Stacked arrangements of devices

Industry

CPC
H01L25/0657

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof

Current Industry

H01L25/0657Stacked arrangements of devices

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
3D semiconductor device and structure with metal layers
- Patent number 12,368,138
- Issue date Jul 22, 2025
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for laser drilling process for an integrated circuit package
- Patent number 12,368,053
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chia-Shen Cheng
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Microelectronic devices with through-substrate interconnects and as...
- Patent number 12,368,096
- Issue date Jul 22, 2025
- Kyle K. Kirby
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,368,122
- Issue date Jul 22, 2025
- Samsung Electronics Co., Ltd.
- Jinhee Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure including stacked pillar portions and method for...
- Patent number 12,368,123
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jung-Hua Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and a method of manufacturing the semiconduct...
- Patent number 12,368,136
- Issue date Jul 22, 2025
- Samsung Electronics Co., Ltd.
- Hyunsu Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices with isolation trenches in upper portions o...
- Patent number 12,369,333
- Issue date Jul 22, 2025
- Yi Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Field programmable platform array
- Patent number 12,366,882
- Issue date Jul 22, 2025
- Movellus Circuits Inc.
- Mohammad Faisal
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Stacked column floorplan for NAND
- Patent number 12,367,931
- Issue date Jul 22, 2025
- SanDisk Technologies, Inc.
- Yuki Mizutani
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor memory device
- Patent number 12,368,121
- Issue date Jul 22, 2025
- SK hynix Inc.
- Yu Jin Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method comprising formation of redistribu...
- Patent number 12,368,077
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jiun Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inductive coupling system and method for adaptive control of power...
- Patent number 12,368,324
- Issue date Jul 22, 2025
- Zhejiang University
- Xiaolei Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,368,119
- Issue date Jul 22, 2025
- Samsung Electronics Co., Ltd.
- Minki Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power management
- Patent number 12,367,939
- Issue date Jul 22, 2025
- Micron Technology, Inc.
- Liang Yu
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor chip package having underfill material surrounding a...
- Patent number 12,368,127
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Po-Chen Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High bandwidth die to die interconnect with package area reduction
- Patent number 12,368,137
- Issue date Jul 22, 2025
- Apple Inc.
- Chonghua Zhong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory devices and methods of manufacturing thereof
- Patent number 12,369,316
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Meng-Han Lin
- G11 - INFORMATION STORAGE
Information Patent Grant
Bonded memory devices and methods of making the same
- Patent number 12,362,301
- Issue date Jul 15, 2025
- SanDisk Technologies, Inc.
- Adarsh Rajashekhar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding layer and process of making
- Patent number 12,362,304
- Issue date Jul 15, 2025
- Tokyo Electron Limited
- Robert D. Clark
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with balanced wiring structure
- Patent number 12,362,313
- Issue date Jul 15, 2025
- Samsung Electronics Co., Ltd.
- Kiwon Baek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor device and structure with connection paths
- Patent number 12,362,330
- Issue date Jul 15, 2025
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die package with ring structure
- Patent number 12,362,197
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Sheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low stress asymmetric dual side module
- Patent number 12,362,266
- Issue date Jul 15, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Chee Hiong Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 12,362,282
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ching-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board and semiconductor package including the same
- Patent number 12,362,286
- Issue date Jul 15, 2025
- Samsung Electronics Co., Ltd.
- Byeonguk Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of fabricating the same
- Patent number 12,362,270
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kris Lipu Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and data storage systems including the same
- Patent number 12,362,302
- Issue date Jul 15, 2025
- Samsung Electronics Co., Ltd.
- Moorym Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser ablation-based surface property modification and contaminatio...
- Patent number 12,362,340
- Issue date Jul 15, 2025
- Intel Corporation
- Denis Myasishchev
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing the same
- Patent number 12,362,344
- Issue date Jul 15, 2025
- Samsung Electronics Co., Ltd.
- Juhyeon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device
- Patent number 12,362,303
- Issue date Jul 15, 2025
- Kioxia Corporation
- Nobuaki Okada
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Through Via Power Delivery Structure for Stacked Chips
- Publication number 20250233054
- Publication date Jul 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Chieh CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Packages and Methods of Forming Same
- Publication number 20250233115
- Publication date Jul 17, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE WITH CAPPING LAYER AND MANUFACTURING METHOD...
- Publication number 20250233034
- Publication date Jul 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Pin Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-DIE LAYER MEMORY DEVICE
- Publication number 20250234564
- Publication date Jul 17, 2025
- Rambus Inc.
- Thomas VOGELSANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND TEST METHOD OF THE SAME
- Publication number 20250233029
- Publication date Jul 17, 2025
- Samsung Electronics Co., Ltd.
- Jungwoo JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20250233112
- Publication date Jul 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- HsiaoYun Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND ELECTRONIC DEVICE
- Publication number 20250232167
- Publication date Jul 17, 2025
- SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
- Satoru OHSHITA
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DEVICES
- Publication number 20250234554
- Publication date Jul 17, 2025
- Yunjo Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20250233113
- Publication date Jul 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Ting CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE INCLUDING A SCHOTTKY SOURCE CONTACT...
- Publication number 20250234543
- Publication date Jul 17, 2025
- SANDISK TECHNOLOGIES LLC
- Tatsuya HINOUE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE INCLUDING A P-I-N JUNCTION SOURCE C...
- Publication number 20250234545
- Publication date Jul 17, 2025
- SANDISK TECHNOLOGIES LLC
- Masanori TSUTSUMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR NON-VOLATILE RANDOM ACCESS MEMORY STACKS
- Publication number 20250233114
- Publication date Jul 17, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Javier A. DeLaCruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3-DIMENSIONAL SEMICONDUCTOR MEMORY DEVICE AND A METHOD OF OPERATING...
- Publication number 20250232828
- Publication date Jul 17, 2025
- Samsung Electronics Co., LTD
- Myeong-Woo Lee
- G11 - INFORMATION STORAGE
Information Patent Application
NONVOLITILE MEMORY DEVICE AND MEMORY PACKAGE INCLUDING THE SAME
- Publication number 20250234563
- Publication date Jul 17, 2025
- Samsung Electronics Co., Ltd.
- Guyeol Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN FILM SEMICONDUCTOR SWITCHING DEVICE
- Publication number 20250234589
- Publication date Jul 17, 2025
- Zinite Corporation
- Douglas W. BARLAGE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20250226277
- Publication date Jul 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sam Vaziri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250226283
- Publication date Jul 10, 2025
- Samsung Electronics Co., Ltd.
- Wooseup HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADVANCED SEMICONDUCTOR PACKAGING STRUCTURE
- Publication number 20250226339
- Publication date Jul 10, 2025
- AMAZING COOL TECHNOLOGY CORPORATION
- Hsien-Tsung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE INCLUDING MERGED SUB ARRAY
- Publication number 20250227926
- Publication date Jul 10, 2025
- Samsung Electronics Co., Ltd.
- Changyoung LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH BANDWIDTH THREE-DIMENSIONAL SYSTEM-ON-CHIP
- Publication number 20250225095
- Publication date Jul 10, 2025
- Kepler Computing Inc.
- Amrita Mathuriya
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DEVICE WITH BACKSIDE CONNECTION MECHANISM AND METHODS...
- Publication number 20250226308
- Publication date Jul 10, 2025
- Micron Technology, Inc.
- Bharat Bhushan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250226361
- Publication date Jul 10, 2025
- Samsung Electronics Co., Ltd.
- Dawoon JUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED COOLING SYSTEMS AND METHODS OF MANUFACTURING EMBEDDED COOL...
- Publication number 20250226290
- Publication date Jul 10, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE COMPRISING A PLURALITY OF INTEGRATED CIRCUITS AND METHOD OF...
- Publication number 20250226304
- Publication date Jul 10, 2025
- STMicroelectronics International N.V.
- Romain COFFY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20250226336
- Publication date Jul 10, 2025
- MEDIATEK SINGAPORE PTE LTD
- Zhigang DUAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20250226355
- Publication date Jul 10, 2025
- Powerchip Semiconductor Manufacturing Corporation
- Chun-Lin Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHODS OF FORMATION
- Publication number 20250218973
- Publication date Jul 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Fu-Hai LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND PADS FOR SEMICONDUCTOR DIE ASSEMBLIES AND ASSOCIATED METHODS A...
- Publication number 20250218990
- Publication date Jul 3, 2025
- Micron Technology, Inc.
- Bharat Bhushan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Making a Chip-on-Wafer Underfill...
- Publication number 20250219006
- Publication date Jul 3, 2025
- STATS ChipPAC Pte Ltd.
- Marites Roque
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL INTERCONNECTS FOR PACKAGES CONTAINING PHOTONIC INTEGRATE...
- Publication number 20250219034
- Publication date Jul 3, 2025
- Celestial AI Inc.
- Matteo Staffaroni
- H01 - BASIC ELECTRIC ELEMENTS

Stacked arrangements of devices

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

3D semiconductor device and structure with metal layers

Method for laser drilling process for an integrated circuit package

Microelectronic devices with through-substrate interconnects and as...

Semiconductor package

Package structure including stacked pillar portions and method for...

Semiconductor package and a method of manufacturing the semiconduct...

Microelectronic devices with isolation trenches in upper portions o...

Field programmable platform array

Stacked column floorplan for NAND

Semiconductor memory device

Semiconductor package and method comprising formation of redistribu...

Inductive coupling system and method for adaptive control of power...

Semiconductor package

Power management

Semiconductor chip package having underfill material surrounding a...

High bandwidth die to die interconnect with package area reduction

Semiconductor memory devices and methods of manufacturing thereof

Bonded memory devices and methods of making the same

Bonding layer and process of making

Semiconductor package with balanced wiring structure

3D semiconductor device and structure with connection paths

Semiconductor die package with ring structure

Low stress asymmetric dual side module

Semiconductor structure and manufacturing method thereof

Printed circuit board and semiconductor package including the same

Package structure and method of fabricating the same

Semiconductor devices and data storage systems including the same

Laser ablation-based surface property modification and contaminatio...

Semiconductor package and method of manufacturing the same

Semiconductor memory device

Patents Applicationslast 30 patents

Through Via Power Delivery Structure for Stacked Chips

Semiconductor Packages and Methods of Forming Same

SEMICONDUCTOR STRUCTURE WITH CAPPING LAYER AND MANUFACTURING METHOD...

MULTI-DIE LAYER MEMORY DEVICE

SEMICONDUCTOR DEVICE AND TEST METHOD OF THE SAME

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND ELECTRONIC DEVICE

SEMICONDUCTOR DEVICES

PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME

THREE-DIMENSIONAL MEMORY DEVICE INCLUDING A SCHOTTKY SOURCE CONTACT...

THREE-DIMENSIONAL MEMORY DEVICE INCLUDING A P-I-N JUNCTION SOURCE C...

APPARATUS FOR NON-VOLATILE RANDOM ACCESS MEMORY STACKS

3-DIMENSIONAL SEMICONDUCTOR MEMORY DEVICE AND A METHOD OF OPERATING...

NONVOLITILE MEMORY DEVICE AND MEMORY PACKAGE INCLUDING THE SAME

THIN FILM SEMICONDUCTOR SWITCHING DEVICE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

ADVANCED SEMICONDUCTOR PACKAGING STRUCTURE

MEMORY DEVICE INCLUDING MERGED SUB ARRAY

HIGH BANDWIDTH THREE-DIMENSIONAL SYSTEM-ON-CHIP

SEMICONDUCTOR DEVICE WITH BACKSIDE CONNECTION MECHANISM AND METHODS...

SEMICONDUCTOR PACKAGE

EMBEDDED COOLING SYSTEMS AND METHODS OF MANUFACTURING EMBEDDED COOL...

DEVICE COMPRISING A PLURALITY OF INTEGRATED CIRCUITS AND METHOD OF...

SEMICONDUCTOR PACKAGE STRUCTURE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND METHODS OF FORMATION

BOND PADS FOR SEMICONDUCTOR DIE ASSEMBLIES AND ASSOCIATED METHODS A...

Semiconductor Device and Method of Making a Chip-on-Wafer Underfill...

ELECTRICAL INTERCONNECTS FOR PACKAGES CONTAINING PHOTONIC INTEGRATE...