Patent Application
20130284794
1. Field of the Invention
The present invention relates to a metal bonding apparatus, and more specifically, relates to a copper-copper bonding apparatus.
2. Description of the Related Art
As an electrically conductive material used to form a wiring layer that is a component of a wiring substrate, or used to form an electrode surface of each electrode of a semiconductor chip or the like, copper is widely employed.
As a conventional metal bonding method for electrically connecting a first bonding member to be bonded such as a wiring layer of a wiring substrate or the like to a second bonding member to be bonded such as an element electrode of a semiconductor chip, examples of such a conventional metal bonding methods include: a method in which the bonding faces are solder-bonded via solder; a method in which the bonding faces are bonded to each other by applying pressure while heating the bonding faces at a high temperature; and a method in which the bonding faces are activated by means of ion irradiation or the like in a vacuum so as to bond the bonding faces to each other; and so forth.
With such a conventional method in which copper-copper bonding is performed via soldering, there is room for further improvement of reliability of connection at a bonded portion. On the other hand, with such a conventional method in which the faces to be bonded are heated at a high temperature, such an arrangement leads to a risk of damage of a wiring substrate or a semiconductor chip.
An embodiment of the present invention relates to a metal bonding apparatus. The metal bonding apparatus comprises: a solution supply unit configured to supply a solution which is able to elute an oxide with copper oxide as a principal component, to at least one of a first bonding portion and a second bonding portion; a pressing unit configured to apply pressure to the first bonding portion and the second bonding portion so as to sandwich the solution between the first bonding portion and the second bonding portion, and in a direction in which a distance between the first bonding portion and the second bonding portion is reduced; and a heating unit configured to heat the first bonding portion and the second bonding portion, wherein the first bonding portion and the second bonding portion are bonded by the pressure applied by the pressing unit and the heat from the heating unit.
Embodiments will now be described, by way of example only, with reference to the accompanying drawings which are meant to be exemplary, not limiting, and wherein like elements are numbered alike in several Figures, in which:
The invention will now be described by reference to the preferred embodiments. This does not intend to limit the scope of the present invention, but to exemplify the invention.
Description will be made below regarding an embodiment of the present invention with reference to the drawings. It should be noted that, in all the drawings, the same components are denoted by the same reference symbols, and redundant description will be omitted. First, before specific description of the embodiment, description will be made regarding the basic knowledge for the present invention. With a conventional method in which a copper member is bonded to another copper member using conventional Sn-based solder, a Cu—Sn alloy occurs at a bonded interface between each copper layer and the adjacent solder layer. Such a Cu—Sn alloy has relatively large electric resistance, and poor ductility, leading to a problem of poor electrical characteristics and/or a problem of poor connection reliability at such a bonded portion. With a method in which the bonding faces are bonded to each other by applying pressure while heating the bonding faces at a high temperature, in some cases, such an arrangement leads to a problem of damage of a wiring substrate or a semiconductor chip due to the application of heat or the application of pressure. With a method in which the bonding faces are activated in a vacuum so as to bond the bonding faces to each other, such an arrangement requires large-scale equipment such as a vacuum apparatus, leading to an unavoidable increase in costs.
A metal bonding apparatus 1 according to the present embodiment includes a casing 2 and a cover 3, and a solution supply unit 10, a pressing unit 30, and a heating unit 50, which are configured as principal components housed in a housing space defined by the casing 2 and the cover 3. The cover 3 includes a window 3a which allows the housing space to be monitored, a monitor 4 configured to display various kinds of setting conditions and the states of the metal bonding apparatus 1 such as a solution supply amount, pressure, temperature, etc., and an exhaust duct 5 configured to discharge gas that fills the housing space. The casing 2 includes an operating unit 6 which allows the user to input an instruction such as operation setting for the metal bonding apparatus 1, an instruction to start/stop the operation, and so forth. Furthermore, a control unit 7 is housed in the housing space, which enables various kinds of control operations to be executed for the metal bonding apparatus 1.
Furthermore, in the housing space of the metal bonding apparatus 1 according to the present embodiment, the metal bonding apparatus 1 includes a first member supply unit configured to store a first member 200 having a first bonding portion 202, and a second member supply unit 80 configured to store a second member 210 having a second bonding portion 212. The bonding target to be bonded by means of the metal bonding apparatus 1 is a pair of the first bonding portion 202 of the first member 200 and the second bonding portion 212 of the second member 210. Moreover, in the housing space, the metal bonding apparatus 1 includes a stage 90 on which pressure and heat are to be applied to the first bonding portion 202 and the second bonding portion 212.
The first member supply unit 70, the stage 90, and the second member supply unit 80 are arranged in this order. Furthermore, an arm rail 32 is provided such that it extends along the axis along which the first member supply unit 70, the stage 90, and the second member supply unit 80 are arranged. The arm rail 32 includes two slidable arms 34. The two arms 34 each include a member holding unit 36 (chuck) at one of their ends. Each member holding unit 36 is configured such that its end faces the lower side of the apparatus. The member holding unit 36 includes, at its end portion, a vacuum coupling opening connected to a vacuum pump (both units are not shown). By driving the vacuum pump in a state in which the end portion of the member holding unit 36 is in contact with a member to be held, such an arrangement allows the member holding unit 36 to hold the member. Furthermore, a heater is built into the member holding unit 36, which allows the member thus held to be heated. Thus, with the metal bonding apparatus 1 according to the present embodiment, the member holding unit 36 itself functions as the heating unit 50. It should be noted that the order in which the first member supply unit 70, the second member supply unit 80, and the stage 90 are arranged is not restricted in particular. Also, such a heater may be provided as an external heater that is separate from the member holding unit 36.
The arm rail 32 is arranged such that it does not overlap the first member supply unit 70, the second member supply unit 80, and the stage 90, when the metal bonding apparatus 1 is viewed from above (in plan view). The arms 34 are extended from the arm rail 32 toward an area in which the first member supply unit 70, the second member supply unit 80, and the stage 90 are arranged. The member holding unit 36 connected to the end portion of the arm 34 is arranged such that it overlaps the stage 90 in a plan view in a state in which the arm 34 is positioned at approximately the center of the arm rail 32. By sliding the arm 34 along the arm rail 32, such an arrangement is capable of moving the member holding unit 36 from a position above the stage 90 to a position above the first member supply unit 70 or otherwise the second member supply unit 80. It should be noted that the two arms 34 are configured to be slidable independently of each other along the arm rail 32.
Both ends of the arm rail 32 are respectively connected to rail support units 38. Each rail support unit 38 is configured in an approximately L shape as viewed from the side of the apparatus. The rail support unit 38 is arranged such that one of its ends is fixed to the end portion of the arm rail 32, and the other of its ends is positioned below on the rear side of the apparatus relative to the arm rail 32. The rail support unit 38 is arranged such that the aforementioned other end is connected to a driving mechanism (not shown) housed within the casing 2, which allows the rail support units 38 to be moved along the vertical direction of the apparatus. By moving the positions of the rail support units 38 along the vertical direction of the apparatus, such an arrangement is capable of moving the arm rail 32, the arms 34, and the member holding units 36 along the vertical direction of the apparatus according to the displacement of the rail support units 38. Thus, such an arrangement allows the end portion of each member holding unit 36 to approach and retract from the first member supply unit 70, the second member supply unit 80, or otherwise the stage 90.
With such a metal bonding apparatus 1, the arm 34 is slid toward the first member supply unit 70 side, and the rail support units 38 are moved downward relative to the apparatus, so as to move the member holding unit 36 such that its end approaches the first member supply unit 70, and the first member 200 stored in the first member supply unit 70 is held by means of vacuum contact. Subsequently, the rail support units 38 are moved upward relative to the apparatus such that the end portion of the member holding unit 36 retracts from the first member supply unit 70, and the arm 34 is slid toward the stage 90 side. Subsequently, the metal bonding apparatus 1 instructs the rail support units 38 to move downward relative to the apparatus such that the end portion of the member holding unit 36 approaches the stage 90, so as to mount, on the stage 90, the first member 200 held by the member holding unit 36 by means of vacuum contact. In the same way, such an arrangement is capable of transferring the second member 210 from the second member supply unit 80 to the stage 90. Thus, with the present embodiment, the arm rail 32, the arms 34, the member holding unit 36, and the rail support units 38 compose a first transfer unit configured to transfer the first member 200 having the first bonding portion 202 to the stage 90, and a second transfer unit configured to transfer the second member 210 having the second bonding portion 212 to the stage 90.
Furthermore, by moving the positions of the rail support units 38 downward relative to the apparatus in a state in which the first member 200 is mounted on the stage 90 and the second member 210 is held by the member holding unit 36, such an arrangement is capable of applying pressure to the first bonding portion 202 and the second bonding portion 212 in a direction in which the distance between the first bonding portion 202 of the first member 200 and the second bonding portion 212 of the second member 210 is reduced. Thus, with the present embodiment, the arm rail 32, the arms 34, the member holding units 36, and the rail support units 38 compose the pressing unit 30.
A solution tank 12 is fixedly mounted on the rail support units 38. Two solution supply tubes 14 are arranged such that one end of each solution supply tube 14 is connected to the solution tank 12. Furthermore, the two solution supply tubes 14 are arranged such that the other end of each solution supply tube 14 extends up to a position in the vicinity of the end portion of the member holding unit 36. A nozzle 16 is provided to the aforementioned other end of each solution supply tube 14. With the present embodiment, each nozzle 16 has a dropper structure. Each nozzle 16 is connected to the arm 18 connected to the driving mechanism (not shown) housed in the casing 2. Each arm 18 allows the nozzle 16 to approach and retract from the bonding region in which the first bonding portion 202 and the second bonding portion 212 are to be bonded. A solution retained in the solution tank 12 is dropped from the nozzle 16 via the solution supply tube 14 in a state in which the nozzle 16 is positioned in the vicinity of the bonding region on the stage in which the first bonding portion 202 and the second bonding portion 212 are to be bonded. With such an arrangement, the solution is supplied to at least one of the first bonding portion 202 or the second bonding portion 212. Thus, with the present embodiment, the solution tank 12, the solution supply tubes 14, the nozzles 16, and the arms 18 compose the solution supply unit 10.
Next, description will be made regarding the operation of the metal bonding apparatus 1 according to the present embodiment.
As shown in
Provided that the first base portion 204 and the second base portion 214 are formed of copper-based metal, the forms of the first base portion 204 and the second base portion 214 are not restricted in particular. For example, the first base portion 204 and the second base portion 214 may each be configured as a deposited layer formed of copper on a substrate such as a silicon substrate using a sputtering method or the like. Also, the first base portion 204 and the second base portion 214 may each be configured as an external terminal portion of a wiring layer formed by patterning a copper sheet such as a copper foil. Specifically, the first coating portion 206 and the second coating portion 216 are each configured as a thin film formed of Cu2O, CuO, or the like, and each having a thickness of 10 nm, for example. The first coating portion 206 and the second coating portion 216 may each be configured as an artificial coating film or a natural coating film. With the present embodiment, the first coating portion 206 and the second coating portion 216 are each configured as a natural oxide film, which is formed by oxidation of copper in the atmosphere.
Next, as shown in
Next, as shown in
The metal bonding apparatus 1 further moves the member holding unit 36 such that it approaches the stage 90, so as to apply pressure to the first bonding portion 202 and the second bonding portion 212 such that the distance between them is reduced (see (ii-3) in
In such a state in which the first bonding portion 202 and the second bonding portion 212 are pressed in contact with each other, the metal bonding apparatus 1 heats the second bonding portion 212, the solution 11, and the first bonding portion 202 at a relatively low temperature of 200° C. to 300° C. With the present embodiment, the heating provides evaporation of water. Furthermore, the heating provides thermal decomposition of the thermo-degradable tetraamine copper complex ion, thereby providing evaporation of the ammonia component. This gradually increases the concentration of copper contained in the solution 11. Furthermore, pressing by means of the pressing unit 30 gradually reduces the distance between the outermost face of the first bonding portion 202 and the outermost face of the second bonding portion 212.
Next, as shown in
With the metal bonding apparatus 1 described above, the first coating portion 206 and the second coating portion 216 are eluted into the solution 11, thereby exposing copper on the bonding face of each of the first bonding portion 202 and the second bonding portion 212. In other words, the bonding face of the first bonding portion 202 and the bonding face of the second bonding portion 212 are activated. After the bonding face of the first bonding portion 202 and the bonding face of the second bonding portion 212 are activated, bonding is performed by means of solid-phase diffusion of the copper thus exposed. Thus, such an arrangement provides copper-copper bonding at a relatively low temperature. In addition, such an arrangement provides copper-copper bonding at a relatively low pressure. Thus, such an arrangement reduces the risk of damage that can occur at the first bonding portion 202 and the second bonding portion 212. Furthermore, such an arrangement suppresses the occurrence of voids or byproducts between the respective bonding faces of the first bonding portion 202 and the second bonding portion 212, thereby providing improved reliability of connection between the first bonding portion 202 and the second bonding portion 212.
Furthermore, the solution 11 is dropped from the nozzle 16 that is moved such that it approaches the bonding region between the first bonding portion 202 and the second bonding portion 212. Thus, such an arrangement is capable of locally supplying an appropriate amount of the solution 11. Thus, such an arrangement prevents the solution 11 from scattering, thereby avoiding a problem of corrosion of the first member 200 and the second member 210. Furthermore, such an arrangement is capable of preventing an increase in the bonding time due to an excess supply of the solution 11.
With the metal bonding apparatus 1 according to the aforementioned embodiment 1, ammonia water is used as the solution 11 to be used for metal bonding. However, the present invention is not restricted to such an arrangement. Rather, a desired solution may be employed provided that the solution contains a ligand that can form a complex with copper. Examples of such a solution include a carboxylic acid aqueous solution.
Examples of carboxylic acids used to prepare such a carboxylic acid aqueous solution include: monocarboxylic acid such as acetic acid, and the like; dicarboxylic acid such as oxalic acid, malonic acid, succinic acid, glutaric acid, phthalic acid, maleic acid, and the like; and oxycarboxylic acid such as tartaric acid, citric acid, lactic acid, salicylic acid, and the like.
With such an arrangement, such a carboxylic acid aqueous solution preferably contains carboxylic acid which is able to function as a multidentate ligand. With such a carboxylic acid aqueous solution containing carboxylic acid which is able to function as a multidentate ligand, such a carboxylic acid provides at least two coordinate bonds that bond a single copper ion, and forms a chelate, thereby generating a copper complex having markedly improved stability. As a result, such an arrangement is capable of reducing the temperature required for the bonding. It should be noted that the fact that tartaric acid forms a chelate is described in “The Iwanami Dictionary of Physics and Chemistry”, 4th ed., p. 593 (Iwanami Shoten). Also, the fact that tartaric acid, oxalic acid, etc., each forms a chelate is described in “Inorganic chemistry”, Vol. 2, p. 666, written by R. B. Heslop, K. Jones, translated by Yoshihiko Saito. Here, chelation represents a reaction in which a multidentate ligand forms a ring, thereby generating a complex having markedly improved stability.
A metal bonding test was performed using an acetic acid solution (acetic acid concentration of 10% by weight) and an oxalic acid solution (oxalic acid concentration of 10% by weight). It should be noted that bonding was performed at a pressure of 1 MPa.
With the bonding using an acetic acid solution containing monocarboxylic acid, when the bonding was performed at a bonding temperature of 150° C., such an arrangement exhibited a shear stress of 25 MPa or more, i.e., provided a sufficient bonding strength. However, when the bonding was performed at a bonding temperature of 125° C., such an arrangement was not capable of providing such sufficient bonding strength.
In contrast, with the bonding using an oxalic acid solution containing dicarboxylic acid, such an arrangement exhibited a shear stress of 25 MPa or more, i.e., provided sufficient bonding strength even if the bonding was performed under a low temperature condition of 125° C. However, when the bonding was performed at a further reduced temperature of 100° C., such an arrangement was not capable of providing a sufficient bonding strength.
As a result of the aforementioned bonding test, it has been confirmed that, by employing an oxalic acid solution that forms a chelate with a copper ion, such an arrangement provides bonding even if the bonding temperature is reduced to on the order of 125° C. It is difficult for conventional techniques to provide metal bonding under such a low-temperature condition. Thus, it can be said that metal bonding under such a low-temperature condition is one of the features of the present metal bonding technique. The present metal bonding technique is expected to be widely applied in the future in various kinds of fields, in addition to electronic component bonding.
Various kinds of modifications as described below will be made regarding the metal bonding apparatus 1 according to the aforementioned embodiment 1.
With the metal bonding apparatus 1 according to a modification 1, the solution supply unit 10 includes a spray nozzle configured to spray the solution 11 onto at least one of the first bonding portion 202 or the second bonding portion 212. That is to say, with the present modification, the nozzle 16 is configured as a spray nozzle. Description will be made below regarding the metal bonding apparatus 1 according to the modification 1 with reference to
As shown in
Next, as shown in
With the present embodiment, the nozzle 16 is configured as a spray nozzle. Thus, such an arrangement allows the surface of the first coating portion 206 or the surface of the second coating portion 216 to be coated with the solution 11 with high uniformity. Furthermore, such an arrangement suppresses excess coating of the surface of the coating portion with the solution 11.
The metal bonding apparatus 1 according to a modification 2 includes an inkjet nozzle configured to discharge the solution 11 onto at least one of the first bonding portion 202 or the second bonding portion 212. That is to say, with the present modification, the nozzle 16 is configured as an inkjet nozzle. Description will be made below regarding the metal bonding apparatus 1 according to the modification 2 with reference to
As shown in
Next, as shown in
With the present modification, the nozzle 16 is configured as an inkjet nozzle. Thus, such an arrangement is capable of providing a solution-coated region having various kinds of shapes according to the shape of the first bonding portion 202 or the shape of the second bonding portion 212.
The metal bonding apparatus 1 according to a modification 3 includes a shower head configured to disperse the solution 11 onto at least one of the first bonding portion 202 or the second bonding portion 212. That is to say, with the present modification, the nozzle 16 is configured as a shower head. Description will be made below regarding the metal bonding apparatus 1 according to the modification 3 with reference to
As shown in
Next, as shown in
With the present modification, the nozzle 16 is configured as a shower head. Thus, such an arrangement is preferably employed in a case in which the region to be coated with the solution 11 is relatively large.
The metal bonding apparatus 1 according to a modification 4 includes a partition that encloses at least one of the region of the first bonding portion 202 or the region of the second bonding portion 212 onto which the solution 11 is to be supplied, and is configured to supply the solution 11 to the region enclosed by the partition. Description will be made below regarding the metal bonding apparatus 1 according to the modification 4 with reference to
As shown in
With the present modification, the region to which the solution 11 is to be supplied is enclosed by the partition 17. Thus, only the region to be coated with the solution 11, i.e., only the bonding portion, is coated with the solution 11. That is to say, such an arrangement is capable of preventing the solution 11 from spattering to other regions.
With the metal bonding apparatus 1 according to a modification 5, the solution supply unit 10 includes a container for the solution 11. The metal bonding apparatus 1 is configured to bring at least one of the first bonding portion 202 or the second bonding portion 212 into contact with the solution 11 stored in the container. Description will be made regarding the metal bonding apparatus 1 according to the modification 5 with reference to
As shown in
Next, as shown in
Next, as shown in
With the present modification, either the first bonding portion 202 or the second bonding portion 212 is immersed in the container storing the solution 11 so as to coat the bonding portion with the solution 11. Thus, such an arrangement allows the solution supply unit 10 to have a simple configuration.
With the metal bonding apparatus 1 according to the modification 6, the solution bonding apparatus 10 includes a soft porous body which is to be impregnated with the solution 11. The metal bonding apparatus 1 is configured to press the porous body, with which the solution 11 is impregnated, into contact with at least one of the first bonding portion 202 or the second bonding portion 212. Description will be made below regarding the metal bonding apparatus 1 according to the modification 6 with reference to
As shown in
Next, as shown in
Next, as shown in
With the present modification, the porous body 20 impregnated with the solution 11 is introduced between the first bonding portion 202 and the second bonding portion 212 so as to coat them with the solution 11. Thus, such an arrangement allows the solution supply unit 10 to have a simple configuration.
A metal bonding apparatus according to an embodiment 2 is configured as a handheld apparatus. Description will be made below regarding the metal bonding apparatus 1 according to the embodiment 2 with reference to
The metal bonding apparatus 1 according to the present embodiment includes a first arm 100 and a second arm 110. The second arm 110 is arranged such that one end 110a side thereof is rotatably connected to one end 100a side of the first arm 100. With the present embodiment, the one end 100a side of the first arm 100 and the one end 110a side of the second arm 110 are connected to each other by means of a movable unit 102 such as a hinge or the like such that they can be turned relative to one another. Thus, the first arm 100 and the second arm 110 can be operated such that the other end 100b side of the first arm 100 and the other end 110b side of the second arm 110 are moved relative to one another, i.e., such that they approach each other or otherwise move away from each other.
A base pair 120 is provided to the faces of the other end 100b side of the first arm 100 and the other end 110b side of the second arm 110 that face each other. The base pair 120 includes a first base 122 provided to the first arm 100 and a second base 124 provided to the second arm 110. In a state in which the first arm 100 and the second arm 110 are not operated, a space is defined by the base pair 120, which allows the first bonding portion 202 and the second bonding portion 212 to be inserted. By turning the first arm 100 and the second arm 110 relative to one another with the movable unit 102 as an axis such that the other end 100b side of the first arm 100 approaches the other end 110b side of the second arm 110, such an arrangement is capable of applying pressure to the first bonding portion 202 and the second bonding portion 212 inserted into the space between the first base 122 and the second base 124. Thus, with the metal bonding apparatus 1 according to the present embodiment, a pressing unit 30 comprises the first arm 100, the second arm 110, and the base pair 120.
The first base 122 and the second base 124 of the base pair 120 each include a heater. Thus, such an arrangement allows the first bonding portion 202 and the second bonding portion 212 thus inserted to be heated by means of the first base 122 and the second base 124. Thus, with the metal bonding apparatus 1 according to the present embodiment, the base pair 120 functions as a heating unit 50.
A solution tank 12 is provided to the face of the end 100a of the first arm 100 that is opposite to the second arm 110. A solution inlet 12a is provided to the solution tank 12, which allows the solution 11 to be supplied to the tank. Furthermore, a nozzle 16 is provided to the other end 100b side of the first arm 100. The nozzle 16 is configured to supply the solution 11 stored in the solution tank 12 to at least the first bonding portion 202 or the second bonding portion 212 inserted in the space between the first base 122 and the second base 124. The solution tank 12 and the nozzle 16 are connected to each other by means of a solution supply tube 14 provided within the first arm 100.
Furthermore, a control unit 7 is provided to the face of the first arm 100 that is opposite to the second arm 110 such that it is arranged adjacent to the solution tank 12. An operating unit 6 and a solution supply button 8 are provided to the top face of the control unit 7. The operating unit 6 may have a display function of displaying the setting temperature, the remaining amount of the solution, and so forth. That is to say, a monitor 4 may be built into the operating unit 6. By pressing the solution supply button 8, such an arrangement allows the solution 11 stored in the solution tank 12 to be discharged via the nozzle 16.
The operating method for the metal bonding apparatus 1 according to the present embodiment is as follows, for example. First, the user holds the metal bonding apparatus 1, and inserts the first bonding portion 202 (see
The pressing operation of the metal bonding apparatus 1 according to the present embodiment is similar to that of a stapler. That is to say, such an arrangement allows the user to perform a gripping operation such that the first arm 100 and the second arm 110 approach each other with the movable unit 102 as an axis, thereby providing such a pressing operation. Alternatively, such an arrangement allows the user to press the first arm 100 downward with the movable unit 102 as an axis with the second arm 110 being fixedly placed on a desk or the like, thereby providing such a pressing operation.
With the metal bonding apparatus 1 according to the embodiment 2 described above, such an arrangement provides the same advantages as those of the embodiment 1.
The present invention is not restricted to the aforementioned embodiments. Also, various kinds of modifications such as design modifications may be made based on the knowledge of those skilled in this art, which are also encompassed within the technical scope of the present invention.
Description has been made in the aforementioned embodiments regarding an arrangement in which the first bonding portion and the second bonding portion are each formed of copper. Also, either one of or both of the first bonding portion and the second bonding portion may be formed of a metal other than copper. For example, an arrangement may be made in which the first bonding portion is formed of copper, and the second bonding portion is formed of aluminum. Also, an arrangement may be made in which the first bonding portion is formed of iron, and the second bonding portion is formed of aluminum.
Description has been made in the aforementioned embodiments regarding an arrangement in which heating and pressing is performed so as to provide metal bonding of the first bonding portion and the second bonding portion. Also, ultrasonic waves may be applied instead of heating or pressing. Also, either the heating or pressing may be replaced by applying ultrasonic waves. Also, ultrasonic waves may be applied in addition to the heating and pressing.
It should be noted that the invention according to the present embodiments may be specified according to the items described below.
a solution supply unit configured to supply a solution which is able to elute an oxide with copper oxide as a principal component, to at least one of a first bonding portion and a second bonding portion;
a pressing unit configured to apply pressure to the first bonding portion and the second bonding portion so as to sandwich the solution between the first bonding portion and the second bonding portion, and in a direction in which a distance between the first bonding portion and the second bonding portion is reduced; and
a heating unit configured to heat the first bonding portion and the second bonding portion,
wherein the first bonding portion and the second bonding portion are bonded by the pressure applied by the pressing unit and the heat from the heating unit.
wherein the first bonding portion comprises a first base portion formed of a metal with copper as a principal component and the first coating portion formed of an oxide with copper oxide as a principal component and configured to coat a surface of the first base portion,
wherein the second bonding portion comprises a second base portion formed of a metal with copper as a principal component and the second coating portion formed of an oxide with copper oxide as a principal component and configured to coat a surface of the second base portion, and
wherein the solution supply unit supplies the solution to at least one of the first coating portion and the second coating portion.
and wherein at least one from among the first bonding portion and the second bonding portion is brought into contact with the solution stored in the container.
a stage on which pressure and heat are applied to the first bonding portion and the second bonding portion;
a first transfer unit configured to transfer a first member having the first bonding portion to the stage; and
a second transfer unit configured to transfer a second member having the second bonding portion to the stage.
a first arm; and
a second arm arranged such that one end side thereof is rotatably connected to one end side of the first arm, and configured to be operated such that the other end side thereof approaches the other end side of the first arm,
wherein the pressing unit comprises a pair of bases respectively provided to a face of the first arm on the other end side and a face of the second arm on the other end side that respectively face each other,
and wherein the pair of bases defines a space which allows the first bonding portion and the second bonding portion to be inserted,
and wherein, by operating the first arm and the second arm such that the other end sides thereof approach each other, the first bonding portion and the second bonding portion inserted into the space are pressed.
a solution tank provided to the first arm; and
a nozzle arranged on the other end side of the first arm, and configured to supply the solution stored in the solution tank to at least one from among of the first bonding portion and the second bonding portion inserted into the space.
[Item 14] A metal bonding apparatus according to Item 12 or 13, wherein the heating unit comprises heaters housed in the pair of bases.
a solution supply unit configured to supply a solution which is able to elute an oxide with copper oxide as a principal component, to at least one from among a first coating portion of a first bonding portion that comprises a first base portion formed of a metal with copper as a principal component and the first coating portion formed of an oxide with copper oxide as a principal component and configured to coat a surface of the first base portion, and a second coating portion of a second bonding portion that comprises a second base portion formed of a metal with copper as a principal component and the second coating portion formed of an oxide with copper oxide as a principal component and configured to coat a surface of the second base portion;
a pressing unit configured to apply pressure to the first bonding portion and the second bonding portion in a direction in which a distance between the first bonding portion and the second bonding portion is reduced; and
a heating unit configured to heat the first bonding portion and the second bonding portion,
wherein, in a state in which the first bonding portion and the second bonding portion are pressed and heated, copper on the first bonding portion and copper on the second bonding portion exposed by the solution are bonded to each other.
| Number | Date | Country | Kind |
|---|---|---|---|
| 2011-189244 | Aug 2011 | JP | national |
This application is a Continuation of International Application No. PCT/JP2012/005425, filed on Aug. 29, 2012, which in turn claims the benefit of Japanese Application No. 2011-189244, filed on Aug. 31, 2011, the disclosures of which Applications are incorporated by reference herein.
| Number | Date | Country | |
|---|---|---|---|
| Parent | PCT/JP2012/005425 | Aug 2012 | US |
| Child | 13772208 | US |
