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Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
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SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
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Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
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last 30 patents
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Patent Grant
Eccentric via structures for stress reduction
Patent number
12,322,703
Issue date
Jun 3, 2025
Taiwan Semiconductor Manufacturing Co., Ltd
Shu-Shen Yeh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wafer reconstitution and die-stitching
Patent number
12,322,730
Issue date
Jun 3, 2025
Apple Inc.
Sanjay Dabral
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Self-aligned metal gate for multigate device and method of forming...
Patent number
12,322,653
Issue date
Jun 3, 2025
Taiwan Semiconductor Manufacturing Co., Ltd
Jia-Chuan You
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor package having composite seed-barrier layer and metho...
Patent number
12,322,682
Issue date
Jun 3, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Wei-Chung Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor devices devices including crystallized layer having m...
Patent number
12,322,595
Issue date
Jun 3, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Chun-Yen Peng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Interlayer dielectric layer
Patent number
12,322,648
Issue date
Jun 3, 2025
Taiwan Semiconductor Manufacturing Co., Ltd
Joung-Wei Liou
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Local interconnect for cross coupling
Patent number
12,322,652
Issue date
Jun 3, 2025
International Business Machines Corporation
Heng Wu
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor device having backside interconnect structure on thro...
Patent number
12,322,680
Issue date
Jun 3, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Yung-Chi Lin
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor memory structure and method for forming the same
Patent number
12,322,698
Issue date
Jun 3, 2025
Winbond Electronics Corp.
Hung-Jung Yan
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Annealed seed layer to improve ferroelectric properties of memory l...
Patent number
12,324,161
Issue date
Jun 3, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Song-Fu Liao
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Method and system for fabricating unique chips using a charged part...
Patent number
12,322,569
Issue date
Jun 3, 2025
ASML Netherlands B.V.
Marcel Nicolaas Jacobus van Kervinck
G06 - COMPUTING CALCULATING COUNTING
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Patent Grant
Semiconductor structure and method for forming same
Patent number
12,322,589
Issue date
Jun 3, 2025
CHANGXIN MEMORY TECHNOLOGIES, INC.
Xiang Liu
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Interconnect structure of semiconductor device
Patent number
12,322,649
Issue date
Jun 3, 2025
Taiwan Semiconductor Manufacturing Co., Ltd
Yao-Min Liu
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Diffusion barrier for interconnects
Patent number
12,322,650
Issue date
Jun 3, 2025
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Rajesh Katkar
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor die including through substrate via barrier structure...
Patent number
12,322,679
Issue date
Jun 3, 2025
Taiwan Semiconductor Manufacturing Company Limited
Jen-Yuan Chang
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Method for forming semiconductor structure and a semiconductor
Patent number
12,324,148
Issue date
Jun 3, 2025
CHANGXIN MEMORY TECHNOLOGIES, INC.
Chih-Cheng Liu
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Image sensor device
Patent number
12,324,268
Issue date
Jun 3, 2025
ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
Rajesh Katkar
H01 - BASIC ELECTRIC ELEMENTS
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Semiconductor device and method
Patent number
12,322,590
Issue date
Jun 3, 2025
Taiwan Semiconductor Manufacturing Co., Ltd
Ching-Yu Chang
H01 - BASIC ELECTRIC ELEMENTS
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Semiconductor devices and methods
Patent number
12,322,647
Issue date
Jun 3, 2025
Taiwan Semiconductor Manufacturing Co., Ltd
Yu-Kai Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Etching to reduce line wiggling
Patent number
12,322,651
Issue date
Jun 3, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Kuan-Wei Huang
H01 - BASIC ELECTRIC ELEMENTS
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Semiconductor structure with interconnects and method for preparing...
Patent number
12,324,212
Issue date
Jun 3, 2025
CHANGXIN MEMORY TECHNOLOGIES, INC.
Tieh-Chiang Wu
H01 - BASIC ELECTRIC ELEMENTS
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Method of forming high density, high shorting margin, and low capac...
Patent number
12,322,699
Issue date
Jun 3, 2025
Tahoe Research, LTD.
Christopher J. Jezewski
H01 - BASIC ELECTRIC ELEMENTS
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Integrated circuit, system and method of forming the same
Patent number
12,321,679
Issue date
Jun 3, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Shih-Wei Peng
G06 - COMPUTING CALCULATING COUNTING
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Patent Grant
Pulsing plasma treatment for film densification
Patent number
12,322,573
Issue date
Jun 3, 2025
Applied Materials, Inc.
Rui Li
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
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Patent Grant
Passivation layers with rounded corners
Patent number
12,322,646
Issue date
Jun 3, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Mingni Chang
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor structure, method for forming same, and wafer on wafe...
Patent number
12,322,654
Issue date
Jun 3, 2025
CHANGXIN MEMORY TECHNOLOGIES, INC.
Yuanhao Gao
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Self-aligned interconnect structure
Patent number
12,322,723
Issue date
Jun 3, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Hsin-Chieh Yao
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor structure and manufacturing method thereof
Patent number
12,324,140
Issue date
Jun 3, 2025
CHANGXIN MEMORY TECHNOLOGY, INC.
Xiang Liu
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor apparatus and method for manufacturing the same
Patent number
12,317,612
Issue date
May 27, 2025
SONY SEMICONDUCTOR SOLUTIONS CORPORATION
Nobutoshi Fujii
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Devices including a stair step structure adjacent a substantially p...
Patent number
12,317,489
Issue date
May 27, 2025
Micron Technology, Inc.
Troy R. Sorensen
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
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Patent Application
Semiconductor Die Connection System and Method
Publication number
20250174591
Publication date
May 29, 2025
Taiwan Semiconductor Manufacturing Co., Ltd.
Ming-Fa Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BEOL FABRICATION METHOD INCLUDING REMOVING DUMMY LINES
Publication number
20250174494
Publication date
May 29, 2025
Samsung Electronics Co., Ltd.
JAEMYUNG CHOI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MICROELECTRONIC DEVICES INCLUDING ACTIVE CONTACTS AND SUPPORT CONTACTS
Publication number
20250174558
Publication date
May 29, 2025
Micron Technology, Inc.
S M Istiaque Hossain
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
METHOD FOR PREPARING AIR GAP BETWEEN BIT LINE STRICTURE AND CAPACIT...
Publication number
20250176157
Publication date
May 29, 2025
NANYA TECHNOLOGY CORPORATION
Cheng-Hsiang FAN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
Publication number
20250174490
Publication date
May 29, 2025
NANYA TECHNOLOGY CORPORATION
CHUN-HENG WU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor layout pattern and semiconductor stack structure suit...
Publication number
20250174491
Publication date
May 29, 2025
UNITED MICROELECTRONICS CORP.
Wei Lun Oo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR STRUCTURE WITH BURIED POWER RAILS AND METHOD OF FABRI...
Publication number
20250174495
Publication date
May 29, 2025
Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
Sheng HU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
NESTED ARCHITECTURES FOR ENHANCED HETEROGENEOUS INTEGRATION
Publication number
20250174523
Publication date
May 29, 2025
Intel Corporation
Ravindranath MAHAJAN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SVIA FORMATION USING VFTL SCHEME
Publication number
20250174549
Publication date
May 29, 2025
International Business Machines Corporation
Yann Mignot
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR STRUCTURE HAVING ACTIVE AREAS AND METHOD FOR MANUFACT...
Publication number
20250174551
Publication date
May 29, 2025
NANYA TECHNOLOGY CORPORATION
Ping HSU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTERCONNECT STRUCTURES AND METHODS OF FABRICATION THEREOF
Publication number
20250174553
Publication date
May 29, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Chao-Hsun Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WORD LINE STRUCTURE OF THREE-DIMENSIONAL MEMORY DEVICE
Publication number
20250176182
Publication date
May 29, 2025
Yangtze Memory Technologies Co., Ltd.
Qiang XU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE, AND PRODUCTION METHOD FOR SEMICONDUCTOR DEVICE
Publication number
20250174546
Publication date
May 29, 2025
SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
Yukinori NOSE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES
Publication number
20250174545
Publication date
May 29, 2025
Amkor Technology Singapore Holding Pte. Ltd.
Sang Hyun Jin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DIE HAVING A DIE DAMAGE RING AND FABRICATION METHOD T...
Publication number
20250174557
Publication date
May 29, 2025
MEDIATEK INC.
Cing-Yao Jhan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE STRUCTURE WITH STACKED SEMICONDUCTOR DIES
Publication number
20250174578
Publication date
May 29, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Yi-Chao Mao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MEMORY CELL, INTEGRATED CIRCUIT, AND MANUFACTURING METHOD OF MEMORY...
Publication number
20250176442
Publication date
May 29, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Yu-Chao Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTERCONNECTION STRUCTURE HAVING AIR GAP
Publication number
20250174492
Publication date
May 29, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Shu-Yun KU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTERLAYER DIELECTRIC LAYER
Publication number
20250174493
Publication date
May 29, 2025
Taiwan Semiconductor Manufacturing Co., Ltd.
Joung-Wei Liou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR STRUCTURE HAVING ACTIVE AREAS AND METHOD FOR MANUFACT...
Publication number
20250174548
Publication date
May 29, 2025
NANYA TECHNOLOGY CORPORATION
Ping HSU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
Publication number
20250174584
Publication date
May 29, 2025
Samsung Electronics Co., Ltd.
Youngja KIM
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SEMICONDUCTOR DEVICE HAVING LOW DIELECTRIC CAPACITANCE, AND METHOD...
Publication number
20250167042
Publication date
May 22, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Ting-Ya LO
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
INTERCONNECT STRUCTURE, METHOD OF MANUFACTURING SAME, AND ELECTRONI...
Publication number
20250167043
Publication date
May 22, 2025
Samsung Electronics Co., Ltd.
Keun Wook SHIN
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
LOW RESISTANCE VIA STRUCTURE
Publication number
20250167103
Publication date
May 22, 2025
International Business Machines Corporation
Oscar van der Straten
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
Selective Removal of an Etching Stop Layer for Improving Overlay Sh...
Publication number
20250167002
Publication date
May 22, 2025
Taiwan Semiconductor Manufacturing Co., LTD
Chien-Hua Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BEOL INTEGRATION SOLUTION BASED ON DIRECT CMP TO IMPROVE INTERMETAL...
Publication number
20250167041
Publication date
May 22, 2025
STMicroelectronics International N.V.
Fabrizio Fausto Renzo TOIA
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
METHOD OF FABRICATING CONTACT STRUCTURE
Publication number
20250167045
Publication date
May 22, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Chang-Ting Chung
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
VIAS WITH SELECTED GRAIN DISTRIBUTION
Publication number
20250167046
Publication date
May 22, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Chia-Pang Kuo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PASSIVE THERMAL CONTROL LAYER FOR INTEGRATED DEVICE
Publication number
20250167074
Publication date
May 22, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Sam Vaziri
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DIE INCLUDING FUSE STRUCTURE AND METHODS FOR FORMING...
Publication number
20250167078
Publication date
May 22, 2025
Taiwan Semiconductor Manufacturing Company Limited
Jen-Yuan CHANG
H01 - BASIC ELECTRIC ELEMENTS