Claims
- 1. A member for developing electrostatic latent images to visible images, comprising a support, a first coating layer comprising an elastic material formed on said support, and a second coating layer comprising an electroconductive material and a flexible resin having a elongation ratio of 10% to 500% formed on said first coating layer, said flexible resin being a resin prepared by cross-linking a fluorine-containing polymer comprising a fluoro-olefin and a hydroxyl-group containing vinyl ether through a polyfunctional isocyanante isocyanate, wherein said first and second coating layers have a volume resistivity of 106 to 1011 Ω-cm, and wherein said elastic material of said first coating layer comprises as a base material a material selected from the group consisting of nitrile rubber, epichlorohydrin rubber, urethane rubber, silicone rubber, and mixtures thereof.
- 2. The member for developing electrostatic latent images as claimed in claim 1, wherein said electroconductive material is carbon black.
- 3. The member for developing electrostatic latent images as claimed in claim 1, wherein said fluorine-contained copolymer contains 25 wt % to 32 wt. % of fluorine, and has a specific gravity of 1.4 to 1.5, an OH value of 40 to 150 mgKOH/g-resin, an acid value of 0 to 30 mgKOH/g-resin, a number-average molecular weight of 0.4×104 to 10×104, a weight-average molecular weight of 0.8×104 to 20×104, a glass transition temperature of 0° C. to 70° C., a heat decomposition starting temperature of 240° C. to 250° C., and a solubility parameter of 8 to 9.
- 4. The member for developing electrostatic latent images as claimed in claim 1, wherein said second coating layer has a thickness of 5 μm to 70 μm.
Priority Claims (3)
Number |
Date |
Country |
Kind |
62-133438 |
May 1987 |
JP |
|
62-283855 |
Nov 1987 |
JP |
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63-100396 |
Apr 1988 |
JP |
|
Parent Case Info
This application is a Continuation of application Ser. No. 08/459,634, filed on Jun. 2, 1995, now abandoned, which is a continuation of application Ser. No. 08/018,923, filed on Feb. 16, 1993, now abandoned, which is a reissue of application Ser. No. 07/199,868, filed May 27, 1988, now U.S. Pat. No. 4,994,319.
US Referenced Citations (10)
Foreign Referenced Citations (2)
Number |
Date |
Country |
58-194061 |
Nov 1983 |
JP |
63-100396 |
Feb 1988 |
JP |
Non-Patent Literature Citations (1)
Entry |
Electronic Packaging, Microelectronics, and Interconnection Dictionary, Charles A. Haper & Martin B. Miller, McGraw-Hill Inc., New York, Dec. 1993, p. 210. |
Divisions (1)
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Number |
Date |
Country |
Parent |
07/199868 |
May 1988 |
US |
Child |
08/705054 |
|
US |
Continuations (2)
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Number |
Date |
Country |
Parent |
08/459634 |
Jun 1995 |
US |
Child |
07/199868 |
|
US |
Parent |
08/018923 |
Feb 1993 |
US |
Child |
08/459634 |
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US |
Reissues (1)
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Number |
Date |
Country |
Parent |
07/199868 |
May 1988 |
US |
Child |
08/705054 |
|
US |