Machine for treating substrates and method

Abstract

A machine 1 for treating substrates S comprises an infeed area 6, at least a first process chamber 2, a second process chamber 3, a third process chamber 4, and a fourth process chamber 8 for the execution of a treatment, for example the application of a coating to a substrate S for coating, as well as an outfeed area 7. The four process chambers 2,3, 4 and 8 are connected to a central transport chamber 5. The first process chamber 2 fourth process chamber 8 are each arranged between one of the lock areas 6 or 7 and the central transport chamber 5 in series. The second process chamber 3 and the third process chamber 4 are connected in parallel and independently accessible from each other to the central transport chamber. The treatment method comprises the stages: a) infeed of a substrate into the machine 1; b) transport of the substrate S into the first process chamber 2 and execution of a first treatment stage; c) transport of the substrate S into the central transport chamber 5; d) transport of the substrate S alternatively into the second process chamber 3 or the third process chamber 4, and execution of a second treatment stage; e) transport of the substrate S into the central transport chamber 5; and g) outfeed of the substrate S from the machine 1.

Description

Further objects and advantages of the invention result from the specific description of specific embodiments. In these,

FIG. 1 is a treatment machine in accordance with the invention; and

FIG. 2 an alternative embodiment of the machine of the invention.

Claims

1-16. (canceled)

17. A machine for treating substrates, said machine comprising: at least a first process chamber, a second process chamber and a third process chamber for executing a first treatment stage;a central transport chamber to which at least the first, second, and third process chambers are connected;a first lock area for infeed or outfeed of the substrates into the machine or out of the machine; andwherein the first process chamber is arranged between the first lock area and the central transport chamber in series with the first lock area and the central transport chamber, and the second process chamber and the third process chamber being connected to the central transport chamber and accessible independently from each other.

18. A machine in accordance with claim 17, further comprising transport means for transporting the substrates through the machine from the first lock area into the first process chamber for the execution of a first treatment stage, for transport from the first process chamber into the central transport chamber, for transport from the central transport chamber optionally into the second process chamber or into the third process chamber for the execution of a second treatment stage, and for return transport from the second process chamber or from the third process chamber into the central transport chamber.

19. A machine in accordance with claim 17, wherein the central transport chamber has a rotary platform for aligning the substrates optionally towards the opening of the second process chamber or towards the opening of the third process chamber and for receiving the substrates from the second process chamber or from the third process chamber.

20. A machine in accordance with claim 17 further comprising a second lock area for outfeeding the substrates from the machine.

21. A machine in accordance with claim 20, further comprising a fourth process chamber connected to the central transport chamber, with the fourth process chamber being arranged between the second lock area and the central transport chamber in series with the second lock area and the central transport chamber.

22. A machine in accordance with claim 17, wherein one or more of the processing chambers, especially adjacent chambers, may be closed off from each other by a valve door.

23. A machine in accordance with claim 17, wherein the first process chamber is set up for the execution of a first treatment process, and the second process chamber and the third process chamber are set up for the execution of a second treatment process.

24. A machine in accordance with claim 17, wherein the machine is configured and arranged for the formation of thin film transistor metallization, with one of the layers in the layer sequence of the thin film transistor metallization being alternatively applied in the second process chamber or in the third process chamber.

25. A machine in accordance with claim 20, wherein the first lock area or the second lock area comprises a lock chamber and a transfer chamber.

26. A method of coating in a machine, the machine having at least a first process chamber, a second process chamber and a third process chamber; a central transport chamber to which at least the first, second, and third process chambers are connected; a first lock area for infeed or outfeed of the substrates into the machine or out of the machine; and wherein the first process chamber is arranged between the first lock area and the central transport chamber in series with the first lock area and the central transport chamber, and the second process chamber and the third process chamber being connected to the central transport chamber and accessible independently from each other, said method comprising the steps of: a) infeeding a substrate into the machine;b) transporting the substrate into the first process chamber;c) executing a first treatment stage in the first process chamber;d) transporting the substrate into the central transport chamber;e) transporting the substrate alternatively into the second process chamber or into the third process chamber;f) executing a second treatment stage;g) returning the substrate into the central transport chamber; andh) outfeeding the substrate from the machine.

27. A method in accordance with claim 26, further comprising: transporting the substrate from the central transport chamber into a fourth coating chamber of the machine and executing a further treatment stage between steps g) and h).

28. A method in accordance with claim 26, further comprising: transporting the substrate through an infeed chamber and a transfer chamber during the infeeding the substrate into the machine.

29. A method in accordance with claim 26, wherein the same process occurs in the second process chamber and in the third process chamber.

30. A method in accordance with claim 27, wherein one or more of the executing steps includes thin film transistor (TFT) metallization of at least three layers on to the substrate.

31. A method in accordance with claim 26, further comprising transporting a plurality of substrates through the machine and substantially vertically aligning the substrates during transport through the machine.

32. A method in accordance with claim 26, wherein the steps a)-h) are sequentially staggered in time, with at least a second substrate being repeated.