Stacked arrangements of devices

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H01L25/0657

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof

Current Industry

H01L25/0657Stacked arrangements of devices

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Standby exit for memory die stack
- Patent number 12,254,948
- Issue date Mar 18, 2025
- Micron Technology, Inc.
- Hari Giduturi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device interface and method
- Patent number 12,253,943
- Issue date Mar 18, 2025
- Brent Keeth
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device with composite conductive features and method...
- Patent number 12,255,161
- Issue date Mar 18, 2025
- NANYA TECHNOLOGY CORPORATION
- Teng-Yen Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond pads for semiconductor die assemblies and associated methods a...
- Patent number 12,255,163
- Issue date Mar 18, 2025
- Micron Technology, Inc.
- Bharat Bhushan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor device
- Patent number 12,255,177
- Issue date Mar 18, 2025
- SK HYNIX INC.
- Yo Sep Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Secure semiconductor integration and method for making thereof
- Patent number 12,255,189
- Issue date Mar 18, 2025
- BroadPak Corporation
- Farhang Yazdani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Module
- Patent number 12,255,151
- Issue date Mar 18, 2025
- Murata Manufacturing Co., Ltd.
- Yoshihito Otsubo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods of forming the same
- Patent number 12,255,184
- Issue date Mar 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Layouts of data pads on a semiconductor die
- Patent number 12,255,198
- Issue date Mar 18, 2025
- Micron Technology, Inc.
- Takamasa Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bond wires for interference shielding
- Patent number 12,255,153
- Issue date Mar 18, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Abiola Awujoola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mirror image of geometrical patterns in stacked integrated circuit...
- Patent number 12,255,178
- Issue date Mar 18, 2025
- Mellanox Technologies, Ltd.
- Ido Bourstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for forming three-dimensional memory devices
- Patent number 12,255,181
- Issue date Mar 18, 2025
- Yangtze Memory Technologies Co., Ltd.
- Kun Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D package configuration
- Patent number 12,255,180
- Issue date Mar 18, 2025
- CCS TECHNOLOGY CORPORATION
- Tung-Po Sung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and manufacturing method thereof
- Patent number 12,255,182
- Issue date Mar 18, 2025
- Siliconware Precision Industries Co., Ltd.
- Meng-Huan Chia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including heat dissipation layer
- Patent number 12,255,183
- Issue date Mar 18, 2025
- SK hynix Inc.
- Joo Wan Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device
- Patent number 12,254,949
- Issue date Mar 18, 2025
- Macronix International Co., Ltd.
- Teng-Hao Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,249,563
- Issue date Mar 11, 2025
- Samsung Electronics Co., Ltd.
- Donguk Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device arrangement with compressible adhesive
- Patent number 12,249,561
- Issue date Mar 11, 2025
- Infineon Technologies AG
- Thorsten Scharf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three dimensional circuit implementing machine trained network
- Patent number 12,248,869
- Issue date Mar 11, 2025
- Adeia Semiconductor Inc.
- Steven L. Teig
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
3D semiconductor memory devices and structures
- Patent number 12,250,830
- Issue date Mar 11, 2025
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor structure
- Patent number 12,249,517
- Issue date Mar 11, 2025
- Hon Hai Precision Industry Co., Ltd.
- Kuang-Hao Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including penetration via structure
- Patent number 12,249,558
- Issue date Mar 11, 2025
- Samsung Electronics Co., Ltd.
- Jubin Seo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated assemblies comprising vertically-stacked decks with inte...
- Patent number 12,249,598
- Issue date Mar 11, 2025
- Micron Technology, Inc.
- Werner Juengling
- G11 - INFORMATION STORAGE
Information Patent Grant
Quasi-volatile memory device with a back-channel usage
- Patent number 12,242,759
- Issue date Mar 4, 2025
- SUNRISE MEMORY CORPORATION
- Robert D. Norman
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Protection structures for bonded wafers
- Patent number 12,243,772
- Issue date Mar 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ssu-Chiang Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory system having combined high density, low bandwidth and low d...
- Patent number 12,243,575
- Issue date Mar 4, 2025
- Apple Inc.
- Sukalpa Biswas
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor device with electromagnetic interference film and met...
- Patent number 12,243,833
- Issue date Mar 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chi-Hsi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices, systems, and methods for stacked die packages
- Patent number 12,243,850
- Issue date Mar 4, 2025
- Flex Ltd.
- Cheng Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Offset pads over TSV
- Patent number 12,243,851
- Issue date Mar 4, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Bongsub Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 12,243,852
- Issue date Mar 4, 2025
- Kioxia Corporation
- Akihito Sawanobori
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
3D STACKED VOLTAGE REGULATOR WITH COMPONENTS DISTRIBUTED ON MULTIPL...
- Publication number 20250096200
- Publication date Mar 20, 2025
- Intel Corporation
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED VOLTAGE REGULATOR (IVR) PACKAGE INCLUDING INDUCTOR AND C...
- Publication number 20250096211
- Publication date Mar 20, 2025
- Samsung Electronics Co., Ltd.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND PACKAGING METHOD THEREOF
- Publication number 20250096220
- Publication date Mar 20, 2025
- Yangtze Memory Technologies Co., Ltd.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STORAGE DEVICE AND METHOD OF HEATING SEMICONDUCTOR ST...
- Publication number 20250096102
- Publication date Mar 20, 2025
- KIOXIA Corporation
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20250096152
- Publication date Mar 20, 2025
- SK HYNIX INC.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED SEMICONDUCTOR DEVICES AND METHODS OF PACKAGING SEMICONDUCT...
- Publication number 20250096008
- Publication date Mar 20, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF TESTING THE SAME
- Publication number 20250096047
- Publication date Mar 20, 2025
- Samsung Electronics Co., Ltd.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE
- Publication number 20250098141
- Publication date Mar 20, 2025
- KIOXIA Corporation
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE, METHOD FOR FABRICATING THE SAME AND EL...
- Publication number 20250098172
- Publication date Mar 20, 2025
- Samsung Electronics Co., Ltd.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR DEVICE
- Publication number 20250096202
- Publication date Mar 20, 2025
- Micron Technology, Inc.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL STACKING STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20250096204
- Publication date Mar 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IO INTERCONNECT CAGE STRUCTURE FOR PACKAGE FORM REDUCTION
- Publication number 20250096094
- Publication date Mar 20, 2025
- QUALCOMM Incorporated
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING STRUCTURE, SEMICONDUCTOR DEVICE INCLUDING THE SAME AND METH...
- Publication number 20250096170
- Publication date Mar 20, 2025
- SK HYNIX INC.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DATA PATH OSCILLATOR MISMATCH ERROR REDUCTION FOR NON-VOLATILE MEMORY
- Publication number 20250095753
- Publication date Mar 20, 2025
- Western Digital Technologies, Inc.
- G11 - INFORMATION STORAGE
Information Patent Application
INTEGRATED STACKED SUBSTRATE FOR ISOLATED POWER MODULE
- Publication number 20250096084
- Publication date Mar 20, 2025
- TEXAS INSTRUMENTS INCORPORATED
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED MEMORY CONTROLLER CIRCUITRY
- Publication number 20250098181
- Publication date Mar 20, 2025
- ADVANCED MICRO DEVICES, INC.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fabrication of Through-Silicon Vias
- Publication number 20250098549
- Publication date Mar 20, 2025
- IMEC vzw
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE FOR TESTING INTERFACIAL ADHESION BETWEEN MOLD COMPOUND AN...
- Publication number 20250096046
- Publication date Mar 20, 2025
- Micron Technology, Inc.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NON-VOLATILE MEMORY WITH EFFICIENT PRECHARGE IN SUB-BLOCK MODE
- Publication number 20250095740
- Publication date Mar 20, 2025
- Western Digital Technologies, Inc.
- G11 - INFORMATION STORAGE
Information Patent Application
PACKAGE STRUCTURE AND FABRICATING METHOD THEREOF
- Publication number 20250096192
- Publication date Mar 20, 2025
- Kore Semiconductor Co., Ltd.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURES AND METHODS OF FORMING SAME
- Publication number 20250096199
- Publication date Mar 20, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY LAYERS AT OPPOSING SIDES OF A COMPLEMENTARY METAL-OXIDE SEMI...
- Publication number 20250098179
- Publication date Mar 20, 2025
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250096201
- Publication date Mar 20, 2025
- Samsung Electronics Co., Ltd.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE
- Publication number 20250096203
- Publication date Mar 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE
- Publication number 20250095743
- Publication date Mar 20, 2025
- KIOXIA Corporation
- G11 - INFORMATION STORAGE
Information Patent Application
LOW COST PACKAGE WARPAGE SOLUTION
- Publication number 20250096009
- Publication date Mar 20, 2025
- Intel Corporation
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPRISING A SUBSTRATE WITH A PASSIVE COMPONENT BLOCK
- Publication number 20250096111
- Publication date Mar 20, 2025
- QUALCOMM Incorporated
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250096118
- Publication date Mar 20, 2025
- KIOXIA Corporation
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP BONDING FILM, METHOD OF MANUFACTURING THE SAME, AND SEMICONDUC...
- Publication number 20250096184
- Publication date Mar 20, 2025
- Samsung Electronics Co., Ltd.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20250098180
- Publication date Mar 20, 2025
- Samsung Electronics Co., Ltd.
- H01 - BASIC ELECTRIC ELEMENTS

Stacked arrangements of devices

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Standby exit for memory die stack

Memory device interface and method

Semiconductor device with composite conductive features and method...

Bond pads for semiconductor die assemblies and associated methods a...

Stacked semiconductor device

Secure semiconductor integration and method for making thereof

Module

Semiconductor packages and methods of forming the same

Layouts of data pads on a semiconductor die

Wire bond wires for interference shielding

Mirror image of geometrical patterns in stacked integrated circuit...

Methods for forming three-dimensional memory devices

3D package configuration

Electronic package and manufacturing method thereof

Semiconductor package including heat dissipation layer

Memory device

Semiconductor device

Semiconductor device arrangement with compressible adhesive

Three dimensional circuit implementing machine trained network

3D semiconductor memory devices and structures

Manufacturing method of semiconductor structure

Semiconductor device including penetration via structure

Integrated assemblies comprising vertically-stacked decks with inte...

Quasi-volatile memory device with a back-channel usage

Protection structures for bonded wafers

Memory system having combined high density, low bandwidth and low d...

Semiconductor device with electromagnetic interference film and met...

Devices, systems, and methods for stacked die packages

Offset pads over TSV

Semiconductor package and manufacturing method thereof

Patents Applicationslast 30 patents

3D STACKED VOLTAGE REGULATOR WITH COMPONENTS DISTRIBUTED ON MULTIPL...

INTEGRATED VOLTAGE REGULATOR (IVR) PACKAGE INCLUDING INDUCTOR AND C...

SEMICONDUCTOR PACKAGE STRUCTURE AND PACKAGING METHOD THEREOF

SEMICONDUCTOR STORAGE DEVICE AND METHOD OF HEATING SEMICONDUCTOR ST...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

PACKAGED SEMICONDUCTOR DEVICES AND METHODS OF PACKAGING SEMICONDUCT...

SEMICONDUCTOR PACKAGE AND METHOD OF TESTING THE SAME

SEMICONDUCTOR MEMORY DEVICE

SEMICONDUCTOR MEMORY DEVICE, METHOD FOR FABRICATING THE SAME AND EL...

STACKED SEMICONDUCTOR DEVICE

THREE-DIMENSIONAL STACKING STRUCTURE AND MANUFACTURING METHOD THEREOF

IO INTERCONNECT CAGE STRUCTURE FOR PACKAGE FORM REDUCTION

BONDING STRUCTURE, SEMICONDUCTOR DEVICE INCLUDING THE SAME AND METH...

DATA PATH OSCILLATOR MISMATCH ERROR REDUCTION FOR NON-VOLATILE MEMORY

INTEGRATED STACKED SUBSTRATE FOR ISOLATED POWER MODULE

INTEGRATED MEMORY CONTROLLER CIRCUITRY

Fabrication of Through-Silicon Vias

STRUCTURE FOR TESTING INTERFACIAL ADHESION BETWEEN MOLD COMPOUND AN...

NON-VOLATILE MEMORY WITH EFFICIENT PRECHARGE IN SUB-BLOCK MODE

PACKAGE STRUCTURE AND FABRICATING METHOD THEREOF

SEMICONDUCTOR PACKAGE STRUCTURES AND METHODS OF FORMING SAME

MEMORY LAYERS AT OPPOSING SIDES OF A COMPLEMENTARY METAL-OXIDE SEMI...

SEMICONDUCTOR PACKAGE

MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE

SEMICONDUCTOR MEMORY DEVICE

LOW COST PACKAGE WARPAGE SOLUTION

PACKAGE COMPRISING A SUBSTRATE WITH A PASSIVE COMPONENT BLOCK

SEMICONDUCTOR DEVICE

CHIP BONDING FILM, METHOD OF MANUFACTURING THE SAME, AND SEMICONDUC...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME