Claims
- 1. An assemblage for holding, transporting and baking semiconductor devices including the following;a carrier tape having an array of recesses, a cover tape comprising the same polymer and having the same thermal properties as said carrier tape, an adhesive joining said tape components, and a plurality of integrated circuit devices.
- 2. An assemblage as in claim 1 wherein said carrier and cover tapes have heat deflection temperature greater than 125 degrees C.
- 3. An assemblage as in claim 1 said carrier tape and said cover tape comprise polycarbonate resin.
- 4. An assemblage as in claim 1 wherein said cover tape is in the range of 0.05 to 0.10 mm thickness.
- 5. An assemblage as in claim 1 wherein said adhesive is a pressure sensitive adhesive.
- 6. An assemblage as in claim 1 wherein said assemblage is dimensionally stable at 125 degrees C.
- 7. An assemblage as in claim 1 having thermal characteristics equal to those of a transport reel onto which said assemblage is wound.
- 8. An assemblage as in claim 1 wherein said semiconductor devices are leaded plastic molded surface devices.
- 9. An assemblage as in claim 1 wherein said semiconductor devices are ball grid array (BGA) devices.
- 10. An assemblage as in claim 1 wherein said semiconductor devices are chip scale packages (CSP).
- 11. A tape assemblage for holding, transporting and baking semiconductor devices including the following;a carrier tape having an array of recesses comprising a polycarbonate resin having a heat deflection temperature greater than 125 degrees C, a cover tape in the range of 0.05 to 0.10 mm thickness comprising a polycarbonate resin having the same thermal properties as said carrier tape, an adhesive joining said tape components, and a plurality of integrated circuit devices.
Parent Case Info
This application claims the benefit of Provisional application Ser. No. 60/204,497, filed May 16, 2000.
US Referenced Citations (9)
Foreign Referenced Citations (1)
Number |
Date |
Country |
408244839 |
Sep 1996 |
JP |
Provisional Applications (1)
|
Number |
Date |
Country |
|
60/204497 |
May 2000 |
US |