Patent Application
20110114293
1. Field of the Invention
The present invention in general relates to a cooler, in particular, to a manufacturing method of aligning heated faces of multiple heat pipes closely to form a coplanar configuration, and to a finished product and a fixture thereof.
2. Description of Prior Art
Accordingly, when a common heat pipe is applied as a cooling device for an electronic product, one side of the heat pipe is thermally connected to an electronic heating component, while another side is arranged by passing a plurality of cooling fins therethrough. Through the high thermal conductivity of the heat pipe, the heat generated by the electronic heating component can be transferred into each cooling fins via heat pipe, whereby the heat is dissipated into the ambiance, subsequently lowing down the temperature of the electronic component. In the meantime, the heat accumulated in each cooling fins can also be dissipated by means of cooling fans, thus an excellent cooling effect being able to achieve.
Since the profile section of the heat pipe is substantially shown as a tubular configuration, its area is not big enough even after pressed flatly. Therefore, in a usual practice, the heat pipe is first connected to a thermally conductive plate, which is then attached onto the surface of an electronic heating component. However, in this kind of manner, it is impossible for the heat pipe to make a direct and close contact with the electronic heating component, thus the inherent performance of the heat pipe being unable to develop completely. On the one hand, since the thermally conductive plate is made of a material of copper, its weight is heavy and the purchasing cost is high. On the other hand, if the copper material is replaced by an aluminum material, which has a lighter weight, however, the thermally conductive performance will be influenced, because of its poor thermal conductivity. Therefore, a flatly rolled heat pipe is adapted by some practices; namely, the heated side of the heat pipe is formed as a flat configuration for facilitating a tight contact with the surface of an electronic heating component, as disclosed in a Taiwan Utility Model Publication No.: M248231 titled as “Heat Pipe Cooling Device”.
Nonetheless, in flatly rolling a heat pipe according to the aforementioned method, on the one hand, when the flatly pressed area is small, the heated side of the heat pipe is insufficiently to cover the entire surface of the electronic heating component. On the other hand, in order to flatly roll out a sufficiently large area capable of thermal conduction, the tube will be broken when flatly rolled, if the thickness of the tubular wall can not stand the excessively rolling pressure.
Accordingly, after a substantially devoted study, in cooperation with the application of relative academic principles, the inventor has finally proposed the present invention designed reasonably to possess the capability to improve the drawbacks of the prior arts significantly.
Therefore, in order to solve aforementioned problems, the invention is mainly to provide a manufacturing method, finished product and fixture of coplanar evaporators of multiple heat pipes. During implementation, the evaporators of the multiple heat pipes can make a directly thermal conduction with the electronic heating component. In the meantime, the coplanar configuration constituted by the heated faces of the evaporators of the multiple heat pipes has a larger area, which is able to completely and closely cover the upper surface of the electronic heating component
Secondly, the invention is to provide a manufacturing method of coplanar evaporators of multiple heat pipes, including following steps:
a) Providing a plurality of heat pipes, each of which has an evaporator formed a heated face thereon;
b) Moving the evaporators closely to one another in a manner, thus their heated faces being disposed onto a flat face;
c) Limiting the evaporators from multiple directions;
d) Pressing the evaporators toward the flat face to make their heated faces flush therewith;
e) Injecting bonding media into the gaps among the heat faces of the evaporators to bond the heat faces together and form a fixedly coplanar configuration.
Thirdly, the invention is to provide a coplanar structure of the evaporators of multiple heat pipes, including a plurality of heat pipes, each of which has a condenser and an evaporator having a heated face. In the meantime, the evaporators are aligned closely to one another, among which a bonding media is implemented. Thereby, a connection face is formed among each heated faces, which are bonded into a coplanar configuration, because of the implementation of the bonding media.
Fourthly, the invention is to provide a fixture of coplanar evaporators of multiple heat pipes, adapted for aligning the evaporators of multiple heat pipes closely to form a coplanar configuration, including a platform, a plurality of limiting blocks and a moudling. The surface of the platform is a flat face provided for each limiting blocks arranged thereon, whereby the evaporators of the heat pipes can be limited by the limiting blocks from multiple directions. The moudling, adapted for pressing the evaporators of the heat pipes, is arranged a nozzle and overrides two limiting blocks opposite to each other. According to the invention, the nozzle is adapted for injecting thick bonding media into the gaps among each evaporators of the heat pipes.
The features of the invention believed to be novel are set forth with particularity in the appended claims. The invention itself, however, may be best understood by reference to the following detailed description, which describes a number of embodiments of the invention, taken in conjunction with the accompanying drawings, in which:
In cooperation with attached drawings, the technical contents and detailed description of the present invention are described thereinafter according to a number of preferable embodiments, not used to limit its executing scope. Any equivalent variation and modification made according to appended claims is all covered by the claims claimed by the present invention.
The invention is to provide a manufacturing method, finished product and fixture of coplanar evaporators of multiple heat pipes. Mainly, after the evaporators 10 of the multiple heat pipes 1 are aligned closely to one another, a bonding media 12 is filled into the gaps among the heated faces 100 under each evaporators 10, whereby each evaporators 10 are bonded together, making the bonding media 12 and each heated faces 100 formed into a coplanar configuration.
Please refer to step S1 of
Please again refer to step S2 of
Please again refer to step S3 of
Please again refer to S4 of
Finally, please refer to S5 of
Moreover, after the evaporators 10 of each heat pipes 1 are bonded together, in order to keep the condensers 11 of each heat pipes 1 maintaining an arrangement of being interspaced to one another and facilitating the cooling fins to pass therethrough, in the step S1 or S2, the condensers 11 of each heat pipes 1 can be commonly arranged a spacer 26, on which a plurality of positioning holes 260 are arranged by corresponding to the disposition of each condensers 11, thus that the condensers 11 still can maintain an arrangement of being interspaced to one another, under the condition that the evaporators 10 of each heat pipes 1 can be drawn and aligned closely. In addition, since the platform 2, each limiting blocks 21, 22, 23, 24, the moudling 25 and the spacer 26 of the fixture 2 are all constituted by the materials of temperature-enduring fibers or ceramics, when the bonding media 12 is heated in the oven, the fixture 2 can stand high temperature and has sufficient strength to maintain each evaporators 10 with fixed position and configuration.
Therefore, through the constitution of aforementioned assemblies, a manufacturing method, finished product and fixture of coplanar evaporators of multiple heat pipes according to the invention are thus obtained.
In addition, as shown in
Therefore, in the manufacturing method, the finished product and the fixture of the coplanar evaporators of the multiple heat pipes according to the invention, the evaporators 10 of the multiple heat pipes 1 can be drawn closely to one another and fixed by a bonding media 12, thereby, the heated faces of each evaporators 10 being able to be formed into a coplanar configuration with a larger area of heat conduction, which can entirely cover the surface of the electronic component and be attached closely thereto, so the evaporator 10 of the heat pipe 1 can be directly contacted with the electronic heating component to undergo a heat transfer process.
Summarizing aforementioned description, the manufacturing method, the finished product and the fixture of the coplanar evaporators are indispensable invention for multiple heat pipes indeed, which may positively reach the expected usage objective for solving the drawbacks of the prior arts, and which extremely possesses the innovation and progressiveness to completely fulfill the applying merits of a new type patent, according to which the invention is thereby applied. Please examine the application carefully and grant it as a formal patent for protecting the rights of the inventor.
However, the aforementioned description is only a number of preferable embodiments according to the present invention, not used to limit the patent scope of the invention, so equivalently structural variation made to the contents of the present invention, for example, description and drawings, is all covered by the claims claimed thereinafter.
