heat-absorption part 15 and the heat-dissipation part 16 correspond to the back part and the front part of the vapor channel 12 and the liquid channel 13 respectively. The capillary 20 may be a porous sintered metal, and be arranged in the vapor channel 12 and the liquid channel 13 of the heat-absorption part 15. The vapor channel 12 of the heat-absorption part 15 is surrounded partly by the capillary 20 to form a hollow portion. The liquid channel 13 of the heat-absorption part 15 is fully filled with capillary 20 to form a solid structure for preventing the vapor from flowing therethrough. The working fluid 30 may be pure water, etc., and be contained in the chamber 11.



FIGS. 3 to 5, are respectively, a flowing chart and schematic, sectional views for manufacturing the heat pipe of the present invention. The manufacturing method includes following steps:


a) A metal tube 10 is provided. The metal tube 10 has a vapor channel 12 and a liquid channel 13 communicated with the vapor channel 12 therein (as shown in FIG. 4). In this step, the metal tube 10 is made of a material with good heat-conducting and/or heat-dissipating capabilities, such as copper, etc. The metal tube 10 may be ring-shaped or other different geometrical-shaped. In this step for manufacturing the metal tube 10, two arc-shaped partition boards 101, 102 (as shown in FIG. 2) extend directly from the inner surface of the metal tube 10 with specific mold (not shown). Then the two partition boards 101, 102 are pressed to be deformed plastically by a molding tool, such that the vapor channel 12 and the liquid channel 13 are formed. Furthermore, the front and back ends of the two partition boards 101, 102 are processed by a tool to form a connecting area 14 arranged in the metal tube 10 (as shown in FIG. 4).


b) One end of the metal tube 10 is sealed by a welding device (as shown in FIG. 4). In this step, the bottom of the metal tube 10 is sealed by a welding device, such as welding torch, etc., (not shown).


c) A mandrel 5 is inserted into the vapor channel 12, and a gap 51 is formed between the mandrel 5 and the vapor channel 12 (as shown in FIG. 4). In this step, the outer diameter of the mandrel 5 is less than the inner diameter of the vapor channel 12, and the mandrel 5 is inserted into the vapor channel 12, thus the gap 51 is formed between the outer surface of the mandrel 5 and the inner surface of the vapor channel 12.


d) Metal powder is filled into the gap 51 and the liquid channel 13 (as shown in FIG. 5). In this step, powder made of metal material (not shown) is filled in the gap 51 manufactured in the step c) and the liquid channel 13. The amount of the metal powder is less than the volume of the liquid channel 13 and the gap 51. In this exemplary embodiment, the amount of the metal powder is less than one-third of the volume of the liquid channel 13 and the gap 51. Furthermore, the metal powder is arranged only in the bottom of the gap 51 and the liquid channel 13 for avoiding occupying more space of the metal tube 10.


e) The metal powder is sintered to form the capillary 20 in the vapor channel 12 and the liquid channel 13 (as shown in FIG. 5). In this step, the metal powder is sintered by a sintering process to form the capillary 20 communicated to each other in the bottom of the vapor channel 12 and the liquid channel 13.


f) The mandrel 5 is taken out (as shown in FIG. 6). In this step, the mandrel 5 is shaken to loosen the capillary 20 from the mandrel 5, and then the mandrel 5 is taken out from the vapor channel 12. Thus, the vapor channel 12 of the heat-absorption part 15 is hollow, and the liquid channel 13 of the heat-absorption part 15 is solid to prevent the vapor flowing therethrough.


g) The working fluid 30 is filled in the metal tube 10, and the metal tube 10 is degassed and sealed. In this step, the working fluid 30 is filled in the chamber 11 (as shown in FIG. 1). The metal tube 10 is arranged erectly or slantways, then the working fluid 30, such as pure water, etc., is filled into the chamber 11 of the metal tube 10. The metal tube 10 is degassed by an air extractor, such as heat device. Finally, another opposite end of the metal tube 10 is sealed.



FIG. 7 is a schematic, using-state view of the heat pipe of the present invention used in an electronic heat-generating element. The heat-dissipation part 16 is covered with a group 6 of heat-dissipation fins. The heat-absorption part 15 is attached on an electronic heat-generating element 7. When the electronic heat-generating element 7 operates, it will generate large heat to vaporize the working fluid 30. The vaporized fluid takes out the heat by the phase-change, and moves quickly to the group 6 of heat-dissipation fins via the vapor channel 12 since the chamber 11 has a structure configured for preventing the vapor flowing therethrough. The vaporized fluid then enters the front end of the liquid channel 13 via the connecting area 14, and is cooled to be liquid by the group 6 of heat-dissipation fins. The cooled liquid then flows to the capillary 20 by the gas high-low pressure effect or the gravitation effect, and then reflows to the end of the heat pipe attached on the electronic heat-generating element 7 by the capillary force of the capillary 20. Thus the heat pipe operates in circle.



FIGS. 8, 9 and 10, are respective schematic, sectional views of a heat pipe in accordance to other embodiments of the present invention. In FIG. 8, two partition boards 101, 102 are respectively arranged in erectly, and the end faces thereof are jointed together. Furthermore, a plurality of grooves 103 spaced in a same distance with one another, are formed in the inner surface of the metal tube 10 to increase the heat-exchanging area. In FIG. 9, a partition board 101 is arranged in erectly, and the end face thereof is jointed with the inner surface of the metal tube 10. In FIG. 10, a metal net 40 is arranged on the inner surface of the metal tube 10, and a hollow round pole 17 is inserted in the metal tube 10. The outer surface of the pole 17 joints with the inner surface of the metal net, such that the metal net 40 is arranged between the inner surface of the metal tube 10 and the capillary 20 to obtain the same capability described in the above embodiments.


The above description is given by way of example, and not limitation. Given the above disclosure, one skilled in the art could devise variations that are within the scope and spirit of the invention disclosed herein, including configurations ways of the recessed portions and materials and/or designs of the attaching structures. Further, the various features of the embodiments disclosed herein can be used alone, or in varying combinations with each other and are not intended to be limited to the specific combination described herein. Thus, the scope of the claims is not to be limited by the illustrated embodiments.

Claims
  • 1. A long-acting heat pipe, comprising: a metal tube having two sealed ends and a chamber formed in the metal tube;a partition element formed inside the metal tube to divide the chamber into a vapor channel and a liquid channel communicating with the vapor channel only at the two sealed ends by two connecting areas, respectively;a heat-absorption part corresponding to a portion of the metal tube to include respective portions of the vapor channel and the liquid channel;a capillary arranged only in the respective portions of the vapor channel and the liquid channel, wherein the respective portion of the vapor channel is partly filled with the capillary on a periphery of the respective portion of the vapor channel to form a hollow portion in the respective portion of the vapor channel, and the respective portion of the liquid channel is entirely filled with the capillary to form a structure for preventing vapor from flowing through the respective portion of the liquid channel; andworking fluid filling the chamber.
  • 2. The heat pipe as claimed in claim 1, wherein the partition element includes two opposed arc-shaped partition boards extending from an inner surface of the metal tube, each arc-shaped board having an end face, and the end faces of the two partition boards are contacted with each other.
  • 3. The heat pipe as claimed in claim 1, further comprising two opposite erect-shaped partition boards extending from an inner surface of the metal tube, and end faces of the two partition boards jointing together.
  • 4. The heat pipe as claimed in claim 1, further comprising an erect-shaped partition board extending from an inner surface of the metal tube, and an end face of the partition board jointing with the inner surface of the metal tube.
  • 5. The heat pipe as claimed in claim 1, further comprising a hollow pole arranged in the metal tube, parts of an outer surface of the pole jointing with an inner surface of the metal tube.
  • 6. The heat pipe as claimed in claim 1, further comprising a plurality of grooves formed on an inner surface of the metal tube, the plurality of grooves being arranged in the vapor channel and the liquid channel.
  • 7. The heat pipe as claimed in claim 1, wherein the liquid channel is shorter than the vapor channel.
  • 8. The heat pipe as claimed in claim 1, wherein the capillary is made of a porous sintered metal.
  • 9. The heat pipe as claimed in claim 1, further comprising a heat-dissipation part corresponding to another portion of the metal tube.
  • 10. The heat pipe as claimed in claim 1, further comprising a metal net arranged between an inner surface of the metal tube and the capillary.
US Referenced Citations (45)
Number Name Date Kind
3414475 Fiebelmann Dec 1968 A
3666005 Moore, Jr. May 1972 A
3700028 Noren Oct 1972 A
3714981 Noren Feb 1973 A
3750745 Moore, Jr. Aug 1973 A
3901311 Kosson et al. Aug 1975 A
3913664 Roukis et al. Oct 1975 A
4019571 Kosson et al. Apr 1977 A
4058159 Iriarte Nov 1977 A
4351388 Calhoun et al. Sep 1982 A
4422501 Franklin et al. Dec 1983 A
4515207 Alario et al. May 1985 A
4583587 Alario et al. Apr 1986 A
4807697 Gernert et al. Feb 1989 A
4846263 Miyazaki et al. Jul 1989 A
4890668 Cima Jan 1990 A
4903761 Cima Feb 1990 A
4917177 Gernert Apr 1990 A
4934160 Mueller Jun 1990 A
5360058 Koeppl et al. Nov 1994 A
5579828 Reed et al. Dec 1996 A
5771967 Hyman Jun 1998 A
6293333 Ponnappan et al. Sep 2001 B1
6330907 Ogushi et al. Dec 2001 B1
6382309 Kroliczek et al. May 2002 B1
6508302 Ishida et al. Jan 2003 B2
6564860 Kroliczek et al. May 2003 B1
6725910 Ishida et al. Apr 2004 B2
7445039 Hou et al. Nov 2008 B2
7461450 Lin et al. Dec 2008 B2
7845394 Chang et al. Dec 2010 B2
7866373 Hou et al. Jan 2011 B2
20030141045 Oh et al. Jul 2003 A1
20030178184 Kroliczek et al. Sep 2003 A1
20040188067 Chau et al. Sep 2004 A1
20050230085 Valenzuela Oct 2005 A1
20050252643 Kroliczek et al. Nov 2005 A1
20060086482 Thayer et al. Apr 2006 A1
20070089864 Chang et al. Apr 2007 A1
20070107875 Lee et al. May 2007 A1
20070107877 Hou et al. May 2007 A1
20070107878 Hou et al. May 2007 A1
20070114008 Hou et al. May 2007 A1
20070193723 Hou et al. Aug 2007 A1
20070295485 Liu et al. Dec 2007 A1
Foreign Referenced Citations (1)
Number Date Country
200720614 Jun 2007 TW
Related Publications (1)
Number Date Country
20090260793 A1 Oct 2009 US