Examples described herein relate to memory devices. Exemplary configurations of memory controllers and memory modules are described.
Computer systems may use memory modules, such as dynamic random access memory (DRAM) modules to store data that may be accessed by a processor. These memory modules may be used as system memory in computer systems. Typically, the processor may communicate with the system memory through a processor bus and a memory controller. The memory controller may be integrated into a system controller that may further include bus bridge circuitry for coupling the processor bus to an expansion bus, among other forms of circuitry.
Notably, operation of various memory modules frequently depends on internal and external signal relationships specific to each type of module. As a result, often times memory controllers are configured to interface only with a particular type of memory module, based on the types and number of control signals, signal timings, and signal characteristics associated with that particular type of module.
Certain details are set forth below to provide a sufficient understanding of embodiments of the invention. However, it will be clear to one skilled in the art that embodiments of the invention may be practiced without these particular details. Moreover, the particular embodiments of the present invention described herein are provided by way of example and should not be used to limit the scope of the invention to these particular embodiments. In other instances, well-known circuits, control signals, timing protocols, and software operations have not been shown in detail in order to avoid unnecessarily obscuring the invention.
As described above, memory controllers may be configured to interface with a particular type of memory module that utilizes particular signal relationships and timing. In some system designs, however, it may be desirable to use another type of memory module without requiring that a system's memory controller be modified or replaced. When a memory controller is configured to interface with a specific memory module, configuring the memory controller to interface with a different type of memory module may require redesigning an entire system controller, or may require manufacturing new memory controllers when existing controllers are already available. This may be undesirable.
Moreover, when designing a new memory module, it may be advantageous to allow the new module to operate with existing systems. However, as a result of using the new memory module, compatibility issues may need to be addressed to ensure operability between the existing memory controller and the memory module.
Embodiments of the present invention may provide systems and methods to configure existing memory controllers to interface with different types of memory modules without requiring that the memory controller be modified or replaced. Moreover, embodiments of the present invention may provide memory modules that are configured to interface with controllers configured to interface with a different type of memory module.
The memory die 102 may be coupled to an impedance 120 and may be further configured to receive an on-die termination signal ODT0 at an input 160. The impedance 120 may be used to calibrate an output driver on'the memory die 102 (not shown in
The three-dimensional memory package 100 may be configured to be controlled by an external memory controller (not shown) that interfaces with each memory die of the three-dimensional memory package 100. In addressing each memory die, the memory controller may differentiate each memory die by a rank. For example, as illustrated in
Accordingly, a conventional three-dimensional memory package, such as the package 100 shown in
A conventional dual die package may employ a different signaling scheme.
The dual die package 200 may be configured to receive chip select signals S0# and S1# at inputs 290 and 291, respectively, and active S0# and S1# signals may cause either memory die 202 or memory die 204, respectively, to perform memory operations, which may include reading from the busses 210, 212. Note that, in contrast to the three-dimensional package 100 described with reference to
Impedances 220 and 222 may be coupled to the memory die 202 and 204, respectively, and may be used to calibrate a respective output driver (not shown in
Memory dies 202, 204 may receive individual clock enable signals from a memory controller (not shown in
The dual die package 200 may be controlled by an external memory controller (not shown in PEG. 2) that may be in communication with memory dies 202, 204. In addressing each memory die 202, 204, the memory controller may differentiate each memory die by a rank. Memory die 202 may be assigned rank 0 and memory die 204 may be assigned rank 1. Rank 0 may indicate that memory die 202 is at one position in the dual die package, while rank 1 may indicate that memory die 204 is located at another position in the dual die package.
Accordingly, in a conventional dual die package, such as the dual die package 200 of
The conventional four-rank dual die module 300 may further include a dual die package 201 including memory die 206 and memory die 208. The dual die package 201 operates in the same manner as dual die module 200, except that dual due package 201 receives chip select signals S2# and S3# at inputs 292 and 293, respectively. Moreover, the memory dies 206, 208 may be assigned ranks 2 and 3, respectively, while, as described above with reference to
In operation, a controller (not shown in
The memory dies 402-408 may be coupled to respective impedances 420-426 that may be used to calibrate respective output drivers for each memory die 402-408. Memory dies 402 and 406 may be further configured to receive on-die termination signals ODT0 and ODT1 at inputs 460 and 462, respectively, to reduce noise and/or reflections of signals received by the memory dies 402 and 406 by providing a dynamic termination impedance. Memory dies 404 and 408 may have respective inputs 461 and 463 coupled to the supply voltage VDD, thereby enabling mode registers (not shown in
Moreover, the memory dies 402 and 406 may be configured to receive a clock enable signal CKE0 at respective inputs 470 and 472, and similarly, memory dies 404 and 408 may receive a clock enable signal CKE1 at respective inputs 471 and 473. In at least one embodiment, the clock enable signals CKE0 and CKE1 may be provided by a memory controller (not shown in
The quad die package 401 may be controlled by an external memory controller (not shown in
Accordingly, in a conventional quad die package, such as the quad die package 401 of
The three-dimensional memory package 502 included in the memory module 500 may comprise memory dies 106, 108 and operate in the same manner as the three-dimensional memory package 501, except that the three-dimensional memory package 502 may receive chip select signals S1# and S3# at inputs 192 and 193, respectively. The three-dimensional memory package 502 may also be coupled to an impedance 122 at input 181, that may be used to calibrate the output driver as described above, to reduce to signal reflections and/or noise. The memory dies 106, 108 may be assigned ranks 1 and 3, respectively, while memory dies 102, 104 may be assigned ranks 0 and 2. Consequently, a clock enable signal (e.g. CKE0) provided to the three-dimensional memory package 501 may be provided to ranks 0 and 2. Another clock enable signal (e.g. CKE1) provided to the package 502 may be provided to ranks 1 and 3. The association of CKE0 with ranks 0 and 2 and CKE1 with ranks 1 and 3 is analogous to the association used in a quad die package 401, e.g. the module 401 of
Referring again to
In this manner, by assigning non-consecutive ranks to dies in each three-dimensional package 501, 502 (e.g. assigning ranks 0 and 2 to dies in three-dimensional memory package 401 and assigning ranks 1 and 3 in three-dimensional memory package 402), the module 500 of
In some examples, the module 500 of
In some embodiments, a memory system, such as the memory system 600 illustrated in
The die packages 610 and 620 may be coupled to the memory controller 605 by conductive traces 611 and 612, respectively, and may be three-dimensional memory packages, such as the three-dimensional memory package 100 illustrated in
In operation, the memory controller 605 may communicate with the signal presence detect unit 650 and receive configuration data stored therein. In one embodiment, the memory controller 605 may be configured to receive configuration data from the signal presence detect unit 650 during an initialization of the memory system 500. In other embodiments, the memory controller 605 may receive the configuration data during each initialization of the memory system 500 or the memory controller 605 may receive configuration data in response to the signal presence detect unit 650 receiving a configuration signal. Moreover, the controller 605 may communicate with the signal presence detect unit 650 through a serial data connection and/or receive data indicative of the temperature of memory module 615. In yet another embodiment, the signal presence detect unit 650 may be configured to store data provided by the controller 605.
The configuration data provided to memory controller 605 from the signal presence detect unit 650 may comprise operating parameters used to configure the memory controller 605 such that the memory controller 605 may interface with the die packages 610 and 620. For example, the configuration data may include control signal timings associated with the die packages 610 and 620, such as timing relationships between clock enable, chip select, and on-die termination signals corresponding to each package. Additionally, the configuration data may also comprise data corresponding to input/output (I/O) pin assignments for the memory controller 605 with respect to control signals, such as chip select and clock enable signals.
As described above, the die packages 610 and 620 of
Moreover, because each of a variety of die package types, such as the three-dimensional memory package 100 of
As a result of modifying the signal timings stored in memory controller 605 and/or the traces coupling the memory controller 605 to the die packages 610, 620, the memory controller 605 may not have any indication that it is interfacing with a different type of memory module than the type of memory module for which it is configured. In short, modifying traces as well as signal timings may allow one type of memory module to be emulated as a second type of memory module.
From the foregoing it will be appreciated that, although specific embodiments of the invention have been described herein for purposes of illustration, various modifications may be made without deviating from the spirit and the scope of the invention. For example, although the embodiments of the invention are explained in the context of providing configuration data from a signal presence detect unit, it will be understood that configuration data may be provided from other devices as well. Accordingly, the invention is not limited except as by the amended claims.
This application is a continuation of U.S. patent application Ser. No. 13/397,392, filed Feb. 15, 2012. This application is incorporated by reference herein in its entirety and for all purposes.
Number | Name | Date | Kind |
---|---|---|---|
5297148 | Harari et al. | Mar 1994 | A |
5418752 | Harari et al. | May 1995 | A |
5535328 | Harari et al. | Jul 1996 | A |
5602987 | Harari et al. | Feb 1997 | A |
5912848 | Bothwell | Jun 1999 | A |
5943254 | Bakeman, Jr. et al. | Aug 1999 | A |
6051887 | Hubbard | Apr 2000 | A |
6092160 | Marsters | Jul 2000 | A |
6168973 | Hubbard | Jan 2001 | B1 |
7181584 | LaBerge | Feb 2007 | B2 |
7224595 | Dreps et al. | May 2007 | B2 |
7260009 | Origasa | Aug 2007 | B2 |
7307863 | Yen et al. | Dec 2007 | B2 |
7411292 | Chen et al. | Aug 2008 | B2 |
7411293 | Chen et al. | Aug 2008 | B2 |
7546435 | LaBerge | Jun 2009 | B2 |
7554353 | Lee | Jun 2009 | B2 |
7562271 | Shaeffer et al. | Jul 2009 | B2 |
7659610 | Chen et al. | Feb 2010 | B2 |
7685364 | Shaeffer | Mar 2010 | B2 |
7687921 | Hiew et al. | Mar 2010 | B2 |
7804735 | Mao | Sep 2010 | B2 |
7838337 | Marimuthu et al. | Nov 2010 | B2 |
7870459 | Hazelzet | Jan 2011 | B2 |
7990171 | Chung | Aug 2011 | B2 |
8000105 | Hinkle | Aug 2011 | B2 |
8055833 | Danilak | Nov 2011 | B2 |
8064276 | Norman | Nov 2011 | B2 |
8209479 | Rajan | Jun 2012 | B2 |
8370566 | Danilak | Feb 2013 | B2 |
8566516 | Schakel | Oct 2013 | B2 |
8751732 | Danilak | Jun 2014 | B2 |
20010002475 | Bothwell et al. | May 2001 | A1 |
20060171200 | Rinerson et al. | Aug 2006 | A1 |
20070069374 | Chen et al. | Mar 2007 | A1 |
20070069390 | Chen et al. | Mar 2007 | A1 |
20070143553 | LaBerge | Jun 2007 | A1 |
20070183251 | Jang | Aug 2007 | A1 |
20070258278 | Bacha et al. | Nov 2007 | A1 |
20080030221 | Lee | Feb 2008 | A1 |
20080080261 | Shaeffer et al. | Apr 2008 | A1 |
20080109775 | Norman | May 2008 | A1 |
20080126692 | Rajan et al. | May 2008 | A1 |
20080150111 | Hiller et al. | Jun 2008 | A1 |
20080277782 | Chen et al. | Nov 2008 | A1 |
20090024789 | Rajan | Jan 2009 | A1 |
20090024790 | Rajan | Jan 2009 | A1 |
20090103855 | Binkert et al. | Apr 2009 | A1 |
20090154212 | Park | Jun 2009 | A1 |
20090158918 | Norman | Jun 2009 | A1 |
20090164204 | Norman | Jun 2009 | A1 |
20090166887 | Upadhyayula et al. | Jul 2009 | A1 |
20090171650 | Norman | Jul 2009 | A1 |
20090198924 | Shaeffer et al. | Aug 2009 | A1 |
20090219779 | Mao | Sep 2009 | A1 |
20090273096 | Hiew et al. | Nov 2009 | A1 |
20100001397 | Kirisawa | Jan 2010 | A1 |
20100008034 | Hinkie | Jan 2010 | A1 |
20100020583 | Kang et al. | Jan 2010 | A1 |
20100070696 | Blankenship | Mar 2010 | A1 |
20100074038 | Ruckerbauer et al. | Mar 2010 | A1 |
20100157645 | Harashima et al. | Jun 2010 | A1 |
20100162037 | Maule et al. | Jun 2010 | A1 |
20100214812 | Kim | Aug 2010 | A1 |
20100318730 | Mao | Dec 2010 | A1 |
20100321973 | Hofstra | Dec 2010 | A1 |
20110002153 | Gravez et al. | Jan 2011 | A1 |
20110010472 | Kang | Jan 2011 | A1 |
20110055616 | Nishio et al. | Mar 2011 | A1 |
20110107009 | Scouller et al. | May 2011 | A1 |
20110110168 | Sung et al. | May 2011 | A1 |
20110194326 | Nakanishi | Aug 2011 | A1 |
20110242869 | Lee | Oct 2011 | A1 |
20110260331 | Lee | Oct 2011 | A1 |
20120284480 | Williams et al. | Nov 2012 | A1 |
Entry |
---|
Gian Luca Loi et al, “A Thermally-Aware Performance Analysis of Vertically Integrated (3-D) Processor-Memory Heirarchy”, Jul. 2006, pp. 1-6, http://citeseerx.ist.psu.edu/viewdoc/download?doi=10.1.1.88.9543&rep=rep1&type=pdf (Year: 2006). |
Gabriel H. Loh, “3D-Stacked Memory Architectures for Multi-Core Processors”, ISCA '08 Proceedings of the 35th Annual International Symposium on Computer Architecture, pp. 453-464, Jun. 2008, https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=4556747 (Year: 2008). |
Anonymous, “Three Dimensional Integration—Considerations for Memory Applications”, 2011, pp. 1-7, https://ieeexplore.ieee.org/stamp/stamp.jsp?arnumber=6055356 (Year: 2011). |
Shamik Das et al., “Timing, Energy, and Thermal Performance of Three-Dimensional Integrated Circuits”, Apr. 2004, pp. 1-6 Year: 2004). |
Doug Milner, “Three-dimensional SoCs perform for future”, Nov. 17, 2003, pp. 1-4, https://www.edn.com/electronics-news/4154602/Three-dimensional-SoCs-perform-for-future?utm_source=eetimes&utm_medium=relatedcontent (Year: 2003). |
LookinAround, “Plug and Play Overview: How Windows Finds Drivers for USB Devices”, May 20, 2009, pp. 1-7 https://www.techspot.com/community/topics/plug-and-play-overview-how-windows-finds-drivers-for-usb-devices.127886/. |
Microsoft, “How Plug and Play Works”, Mar. 28, 2003, pp. 1-10 https://technet.microsoft.com/en-us/library/cc781092(v=ws.1 O).aspx. |
Euronymous, “3D Integration: A Revolution in Design”, http://www.realworldtech.com/3d-integration/ May 2, 2007, pp. 1-18. |
IBM “Understanding DRAM Operation”, https://www.ece.cmu.edu/˜ece548/localcpy/dramop.pdf Dec. 1996, pp. 1-10. |
IBM “Understanding Static RAM Operation”, https://www.ece.cmu.edu/˜ece548/localcpy/sramop.pdf Mar. 1997, pp. 1-12. |
Ickes, Nathan et al., “L7: Memory Basics and Timing”, http://web.mit.edu/6.111/www/s2004/LECTURES/I7.pdf Mar. 2004, pp. 1-27. |
Milner, Doug “Three-Dimensional SOCs Perform for Future”, http:/www.eetimes.com/document.asp?doc_id=1217369 Nov. 17, 2003, pp. 1-4. |
Number | Date | Country | |
---|---|---|---|
20190088651 A1 | Mar 2019 | US |
Number | Date | Country | |
---|---|---|---|
Parent | 13397392 | Feb 2012 | US |
Child | 16193506 | US |