Stacked arrangements of devices

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H01L25/0657

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof

Current Industry

H01L25/0657Stacked arrangements of devices

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor circuit structure with direct die heat removal structure
- Patent number 12,224,225
- Issue date Feb 11, 2025
- INVENTION AND COLLABORATION LABORATORY, INC.
- Chao-Chun Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip and semiconductor package including the same
- Patent number 12,224,258
- Issue date Feb 11, 2025
- Samsung Electronics Co., Ltd.
- Wonkyun Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory devices having cell over periphery structure, memory package...
- Patent number 12,224,277
- Issue date Feb 11, 2025
- Samsung Electronics Co., Ltd.
- Yonghyuk Choi
- G11 - INFORMATION STORAGE
Information Patent Grant
Stacked semiconductor device assembly in computer system
- Patent number 12,222,880
- Issue date Feb 11, 2025
- RAMBUS INC.
- Scott C. Best
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor wafer and semiconductor dies formed therefrom includi...
- Patent number 12,224,248
- Issue date Feb 11, 2025
- SanDisk Technologies, Inc.
- Chin-Tien Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out packages providing enhanced mechanical strength and methods...
- Patent number 12,224,268
- Issue date Feb 11, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
United states 3D memory semiconductor devices and structures with m...
- Patent number 12,225,727
- Issue date Feb 11, 2025
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive structure, semiconductor structure and manufacturing met...
- Patent number 12,224,206
- Issue date Feb 11, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Ping-Heng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Clamped semiconductor wafers and semiconductor devices
- Patent number 12,224,259
- Issue date Feb 11, 2025
- SanDisk Technologies, Inc.
- Kirubakaran Periyannan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure with metallic layer over the surfaces of a plural...
- Patent number 12,224,224
- Issue date Feb 11, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
TSV check circuit with replica path
- Patent number 12,224,275
- Issue date Feb 11, 2025
- Micron Technology, Inc.
- Harutaka Makabe
- G11 - INFORMATION STORAGE
Information Patent Grant
Bonding to alignment marks with dummy alignment marks
- Patent number 12,218,097
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,218,100
- Issue date Feb 4, 2025
- Samsung Electronics Co., Ltd.
- Inhyo Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside contact to improve thermal dissipation away from semicondu...
- Patent number 12,218,106
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with composite conductive features and method...
- Patent number 12,218,087
- Issue date Feb 4, 2025
- NANYA TECHNOLOGY CORPORATION
- Teng-Yen Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor device and method of forming thereof
- Patent number 12,218,089
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die connection system and method
- Patent number 12,218,093
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of forming the same
- Patent number 12,218,096
- Issue date Feb 4, 2025
- Samsung Electronics Co., Ltd.
- Yeongkwon Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked IC structure with orthogonal interconnect layers
- Patent number 12,218,059
- Issue date Feb 4, 2025
- Adeia Semiconductor Inc.
- Ilyas Mohammed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing semiconductor pac...
- Patent number 12,218,092
- Issue date Feb 4, 2025
- Samsung Electronics Co., Ltd.
- Moonyong Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radiation hardened semiconductor devices and packaging
- Patent number 12,218,103
- Issue date Feb 4, 2025
- Micron Technology, Inc.
- Chong Leong Gan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package and method of forming the same
- Patent number 12,218,105
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical redundancy for bonded structures
- Patent number 12,218,107
- Issue date Feb 4, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrating circuit elements in a stacked quantum computing device
- Patent number 12,217,129
- Issue date Feb 4, 2025
- Google LLC
- Julian Shaw Kelly
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Three-dimensional stacking semiconductor assemblies and methods of...
- Patent number 12,218,101
- Issue date Feb 4, 2025
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,218,102
- Issue date Feb 4, 2025
- Samsung Electronics Co., Ltd.
- Youngkun Jee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming chip package structure with molding layer
- Patent number 12,218,104
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package and manufacturing method thereof
- Patent number 12,218,108
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 12,219,767
- Issue date Feb 4, 2025
- Kioxia Corporation
- Tomoya Sanuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fault tolerant memory systems and components with interconnected an...
- Patent number 12,216,543
- Issue date Feb 4, 2025
- RAMBUS INC.
- Kenneth L. Wright
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLIES AND SYSTEMS WITH ONE OR MORE DIES A...
- Publication number 20250046743
- Publication date Feb 6, 2025
- Micron Technology, Inc.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING CONDUCTIVE POSTS AND A HEAT SPREADE...
- Publication number 20250046757
- Publication date Feb 6, 2025
- Samsung Electronics Co., Ltd.
- Hyunsoo CHUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURES AND FABRICATION METHODS THEREOF
- Publication number 20250048630
- Publication date Feb 6, 2025
- Yangtze Memory Technologies Co., Ltd.
- Xiaoxin LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD FOR THE SAME
- Publication number 20250046691
- Publication date Feb 6, 2025
- Samsung Electronics Co., Ltd.
- Ji Hwang KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW RESISTANCE ENHANCED ASPECT RATIO CONNECTOR FOR SEMICONDUCTOR DE...
- Publication number 20250046711
- Publication date Feb 6, 2025
- Micron Technology, Inc.
- Shyam Surthi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP STRUCTURE
- Publication number 20250046740
- Publication date Feb 6, 2025
- Samsung Electronics Co., Ltd.
- Jubin SEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect Structure for Front-to-Front Stacked Chips
- Publication number 20250046756
- Publication date Feb 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Chieh Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHODS FOR INCREASING CROSS BIT LINE PITCH IN NON-VO...
- Publication number 20250048637
- Publication date Feb 6, 2025
- Western Digital Technologies, Inc.
- Hiroki Yabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE INCLUDING HAFNIUM OR ZIRCONIUM OXIDE CONTAINING BLOCK...
- Publication number 20250048641
- Publication date Feb 6, 2025
- Western Digital Technologies, Inc.
- Tatsuya Hinoue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REMAPPING LAYERS FOR PHOTONIC INTERPOSERS
- Publication number 20250046775
- Publication date Feb 6, 2025
- Lightmatter, Inc
- Chian-min Richard Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE PACKAGES INCLUDING COMMAND/ADDRESS CONNECTIONS, AND RELATED...
- Publication number 20250046710
- Publication date Feb 6, 2025
- Micron Technology Inc.
- Scott Smith
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE ASSEMBLIES WITH DECOMPOSABLE MATERIALS AND ASSOCI...
- Publication number 20250046723
- Publication date Feb 6, 2025
- Micron Technology, Inc.
- Fatma Arzum Simsek-Ege
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20250048654
- Publication date Feb 6, 2025
- SK HYNIX INC.
- Nam Jae LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING LAYERS IN SEMICONDCUTOR PACKAGES AND METHODS OF FORMING
- Publication number 20250046744
- Publication date Feb 6, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heat Dissipating Structure and Methods of Forming The Same
- Publication number 20250046667
- Publication date Feb 6, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tsung-Chieh Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE WITH BACKSIDE THROUGH SUBSTRATE THERMAL CON...
- Publication number 20250046678
- Publication date Feb 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Chieh Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packages with Power Switches and Power User Circuits Separated in D...
- Publication number 20250046700
- Publication date Feb 6, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Chao Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250046747
- Publication date Feb 6, 2025
- Samsung Electronics Co., Ltd.
- Junyun KWEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY SYSTEM
- Publication number 20250036583
- Publication date Jan 30, 2025
- KIOXIA Corporation
- Kenji SAKAUE
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
INTEGRATED CIRCUITS WITH CAPACITORS
- Publication number 20250038104
- Publication date Jan 30, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME
- Publication number 20250040153
- Publication date Jan 30, 2025
- Samsung Electronics Co., Ltd.
- HYUN-MOOK CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES
- Publication number 20250040154
- Publication date Jan 30, 2025
- Samsung Electronics Co., Ltd.
- Hakseon KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250038090
- Publication date Jan 30, 2025
- Samsung Electronics Co., Ltd.
- Minjin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250040176
- Publication date Jan 30, 2025
- Samsung Electronics Co., Ltd.
- Youngtaek Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250038134
- Publication date Jan 30, 2025
- Samsung Electronics Co., Ltd.
- Junbae KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH ELECTRICAL VIAS
- Publication number 20250038151
- Publication date Jan 30, 2025
- Samsung Electronics Co., Ltd.
- Kyuha Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED METAL LINES
- Publication number 20250038152
- Publication date Jan 30, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Stephen Morein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULAR INTERCONNECTION UNIT, SEMICONDUCTOR PACKAGE AND METHOD FOR...
- Publication number 20250038059
- Publication date Jan 30, 2025
- JCET STATS ChipPAC Korea Limited
- HyeonChul LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heterogeneous Fan-Out Structure and Method of Manufacture
- Publication number 20250038087
- Publication date Jan 30, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Po-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING STACKED SEMICONDUCTOR CHIPS
- Publication number 20250038119
- Publication date Jan 30, 2025
- SK HYNIX INC.
- Hyun Chul SEO
- H01 - BASIC ELECTRIC ELEMENTS

Stacked arrangements of devices

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor circuit structure with direct die heat removal structure

Semiconductor chip and semiconductor package including the same

Memory devices having cell over periphery structure, memory package...

Stacked semiconductor device assembly in computer system

Semiconductor wafer and semiconductor dies formed therefrom includi...

Fan-out packages providing enhanced mechanical strength and methods...

United states 3D memory semiconductor devices and structures with m...

Conductive structure, semiconductor structure and manufacturing met...

Clamped semiconductor wafers and semiconductor devices

Package structure with metallic layer over the surfaces of a plural...

TSV check circuit with replica path

Bonding to alignment marks with dummy alignment marks

Semiconductor package

Backside contact to improve thermal dissipation away from semicondu...

Semiconductor device with composite conductive features and method...

Packaged semiconductor device and method of forming thereof

Semiconductor die connection system and method

Semiconductor package and method of forming the same

Stacked IC structure with orthogonal interconnect layers

Semiconductor package and method of manufacturing semiconductor pac...

Radiation hardened semiconductor devices and packaging

Package and method of forming the same

Electrical redundancy for bonded structures

Integrating circuit elements in a stacked quantum computing device

Three-dimensional stacking semiconductor assemblies and methods of...

Semiconductor package

Method for forming chip package structure with molding layer

Package and manufacturing method thereof

Semiconductor device and method of manufacturing the same

Fault tolerant memory systems and components with interconnected an...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE ASSEMBLIES AND SYSTEMS WITH ONE OR MORE DIES A...

SEMICONDUCTOR PACKAGE INCLUDING CONDUCTIVE POSTS AND A HEAT SPREADE...

SEMICONDUCTOR STRUCTURES AND FABRICATION METHODS THEREOF

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD FOR THE SAME

LOW RESISTANCE ENHANCED ASPECT RATIO CONNECTOR FOR SEMICONDUCTOR DE...

SEMICONDUCTOR CHIP STRUCTURE

Interconnect Structure for Front-to-Front Stacked Chips

APPARATUS AND METHODS FOR INCREASING CROSS BIT LINE PITCH IN NON-VO...

MEMORY DEVICE INCLUDING HAFNIUM OR ZIRCONIUM OXIDE CONTAINING BLOCK...

REMAPPING LAYERS FOR PHOTONIC INTERPOSERS

DEVICE PACKAGES INCLUDING COMMAND/ADDRESS CONNECTIONS, AND RELATED...

SEMICONDUCTOR DIE ASSEMBLIES WITH DECOMPOSABLE MATERIALS AND ASSOCI...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

BONDING LAYERS IN SEMICONDCUTOR PACKAGES AND METHODS OF FORMING

Heat Dissipating Structure and Methods of Forming The Same

SEMICONDUCTOR STRUCTURE WITH BACKSIDE THROUGH SUBSTRATE THERMAL CON...

Packages with Power Switches and Power User Circuits Separated in D...

SEMICONDUCTOR PACKAGE

MEMORY SYSTEM

INTEGRATED CIRCUITS WITH CAPACITORS

SEMICONDUCTOR MEMORY DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME

SEMICONDUCTOR DEVICES

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE WITH ELECTRICAL VIAS

EMBEDDED METAL LINES

MODULAR INTERCONNECTION UNIT, SEMICONDUCTOR PACKAGE AND METHOD FOR...

Heterogeneous Fan-Out Structure and Method of Manufacture

SEMICONDUCTOR PACKAGE INCLUDING STACKED SEMICONDUCTOR CHIPS