The invention relates to electronic systems, and more particularly to novel thermal management of devices, including memory devices.
With reference to
Increasing clock speeds and transistor densities are causing temperature regulation challenges for high-performance microprocessors. In many cases, microprocessors are equipped with on-die or on-package temperature sensors to reduce the component activity level in response to elevated temperatures. For example, the clock speed may be reduced to limit the active switching power. Reducing the activity level is sometimes referred to as “throttling.”
Components in the memory subsystem face thermal management issues as well. Direct or indirect temperature sensing and feedback have been proposed for controlling memory temperature. For example, U.S. Patent Publication No. 2002/0143488 describes a system which determines throttle settings using a thermal sensor. PCT Publication No. WO 00/11675 also describes controlling data transmission rates based on a temperature of a component, which in some examples includes a temperature sensor coupled to a memory module. However, the additional cost and complexity of a temperature sensor are less desirable for high-volume memory applications.
Various features of the invention will be apparent from the following description of preferred embodiments as illustrated in the accompanying drawings, in which like reference numerals generally refer to the same parts throughout the drawings. The drawings are not necessarily to scale, the emphasis instead being placed upon illustrating the principles of the invention.
In the following description, for purposes of explanation and not limitation, specific details are set forth such as particular structures, architectures, interfaces, techniques, etc. in order to provide a thorough understanding of the various aspects of the invention. However, it will be apparent to those skilled in the art having the benefit of the present disclosure that the various aspects of the invention may be practiced in other examples that depart from these specific details. In certain instances, descriptions of well known devices, circuits, and methods are omitted so as not to obscure the description of the present invention with unnecessary detail.
In general terms, a memory request access control algorithm, in the absence of direct on-package (or on-module) temperature measurement and feedback, utilizes an estimate to account for the cooling rate (e.g. temperature decay) of the memory devices based on environmental and package characteristics, and the heating rate due to memory access requests (e.g. reads and writes). In most systems, a goal is to permit a large number of granted memory access requests (as a metric of memory system performance), to maintain junction temperatures within desired limits, and to have a low computational impact from the thermal budgeting algorithm.
With reference to
For some embodiments of the present invention, a predicted value of memory device temperature is utilized to control an access request budget, as opposed to an access request counter. For example, an access request budget may be calculated at some large multiple of the access period, and requests are granted until the budget is exhausted. In appropriate circumstances, it is believed that electronic systems utilizing embodiments of the present invention provide higher memory bandwidths than alternate mechanisms while maintaining acceptable junction temperatures of memory devices. For example, it is believed that thermal budgeting according to some embodiments of the invention provides more realistic treatment of actual heating and cooling characteristics of the memory devices as compared to an access request counter.
In general, physical objects reach thermal equilibrium with their surroundings along an exponential curve—i.e., the temperature response to a step-change in external conditions (Eq. 1):
T=T∞+(Ti−T∞)·e−αt (Eq. 1)
Where: T corresponds to temperature as a function of time;
The value for α may be determined, for example, through numerical, experimental, or analytical characterization, and depends upon various factors, including, for example, the thermal conductivity of the memory devices, the approach or device airflow velocity, DIMM pitch, etc. Expanding the term from Eq. 1 for equilibrium temperature (T∞=Ta+P*θja) provides a prediction of memory device temperature in accordance with physical characteristics of device operation (Eq. 2):
T=(Ta+P·θja)+[Ti−(Ta+P·θja)]·e−αt (Eq. 2)
Where: Ta corresponds to an ambient temperature;
According to some embodiments, various assumptions may be made for purposes of simplification. For example, the temperature prediction may not distinguish between active device power, Pactive (related to memory read/write activity) and standby power, Pstandby (present whenever the memory subsystem is operating). A linear fit to Eq. 2 with an update period of Δupdate provides a memory temperature prediction in accordance with the following equation (Eq. 3).
Where:
Simplification of Eq. 3 yields the following expression (Eq. 4).
Tn=Tn−1−[Tn−1−(Ta+c1·Rcount)]·c2 (Eq. 4)
Where:
With an updated knowledge of device temperature, the access request counter may be reset and the access request budget may be recalculated. In some embodiments, the access request budget may be determined by setting Tn=Tmax in Eq. 3, and solving for Rbudget (Eq. 5), which corresponds to Rcount per update period (e.g., the number of access requests that will be granted each update period).
However, a detailed equation for Rbudget is not required. For example, the budget may only be imposed when full memory bandwidth is estimated to potentially cause memory junction temperatures to exceed a pre-determined temperature limit. For example, the temperature limit in this instance may be determined from Eq. 3 by setting Tn=Tmax and Rcount=1/frequest/Δperiod and solving for Tn−1 (Eq. 6). Note equation yields a constant for a given ambient temperature.
Then, in some embodiments, Tn−1 is compared to the temperature limit, Tlimit; if Tn−1>Tlimit, then an access request budget may be imposed. For example, the imposed access request budget may be pre-calculated or calculated in accordance with Eq. 7.
For example, Rbudget may be determined by setting Tn−1=Tmax in Eq. 5 and solving for Rbudget, which is equal to Rcount per update period (e.g., the number of access requests that will be granted each update period). In some embodiments, a pre-calculated access request budget may be used for all operations. In some embodiments, an access request budget may be updated periodically in accordance with periodic updates of Ta. In some embodiments, an access request budget may be newly calculated each time an access request budget is imposed.
Advantageously, this equation also yields a constant for a given ambient temperature, and that simplification can further reduce the number of mathematical operations (Eq. 8):
Rbudget=(Tmax−Ta)·c3 (Eq. 8)
Where:
With reference to
Advantageously, because some embodiments of the invention do not impose an access request budget until a predicted temperature exceeds the threshold, access processing overhead is reduced. Moreover, with appropriately selected constants, some embodiments of the invention more accurately model the actual thermal behavior of the device, providing potentially higher bandwidths while maintaining junction temperatures within suitable limits. In addition, some embodiments of the invention provide relatively accurate modeling of device thermal behavior without the cost or complexity of physical sensors.
With reference to
In
In comparison with the method illustrated in connection with
With reference to
With reference to
The foregoing and other aspects of the invention are achieved individually and in combination. The invention should not be construed as requiring two or more of the such aspects unless expressly required by a particular claim. Moreover, while the invention has been described in connection with what is presently considered to be the preferred examples, it is to be understood that the invention is not limited to the disclosed examples, but on the contrary, is intended to cover various modifications and equivalent arrangements included within the spirit and the scope of the invention.
Number | Name | Date | Kind |
---|---|---|---|
5422806 | Chen et al. | Jun 1995 | A |
5557551 | Craft | Sep 1996 | A |
6047248 | Georgiou et al. | Apr 2000 | A |
6115441 | Douglass et al. | Sep 2000 | A |
6173217 | Bogin et al. | Jan 2001 | B1 |
6470238 | Nizar et al. | Oct 2002 | B1 |
20020143488 | Cooper et al. | Oct 2002 | A1 |
20030060934 | Walsh | Mar 2003 | A1 |
20040215371 | Samson et al. | Oct 2004 | A1 |
Number | Date | Country |
---|---|---|
WO 0011675 | Mar 2000 | WO |
Number | Date | Country | |
---|---|---|---|
20040267409 A1 | Dec 2004 | US |