Number | Name | Date | Kind |
---|---|---|---|
5264377 | Chesire et al. | Nov 1993 | A |
5477082 | Buckley et al. | Dec 1995 | A |
5497076 | Kuo et al. | Mar 1996 | A |
5514974 | Bouldin | May 1996 | A |
5801394 | Isobe | Sep 1998 | A |
5874777 | Ohmi et al. | Feb 1999 | A |
5900735 | Yamamoto | May 1999 | A |
5930587 | Ryan | Jul 1999 | A |
6069070 | Labunov et al. | May 2000 | A |
6091080 | Usui | Jul 2000 | A |
6147361 | Lin et al. | Nov 2000 | A |
Number | Date | Country |
---|---|---|
9074121 | Mar 1997 | JP |
11214628 | Aug 1999 | JP |
11260878 | Sep 1999 | JP |
Entry |
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Tom C. Lee, Deborah Tibel, Timothy D. Sullivan, and Sheri Forhan, “Comparison of Isothermal, Constant Current and SWEAT Wafer Level EM Testing Methods,”. |
Deborah Tibel, Timothy D. Sullivan, “Comparison of Via/Line Package Level Vs. Wafer Level Results”. |