Claims
- 1. A ferrite device comprising:
- a ferrite substrate having a first composition including at least two metal elements in a first ratio and oxygen; and
- a metallized surface region integral with said ferrite substrate and having a second composition including said at least two metal elements in said first ratio but differing from said first composition with respect to oxygen, at least a portion of said metallized region being formed from at least a portion of said ferrite substrate, said metallized surface region comprising a reduced portion of the ferrite substrate.
- 2. A ferrite device according to claim 1 wherein the metallized surface region is patterned to create conductive windings and the ferrite substrate is positioned as the core of the conductive windings.
- 3. A ferrite device according to claim 2 wherein the windings define an inductor.
- 4. A ferrite device according to claim 2 wherein the windings define a transformer.
- 5. A ferrite device according to claim 1 further comprising a deposited metal layer on said metallized surface region.
- 6. A ferrite device according to claim 5 wherein the deposited metal layer is selected from copper, nickel, and zinc.
- 7. The apparatus as recited in claim 1 further comprising a graded interface formed between the ferrite substrate and the metallized surface region and integral therewith, the graded interface comprising partially-reduced ferrite and unreacted ferrite.
Parent Case Info
This application is a continuation of application Ser. No. 08/268487, filed on Jun. 30, 1994, now abandoned.
US Referenced Citations (11)
Continuations (1)
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Number |
Date |
Country |
Parent |
268487 |
Jun 1994 |
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