Membership
Tour
Register
Log in
Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
Follow
Industry
CPC
H01L21/768
This industry / category may be too specific. Please go to a parent level for more data
Parent Industries
H
ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L21/00
Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Current Industry
H01L21/768
Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
Industries
Overview
Organizations
People
Information
Impact
Please log in for detailed analytics
Patents Grants
last 30 patents
Information
Patent Grant
Chip-substrate composite semiconductor device
Patent number
12,368,052
Issue date
Jul 22, 2025
Infineon Technologies Austria AG
Christian Fachmann
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Manufacturing method of semiconductor structure comprising a gap an...
Patent number
12,368,074
Issue date
Jul 22, 2025
CHANGXI MEMORY TECHNOLOGIES, INC.
Ting Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Microelectronic devices with through-substrate interconnects and as...
Patent number
12,368,096
Issue date
Jul 22, 2025
Kyle K. Kirby
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for producing semiconductor apparatus and semiconductor appa...
Patent number
12,368,107
Issue date
Jul 22, 2025
Shin-Etsu Handotai Co., Ltd.
Tsuyoshi Ohtsuki
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
3D semiconductor device and structure with metal layers
Patent number
12,368,138
Issue date
Jul 22, 2025
Monolithic 3D Inc.
Zvi Or-Bach
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods of forming semiconductor device
Patent number
12,368,098
Issue date
Jul 22, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Pei-Yu Chou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Apparatuses including interconnect structures including dielectric...
Patent number
12,368,101
Issue date
Jul 22, 2025
Battelle Energy Alliance, LLC
Jordan D. Greenlee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Microelectronic devices with isolation trenches in upper portions o...
Patent number
12,369,333
Issue date
Jul 22, 2025
Yi Hu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Thin film transfer using substrate with etch stop layer and diffusi...
Patent number
12,369,352
Issue date
Jul 22, 2025
Taiwan Semiconductor Manufacturing Co., Ltd
Eugene I-Chun Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Hybrid integrated circuit packages
Patent number
12,368,146
Issue date
Jul 22, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method and structure of cut end with self-aligned double patterning
Patent number
12,368,046
Issue date
Jul 22, 2025
Taiwan Semiconductor Manufacturing Co., Ltd
Hsi-Wen Tien
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device having air gap and method for manufacturing th...
Patent number
12,368,073
Issue date
Jul 22, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Hung-Yu Yen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Graphene integration
Patent number
12,368,075
Issue date
Jul 22, 2025
Lam Research Corporation
Bhadri N. Varadarajan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package and method comprising formation of redistribu...
Patent number
12,368,077
Issue date
Jul 22, 2025
Taiwan Semiconductor Manufacturing Co., Ltd
Jiun Yi Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device with etched landing pad surface and manufactur...
Patent number
12,369,298
Issue date
Jul 22, 2025
NANYA TECHNOLOGY CORPORATION
Yen-Ho Chu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Interconnect structure and methods of forming the same
Patent number
12,368,076
Issue date
Jul 22, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Yu-An Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Memory device
Patent number
12,369,292
Issue date
Jul 22, 2025
Taiwan Semiconductor Manufacturing Co., Ltd
Yi-Hsin Nien
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Dual-side power rail design and method of making same
Patent number
12,368,078
Issue date
Jul 22, 2025
Taiwan Semiconductor Manufacturing Co., Ltd
Chih-Chao Chou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Simultaneous filling of variable aspect ratio single damascene cont...
Patent number
12,368,095
Issue date
Jul 22, 2025
Intel Corporation
AKM Shaestagir Chowdhury
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Contact structures for reducing electrical shorts and methods of fo...
Patent number
12,368,097
Issue date
Jul 22, 2025
Taiwan Semiconductor Manufacturing Company Limited
Tung-Jiun Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Diagonal vias in semiconductor structures
Patent number
12,368,106
Issue date
Jul 22, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Shih-Wei Peng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Epitaxial layers in source/drain contacts and methods of forming th...
Patent number
12,369,386
Issue date
Jul 22, 2025
Taiwan Semiconductor Manufacturing Co., Ltd
Ding-Kang Shih
C30 - CRYSTAL GROWTH
Information
Patent Grant
Systems and methods for fabrication of superconducting integrated c...
Patent number
12,369,501
Issue date
Jul 22, 2025
1372934 B.C. LTD
Eric Ladizinsky
B82 - NANO-TECHNOLOGY
Information
Patent Grant
Method for manufacturing semiconductor structure, and semiconductor...
Patent number
12,362,192
Issue date
Jul 15, 2025
CHANGXI MEMORY TECHNOLOGIES, INC.
Yexiao Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Test structure of wafer and method of manufacturing test structure...
Patent number
12,362,242
Issue date
Jul 15, 2025
CHANGXIN MEMORY TECHNOLOGIES, INC.
Hongcheng Zhu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods of packaging semiconductor devices and packaged semiconduct...
Patent number
12,362,260
Issue date
Jul 15, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Li-Hui Cheng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device including through die via
Patent number
12,362,262
Issue date
Jul 15, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Partial barrier free vias for cobalt-based interconnects and method...
Patent number
12,362,281
Issue date
Jul 15, 2025
Taiwan Semiconductor Manufacturing Co., Ltd
Tsung-Ling Tsai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor structure and manufacturing method thereof
Patent number
12,362,282
Issue date
Jul 15, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Ching-Jung Yang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device comprising transistor
Patent number
12,364,041
Issue date
Jul 15, 2025
Semiconductor Energy Laboratory Co., Ltd.
Motomu Kurata
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
METHOD OF MANUFACTURING METAL STRUCTURE HAVING FUNNEL-SHAPED INTERC...
Publication number
20250239519
Publication date
Jul 24, 2025
NANYA TECHNOLOGY CORPORATION
MIN-CHUNG CHENG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD OF ELECTRONIC PACKAGE
Publication number
20250239530
Publication date
Jul 24, 2025
VIA TECHNOLOGIES, INC.
Yeh-Chi Hsu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHODS OF FORMING CONTACT FEATURES IN FIELD-EFFECT TRANSISTORS
Publication number
20250241052
Publication date
Jul 24, 2025
Taiwan Semiconductor Manufacturing Co., LTD
Yi-Hsiung LIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
GATE STACK TREATMENT
Publication number
20250241055
Publication date
Jul 24, 2025
Taiwan Semiconductor Manufacturing Co., Ltd.
Chandrashekhar Prakash Savant
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR MEMORY DEVICE
Publication number
20250240972
Publication date
Jul 24, 2025
KIOXIA Corporation
Hidenobu NAGASHIMA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SELF-ALIGNED CONTACTS
Publication number
20250239486
Publication date
Jul 24, 2025
Intel Corporation
Mark T. BOHR
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MEMORY ARRAYS AND METHODS USED IN FORMING A MEMORY ARRAY
Publication number
20250239520
Publication date
Jul 24, 2025
Lodestar Licensing Group LLC
Harsh Narendrakumar Jain
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
Publication number
20250239525
Publication date
Jul 24, 2025
SK HYNIX INC.
Se Ra HWANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF MAKING ELECTROSTATIC DISCHARGE PROTECTION CELL AND ANTENN...
Publication number
20250239541
Publication date
Jul 24, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
HoChe YU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor structure with a deep trench capacitor structures and...
Publication number
20250240985
Publication date
Jul 24, 2025
UNITED MICROELECTRONICS CORP.
Yi-Fan Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SELECTIVE FILM DEPOSITION
Publication number
20250239484
Publication date
Jul 24, 2025
ASM IP HOLDING B.V.
Paul Ma
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
MEMORY DEVICE INCLUDING SELF-ALIGNED CONDUCTIVE CONTACTS
Publication number
20250239485
Publication date
Jul 24, 2025
Micron Technology, Inc.
Kar Wui Thong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HERMETIC VIAS WITH LOWER PARASITIC CAPACITANCES
Publication number
20250239488
Publication date
Jul 24, 2025
HAHN-SCHICKARD-GESELLSCHAFT FUR ANGEWANDTE FORSCHUNG E.V.
Alfons Dehé
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
VERTICAL WIRING OF A SEMICONDUCTOR COMPONENT
Publication number
20250239489
Publication date
Jul 24, 2025
Siemens Healthineers AG
Michael HOSEMANN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ETCHING COMPOSITIONS AND METHODS FOR FABRICATING SEMICONDUCTOR DEVI...
Publication number
20250236793
Publication date
Jul 24, 2025
Samsung Electronics Co., Ltd.
Min Hyung CHO
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information
Patent Application
INTEGRATED CIRCUIT PROVIDING POWER GATING AND METHOD OF DESIGNING T...
Publication number
20250239524
Publication date
Jul 24, 2025
Samsung Electronics Co., Ltd.
Jianfeng Liu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SUBSTRATE-TREATMENT METHOD AND SUBSTRATE-TREATMENT SYSTEM
Publication number
20250239446
Publication date
Jul 24, 2025
TOKYO ELECTRON LIMITED
Isao GUNJI
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
SEMICONDUCTOR DEVICE STRUCTURE AND MANUFACTURING METHOD THEREOF
Publication number
20250239449
Publication date
Jul 24, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Kun-Yen Liao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE WITH SELF-ALIGNED VIAS
Publication number
20250239487
Publication date
Jul 24, 2025
Taiwan Semiconductor Manufacturing Co., Ltd.
Chien-Han Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE
Publication number
20250239501
Publication date
Jul 24, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Hao-Yi Tsai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Different Via Configurations for Different Via Interface Requirements
Publication number
20250239527
Publication date
Jul 24, 2025
Taiwan Semiconductor Manufacturing Co., LTD
Shih-Che Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STRUCTURE INCLUDING SiOCN LAYER AND METHOD OF FORMING SAME
Publication number
20250239444
Publication date
Jul 24, 2025
ASM IP HOLDING B.V.
YoungChol Byun
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
Through Via Power Delivery Structure for Stacked Chips
Publication number
20250233054
Publication date
Jul 17, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Chih-Chieh CHANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
Publication number
20250233071
Publication date
Jul 17, 2025
Taiwan Semiconductor Manufacturing company Ltd.
CHI-TA LU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HIGH ASPECT RATIO CARBON LAYER ETCH WITH IMPROVED THROUGHPUT AND PR...
Publication number
20250232981
Publication date
Jul 17, 2025
TOKYO ELECTRON LIMITED
Du Zhang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHODS OF MANUFACTURING INTERCONNECT STRUCTURES
Publication number
20250233015
Publication date
Jul 17, 2025
Applied Materials, Inc.
Bhaskar Jyoti Bhuyan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
Publication number
20250233016
Publication date
Jul 17, 2025
Taiwan Semiconductor Manufacturing company Ltd.
JHENG-HONG JIANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
GATE CONTACT STRUCTURE OVER ACTIVE GATE AND METHOD TO FABRICATE SAME
Publication number
20250233020
Publication date
Jul 17, 2025
Intel Corporation
Abhijit Jayant PETHE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR STRUCTURE
Publication number
20250233012
Publication date
Jul 17, 2025
WINBOND ELECTRONICS CORP.
Hung-Yu Wei
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CONTACT RESISTANCE BETWEEN VIA AND CONDUCTIVE LINE
Publication number
20250233018
Publication date
Jul 17, 2025
Taiwan Semiconductor Manufacturing Co., LTD
Chun-Yuan Chen
H01 - BASIC ELECTRIC ELEMENTS