This application claims the priority of Korean Patent Application No. 2003-45409, filed on Jul. 4, 2003, in the Korean Intellectual Property Office, the disclosure of which is incorporated herein in its entirety by reference.
1. Field of the Invention
The present invention relates, in general, to a method and arrangement for attaching labels to semiconductor modules mounted on a double-sided substrate.
2. Description of the Related Art
As technologies develop in such industry fields as the electrical industry, electronic industry and telecommunication industry, there is an increasing use of semiconductor devices in these fields. For example, technical developments have led to performance enhancement and scaling-down of equipment and products used in the respective industry fields. The performance enhancement and scaling-down of electronic equipment and products may be obtained by installing semiconductor modules with various functions in electronic equipment and/or products. One technology utilized for mounting semiconductor modules on a surface of a substrate is referred to as a surface mounting technology (SMT).
Semiconductor devices, or modules, may be classified into memory modules which are configured for storing information and non-memory modules configured for performing calculation. A semiconductor device may include a plurality of semiconductor chips to perform desired functions. The semiconductor chips may be mounted on a printed circuit board (PCB) or a substrate, for example.
Labels reflecting information such as the ‘manufacturing company’, ‘manufactured date’, ‘product specification’, etc. may be attached to the respective semiconductor modules. A process for attaching labels to semiconductor modules may be considered as a final sub-process in a process of manufacturing a semiconductor device, for example.
The loading unit 100 loads a substrate on which semiconductor modules will be mounted onto the process line. The substrate may be a rectangular shape of PCB, or may be a jig designed to allow semiconductor modules to be easily separated, for example. The loading unit 100 loads substrates in a sequential manner (one by one) on the process line, for example, on a conveyer belt. Here, a time interval in which each substrate is loaded on the conveyer belt, etc. may be uniform, and the follow-on units on the process line (i.e., screen printer 200, module mounting unit 300, reflow unit 400, label attaching unit 500, unloading unit 600) perform corresponding processes on the substrate for the time interval.
Referring to
A process that attaches labels to a surface on each of a plurality of semiconductor modules may then be performed at label attaching unit 500. The label may be embodies as a sticker which including various information (i.e., manufacturing company, manufactured date, product specification, etc.) regarding the semiconductor module. The label attaching process may be performed using a robot arm of the label attaching unit 500, for example. After the label attaching process is complete, the unloading unit 600 unloads the substrate from the process line.
The conventional label attaching process as described above may have several problems. The label attaching unit 500 does not include a turner for turning over the substrate. Accordingly, it may be difficult for the conventional label attaching unit 500 to apply labels to a double-sided substrate where semiconductor modules are mounted on both surfaces or sides (front surface and rear surface). For example, if the above-described processes are repeated in order to attach a label on a second surface of a substrate (front or rear surface) after attaching a label on a first surface (top or bottom surface) of the substrate, settings of the processes, as well as of working files, have to be repeated for labeling semiconductor modules on each surface of the substrate. Additionally, the label attached on the first surface could possibly be damaged due to heat generated when performing the reflow process on the second surface.
Further, if two conventional label attaching units are arranged in a row in an effort to solve the above problems, it is necessary to turn over the substrate manually in order to attach a label to a second surface (i.e., surface opposite to the surface in which labels were attached) of a semiconductor substrate after attaching a label to a first surface of the semiconductor substrate. The manual-operation may complicate the label attaching process, possibly reduce accuracy, may reduce process automation, and/or may possibly increase process costs. Since process times allocated to the respective units are pre-set in the conventional label attaching process, intervention of the manual turning operation may prevent the respective units from accurately performing their corresponding processes within the set process time (time interval).
Exemplary embodiments of the present invention are directed to a method and arrangement for attaching labels to a plurality of semiconductor modules arranged on a double-sided substrate. An exemplary arrangement may include at least one label attaching unit configured to attach labels to a plurality of semiconductor modules mounted on one of a first surface and a second surface of the double-sided substrate, and at least one turner configured to turn over the double-sided substrate to expose one of the first surface and second surface to the label attaching unit.
The present invention will become more apparent by describing, in detail, exemplary embodiments thereof with reference to the attached drawings, wherein like elements are represented by like reference numerals, which are given by way of illustration only and thus do not limit the exemplary embodiments of the present invention.
a through 3c illustrate exemplary configurations of an equipment line of an exemplary label attaching arrangement according to an exemplary embodiment of the present invention.
a and 4b illustrate exemplary configurations of an equipment line of an exemplary label attaching arrangement according to another exemplary embodiment of the present invention.
a through 6i are views explaining a method for attaching labels to semiconductor modules mounted on a double-sided substrate using the arrangement of
The present invention will be described more fully with reference to the accompanying drawings, in which exemplary embodiments of the invention are shown. It should be understood, however, that exemplary embodiments of the present invention described herein can be modified in form and detail without departing from the spirit and scope of the invention. Accordingly, the exemplary embodiments described herein are provided by way of example and not of limitation, and the scope of the present invention is not restricted to the particular embodiments described herein.
As will be described in further detail below, the exemplary embodiments of the present invention introduce an arrangement and method for attaching labels which may be capable of reducing equipment costs by simplifying a process line. The exemplary method and arrangement may be applicable to double-sided semiconductor modules as well as single-sided semiconductor modules, in an effort to achieve process automation.
In general, the exemplary arrangement may attach labels to a plurality of semiconductor modules mounted on front and rear surfaces (hereinafter, referred to as first and second surfaces) of a double-sided substrate. As will be seen in further detail below, an exemplary label application methodology, which is part of a manufacturing process for fabricating the semiconductor modules, may be used to attach the labels to the semiconductor modules mounted on the double-sided substrate. A set of semiconductor modules may be symmetrically mounted respectively on front and rear surfaces of a substrate according to a surface mounting technique (SMT), and the exemplary label attaching methodology described hereafter may attach labels to the semiconductor module products. The semiconductor modules may be mounted so as to have an asymmetric arrangement centering on a center line of one surface of the double-sided substrate, so the arrangement of semiconductor modules appears the same when turning over the double-sided substrate.
As a general example of how the modules may be mounted, each of first and second surfaces of a double-sided substrate may be separated into a left side and a right side centering on a center line of the double-sided substrate. On the left side of the first surface of the double-sided substrate, double-sided semiconductor module products (or single-sided semiconductor module products) may be mounted so that their front surfaces face upward. On the right side of the first surface of the doubled-sided substrate, double-sided semiconductor module products (or single-sided semiconductor module products) may be mounted so that their rear surfaces face upward.
Additionally, on the left side of the second (rear) surface of the double-sided substrate, double-sided semiconductor module products (or single-sided semiconductor module products) are mounted so that their rear surfaces face downward. On the right side of the second surface of the double-sided substrate, double-sided semiconductor module products (or single-sided semiconductor module products) are mounted so that their front surfaces face downward. The first and second surfaces of the double-sided substrate may thus have the same module surface arrangement as the substrate is turned over.
The exemplary methodology described hereafter may enable labels to be attached to the first and second surfaces of a double-sided substrate in the same setting state of the exemplary label attaching arrangement. Therefore, when attaching labels to double-sided semiconductor module products, it may be unnecessary to change process files, various jigs and/or components of an equipment line including the label attaching arrangement.
As will be seen below in further detail, and in an alternative embodiment, the exemplary arrangement and methodology may provide two label attaching units and two turners alternately arranged so as to perform the labeling on the first surface, turning to expose the second surface, labeling of the second surface, and turning of the substrate back to its state or position for unloading. Such an arrangement may further reduce process time and/or equipment costs, for example.
The label attaching unit 502 may be embodied as machinery such as a robot arm, for example. The turner 504 may be embodied by any structure or equipment which is configured to turn or flip a substrate from one side or surface to another. For example, the turner 504 may be used to turn over double-sided substrates supporting semiconductor modules on either side or surface. The substrate transfer unit 506 may be used to move the double-sided substrate forward or backward, regardless of the direction of movement of the double-sided substrate in the label attaching arrangement 500′. The substrate transfer unit 506 may move a substrate to a desired location in a given process time, regardless of the movement direction of the substrate on a process line. Thus, it is possible to attach labels to double-sided semiconductor module products using only a turner and a label attaching unit. As discussed above, operations of the substrate transfer unit 506 may be controlled by the controller 510.
The label attaching arrangement 500′ may be unlike the conventional label attaching unit, which has only a label attaching function. The label attaching arrangement 500′ may be embodied as a combination of components, including one or more label attaching units and one or more turners, for example. Additionally, the label attaching arrangement 500′ may apply a label to the front and rear surfaces of a double-sided substrate, so as to improve efficiency in attaching labels to double-sided semiconductor module products. As would be evident to one or ordinary skill in the art, the label attaching arrangement 500′ may also be configured to attach labels to single-sided semiconductor modules mounted on a double-sided substrate or on a general PCB.
a through 3c illustrate exemplary configurations of an equipment line of an exemplary label attaching arrangement according to an exemplary embodiment of the present invention.
Referring to
Hereinafter, a method for attaching labels to semiconductor modules mounted on a double-sided substrate based on the label attaching arrangement 500′ shown in
Since a double-sided substrate is used in this example, it is unnecessary to change a work file or other process settings, even when turning over the substrate. The substrate (with labels having been applied to the semiconductor modules on both first and second surfaces), may then be turned over within the substrate-turning and label-attaching area 505 by the turner 504a to return to its initial state or orientation, for unloading from the label attaching arrangement 500′ by a suitable component such as the unloading unit 600 shown in
Referring to
Hereinafter, another exemplary method for attaching labels to semiconductor modules mounted on a double-sided substrate using the label attaching arrangement 500′ as shown in
Since a double-sided substrate is used in this example, it is unnecessary to change a work file or other process settings when turning over the substrate. Successively, the substrate may be transferred between operation areas, from the label attaching unit 502b to the turner 504b using the substrate transfer unit 506. The substrate (with labels having been applied to the semiconductor modules on both first and second surfaces), may then be turned over within the substrate-turning area 505b by the turner 504b to return to its initial state or orientation, for unloading from the label attaching arrangement 500′ by a suitable component such as the unloading unit 600 shown in
Referring now to
a and 4b illustrate exemplary configurations of an equipment line of an exemplary label attaching arrangement according to another exemplary embodiment of the present invention.
Referring to
For example, if a first substrate subjected to the reflow process (i.e., at reflow unit 400 of
Simultaneously with or shortly after the transfer, a second substrate may be loaded in the first substrate-turning and label-attaching area 505c. Concurrently within second substrate-turning and label-attaching area 505d, a label attaching process may be performed on the exposed second surface of the first substrate by the label attaching unit 512a. In the case where the second substrate has been loaded in the first substrate-turning and label-attaching area 505c, a label attaching process to attach labels may be subsequently performed on the semiconductor modules contained on the first surface of the second substrate. Thus, a substantially continuous labeling attaching process may be performed on surfaces of two different substrates, in accordance with this example.
Since double-sided substrates are used in this example, it is possible to attach labels to the second surface of the first substrate and to the first surface of the second substrate without changing a work file or other process settings, even when turning over the substrates. Successively, in the first substrate-turning and label-attaching area 505c, the first turner 514a turns over the second substrate to expose the second surface, and in the second substrate-turning and label-attaching area 505d, the second turner 516a turns over the first substrate (which has had the semiconductor modules labeled on both surfaces of the substrate) to return the first substrate to its initial state or orientation.
Then, the first substrate may be unloaded from the second substrate-turning and label-attaching area 505d (such as by unloading unit 600 of
Referring to
The label attaching arrangement 500′ of
a through 6i are views explaining a method for attaching labels to semiconductor modules mounted on a double-sided substrate using the arrangement of
The methodology described with reference to
Referring now to
Referring to
No label attaching process is performed on the rear surfaces of the semiconductor modules. In the first label-attaching area 515b on which the first substrate is loaded, first label attaching unit 522 attaches labels to the front surfaces of the five semiconductor modules ({circle over (1)}F through {circle over (5)}F) located on the left side of the first surface of the first substrate. The result is shown in
Referring to
Referring to
Referring to
The label attaching process for the second substrate may be performed anytime before the second substrate is transferred to the substrate-turning area 515a. As a result, and in the case of the second substrate, labels may be attached only to the left side of the first surface of the second substrate. In the case of the first substrate, labels may be attached to all the left sides of the first and second surfaces of the first substrate.
Referring to
The state shown in
Therefore, according to the exemplary embodiments of the present invention, it is possible to automate a label attaching process for double-sided substrates. Accordingly, a probability of error generation in the label attaching process may be reduced and/or possibly eliminated, and process costs may be reduced. Additionally, since at least one label attaching unit and at least one turner are included in a label attaching arrangement, a process stream may be shortened so that equipment costs can be reduced. Use of a substrate transfer unit in the label attaching arrangement may allow a label attaching process to be performed on double-sided substrates using fewer label attaching units and turners, thereby further reducing equipment costs.
The label attaching method and arrangement according to the exemplary embodiments of the present invention are adapted to perform a label attaching process on single-sided semiconductor module products, as well as double-sided semiconductor module products. Accordingly, since it is unnecessary to install different equipment based on the type of semiconductor module product, equipment costs may be further reduced.
The exemplary embodiments of the present invention being thus described, it will be obvious that the same may be varied in many ways. Such variations are not to be regarded as departure from the spirit and scope of the exemplary embodiments of the present invention, and all such modifications as would be obvious to one skilled in the art are intended to be included within the scope of the following claims.
Number | Date | Country | Kind |
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2003-45409 | Jul 2003 | KR | national |