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  • CPC
  • H01L2224/7701
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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/7701Means for cleaning
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Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    METAL BONDING APPARATUS
    • Publication number 20130284794
    • Publication date Oct 31, 2013
    • Sanyo Electric Co., Ltd.
    • Takashi SUZUKI
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR