LOW DIELECTRIC LOSS RESIN, RESIN COMPOSITION, AND THE MANUFACTURING METHOD OF LOW DIELECTRIC LOSS RESIN

Abstract

An object of the present invention is to provide a low dielectric loss resin composition with a narrow molecular weight distribution, the resin composition suffering as low a dielectric loss as that of commercially available polyphenylenether, being soluble in a general-purpose solvent with a low boiling point, and being easily processed into a wiring board. The present invention provides a thermosetting low dielectric loss resin which is a random copolymer of polyphenylenether having an unsaturated bond in a side chain and which has a molecular weight distribution of less than 10, more preferably at most 5, particularly preferably at most 3, as well as the hardened resin, a resin composition and an electronic part containing the resin, and a synthesizing method for obtaining the resin.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a graph showing TMA•SS measurements of hardened resins and hardened resin compositions in accordance with examples of the present invention;

FIG. 2 is a graph showing the glass transition temperatures of resin compositions in accordance with examples of the present invention;

FIG. 3 is a graph showing the pyridine ration and molecular weight distribution of the resin component in accordance with examples of the present invention;

FIG. 4 is a diagram showing an example of structure of a conventional high-frequency semiconductor device;

FIG. 5 is a diagram showing an example of structure of a high-frequency semiconductor device in accordance with examples of the present invention;

FIGS. 6(A) to 6(E) are diagrams showing an example of production of a multilayer wiring board in accordance with an example of the present invention;

FIGS. 7(A) to 7(G) are diagrams showing an example of production of a multilayer wiring board in accordance with another example of the present invention;

FIGS. 8(A) to 8(I) are diagrams showing yet an example of production of a multilayer wiring board in accordance with yet another example of the present invention;

FIGS. 9(A) to 9(F) are diagrams showing an example of production of a multilayer wiring board in accordance with an example of the present invention; and

FIG. 10 is a sectional view showing an antenna element-integrated high-frequency module in accordance with an example of the present invention.

Claims

1. A thermosetting low dielectric loss resin which is a random copolymer consisting of repeating units expressed by the following Formula:

2. The low dielectric loss resin according to claim 1, wherein a glass transition temperature before hardening is at most 210° C.

3. The low dielectric loss resin according to claim 1, wherein the resin or the hardened resin has a dielectric loss tangent of at most 0.003.

4. The low dielectric loss resin according to claim 1, wherein at least 10 wt % of the resin is soluble in a non-halogen-containing solvent with a boiling point of at most 150° C. at room temperature.

5. A resin composition containing the low dielectric loss resin according to claim 1, wherein the resin composition contains 0.01 to 5 wt % of radical salt or peroxide with respect to the weight of the copolymer, as a cross linking catalyst.

6. A resin composition containing the low dielectric loss resin according to claim 1, wherein the resin composition contains 0.01 to 5 wt % of cross-linker.

7. A resin composition containing the low dielectric loss resin according to claim 5, wherein the resin composition contains an organic solvent and the copolymer dissolved into the organic solvent by at least 10 wt %.

8. The resin composition according to claim 7, wherein the organic solvent is a non-halogen-containing solvent with a boiling point of at most 150° C.

9. A resin composition containing the low dielectric loss resin according to claim 1 and a fire retardant.

10. A resin composition containing at least one type of low dielectric constant layer selected from low dielectric loss resin particles of average particle size 1 to 100 μm, empty resin particles, empty glass balloons, and a void, as well as the low dielectric loss resin according to claim 1.

11. A resin composition containing ceramic particles as a high dielectric constant insulator and the low dielectric loss resin according to claim 1.

12. A hardened low dielectric loss resin wherein some or all of unsaturated bonds in the low dielectric loss resin according to claim 1 are cross-linked.

13. A hardened low dielectric loss resin composition wherein some or all of unsaturated bonds in the resin composition containing the low dielectric loss resin according to claim 1 are cross-linked.

14. An electronic part containing the hardened low dielectric loss resin or low dielectric loss resin composition according to claim 12.

15. A multilayer wiring board potting agent consisting of the low dielectric loss resin or resin composition according to claim 1.

16. A multilayer wiring board prepreg manufactured using the resin composition according to claim 1.

17. A multilayer wiring board manufactured using the prepreg according to claim 16.

18. A high-frequency antenna manufactured using the prepreg according to claim 16.

19. A method for manufacturing a low dielectric loss resin, the method comprising manufacturing a random copolymer having a molecular weight distribution of less than 10 by subjecting, to an oxidation coupling polymerization reaction, a compound consisting of repeating units expressed by Formula (1):

20. The method for manufacturing a low dielectric loss resin according to claim 19, wherein polymerization is carried out with a molar ratio of a monomer to metal atoms in a polymerization catalyst set to at least 60.

21. The method for manufacturing a low dielectric loss resin according to claim 19, wherein polymerization is carried out with a molar ratio of an amine ligand to metal atoms in a polymerization catalyst set to at least 600.

22. The method for manufacturing a low dielectric loss resin according to claim 19, wherein polymerization is carried out using copper chloride (I) as the metal atoms in the polymerization catalyst and pyridine as the amine ligand.