This application claims priority from German patent application No. 10 2007 033 617.0, filed on Jul. 17, 2007, the entire disclosure of which is hereby incorporated herein by reference.
The invention relates to a method for positioning a probe card with probe needles, which have needle tips, relative to the surface of a substrate to be tested in a direction perpendicular to the surface of the substrate. In this case, a first position of the needle tips relative to the surface of the substrate is measured and stored as a separation position in such a manner that it is approached in a first positioning step, which does not measure the distance between the needle tips and the surface of the substrate, so as to produce a distance between the needle tips and the surface of the substrate. Furthermore, a second position of the needle tips relative to the surface of the substrate is measured and stored as a contact position in such a manner that it is approached in a second positioning step, which does not measure the distance between the needle tips and the surface of the substrate, until the needle tips make contact with the surface of the substrate. An image of the needle tips is recorded along at least one horizontal imaging direction, which is essentially parallel to the surface of the substrate, and is displayed.
The invention also relates to an arrangement for positioning a probe card with probe needles, which have needle tips and are arranged on the probe card such that they are oriented in position. In this case, the arrangement has a substrate holder, a setting device for adjusting the substrate holder relative to the probe card, and a recording device whose recording axis is directed at the probe needles and essentially parallel to the substrate surface. In this case, the setting device is provided with a drive device which is provided with a memory that stores a contact position and a separation position.
Substrates having electrically active components, for example semiconductor components, have so-called contact pads which are used to make contact from the outside by means of probe needles. Signals can therefore be applied to these semiconductor components from the outside and the reactions of the latter to these signals can be determined. It thus becomes possible to test these substrates. So-called probers are provided for such a test.
Probe needles of probers are fastened either to probe holders or to probe cards. When probe holders are used, the probe holders are positioned on a probe holder plate in such a manner that the needle tips of the probe needles are opposite the contact pads in accordance with the pattern assumed by the contact pads.
When probe cards are used, the probe needles are fastened to just these probe cards in such a manner that the needle tips of the probe needles are likewise opposite the contact pads in the form of the patterns assumed by these contact pads.
In order to observe the probe needles when contact is being made with the contact pads, DE 103 29 792.8 describes an observation device having an observation axis such that the observation axis runs in the gap between the free surface of the wafer and the holding apparatus or apparatuses.
These observation devices can be used to subject the probe needles to precise observation. For example, precisely the extent of overdrive achieved can thus be determined and the movement in the Z direction can be set when an extent has been defined.
In this case, it is expedient for the observation axis to run in an essentially horizontal manner and parallel to the free surface of the wafer. As a result, the holding apparatuses of the components or other components do not obstruct the view of the probe needles.
Whereas the relative distance between the needle tips of the probe needles and the surface of the substrate to be tested can be set and is consequently dependent on the setting device which sets this distance, for example a substrate clamping apparatus which carries out a movement in a direction perpendicular to the semiconductor surface, the absolute height of the needle tips, that is to say the distance between the needle tips and the installation position of the probe holder, for example a probe holder plate, is dependent on the installation or the geometrical configuration of the probe holder.
The substrates are normally tested in a substrate assembly, for example in a semiconductor wafer, on which a plurality of chips are arranged as substrates. In this case, a chip is positioned relative to the needle tips in the lateral direction in such a manner that the needle tips come to rest above the contact pads. Contact is not yet made in this case since, for the purpose of moving the chips relative to the needle tips, it is necessary to set a distance between the needle tips and the surface of the substrate in order to avoid the needle tips scratching the surface of the substrate. Only in the post-position is the distance between the needle tips and the surface of the substrate reduced to such an extent that the needle tips on the contact pads carry out a slight scratch, that is to say a slight lateral movement, on the contact pad.
After testing, the next substrate is then approached. In this case, the distance between the needle tips and the surface of the substrate is set again, the lateral movement is carried out in order to reach the next test position, and contact is made again.
In order to increase the speed, particularly during automatic testing, the two vertical positions, that is to say the first vertical position which is referred to as the “separation position” and the second vertical position which is referred to as the “contact position”, are stored and are read out during positioning and are set using a setting device.
Since there are no precise details of the exact absolute height of the probe needles, these two stored positions no longer correspond to the actual conditions after the probe card has been changed. If work is then continued with the stored positions after the probe card has been changed, this may result in contact being made erroneously, in the needle tips grinding the surface of the substrates in the event of a change in position or in an excessive contact pressure and thus in the destruction of the substrate or the substrate assembly.
The object of the invention is now to ensure that, after a probe card has been changed, the separation position and the contact position can be adapted to the probe card in a simple manner in order to thus avoid erroneous operation.
This object is achieved with a method according to claims 1 to 9 and with an arrangement according to claims 10 to 14.
The invention shall be explained in more detail below using an exemplary embodiment.
As illustrated in
The probe horizon 4 is then used to calculate, by means of computation, both the contact position in which the needle tips 3 are in contact with the contact pads of the substrate and the separation position in which the probe needles 1 or rather the needle tips 3 are at a distance from the surface of the substrate, and the setting device is set correspondingly for the substrate holder. If the contact position now no longer corresponds to the actual height of the needle tips 3, this may result in considerable impairment and may go as far as destruction of the substrate.
As illustrated in
It is very expedient, in particular when the ratio of the stored probe horizon 4 to the actual position of the needle tips 3 is to be presented in order to thus correct the values which are stored and used for positioning, if the probe card has been changed.
An arrangement as illustrated in
According to
A sensor piece 8 which is statically connected to the probe card holder is arranged on the sliding piece 7 in the immediate vicinity.
A pressure line 9 which is connected to a vacuum or compressed air source (not illustrated in any more detail) and opens in an opening 10 is arranged in the sensor piece 8. As illustrated in
If the probe card 5 is intended to be removed, it is necessary to displace the sliding piece 8 to such an extent that the probe card 5 can be removed and a new one can be inserted. The opening 10 is thus compulsorily freed. This opening thus generates a pressure difference in the pressure line, which can be measured and detects when the probe card 5 is changed.
Detection of such a change can also be used, inter alia, to give rise to the display shown in
Number | Date | Country | Kind |
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10 2007 033 617.0 | Jul 2007 | DE | national |