Measuring of material aspects

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CPC
G01R31/2858

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GPHYSICS G01Measuring instruments G01RMEASURING ELECTRIC VARIABLES MEASURING MAGNETIC VARIABLES G01R31/00Arrangements for testing electric properties Arrangements for locating electric faults Arrangements for electrical testing characterised by what is being tested not provided for elsewhere

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G01R31/2858Measuring of material aspects

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor product with edge integrity detection structure
- Patent number 12,216,153
- Issue date Feb 4, 2025
- Avago Technologies International Sales Pte. Limited
- Xiaoming Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
In-situ testing system for semiconductor device in aerospace irradi...
- Patent number 12,146,908
- Issue date Nov 19, 2024
- Nanjing University
- Feng Zhou
- G01 - MEASURING TESTING
Information Patent Grant
Method and testing apparatus related to wafer testing
- Patent number 12,013,431
- Issue date Jun 18, 2024
- NANYA TECHNOLOGY CORPORATION
- Ting Wei Yu
- G01 - MEASURING TESTING
Information Patent Grant
Method for evaluating hot carrier injection effect of device
- Patent number 11,860,220
- Issue date Jan 2, 2024
- Changxin Memory Technologies, Inc.
- QiAn Xu
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor testkey pattern and test method thereof
- Patent number 11,721,599
- Issue date Aug 8, 2023
- United Semiconductor (Xiamen) Co., Ltd.
- Linshan Yuan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for determining the resistance temperature characteristic of...
- Patent number 11,262,393
- Issue date Mar 1, 2022
- BorgWarner Ludwigsburg GmbH
- Karsten Volland
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electromigration sign-off tool
- Patent number 11,182,528
- Issue date Nov 23, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Tseng Hsien
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electromigration test structures for void localization
- Patent number 11,099,230
- Issue date Aug 24, 2021
- International Business Machines Corporation
- Baozhen Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
On-die reliability monitor for integrated circuit
- Patent number 11,099,232
- Issue date Aug 24, 2021
- Intel Corporation
- Suriya Ashok Kumar
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Die edge integrity monitoring system
- Patent number 10,964,611
- Issue date Mar 30, 2021
- Melexis Technologies NV
- Gunnar Munder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded photodetector as device health monitor for hot carrier inj...
- Patent number 10,928,438
- Issue date Feb 23, 2021
- International Business Machines Corporation
- Justin E. Henspeter
- G01 - MEASURING TESTING
Information Patent Grant
Die edge integrity monitoring system
- Patent number 10,811,327
- Issue date Oct 20, 2020
- Melexis Technologies NV
- Gunnar Munder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electromigration monitor
- Patent number 10,794,948
- Issue date Oct 6, 2020
- International Business Machines Corporation
- Fen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and device of remaining life prediction for electromigration...
- Patent number 10,732,216
- Issue date Aug 4, 2020
- Fifth Electronics Research Institute of Ministry of Industry and Information...
- Yiqiang Chen
- G01 - MEASURING TESTING
Information Patent Grant
Electromigration sign-off tool
- Patent number 10,719,652
- Issue date Jul 21, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Tseng Hsien
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Assembly of strip conductors, device, and method for determining er...
- Patent number 10,684,323
- Issue date Jun 16, 2020
- Robert Bosch GmbH
- Franz Dietz
- G01 - MEASURING TESTING
Information Patent Grant
Electromigration monitor
- Patent number 10,677,833
- Issue date Jun 9, 2020
- International Business Machines Corporation
- Fen Chen
- G01 - MEASURING TESTING
Information Patent Grant
Crack sensor including polymer for healing cracks and electronic de...
- Patent number 10,670,655
- Issue date Jun 2, 2020
- Research & Business Foundation Sungkyunkwan University
- Tae Il Kim
- G01 - MEASURING TESTING
Information Patent Grant
Apparatuses including test segment circuits having latch circuits f...
- Patent number 10,663,513
- Issue date May 26, 2020
- Micron Technology, Inc.
- Kevin G. Werhane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for monitoring and predicting reliability of a...
- Patent number 10,634,714
- Issue date Apr 28, 2020
- Intel Corporation
- Huy Le
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Method for estimating an operating profile of an integrated circuit...
- Patent number 10,634,715
- Issue date Apr 28, 2020
- STMicroelectronics (Crolles 2) SAS
- Vincent Huard
- G01 - MEASURING TESTING
Information Patent Grant
Die edge crack and delamination detection
- Patent number 10,629,504
- Issue date Apr 21, 2020
- Avago Technologies International Sales Pte. Limited
- Ennis T. Ogawa
- G01 - MEASURING TESTING
Information Patent Grant
Method and apparatus for integrated circuit monitoring and preventi...
- Patent number 10,591,531
- Issue date Mar 17, 2020
- QUALCOMM Incorporated
- Rajit Chandra
- G01 - MEASURING TESTING
Information Patent Grant
Method of assessing semiconductor substrate and method of assessing...
- Patent number 10,586,699
- Issue date Mar 10, 2020
- Disco Corporation
- Youngsuk Kim
- G01 - MEASURING TESTING
Information Patent Grant
EM-compliance topology in a tree router
- Patent number 10,551,431
- Issue date Feb 4, 2020
- Cadence Design Systems, Inc.
- Chung-Do Yang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
IC degradation management circuit, system and method
- Patent number 10,514,417
- Issue date Dec 24, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Po-Zeng Kang
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Parallel test structure
- Patent number 10,475,677
- Issue date Nov 12, 2019
- GLOBALFOUNDRIES Inc.
- Tian Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electromigration sign-off methodology
- Patent number 10,346,576
- Issue date Jul 9, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Tseng Hsien
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method for estimating an operating profile of an integrated circuit...
- Patent number 10,302,693
- Issue date May 28, 2019
- STMicroelectronics (Crolles 2) SAS
- Vincent Huard
- G01 - MEASURING TESTING
Information Patent Grant
Electromigration wearout detection circuits
- Patent number 10,295,589
- Issue date May 21, 2019
- International Business Machines Corporation
- Keith A. Jenkins
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER

Patents Applicationslast 30 patents

Information Patent Application
FAST LEARNING-BASED ELECTROMIGRATION ANALYSIS FOR MULTI-SEGMENT INT...
- Publication number 20240329117
- Publication date Oct 3, 2024
- The Regents of the University of California
- Sheldon X. D. Tan
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR PRODUCT WITH EDGE INTEGRITY DETECTION STRUCTURE
- Publication number 20230296664
- Publication date Sep 21, 2023
- Avago Technologies International Sales Pte. Limited
- Xiaoming Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND TESTING APPARATUS RELATED TO WAFER TESTING
- Publication number 20220404414
- Publication date Dec 22, 2022
- NANYA TECHNOLOGY CORPORATION
- Ting Wei Yu
- G01 - MEASURING TESTING
Information Patent Application
METHOD FOR EVALUATING HOT CARRIER INJECTION EFFECT OF DEVICE
- Publication number 20210333318
- Publication date Oct 28, 2021
- CHANGXIN MEMORY TECHNOLOGIES, INC
- QiAn XU
- G01 - MEASURING TESTING
Information Patent Application
ELECTROMIGRATION SIGN-OFF TOOL
- Publication number 20200342156
- Publication date Oct 29, 2020
- Taiwan Semiconductor Manufacturing Co., LTD
- Yu-Tseng Hsien
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
DIE EDGE INTEGRITY MONITORING SYSTEM
- Publication number 20200144139
- Publication date May 7, 2020
- MELEXIS TECHNOLOGIES NV
- Gunnar MUNDER
- G01 - MEASURING TESTING
Information Patent Application
ELECTROMIGRATION SIGN-OFF TOOL
- Publication number 20190325105
- Publication date Oct 24, 2019
- Taiwan Semiconductor Manufacturing Co., LTD
- Yu-Tseng Hsien
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD FOR ESTIMATING AN OPERATING PROFILE OF AN INTEGRATED CIRCUIT...
- Publication number 20190285694
- Publication date Sep 19, 2019
- STMicroelectronics (Crolles 2) SAS
- Vincent Huard
- G01 - MEASURING TESTING
Information Patent Application
IC DEGRADATION MANAGEMENT CIRCUIT, SYSTEM AND METHOD
- Publication number 20190195943
- Publication date Jun 27, 2019
- Taiwan Semiconductor Manufacturing Co., LTD
- Po-Zeng KANG
- G01 - MEASURING TESTING
Information Patent Application
ELECTROMIGRATION TEST STRUCTURES FOR VOID LOCALIZATION
- Publication number 20190162775
- Publication date May 30, 2019
- International Business Machines Corporation
- Baozhen Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROMIGRATION SIGN-OFF METHODOLOGY
- Publication number 20180330036
- Publication date Nov 15, 2018
- Taiwan Semiconductor Manufacturing Co., LTD
- Yu-Tseng Hsien
- G01 - MEASURING TESTING
Information Patent Application
ELECTROMIGRATION MONITOR
- Publication number 20180299503
- Publication date Oct 18, 2018
- International Business Machines Corporation
- David M. FRIEND
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
DEVICE FOR ATTACHING A SEMICONDUCTOR DEVICE TO A CIRCUIT BOARD
- Publication number 20180284152
- Publication date Oct 4, 2018
- Advanced Semiconductor Engineering, Inc.
- Heng Yu KUNG
- G01 - MEASURING TESTING
Information Patent Application
CRACK SENSOR INCLUDING POLYMER FOR HEALING CRACKS AND ELECTRONIC DE...
- Publication number 20180246165
- Publication date Aug 30, 2018
- Research & Business Foundation Sungkyunkwan University
- Tae Il KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and Device of Remaining Life Prediction for Electromigration...
- Publication number 20180188316
- Publication date Jul 5, 2018
- Fifth Electronics Research Institute of Ministry of Industry and Information...
- Yiqiang Chen
- G01 - MEASURING TESTING
Information Patent Application
DIE EDGE INTEGRITY MONITORING SYSTEM
- Publication number 20180145002
- Publication date May 24, 2018
- MELEXIS TECHNOLOGIES NV
- Gunnar MUNDER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ASSEMBLY OF CONDUCTING TRACKS, DEVICE, AND METHOD FOR THE FAULT DET...
- Publication number 20180143243
- Publication date May 24, 2018
- ROBERT BOSCH GmbH
- Franz Dietz
- G01 - MEASURING TESTING
Information Patent Application
Voltage Rail Monitoring to Detect Electromigration
- Publication number 20180074109
- Publication date Mar 15, 2018
- International Business Machines Corporation
- David D. Cadigan
- G01 - MEASURING TESTING
Information Patent Application
METHOD FOR ESTIMATING AN OPERATING PROFILE OF AN INTEGRATED CIRCUIT...
- Publication number 20180038907
- Publication date Feb 8, 2018
- STMicroelectronics (Crolles 2) SAS
- Vincent Huard
- G01 - MEASURING TESTING
Information Patent Application
SYSTEMS AND METHODS FOR ELECTRICALLY TESTING ELECTROMIGRATION IN AN...
- Publication number 20170356957
- Publication date Dec 14, 2017
- Cascade Microtech, Inc.
- Timothy Allen McMullen
- G01 - MEASURING TESTING
Information Patent Application
IC DEGRADATION MANAGEMENT CIRCUIT, SYSTEM AND METHOD
- Publication number 20170350938
- Publication date Dec 7, 2017
- Taiwan Semiconductor Manufacturing Co., LTD
- Po-Zeng KANG
- G01 - MEASURING TESTING
Information Patent Application
ELECTROMIGRATION WEAROUT DETECTION CIRCUITS
- Publication number 20170269152
- Publication date Sep 21, 2017
- International Business Machines Corporation
- Keith A. Jenkins
- G01 - MEASURING TESTING
Information Patent Application
INTERCONNECT RELIABILITY STRUCTURES
- Publication number 20170242067
- Publication date Aug 24, 2017
- GLOBALFOUNDRIES Inc.
- Ping-Chuan Wang
- G01 - MEASURING TESTING
Information Patent Application
APPARATUS AND METHOD FOR MONITORING AND PREDICTING RELIABILITY OF A...
- Publication number 20170242068
- Publication date Aug 24, 2017
- Intel Corporation
- Huy Le
- G01 - MEASURING TESTING
Information Patent Application
Voltage Rail Monitoring to Detect Electromigration
- Publication number 20170219648
- Publication date Aug 3, 2017
- International Business Machines Corporation
- David D. Cadigan
- G01 - MEASURING TESTING
Information Patent Application
RESISTANCE MEASUREMENT-DEPENDENT INTEGRATED CIRCUIT CHIP RELIABILIT...
- Publication number 20170212165
- Publication date Jul 27, 2017
- GLOBALFOUNDRIES INC.
- Jeanne P. Bickford
- G01 - MEASURING TESTING
Information Patent Application
SYSTEMS AND METHODS FOR INTERCONNECT SIMULATION AND CHARACTERIZATION
- Publication number 20170162454
- Publication date Jun 8, 2017
- Blake Rogers
- G01 - MEASURING TESTING
Information Patent Application
ON-CHIP SENSOR FOR MONITORING ACTIVE CIRCUITS ON INTEGRATED CIRCUIT...
- Publication number 20170146592
- Publication date May 25, 2017
- GLOBALFOUNDRIES INC.
- Gregory G. Freeman
- G01 - MEASURING TESTING
Information Patent Application
PULSED CURRENT SOURCE WITH INTERNAL IMPEDANCE MATCHING
- Publication number 20170131327
- Publication date May 11, 2017
- QUALITAU, INC.
- Jens ULLMANN
- G01 - MEASURING TESTING
Information Patent Application
PULSED CURRENT SOURCE WITH INTERNAL IMPEDANCE MATCHING
- Publication number 20170131326
- Publication date May 11, 2017
- QUALITAU, INC.
- Jens Ullmann
- G01 - MEASURING TESTING

Measuring of material aspects

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor product with edge integrity detection structure

In-situ testing system for semiconductor device in aerospace irradi...

Method and testing apparatus related to wafer testing

Method for evaluating hot carrier injection effect of device

Semiconductor testkey pattern and test method thereof

Method for determining the resistance temperature characteristic of...

Electromigration sign-off tool

Electromigration test structures for void localization

On-die reliability monitor for integrated circuit

Die edge integrity monitoring system

Embedded photodetector as device health monitor for hot carrier inj...

Die edge integrity monitoring system

Electromigration monitor

Method and device of remaining life prediction for electromigration...

Electromigration sign-off tool

Assembly of strip conductors, device, and method for determining er...

Electromigration monitor

Crack sensor including polymer for healing cracks and electronic de...

Apparatuses including test segment circuits having latch circuits f...

Apparatus and method for monitoring and predicting reliability of a...

Method for estimating an operating profile of an integrated circuit...

Die edge crack and delamination detection

Method and apparatus for integrated circuit monitoring and preventi...

Method of assessing semiconductor substrate and method of assessing...

EM-compliance topology in a tree router

IC degradation management circuit, system and method

Parallel test structure

Electromigration sign-off methodology

Method for estimating an operating profile of an integrated circuit...

Electromigration wearout detection circuits

Patents Applicationslast 30 patents

FAST LEARNING-BASED ELECTROMIGRATION ANALYSIS FOR MULTI-SEGMENT INT...

SEMICONDUCTOR PRODUCT WITH EDGE INTEGRITY DETECTION STRUCTURE

METHOD AND TESTING APPARATUS RELATED TO WAFER TESTING

METHOD FOR EVALUATING HOT CARRIER INJECTION EFFECT OF DEVICE

ELECTROMIGRATION SIGN-OFF TOOL

DIE EDGE INTEGRITY MONITORING SYSTEM

ELECTROMIGRATION SIGN-OFF TOOL

METHOD FOR ESTIMATING AN OPERATING PROFILE OF AN INTEGRATED CIRCUIT...

IC DEGRADATION MANAGEMENT CIRCUIT, SYSTEM AND METHOD

ELECTROMIGRATION TEST STRUCTURES FOR VOID LOCALIZATION

ELECTROMIGRATION SIGN-OFF METHODOLOGY

ELECTROMIGRATION MONITOR

DEVICE FOR ATTACHING A SEMICONDUCTOR DEVICE TO A CIRCUIT BOARD

CRACK SENSOR INCLUDING POLYMER FOR HEALING CRACKS AND ELECTRONIC DE...

Method and Device of Remaining Life Prediction for Electromigration...

DIE EDGE INTEGRITY MONITORING SYSTEM

ASSEMBLY OF CONDUCTING TRACKS, DEVICE, AND METHOD FOR THE FAULT DET...

Voltage Rail Monitoring to Detect Electromigration

METHOD FOR ESTIMATING AN OPERATING PROFILE OF AN INTEGRATED CIRCUIT...

SYSTEMS AND METHODS FOR ELECTRICALLY TESTING ELECTROMIGRATION IN AN...

IC DEGRADATION MANAGEMENT CIRCUIT, SYSTEM AND METHOD

ELECTROMIGRATION WEAROUT DETECTION CIRCUITS

INTERCONNECT RELIABILITY STRUCTURES

APPARATUS AND METHOD FOR MONITORING AND PREDICTING RELIABILITY OF A...

Voltage Rail Monitoring to Detect Electromigration

RESISTANCE MEASUREMENT-DEPENDENT INTEGRATED CIRCUIT CHIP RELIABILIT...

SYSTEMS AND METHODS FOR INTERCONNECT SIMULATION AND CHARACTERIZATION

ON-CHIP SENSOR FOR MONITORING ACTIVE CIRCUITS ON INTEGRATED CIRCUIT...

PULSED CURRENT SOURCE WITH INTERNAL IMPEDANCE MATCHING

PULSED CURRENT SOURCE WITH INTERNAL IMPEDANCE MATCHING