Patent Application
20070282549
These and other features of this invention will be more readily understood from the following detailed description of the various aspects of the invention taken in conjunction with the accompanying drawings that depict various embodiments of the invention, in which:
It is noted that the drawings of the invention are not to scale. The drawings are intended to depict only typical aspects of the invention, and therefore should not be considered as limiting the scope of the invention. In the drawings, like numbering represents like elements between the drawings.
As indicated above, the invention provides a method and system of providing a dynamic sampling plan for integrated metrology (IM), typically associated with a wafer manufacturing process tool.
With reference to the accompanying drawings,
Continuing with
Referring to
In any event, computer 102 can comprise any general purpose computing article of manufacture capable of executing computer program code installed by a user (e.g., a personal computer, server, handheld device, etc.). However, it is understood that computer 102, dynamic sampling plan program 90, and dynamic sampling plan system 100 are only representative of various possible equivalent computing devices that may perform the process of the invention. To this extent, in other embodiments, computer 102 can comprise any specific purpose computing article of manufacture comprising hardware and/or computer program code for performing specific functions, any computing article of manufacture that comprises a combination of specific purpose and general purpose hardware/software, or the like. In each case, the program code and hardware can be created using standard programming and engineering techniques, respectively.
Similarly, computer 102 is only illustrative of various types of computer infrastructures for implementing the invention. For example, in one embodiment, computer 102 comprises two or more computing devices (e.g., a server cluster) that communicate over any type of wired and/or wireless communications link, such as a network, a shared memory, or the like, to perform the process of the invention. When the communications link comprises a network, the network can comprise any combination of one or more types of networks (e.g., the Internet, a wide area network, a local area network, a virtual private network, etc.). Regardless, communications between the computing devices may utilize any combination of various types of transmission techniques.
To this extent, dynamic sampling plan program 90 may further comprise a plurality of dynamic sampling plan programs 90. For example, as shown in
Turning to
In a first step S1, a dynamic sampling plan model is built by sampling plan system 100 in FL-APC system 56 during each run. Step S1 may further comprise several sub-steps, such as steps S2 through S5. Step S2 (“Specify Tool ID”) may comprise specifying which tool 52 (e.g., “Tool1”, “Tool2”, etc.) in system 50 requires a dynamic sampling plan. Step S3 (“Select Sampling Type”) may comprise selecting a sampling type 150. Available sampling types 150 may comprise, for example, two sampling options wherein a first option includes a fixed sampling frequency, and a second option which includes matching wafers that are pre-measured. Other sampling types may be available for other options. Step S4 (“Select Sampling Frequency”) may comprise selecting a sampling frequency 152. Sampling frequency 152 typically may be employed when fixed sampling frequency is selected during step S3. Sampling frequency 152 may comprise, for example, selecting a sampling number such as every wafer, no wafer, or every nth wafer. Alternatively, a sampling number need not be selected in an embodiment, for example, where matching of wafers is selected in step S3. Step S5 (“Sampling Plan Record”) follows wherein a sampling plan record 154 is updated and recorded, by the dynamic sampling plan system 100 in the FL-APC 56, every time that a lot (e.g., wafers) is run. The sampling plan record 154 is typically a recordation of the actual sampling plan that was executed by the tool 52 during the lot run and may include, for example, all wafers, no wafers, a fixed frequency “x”, and/or wafers that were pre-measured.
In a next step S6, typically conducted during front opening unified pod (FOUP) 64 reservation time, MES 54 sends a request to FL-APC system 56 and queries for a recommendation of a sampling plan for a particular FOUP 64. The reservation time includes the time period before the arrival of FOUP 64 at tool 52 and tool 52 has commenced activity on FOUP 64. During the reservation time, typically after a successful runtime handshaking between MES 54 and FL-APC 56, the FOUP 64 is served by MES 54 with logistical information (e.g., tool ID, recipe, route, operational information, etc.).
In steps S7 and S8, dynamic sampling plan system 100 in FL-APC system 56 determines the sampling plan based on what has been modeled (e.g., step S1 and steps S2-S5) and FL-APC system 56 sends a response back to MES 54. The response may comprise a recommended sampling plan. MES 54 may further send recommended sampling plan to EI 58, where the EI 58 may use the recommended sampling plan in creating a process job. The process job, incorporating the recommended sampling plan, is used by tool 52. In this manner, the tool 52 benefits in the receipt and use of the recommended sampling plan.
A final step S9 of method comprises dynamic sampling plan system 100 in FL-APC system 56 updating the dynamic sampling plan system 100, the sampling plan model that has been used, and a return to step S5 as discussed herein.
It is understood that the order of the above-described steps is only illustrative. To this extent, one or more steps can be performed in parallel, in a different order, at a remote time, etc. Further, one or more of the steps may not be performed in various embodiments of the invention. In addition, use of dynamic sampling plan system 100 in a semiconductor fabrication environment 50 is only illustrative as the invention may find application in a number of different manufacturing settings.
While shown and described herein as a method and system for providing a dynamic sampling plan for integrated metrology (IM) associated with a wafer manufacturing process tool, it is understood that the invention further provides various alternative embodiments. For example, in one embodiment, the invention provides a computer-readable medium that includes computer program code to enable a computer infrastructure to provide a dynamic sampling plan for integrated metrology (IM) associated with a wafer manufacturing process tool. To this extent, the computer-readable medium includes program code, such as dynamic sampling plan system 100 (
In another embodiment, the invention provides a business method that performs the process of the invention on a subscription, advertising, and/or fee basis. That is, a service provider, such as an Application Service Provider, could offer to provide a dynamic sampling plan for integrated metrology (IM) associated with a wafer manufacturing process tool as described above. In this case, the service provider can manage (e.g., create, maintain, support, etc.) a computer infrastructure, such as computer 102 (
In still another embodiment, the invention provides a method of generating a system for providing a dynamic sampling plan for integrated metrology (IM) associated with a wafer manufacturing process tool. In this case, a computer infrastructure, such as computer 102 (
As used herein, it is understood that the terms “program code” and “computer program code” are synonymous and mean any expression, in any language, code or notation, of a set of instructions intended to cause a computing device having an information processing capability to perform a particular function either directly or after any combination of the following: (a) conversion to another language, code or notation; (b) reproduction in a different material form; and/or (c) decompression. To this extent, program code can be embodied as one or more types of program products, such as an application/software program, component software/a library of functions, an operating system, a basic I/O system/driver for a particular computing and/or I/O device, and the like.
The foregoing description of various aspects of the invention has been presented for purposes of illustration and description. It is not intended to be exhaustive or to limit the invention to the precise form disclosed, and obviously, many modifications and variations are possible. Such modifications and variations that may be apparent to a person skilled in the art are intended to be included within the scope of the invention as defined by the accompanying claims.
