This is a continuation of application Ser. No. 07/545,909 filed on Jun. 28, 1990, now abandoned.
Number | Name | Date | Kind |
---|---|---|---|
4102733 | DeLa Moneda et al. | Jul 1978 | |
4374700 | Scott et al. | Feb 1983 | |
4458410 | Sugaki et al. | Jul 1984 | |
4462149 | Schwabe | Jul 1984 | |
4463491 | Goldman et al. | Aug 1984 | |
4476482 | Scott et al. | Oct 1984 | |
4519126 | Hsu | May 1985 | |
4714951 | Baudrant et al. | Dec 1987 | |
4745081 | Beyer et al. | May 1988 | |
4777150 | Deneuville et al. | Oct 1988 | |
4873204 | Wong et al. | Oct 1989 | |
4873205 | Critchlow et al. | Oct 1989 | |
5349229 | Wer et al. | Sep 1994 |
Number | Date | Country |
---|---|---|
0046371 | Aug 1981 | EPX |
58-100451 | Jun 1983 | JPX |
59-175726 | Oct 1984 | JPX |
60-130155 | Jul 1985 | JPX |
115753 | Jun 1989 | JPX |
39524 | Jan 1991 | JPX |
2151847 | Jul 1985 | GBX |
Entry |
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Wolf. S, Silicon Processing for the VLSI Era; vol. 2, Process Integration Lattice Press, 1990, pp. 160-169. |
Murarka, S., P., "Refractory Silicides for Integrated Circuits", J. Vac. Sci. Tech. vol. 17, No. 4 Jul./Aug. 1980 pp. 777-792. |
IEEE Transactions, Ed. 34, No. 3, Mar. 1987, "HPSAC--A Silicided Amorphous-Silicon Contact and Interconnect Technology for VLSI". |
IEEE Transactions, Dec. 1988, pp. 450-453, "A Selective CVD Tungsten Local Interconnect Technology" by Lee, et al. |
IBM Technical Disclosure Bulletin, vol. 32, No. 9A, Feb. 1990, "Multi-Purpose Trench for Complementary Metal Oxide Silicon . . . ". |
Number | Date | Country | |
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Parent | 545909 | Jun 1990 |