Claims
- 1. A method for dechucking a substrate comprising the steps of:
projecting a first set of lift pins a first distance above a surface of a substrate support; and projecting a second set of lift pins a second distance above the surface of the substrate support that is less than the first distance projected by the first set of lift pins.
- 2. The method of claim 1, wherein the second set of lifts pins projects at a position radially inward of the first set of lift pins.
- 3. The method of claim 1, wherein the difference in the distances projected by the first and second sets of lift pins is at least 2 mm.
- 4. The method of claim 1 further comprising the steps of:
contacting a substrate with the first set of lift pins and causing the substrate to bow; lifting the substrate to a spaced-apart relation relative to the substrate support substantially without the second set of lift pins contacting the substrate.
- 5. The method of claim 4, wherein the substrate is caused to bow a distance that is less than the difference in projection distances between the first and second sets of lift pins.
- 6. The method of claim 1 further comprising the steps of:
causing the substrate to form a bowed region between a plurality of the first set of lift pins by contacting a substrate with the first set of lift pins; contacting the substrate in the bowed region with the second set of lift pins.
- 7. The method of claim 6, wherein the substrate is caused to bow a distance that is about equal to the difference in projection distances between the first and second sets of lift pins.
- 8. The method of claim 6, further comprising the step of:
overcoming a residual attraction between the substrate and the substrate support proximate to the bowed region of the substrate; breaking contact between the substrate and the second set of lift pins; and supporting the substrate upon the first set of lift pins in a spaced apart relation to the substrate support.
- 9. The method of claim 1 further comprising the steps of:
actuating a lift plate to contact the first set of lift pins before contacting the second set of lift pins.
- 10. The method of claim 9 further comprising the steps of:
contacting the first set of lift pins with a raised rim of the lift plate that projects from a center portion of the lift plate; and contacting the second set of lift pins with the center portion.
- 11. The method of claim 1, further comprising:
lowering the substrate support so that the first and second sets of lift pins are contacted by a lift plate.
- 12. A method for dechucking a substrate comprising the steps of:
moving a lift plate towards a substrate support to displace a first set of lift pins and a second set of lift pins; extending the first set of lift pins with the lift plate a first distance above a support surface of the substrate support; and extending the second set of lift pins with the lift plate a second distance above the support surface of the substrate support, wherein the second distance is less than the first distance.
- 13. The method of claim 12, wherein the second set of lifts pins projects at a position radially inward of the first set of lift pins.
- 14. The method of claim 12 further comprising the steps of:
contacting the substrate with the first set of lift pins and causing the substrate to bow; lifting the substrate to a spaced-apart relation relative to the substrate support substantially without the second set of lift pins contacting the substrate.
- 15. The method of claim 14, wherein the substrate is caused to bow a distance that is less than the difference in projection distances between the first and second sets of lift pins.
- 16. The method of claim 12 further comprising the steps of:
causing the substrate to form a bowed region between a plurality of the first set of lift pins by contacting a substrate with the first set of lift pins; contacting the substrate in the bowed region with the second set of lift pins.
- 17. The method of claim 16, wherein the substrate is caused to bow a distance that is about equal to the difference in projection distances between the first and second sets of lift pins.
- 18. The method of claim 16, further comprising the step of:
overcoming a residual attraction between the substrate and the substrate support proximate to the bowed region of the substrate; breaking contact between the substrate and the second set of lift pins; and supporting the substrate upon the first set of lift pins in a spaced apart relation to the substrate support.
- 19. The method of claim 12 further comprising the steps of:
actuating a lift plate to contact the first set of lift pins before contacting the second set of lift pins.
- 20. The method of claim 19 further comprising the steps of:
contacting the first set of lift pins with a raised rim of the lift plate that projects from a center portion of the lift plate; and contacting the second set of lift pins with the center portion.
CROSS-REFERENCE TO RELATED APPLICATIONS
[0001] This application claims the benefit of co-pending U.S. patent application Ser. No. 10/308,385, filed Dec. 2, 2002, which is a continuation of U.S. patent application Ser. No. 09/619,870, filed Jul.20, 2000, now abandoned, which are herein incorporated by reference in their entireties.
Divisions (1)
|
Number |
Date |
Country |
Parent |
10308385 |
Dec 2002 |
US |
Child |
10688384 |
Oct 2003 |
US |
Continuations (1)
|
Number |
Date |
Country |
Parent |
09619870 |
Jul 2000 |
US |
Child |
10308385 |
Dec 2002 |
US |