METHOD FOR FABRICATING IDENTIFICATION CODE

Abstract

A method for fabricating an identification code is provided. First, a metallic film is provided for fabricating a circuit on a substrate, and a circuit area and a non-circuit area are formed on the metallic film after a patterning process. Next, an identification code is formed on the non-circuit area for the basis of production management and quality control.

Description

BRIEF DESCRIPTION DRAWINGS

The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a portion of this specification. The drawings illustrate embodiments of the invention, and together with the description, serve to explain the principles of the invention.

FIGS. 1˜3 schematically show a process for forming an identification code on a metallic film.

FIGS. 3A˜3C schematically show three different types of identification codes.

FIG. 4 schematically shows a circuit substrate having an identification code formed thereon.

Claims

1. A method for fabricating an identification code, comprising: providing a metallic film for fabricating a circuit on a substrate, and performing a patterning process on the metallic film to form a circuit area and a non-circuit area; andforming the identification code on the non-circuit area.

2. The method for fabricating the identification code of claim 1, after the formation of the identification code, further comprising forming a dielectric layers on the substrate to cover the circuit area and the non-circuit area.

3. The method for fabricating the identification code of claim 2, wherein the substrate is a core layer of a matrix substrate.

4. The method for fabricating the identification code of claim 1, wherein the step for forming the identification code on the non-circuit area is performed by using laser drilling process.

5. The method for fabricating the identification code of claim 1, wherein the identification code comprises a barcode or a serial number code.

6. A method for fabricating an identification code, comprising: providing a first metallic film on a first surface of a substrate;forming a circuit on a first area of the first metallic film; andforming the identification code on a second area of the first metallic film.

7. The method for fabricating the identification code of claim 6, further comprising providing a second metallic film on a second surface of the substrate, wherein the first and the second surface of the substrate are opposite.

8. The method for fabricating the identification code of claim 7, wherein the second metallic film further comprises a circuit.

9. The method for fabricating the identification code of claim 6, further comprising forming a dielectric layer to cover the circuit and the identification code.

10. The method for fabricating the identification code of claim 6, wherein the substrate is a core layer of a matrix substrate.

11. The method for fabricating the identification code of claim 6, wherein the step for forming the identification code on the non-circuit area is performed by using a laser drilling process.

12. The method for fabricating the identification code of claim 6, wherein the identification code comprises a barcode or a serial number code.