BRIEF DESCRIPTION OF THE DRAWINGS
The above and other aspects of the present invention will become more apparent by describing in detail exemplary embodiments thereof with reference to the attached drawings, in which:
FIG. 1 is a schematic sectional view of a related art magnetoresistance device;
FIG. 2 is a schematic sectional view of a magnetoresistance device according to an exemplary embodiment of the present invention;
FIG. 3A is a sectional view of a magnetoresistance device applied to a GMR configuration according to an exemplary embodiment of the present invention;
FIG. 3B is a sectional view of a magnetoresistance device applied to a TMR configuration according to an exemplary embodiment of the present invention;
FIG. 4A is a graph illustrating an M-H characteristic when a magnetoresistance device without a diffusion barrier layer is in an as-depo state;
FIG. 4B is a graph illustrating an M-H characteristic when a magnetoresistance device without a diffusion barrier layer is formed and then heated at a temperature of 600° C. for 32.5 seconds;
FIG. 5A is a graph illustrating an M-H characteristic when a magnetoresistance device according to an exemplary embodiment of the present invention is in an as-depo stage;
FIG. 5B is a graph illustrating an M-H characteristic when a magnetoresistance device according to an exemplary embodiment of the present invention is heated at a temperature of 600° C. for 32.5 seconds;
FIG. 6A is a graph illustrating results of component distribution as measured by a Secondary Ion Mass Spectroscopy (SIMS) after a related art perpendicular magnetic recording medium without a diffusion barrier layer is formed and then heat-treated at a temperature of 600° C.; and
FIG. 6B is a graph illustrating results of component distribution as measured by an SIMS after a perpendicular magnetic recording medium including a diffusion barrier layer according to an exemplary embodiment of the present invention is formed and then heat-treated at a temperature of 600° C.