Claims
- 1. (A method for placing and/or locating and releasing a pattern of conductive preforms onto a pattern of electronic pads, the method comprising the steps of:
applying a tacky media to the electronic pads; locating a pattern of locating mechanisms within a conductive preform locating apparatus to a pattern of electronic pads on a receiving substrate; positioning individual conductive preforms into the pattern of locating mechanisms within the conductive preform locating apparatus; locating a release mechanism in a desired location as required; energizing a release mechanism; and separating the conductive preform locating apparatus from the electronic pads.
- 2. The method of claim 1, wherein the release apparatus applies a compliant mechanical force to the individual conductive preforms to separate the conductive preforms from the conductive preform locating apparatus.
- 3. The method of claim 1, wherein the release apparatus applies a mechanical vibrational force to backing member to separate the conductive preforms from the conductive preform locating apparatus.
- 4. The method of claim 1, wherein the release apparatus applies an air pressure force to the individual locating mechanisms to separate the conductive preforms from the conductive preform locating apparatus.
- 5. The method of claim 1, wherein the release apparatus applies sound pressure wave to the individual locating mechanisms to separate the conductive preforms from the conductive preform locating apparatus.
- 6. The method of claim 1, wherein the release apparatus applies a mechanical force to the individual conductive preforms to separate the conductive preforms from the conductive preform locating apparatus and inspects the completeness of the pattern of conductive preforms, comprising the additional steps:
inspecting the completeness of the pattern of conductive preforms while the mechanical release mechanism is contacting the conductive preforms via: completing an electrical circuit as each mechanical release member contacts the respective conductive preform; evaluating the continuity of each electrical circuit to determine an open or closed circuit; and using the continuity evaluation to determine the presence or absence of each individual conductive preform.
- 7. The method of claim 2, wherein the release apparatus applies a mechanical force to the individual conductive preforms to separate the conductive preforms from the conductive preform locating apparatus and inspects the completeness of the pattern of conductive preforms, comprising the additional steps:
inspecting the completeness of the pattern of conductive preforms while the mechanical release mechanism is contacting the conductive preforms via: completing an electrical circuit as each mechanical release member contacts the respective conductive preform; evaluating the continuity of each electrical circuit to determine an open or closed circuit; and using the continuity evaluation to determine the presence or absence of each individual conductive preform.
- 8. A method for placing and/or locating and releasing a pattern of conductive preforms onto a pattern of electronic pads, the method comprising the steps of:
positioning individual conductive preforms into the pattern of locating mechanisms within the conductive preform locating apparatus; applying a tacky media to the electronic pads; locating a pattern of conductive preforms positioned to the locating mechanisms within a conductive preform locating apparatus to a pattern of electronic pads on a receiving substrate; locating a release mechanism in a desired location as required; energizing a release mechanism; and separating the conductive preform locating apparatus from the electronic pads.
- 9. The method of claim 8, wherein the release apparatus applies a compliant mechanical force to the individual conductive preforms to separate the conductive preforms from the conductive preform locating apparatus.
- 10. The method of claim 8, wherein the release apparatus applies a mechanical vibrational force to backing member to separate the conductive preforms from the conductive preform locating apparatus.
- 11. The method of claim 8, wherein the release apparatus applies an air pressure force to the individual locating mechanisms to separate the conductive preforms from the conductive preform locating apparatus.
- 12. The method of claim 8, wherein the release apparatus applies sound pressure wave to the individual locating mechanisms to separate the conductive preforms from the conductive preform locating apparatus.
- 13. The method of claim 8, wherein the release apparatus applies a mechanical force to the individual conductive preforms to separate the conductive preforms from the conductive preform locating apparatus and inspects the completeness of the pattern of conductive preforms, comprising the additional steps:
inspecting the completeness of the pattern of conductive preforms while the mechanical release mechanism is contacting the conductive preforms via: completing an electrical circuit as each mechanical release member contacts the respective conductive preform; evaluating the continuity of each electrical circuit to determine an open or closed circuit; and using the continuity evaluation to determine the presence or absence of each individual conductive preform.
- 14. The method of claim 9, wherein the release apparatus applies a compliant mechanical force to the individual conductive preforms to separate the conductive preforms from the conductive preform locating apparatus and inspects the completeness of the pattern of conductive preforms, comprising the additional steps:
inspecting the completeness of the pattern of conductive preforms while the mechanical release mechanism is contacting the conductive preforms via: completing an electrical circuit as each mechanical release member contacts the respective conductive preform; evaluating the continuity of each electrical circuit to determine an open or closed circuit; and using the continuity evaluation to determine the presence or absence of each individual conductive preform.
- 15. An compliant mechanical release apparatus for releasing a pattern of conductive preforms from a conductive preform locating and/or placing apparatus to position a pattern of conductive preforms on a similar pattern of electronic pads, the apparatus comprising:
a pattern of mechanical release members, where the pattern mimics the pattern of locating mechanisms, a compliant member to provide compliance for each mechanical release member, a compliant member casing to contain the individual compliant members and the mechanical release members, and a mechanical release support structure to contain the pattern of compliant member casings.
- 16. The apparatus of claim 15, where the apparatus includes an electrical inspection system to determine the presence or absence of conductive preforms for completeness, where the electrical inspection system comprises:
a means to provide an individual circuit respective to each individual location of each respective conductive preform, a first side of a circuit, a second side of a circuit, an ability to close each individual circuit upon the contact of each individual mechanical release member to each conductive preform, and a logic circuit to determine the completeness of the pattern of conductive preforms.
- 17. A vibrational mechanical release apparatus for releasing a pattern of conductive preforms from a conductive preform locating and/or placing apparatus to position a pattern of conductive preforms on a similar pattern of electronic pads, the apparatus comprising:
a vibrational source, a power source for the vibrational source, a means to ensure the release of the conductive preforms is directed towards the electronic pads, and a contacting means to transfer the vibrational source to the conductive preform locating apparatus.
- 18. The apparatus of claim 17, where the apparatus additionally comprising:
a resilient tapping member, and a vibrational source coupled to the resilient tapping member by a coupling member.
- 19. The apparatus of claim 18, where the vibrational source is an off-balanced motor.
- 20. The apparatus of claim 17, where the vibrational source is a piezoelectric transducer.
- 21. The apparatus of claim 17, where the vibrational source is a mass resonant transducer.
- 22. An air pressure release apparatus for releasing a pattern of conductive preforms from a conductive preform locating and/or placing apparatus to position a pattern of conductive preforms on a similar pattern of electronic pads, the apparatus comprising:
an air inlet port, an expansion chamber providing an expansion area to distribute the incoming airflow to apply an air pressure against the locating mechanisms, an open area designed to provide the distributed airflow to the conductive preform locating apparatus, and a means to bring the apparatus to a from conductive preform locating apparatus.
- 23. The apparatus of claim 22, where the open area designed to provide the distributed airflow includes a bottom surface and a pattern of air exit ports, where the pattern of air exit ports is similar to the pattern of locating mechanisms.
- 24. The apparatus of claim 23, where the apparatus further includes a diffuser to aid in further distributed the incoming airflow prior-to flowing through the air exit ports.
- 25. A sound pressure wave release apparatus for releasing a pattern of conductive preforms from a conductive preform locating and/or placing apparatus to position a pattern of conductive preforms on a similar pattern of electronic pads, the apparatus comprising:
a sound pressure wave source designed to produce sound pressure waves and direct the sound pressure waves to the conductive preform locating apparatus, where the sound pressure waves provide a release force to separate the pattern of conductive preforms from the locating mechanisms.
- 26. The apparatus of claim 25, where the sound pressure wave source is a speaker.
- 27. The apparatus of claim 25, where the sound pressure wave source is an ultrasonic transducer.
- 28. An apparatus for the assembly of a pattern of conductive preforms onto a pattern of electronic pads on a Ball Grid Array, where the apparatus comprising:
a conductive preform locating apparatus, a means for positioning individual conductive preforms into the pattern of locating mechanisms, a means for aligning the pattern of electronic pads to the pattern of locating mechanism, a means for locating a release apparatus proximate the conductive preform locating apparatus, a means for-energizing the release mechanism, a means for separating the electronic pads and receiving substrate from the conductive preform locating apparatus, whereby, the release apparatus is of one of the following: (a) compliant mechanical release apparatus (b) vibrational release apparatus (c) air pressure release apparatus (d) directed air pressure release apparatus (e) sound pressure wave apparatus
- 29. The apparatus of claim 28, where the release apparatus is a mechanical release apparatus, where the mechanical release apparatus includes an electrical inspection system to determine the presence or absence of conductive preforms for completeness, where the electrical inspection system comprises:
a means to provide an individual circuit respective to each individual location of each respective conductive preform, a first side of a circuit coupled to the mechanical release member, a second side of a circuit coupled to second object such that when the mechanical release member contacts the conductive preform the second side of the circuit is continuous to the first side of the circuit, a logic circuit to determine the completeness of the pattern of conductive preforms.
Parent Case Info
[0001] Continuation in Part of patent application Ser. No. 08/789,883 filed Jan. 28, 1997 Eric L. Hertz and Allen D. Hertz for METHOD AND APPARATUS FOR RELEASE AND OPTIONAL INSPECTION FOR CONDUCTIVE PREFORMS PLACEMENT APPARATUS
Continuation in Parts (1)
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Number |
Date |
Country |
Parent |
08789883 |
Jan 1997 |
US |
Child |
09309697 |
May 1999 |
US |