The present invention relates to a die used for resin molding such as injection molding, and a method for decorating the surface of the die.
Of late, the external appearance and finish of plastic molding used in automobiles and home electric appliances have come to be highly valued in order to enhance luxury as well as to increase an added-value of commercial merchandise. Particularly, resin molding that is molded by injection molding or the like can have a variety of facades depending on die surface decorations. Conventionally, of the die surface decorations in molding, there has been known an etching method by which to corrode the die through the functions of chemical agents, making it possible to form on the die surface a variety of patterns such as satin finished surface, leathery surface, grain woody texture, linear embossing, geometric patterns or the like. In addition, there is known a sand-blast (honing) processing that forms a fine pattern on the surface of an object by physically blasting and glass beads.
On the other hand, there is known a method of exposing a metal part of the portion necessary for etching or similar by spraying a photoresist in liquid form across the whole of a die and sticking a photoengraved film-like photomask to the die to be exposed and developed.
Hereinafter, a method using a conventional film-like photomask will be explained with reference to
First, as shown in
Meanwhile, there is known another method of directly exposing a photoresist coated on a die by using laser beams.
In Japanese published patent application No. 51-63866 published by the Japanese Patent Office, a method is disclosed in which concavity and convexity are formed by an etching process on the core side surface of a die used for injection molding.
However, the decorations by the etching method and sand-blast process (honing) have been rarely applied to the whole of the die, so that it is necessary to cover and hide the parts to which it is unnecessary to apply thereof by adhesive tapes for masking or the like. There are many cases where it depends on manual work such as when the die has a complicated three-dimensional configuration and when it has parts in need of fine work such that it caused a lot of trouble and there was a limit in its process.
On the other hand, the masking method that uses photoresist has a high feasibility of molding a pattern with high accuracy when it is compared with the above-mentioned masking method. However, when it comes to the case where a pattern needs to be incised on the surface of a die, the photomask must be cut apart and then joined with each other on a three-dimensional die, which leads to an occurrence somewhere of a seam between the photoresist, making perfect transcription impossible. As a result, as shown in
A second invention is a method for decorating the surface of a die according to the first invention, wherein molding the film-like photomask into the same shape as that of aforesaid die is performed by sticking a heated photomask to a predetermined die.
A third invention is a die for resin molding wherein a film-like photomask molded into the same shape as that of aforesaid die is stuck to a photoresist coated on the surface of aforesaid die to be exposed and developed for etching, and a pattern made on aforesaid photomask is formed on the surface thereof.
A first invention is a method for decorating the surface of a die which comprises the steps of coating the surface of the die with a photoresist; molding a film-like photomask into the same shape as that of aforesaid die; sticking the photomask molded into aforesaid shape to aforesaid die coated with the photoresist to be exposed and developed; and etching a pattern formed on aforesaid photomask into aforesaid developed die.
By employing such a manner, a pattern can be uniformly formed without difficulties on the surface of a die having a three-dimensional curved surface and molded components with an excellent appearance can be obtained. Accordingly, a wide range of three-dimensional designs as has been conventionally impossible can be obtained, enabling value-added products to be provided.
Hereinafter, an embodiment of the present invention will be explained with reference to
First, a photomask 2 shown in
Next, as shown in
Next, as shown in
With the above described method, as shown in
Next, of the die 1 shown in
Next, as shown in
The above pattern-transcribed die 1′ is sprayed with iron chloride aqueous solution, and after rinsed in water, the photoresist is exfoliated by, for example, 2% sodium hydroxide aqueous solution of 50° C. in temperature to provide an etching-finished die 1″ with a predetermined pattern formed thereon, as shown in
When a diaphragm is injection-molded using the die 1″ formed by the process as described above, the molded diaphragm has a uniform pattern formed on the whole surface including the cone shape thereof to have an excellent external appearance. That is, a seam 20a shown in
It should be noted that a film used as the photomask according to this embodiment is formed of a general-purpose polyester film coated with a photo-sensitive material and the thickness thereof is preferably 100 μm or more and 250 μm or less, and the film is required to be capable of being molded by such molding technology as vacuum molding or the like. Needless to say, other materials and thickness than those of the above described film can be used as long as they have the feasibility of vacuum molding. A photosensitive material coated thereon is not particularly specified; however the material preferably possesses thermal resistance, so that when a pattern-formed film is vacuum-molded, the material extends accordingly to the amount of stretch of a base polyester without destroying the formed pattern due to heat at the time of molding.
Further, photoresist used in this embodiment may be either of a negative type or a positive type as long as the photoresist has the feasibility of being spray-coated because it needs to be coated on a three-dimensionally curved surface, and becomes tack-free when dried.
A light source that is used at a time of the exposure of the photoresist is preferably a device that can more or less change an angle of light thereof, because the amount of exposure of the vertical surface of a die with respect to the direction of the light source is not sufficient; and the light source is not specifically limited as long as it is corresponding to an absorption wavelength of the photoresist.
In addition, although the present invention is applied to the die for molding the diaphragm used in a speaker, needless to say the above described embodiment can be applied to a die for molding other resin components. Further, as for a pattern to be formed on the surface of a die, a letter or symbol, not a uniform pattern mentioned above, may be formed on the surface thereof as a pattern.
According to the present invention, a pattern can be uniformly formed without difficulties on the surface of a die having a three-dimensional curved surface and molded components with an excellent appearance can be obtained. Accordingly, a wide range of three-dimensional designs as has been conventionally impossible can be obtained, enabling value-added products to be provided.
Number | Date | Country | Kind |
---|---|---|---|
2003-146741 | May 2003 | JP | national |
Filing Document | Filing Date | Country | Kind | 371c Date |
---|---|---|---|---|
PCT/JP2004/007320 | 5/21/2004 | WO | 00 | 5/18/2005 |
Publishing Document | Publishing Date | Country | Kind |
---|---|---|---|
WO2004/103671 | 12/2/2004 | WO | A |
Number | Name | Date | Kind |
---|---|---|---|
2284929 | Stewart | Jun 1942 | A |
2816025 | Dahlberg | Dec 1957 | A |
3462524 | Lemelson | Aug 1969 | A |
3504063 | Lemelson | Mar 1970 | A |
4102735 | Weglin | Jul 1978 | A |
4254184 | Tsukagoshi et al. | Mar 1981 | A |
4388388 | Kornbau et al. | Jun 1983 | A |
4437924 | Weglin | Mar 1984 | A |
4447286 | Weglin | May 1984 | A |
4497686 | Weglin | Feb 1985 | A |
4579634 | Weglin | Apr 1986 | A |
4985116 | Mettler et al. | Jan 1991 | A |
5344729 | Akins et al. | Sep 1994 | A |
5445772 | Uchida et al. | Aug 1995 | A |
5552249 | Jensen et al. | Sep 1996 | A |
5650249 | Dull et al. | Jul 1997 | A |
6013331 | Ogawa | Jan 2000 | A |
6156484 | Bassous et al. | Dec 2000 | A |
6416908 | Klosner et al. | Jul 2002 | B1 |
6627092 | Clements et al. | Sep 2003 | B2 |
6916181 | Brown et al. | Jul 2005 | B2 |
20010048174 | Yamada et al. | Dec 2001 | A1 |
20040265543 | Komatsu et al. | Dec 2004 | A1 |
20050244535 | Tokura et al. | Nov 2005 | A1 |
Number | Date | Country |
---|---|---|
0 320 925 | Jun 1989 | EP |
51-063866 | Jun 1976 | JP |
57178810 | Nov 1982 | JP |
60-024016 | Feb 1985 | JP |
07319146 | Dec 1995 | JP |
10097054 | Apr 1998 | JP |
2000127252 | May 2000 | JP |
2001347534 | Dec 2001 | JP |
Number | Date | Country | |
---|---|---|---|
20050244535 A1 | Nov 2005 | US |