This application claims the benefit of Taiwan application Serial No. 094111191, filed Apr. 8, 2005, the subject matter of which is incorporated herein by reference.
1. Field of the Invention
The invention relates in general to a manufacturing method of heat pipe, and more particularly to a manufacturing method of heat pipe with metal inner layer having the capillary structure.
2. Description of the Related Art
Heat dissipation module, typically comprising a heat pipe, a fan and a heat exchanger, is applied in an electronic device to dissipate the heat. Referring to
When the heat pipe 100 dissipates the heat, the evaporating end 104 is close to the heat source, so that the working fluid at the evaporating end 104 absorbs the heat and vapors. Meanwhile, the pressure at the evaporating end 104 is higher than the pressure at the condensing end 106. Therefore, the vapor moves from the evaporating end 104 to the condensing end 106 in the cavity 108. When the vapor moves to the condensing end 106 of a lower temperature, it condenses and releases its latent heat of vaporization. The condensed working fluid is drawn back into the metal inner layer 110 and returns to the evaporating end 104. The capillary structure of the metal inner layer 110 provides the capillary driving force to return the condensed working fluid to the evaporating end 104. Accordingly, the heat pipe 100 is able to circulate the working fluid to dissipate the heat.
Referring to
An object of the invention provides a manufacturing method of heat pipe. At first, a metal pipe is shaped, and then a metal inner layer having a capillary structure is formed at the internal wall of the metal pipe, so that the capillary structure of the metal inner layer would not be cracked or deformed, thereby enhancing the heat dissipation effect of the heat pipe.
The embodiment of the invention provides a manufacturing method of heat pipe. Executing the deforming procedure shape a metal pipe. Then, a metal inner layer having a capillary structure is formed at the internal wall of the metal pipe.
Other objects, features, and advantages of the invention will become apparent from the following detailed description of the preferred but non-limiting embodiments. The following description is made with reference to the accompanying drawings.
A metal pipe of the embodiment is shaped first, and then a metal inner layer having capillary structure is formed at the internal wall of the metal pipe. Thus, the capillary structure of the metal inner layer would not crack or deform since the metal pipe is shaped in the prior step for enhancing the heat dissipation effect of the heat pipe.
According to the manufacturing method of heat pipe of the above embodiments, the metal pipe is shaped first, and then the metal inner layer having a capillary structure is formed at the cavity of the metal pipe. Therefore, the above embodiments of the manufacturing method of heat pipe effectively avoid the problem of the heat pipe manufactured by the conventional method. That is, the above embodiments keep the capillary structure uninjured, thereby enhancing the heat dissipation effect of the heat pipe. Besides, fewer heat pipes are required in the electronic device if each heat pipe has a great heat dissipation effect. Accordingly, if the heat pipes manufactured by the methods of the embodiments are applied in the electronic device, less space of the electronic device is occupied and the size of the electronic device can be further reduced, to accord with the current trend of slimness, lightweight and compactness of electronic device.
While the invention has been described by way of example and in terms of the embodiments, it is to be understood that the invention is not limited thereto. On the contrary, it is intended to cover various modifications and similar arrangements and procedures, and the scope of the appended claims therefore should be accorded the broadest interpretation so as to encompass all such modifications and similar arrangements and procedures. For example, the metal inner layer of the invention is neither limited to the metal powder of the first embodiment nor the metal mesh of the second embodiment. Any materials capable of forming a capillary structure can be used a material for the metal inner layer of the invention. For example, metal inner layer having capillary structure can be formed by metal fiber.
Number | Date | Country | Kind |
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94111191 | Apr 2005 | TW | national |