Stacked arrangements of devices

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H01L25/0657

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof

Current Industry

H01L25/0657Stacked arrangements of devices

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Capacitive coupling in a direct-bonded interface for microelectroni...
- Patent number 12,272,673
- Issue date Apr 8, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacking structure, package structure and method of fabricating the...
- Patent number 12,272,674
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method of the same
- Patent number 12,272,686
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Fu-Jier Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package and manufacturing method thereof
- Patent number 12,272,622
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D stacked chip that shares power rails
- Patent number 12,272,647
- Issue date Apr 8, 2025
- Samsung Electronics Co., Ltd.
- Byounghak Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including semiconductor chips stacked via con...
- Patent number 12,272,661
- Issue date Apr 8, 2025
- Samsung Electronics Co., Ltd.
- Eunsu Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming 3D stacked compute and memory with copper pillars
- Patent number 12,272,675
- Issue date Apr 8, 2025
- Kepler Computing Inc.
- Sasikanth Manipatruni
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Memory device
- Patent number 12,272,676
- Issue date Apr 8, 2025
- Kioxia Corporation
- Masayoshi Tagami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor and circuit structures, and related methods
- Patent number 12,272,691
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chang-Fen Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages having conductive pillars with inclined surf...
- Patent number 12,272,664
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chiang-Jui Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal structure for semiconductor device and method of forming th...
- Patent number 12,272,613
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wei-Ming Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory devices having vertical transistors and stacked storage unit...
- Patent number 12,274,049
- Issue date Apr 8, 2025
- Yangtze Memory Technologies Co., Ltd.
- Dongxue Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor wafer configured for single touch-down testing
- Patent number 12,270,853
- Issue date Apr 8, 2025
- SanDisk Technologies, Inc.
- Toru Miwa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,272,652
- Issue date Apr 8, 2025
- Samsung Electronics Co., Ltd.
- Jiwon Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct bonded stack structures for increased reliability and improv...
- Patent number 12,272,677
- Issue date Apr 8, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional device structure including substrate-embedded int...
- Patent number 12,272,724
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor memory device and structure with memory and metal...
- Patent number 12,272,586
- Issue date Apr 8, 2025
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Grant
Memory peripheral circuit having three-dimensional transistors and...
- Patent number 12,274,066
- Issue date Apr 8, 2025
- Yangtze Memory Technologies Co., Ltd.
- Chao Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Redundancy scheme for activating circuitry on a base die of a 3D st...
- Patent number 12,271,332
- Issue date Apr 8, 2025
- Xilinx, Inc.
- Brian C. Gaide
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Multi-die mapping matrix multiplication
- Patent number 12,265,494
- Issue date Apr 1, 2025
- Kepler Computing Inc.
- Amrita Mathuriya
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Waveguide interconnects for semiconductor packages and related methods
- Patent number 12,266,840
- Issue date Apr 1, 2025
- Intel Corporation
- Georgios Dogiamis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked dies and methods for forming bonded structures
- Patent number 12,266,650
- Issue date Apr 1, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
DRAM sense amplifier architecture with reduced power consumption an...
- Patent number 12,267,996
- Issue date Apr 1, 2025
- ATOMERA INCORPORATED
- Richard Stephen Roy
- G11 - INFORMATION STORAGE
Information Patent Grant
Stacked die package including a multi-contact interconnect
- Patent number 12,266,636
- Issue date Apr 1, 2025
- STMicroelectronics Pte Ltd
- Jing-En Luan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,266,638
- Issue date Apr 1, 2025
- Samsung Electronics Co., Ltd.
- Sangcheon Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded direct bonded and interconnected stack
- Patent number 12,266,640
- Issue date Apr 1, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Guilian Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D stacked integrated circuits having functional blocks configured...
- Patent number 12,266,647
- Issue date Apr 1, 2025
- Micron Technology, Inc.
- Tony M. Brewer
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Die stack structure and manufacturing method thereof
- Patent number 12,266,637
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating semiconductor package
- Patent number 12,266,639
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hao-Yi Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enhanced base die heat path using through-silicon vias
- Patent number 12,266,589
- Issue date Apr 1, 2025
- Intel Corporation
- Weston Bertrand
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE WITH SHARED BARRIER LAYER IN REDISTRIBUTION A...
- Publication number 20250118711
- Publication date Apr 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Mitigating process problems in hybrid bonding of vertical die stacking
- Publication number 20250118692
- Publication date Apr 10, 2025
- Marvell Asia Pte Ltd.
- Runzi Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20250118702
- Publication date Apr 10, 2025
- Samsung Electronics Co., Ltd.
- Kwang Yong Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250118714
- Publication date Apr 10, 2025
- Samsung Electronics Co., Ltd.
- Keumhee Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NONVOLATILE MEMORY DEVICE AND MEMORY SYSTEM INCLUDING THE SAME
- Publication number 20250120089
- Publication date Apr 10, 2025
- Samsung Electronics Co., Ltd.
- Sehoon Lee
- G11 - INFORMATION STORAGE
Information Patent Application
ARTIFICIAL SELECT GATE CUT FOR NAND
- Publication number 20250118369
- Publication date Apr 10, 2025
- Western Digital Technologies, Inc.
- Yuki Kuniyoshi
- G11 - INFORMATION STORAGE
Information Patent Application
PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS
- Publication number 20250118705
- Publication date Apr 10, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Ellis Chau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHODS OF FORMATION
- Publication number 20250118710
- Publication date Apr 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuo-Ming WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Inhibiting Creep of Underfill Ma...
- Publication number 20250118643
- Publication date Apr 10, 2025
- STATS ChipPAC Pte Ltd.
- Yi Jing Eric Chong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20250120072
- Publication date Apr 10, 2025
- Samsung Electronics Co., Ltd.
- Seryeun YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heterogeneous Semiconductor Interconnect Interfaces, Semiconductor...
- Publication number 20250118663
- Publication date Apr 10, 2025
- JARIET TECHNOLOGIES, INC.
- Scott Richard POWELL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250118709
- Publication date Apr 10, 2025
- Samsung Electronics Co., Ltd.
- Gunho CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CIRCUIT STRUCTURE WITH DIRECT DIE HEAT REMOVAL STRUCTURE
- Publication number 20250118625
- Publication date Apr 10, 2025
- Invention And Collaboration Laboratory, Inc.
- Chao-Chun LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT DIE-TWO-DIE CONNECTION THROUGH AN INTERPOSER WITHOUT VIAS
- Publication number 20250112191
- Publication date Apr 3, 2025
- Intel Corporation
- Thomas WAGNER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250112193
- Publication date Apr 3, 2025
- Samsung Electronics Co., Ltd.
- INHYUNG SONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE CONTAINING SPLIT SUPPORT PILLAR STR...
- Publication number 20250113484
- Publication date Apr 3, 2025
- WESTERN DIGITAL TECHNOLOGIES, INC.,
- Masato NOGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE CONTAINING PHOSPHORUS-DOPED SILICON...
- Publication number 20250113486
- Publication date Apr 3, 2025
- WESTERN DIGITAL TECHNOLOGIES, INC.,
- Nobuyuki FUJIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE CONTAINING LATERALLY UNDULATING ISO...
- Publication number 20250113492
- Publication date Apr 3, 2025
- WESTERN DIGITAL TECHNOLOGIES, INC.,
- Wataru MURANAGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEEP CAVITY ARRANGEMENTS ON INTEGRATED CIRCUIT PACKAGING
- Publication number 20250112124
- Publication date Apr 3, 2025
- Intel Corporation
- Jeremy Ecton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CIRCUIT STRUCTURE WITH DIRECT DIE HEAT REMOVAL STRUCTURE
- Publication number 20250112116
- Publication date Apr 3, 2025
- Invention And Collaboration Laboratory, Inc.
- Chao-Chun LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
QUANTUM DOT IMAGE SENSOR DEVICES AND METHODS OF MANUFACTURING THE SAME
- Publication number 20250113700
- Publication date Apr 3, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Rajesh KATKAR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FINE-GRAIN INTEGRATION OF GROUP III-V DEVICES
- Publication number 20250112210
- Publication date Apr 3, 2025
- Intel Corporation
- Han Wui Then
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ASSEMBLIES INCLUDING VERTICALLY INTEGRATED CIRCUITS A...
- Publication number 20250112105
- Publication date Apr 3, 2025
- Micron Technology, Inc.
- Chan H. YOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH SUBSTRATE VIA STRUCTURES AND PROCESSES
- Publication number 20250112123
- Publication date Apr 3, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTOSENSITIVE COMPOSITION CONTAINING PFAS-FREE POLYCYCLOOLEFINIC P...
- Publication number 20250110403
- Publication date Apr 3, 2025
- PROMERUS, LLC
- TAKANOBU MASUDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE CONTAINING LATERALLY UNDULATING ISO...
- Publication number 20250113485
- Publication date Apr 3, 2025
- Western Digital Technologies, Inc.
- Wataru MURANAGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTU...
- Publication number 20250105181
- Publication date Mar 27, 2025
- Samsung Electronics Co., Ltd.
- Jumyong PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RADIO FREQUENCY COMMUNICATION DEVICE INCLUDING PACKAGE CONTAINING H...
- Publication number 20250105223
- Publication date Mar 27, 2025
- Samsung Electronics Co., Ltd.
- Sangwook HAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20250107078
- Publication date Mar 27, 2025
- SK HYNIX INC.
- Seok Min CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING SEPARATION PATTERNS AND AN ELECTRONI...
- Publication number 20250107093
- Publication date Mar 27, 2025
- Samsung Electronics Co., Ltd.
- Joongshik SHIN
- H01 - BASIC ELECTRIC ELEMENTS

Stacked arrangements of devices

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Capacitive coupling in a direct-bonded interface for microelectroni...

Stacking structure, package structure and method of fabricating the...

Semiconductor structure and manufacturing method of the same

Package and manufacturing method thereof

3D stacked chip that shares power rails

Semiconductor package including semiconductor chips stacked via con...

Method of forming 3D stacked compute and memory with copper pillars

Memory device

Semiconductor and circuit structures, and related methods

Semiconductor packages having conductive pillars with inclined surf...

Thermal structure for semiconductor device and method of forming th...

Memory devices having vertical transistors and stacked storage unit...

Semiconductor wafer configured for single touch-down testing

Semiconductor package

Direct bonded stack structures for increased reliability and improv...

Three-dimensional device structure including substrate-embedded int...

3D semiconductor memory device and structure with memory and metal...

Memory peripheral circuit having three-dimensional transistors and...

Redundancy scheme for activating circuitry on a base die of a 3D st...

Multi-die mapping matrix multiplication

Waveguide interconnects for semiconductor packages and related methods

Stacked dies and methods for forming bonded structures

DRAM sense amplifier architecture with reduced power consumption an...

Stacked die package including a multi-contact interconnect

Semiconductor package

Molded direct bonded and interconnected stack

3D stacked integrated circuits having functional blocks configured...

Die stack structure and manufacturing method thereof

Method of fabricating semiconductor package

Enhanced base die heat path using through-silicon vias

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE WITH SHARED BARRIER LAYER IN REDISTRIBUTION A...

Mitigating process problems in hybrid bonding of vertical die stacking

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR PACKAGE

NONVOLATILE MEMORY DEVICE AND MEMORY SYSTEM INCLUDING THE SAME

ARTIFICIAL SELECT GATE CUT FOR NAND

PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS

SEMICONDUCTOR DEVICE AND METHODS OF FORMATION

Semiconductor Device and Method of Inhibiting Creep of Underfill Ma...

MEMORY DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

Heterogeneous Semiconductor Interconnect Interfaces, Semiconductor...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR CIRCUIT STRUCTURE WITH DIRECT DIE HEAT REMOVAL STRUCTURE

DIRECT DIE-TWO-DIE CONNECTION THROUGH AN INTERPOSER WITHOUT VIAS

SEMICONDUCTOR PACKAGE

THREE-DIMENSIONAL MEMORY DEVICE CONTAINING SPLIT SUPPORT PILLAR STR...

THREE-DIMENSIONAL MEMORY DEVICE CONTAINING PHOSPHORUS-DOPED SILICON...

THREE-DIMENSIONAL MEMORY DEVICE CONTAINING LATERALLY UNDULATING ISO...

DEEP CAVITY ARRANGEMENTS ON INTEGRATED CIRCUIT PACKAGING

SEMICONDUCTOR CIRCUIT STRUCTURE WITH DIRECT DIE HEAT REMOVAL STRUCTURE

QUANTUM DOT IMAGE SENSOR DEVICES AND METHODS OF MANUFACTURING THE SAME

FINE-GRAIN INTEGRATION OF GROUP III-V DEVICES

SEMICONDUCTOR ASSEMBLIES INCLUDING VERTICALLY INTEGRATED CIRCUITS A...

THROUGH SUBSTRATE VIA STRUCTURES AND PROCESSES

PHOTOSENSITIVE COMPOSITION CONTAINING PFAS-FREE POLYCYCLOOLEFINIC P...

THREE-DIMENSIONAL MEMORY DEVICE CONTAINING LATERALLY UNDULATING ISO...

SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTU...

RADIO FREQUENCY COMMUNICATION DEVICE INCLUDING PACKAGE CONTAINING H...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE INCLUDING SEPARATION PATTERNS AND AN ELECTRONI...