Claims
- 1. A method for achieving precise location of wafers within a cassette in preparation for removal of the wafers individually from the cassette by automated equipment for processing, the method comprising:
- forming a jig device having a first elongated body having an upper surface provided with a plurality of teeth separated by substantially V-shaped grooves, wherein the bottom portion of each groove is configured to accept an edge of a semiconductor wafer and wherein a top of each of the plurality of teeth form a trapezoid with two parallel sides of unequal length,
- mounting said jig device upon a surface, said jig device being configured so that when said cassette is placed upon the surface, said jig device extends through a bottom portion of said cassette to engage wafers within said cassette individually, thereby providing precise positioning of said wafers within said cassette; and
- placing said cassette upon said surface in preparation for removal of said wafers individually from said cassette by automated equipment.
- 2. A method as recited in claim 1 wherein said jig device includes two sawtooth jigs and each wafer within the cassette rests within a groove within each of the two sawtooth jigs when the cassette is placed on the surface.
Parent Case Info
This is a division of application Ser. No. 07/715,882 filed Jun. 17, 1991, now U.S. Pat. No. 5,149,244 issued Sep. 22, 1992 which is a continuation of U.S. application Ser. No. 07/395,679 filed Aug. 18, 1989, now abandoned.
US Referenced Citations (14)
Foreign Referenced Citations (2)
Number |
Date |
Country |
56-24921 |
Mar 1981 |
JPX |
61-124407 |
Jun 1986 |
JPX |
Divisions (1)
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Number |
Date |
Country |
Parent |
715882 |
Jun 1991 |
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Continuations (1)
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Number |
Date |
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Parent |
395679 |
Aug 1989 |
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