by building the multilayer layer by layer

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CPC
H05K3/4644

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K3/00Apparatus or processes for manufacturing printed circuits

Current Industry

H05K3/4644by building the multilayer layer by layer

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Wiring board
- Patent number 12,245,366
- Issue date Mar 4, 2025
- Kyocera Corporation
- Hidetoshi Yugawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Information handling system and peripheral printed circuit board ha...
- Patent number 12,245,372
- Issue date Mar 4, 2025
- Dell Products L.P.
- Peng Lip Goh
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Printed circuit board having embedded component
- Patent number 12,185,478
- Issue date Dec 31, 2024
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Gerald Weidinger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Copper-clad laminate and method of forming the same
- Patent number 12,173,201
- Issue date Dec 24, 2024
- VERSIV COMPOSITES LIMITED
- Jennifer Adamchuk
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Circuit board structure and manufacturing method thereof
- Patent number 12,160,953
- Issue date Dec 3, 2024
- Unimicron Technology Corp.
- Kai-Ming Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Providing a lower inductance path in a routing substrate for a capa...
- Patent number 12,160,952
- Issue date Dec 3, 2024
- QUALCOMM Incorporated
- Biancun Xie
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Catheter splines with embedded circuit elements
- Patent number 12,150,751
- Issue date Nov 26, 2024
- BIOSENSE WEBSTER (ISRAEL) LTD.
- Assaf Govari
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Embedded circuit board and manufacturing method thereof
- Patent number 12,156,348
- Issue date Nov 26, 2024
- QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD
- Cheng-Yi Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fabrication of superconducting devices that control direct currents...
- Patent number 12,148,974
- Issue date Nov 19, 2024
- International Business Machines Corporation
- Baleegh Abdo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board and method for producing circuit board
- Patent number 12,133,328
- Issue date Oct 29, 2024
- Murata Manufacturing Co., Ltd.
- Tomoki Kato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Patterned article including electrically conductive elements
- Patent number 12,133,327
- Issue date Oct 29, 2024
- 3M Innovative Properties Company
- Raymond P. Johnston
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring structure, method for manufacturing same, and semiconductor...
- Patent number 12,114,437
- Issue date Oct 8, 2024
- Resonac Corporation
- Masaya Toba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer printed circuit board made of different materials and m...
- Patent number 12,108,544
- Issue date Oct 1, 2024
- TSE CO., LTD.
- Eun Ha Park
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board structure and manufacturing method thereof
- Patent number 12,108,530
- Issue date Oct 1, 2024
- Unimicron Technology Corp.
- Kuang-Ching Fan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Millimeter thick magnetic PCB with high relative permeability and d...
- Patent number 12,094,630
- Issue date Sep 17, 2024
- Winchester Technologies, LLC
- Nian-Xiang Sun
- B32 - LAYERED PRODUCTS
Information Patent Grant
Integrated electronic device with flexible and stretchable substrate
- Patent number 12,096,553
- Issue date Sep 17, 2024
- Carnegie Mellon University
- Gary K. Fedder
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Printed wiring board
- Patent number 12,082,338
- Issue date Sep 3, 2024
- Ibiden Co., Ltd.
- Satoru Kawai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer substrate and method for manufacturing same
- Patent number 12,063,738
- Issue date Aug 13, 2024
- Murata Manufacturing Co., Ltd.
- Kosuke Nishio
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Catalyzed metal foil and uses thereof to produce electrical circuits
- Patent number 12,063,748
- Issue date Aug 13, 2024
- AVERATEK CORPORATION
- Shinichi Iketani
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Power module and manufacturing method thereof
- Patent number 12,058,814
- Issue date Aug 6, 2024
- Delta Electronics (Shanghai) Co., Ltd.
- Shouyu Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices and methods related to metallization of ceramic substrates...
- Patent number 12,058,806
- Issue date Aug 6, 2024
- Skyworks Solutions, Inc.
- Shaul Branchevsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed wiring board and method for manufacturing printed wiring board
- Patent number 12,052,819
- Issue date Jul 30, 2024
- Ibiden Co., Ltd.
- Tomohiro Kobayashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stacked-layer board, electronic component module, and method of man...
- Patent number 12,052,821
- Issue date Jul 30, 2024
- Murata Manufacturing Co., Ltd.
- Takuya Goitsuka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Patterned conductive article
- Patent number 12,048,092
- Issue date Jul 23, 2024
- 3M Innovative Properties Company
- Raymond P. Johnston
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board and method for manufacturing the same
- Patent number 12,035,485
- Issue date Jul 9, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Guh Hwan Lim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board, light emitting device, and manufacturing method thereof
- Patent number 12,035,481
- Issue date Jul 9, 2024
- Nichia Corporation
- Masakazu Sakamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer board and method for manufacturing same
- Patent number 12,028,990
- Issue date Jul 2, 2024
- STEMCO CO., LTD.
- Sung Jin Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and method for preparing same, and electronic device
- Patent number 12,028,965
- Issue date Jul 2, 2024
- Chengdu BOE Optoelectronics Technology Co., Ltd.
- Qing Gong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Guided transport path correction
- Patent number 12,028,991
- Issue date Jul 2, 2024
- Kateeva, Inc.
- Eliyahu Vronsky
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Ceramic electronic component
- Patent number 12,022,622
- Issue date Jun 25, 2024
- Murata Manufacturing Co., Ltd.
- Yuki Takemori
- B32 - LAYERED PRODUCTS

Patents Applicationslast 30 patents

Information Patent Application
PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, PRINTED C...
- Publication number 20250116930
- Publication date Apr 10, 2025
- Resonac Corporation
- Naomitsu KOMORI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250106992
- Publication date Mar 27, 2025
- InnoLux Corporation
- Chen-Kuan KAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT CARRIER AND METHOD
- Publication number 20250106993
- Publication date Mar 27, 2025
- Vitesco Technologies GMBH
- Detlev BAGUNG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CHIP PACKAGE WITH EMBEDDED AND SHIELDED INDUCTORS
- Publication number 20250096089
- Publication date Mar 20, 2025
- ADVANCED MICRO DEVICES, INC.
- Robert Grant SPURNEY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICES AND METHODS RELATED TO METALLIZATION OF CERAMIC SUBSTRATES...
- Publication number 20250089154
- Publication date Mar 13, 2025
- Skyworks Solutions, Inc.
- Shaul BRANCHEVSKY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CATHETER SPLINES WITH EMBEDDED CIRCUIT ELEMENTS
- Publication number 20250082220
- Publication date Mar 13, 2025
- BIOSENSE WEBSTER (ISRAEL) LTD.
- Assaf Govari
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
GENERATION OF RANDOM SECURITY CIRCUIT PATTERNS FOR IN-SITU FABRICAT...
- Publication number 20250089174
- Publication date Mar 13, 2025
- International Business Machines Corporation
- Hongqing ZHANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250081338
- Publication date Mar 6, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Sang Ho JEONG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BRIDGE PRINTED CIRCUIT BOARD EMBEDDED WITHIN ANOTHER PRINTED CIRCUI...
- Publication number 20250081348
- Publication date Mar 6, 2025
- Intel Corporation
- Arumanayagam RAJASEKAR
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20250071912
- Publication date Feb 27, 2025
- InnoLux Corporation
- Ming-Chih TSAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20250056721
- Publication date Feb 13, 2025
- HongQiSheng Precision Electronics (QinHuangdao) Co., Ltd.
- Cheng-Jia LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE CIRCUIT BOARD AND METHOD FOR FABRICATING THE SAME
- Publication number 20250056715
- Publication date Feb 13, 2025
- HongQiSheng Precision Electronics (QinHuangdao) Co., Ltd.
- Chao WANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGH-INTEGRATION-LEVEL CARRIER PLATE AND MANUFACTURING METHOD
- Publication number 20250056722
- Publication date Feb 13, 2025
- SHANGHAI METAPWR ELECTRONICS CO., LTD
- Shouyu Hong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE AND METHOD OF FABRICATING ELECTRONIC DEVICE
- Publication number 20250016926
- Publication date Jan 9, 2025
- BEIJING BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Huiying Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PATTERNED ARTICLE INCLUDING ELECTRICALLY CONDUCTIVE ELEMENTS
- Publication number 20250016916
- Publication date Jan 9, 2025
- 3M Innovative Properties Company
- Raymond P. Johnston
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Catalyzed Metal Foil and Uses Thereof
- Publication number 20240407106
- Publication date Dec 5, 2024
- Averatek Corporation
- Shinichi Iketani
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
WIRING STRUCTURE, METHOD FOR MANUFACTURING SAME, AND SEMICONDUCTOR...
- Publication number 20240397635
- Publication date Nov 28, 2024
- Resonac Corporation
- Masaya TOBA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BURIED SKIP VIAS FOR IMPROVED SIGNAL AND POWER INTEGRITY
- Publication number 20240389230
- Publication date Nov 21, 2024
- NVIDIA Corporation
- Mingyi Yu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20240389231
- Publication date Nov 21, 2024
- IBIDEN CO., LTD.
- Masashi KUWABARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING SUBSTRATE MATERIAL FOR SEMICONDUCTOR PACKA...
- Publication number 20240381529
- Publication date Nov 14, 2024
- Resonac Corporation
- Shunsuke OTAKE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD AND MANUFACTURING METHOD THEREFOR
- Publication number 20240357739
- Publication date Oct 24, 2024
- TOPPAN Holdings Inc.
- Tomoyuki Ishii
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
EMBEDDED INDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240314932
- Publication date Sep 19, 2024
- Unimicron Technology Corp.
- Chen-An TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GUIDED TRANSPORT PATH CORRECTION
- Publication number 20240314941
- Publication date Sep 19, 2024
- Kateeva, Inc.
- Eliyahu Vronsky
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
THERMALLY IMPROVED SUBSTRATE STRUCTURE AND PACKAGE ASSEMBLY WITH TH...
- Publication number 20240304534
- Publication date Sep 12, 2024
- MEDIATEK INC.
- Shu-Wei HSIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PATTERNED CONDUCTIVE ARTICLE
- Publication number 20240306290
- Publication date Sep 12, 2024
- 3M Innovative Properties Company
- Raymond P. Johnston
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE ELECTRONIC CIRCUIT FOR ULTRASOUND CATHETERS AND RELATED DE...
- Publication number 20240268790
- Publication date Aug 15, 2024
- St. Jude Medical, Cardiology Division, Inc.
- Arthur G. Blanck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240276643
- Publication date Aug 15, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Sang Hoon Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ORGANIC SUBSTRATE-BASED WEARABLE PLATFORM AND METHODS FOR ON-BODY S...
- Publication number 20240268037
- Publication date Aug 8, 2024
- Takaroa Corporation, Inc.
- Ethan M. Devine
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD OF ELECTRONIC DEVICE
- Publication number 20240237195
- Publication date Jul 11, 2024
- InnoLux Corporation
- Ker-Yih KAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240237202
- Publication date Jul 11, 2024
- Unimicron Technology Corp.
- Kai-Ming Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

by building the multilayer layer by layer

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Wiring board

Information handling system and peripheral printed circuit board ha...

Printed circuit board having embedded component

Copper-clad laminate and method of forming the same

Circuit board structure and manufacturing method thereof

Providing a lower inductance path in a routing substrate for a capa...

Catheter splines with embedded circuit elements

Embedded circuit board and manufacturing method thereof

Fabrication of superconducting devices that control direct currents...

Circuit board and method for producing circuit board

Patterned article including electrically conductive elements

Wiring structure, method for manufacturing same, and semiconductor...

Multi-layer printed circuit board made of different materials and m...

Circuit board structure and manufacturing method thereof

Millimeter thick magnetic PCB with high relative permeability and d...

Integrated electronic device with flexible and stretchable substrate

Printed wiring board

Multilayer substrate and method for manufacturing same

Catalyzed metal foil and uses thereof to produce electrical circuits

Power module and manufacturing method thereof

Devices and methods related to metallization of ceramic substrates...

Printed wiring board and method for manufacturing printed wiring board

Stacked-layer board, electronic component module, and method of man...

Patterned conductive article

Printed circuit board and method for manufacturing the same

Circuit board, light emitting device, and manufacturing method thereof

Multilayer board and method for manufacturing same

Circuit board and method for preparing same, and electronic device

Guided transport path correction

Ceramic electronic component

Patents Applicationslast 30 patents

PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, PRINTED C...

ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME

CIRCUIT CARRIER AND METHOD

CHIP PACKAGE WITH EMBEDDED AND SHIELDED INDUCTORS

DEVICES AND METHODS RELATED TO METALLIZATION OF CERAMIC SUBSTRATES...

CATHETER SPLINES WITH EMBEDDED CIRCUIT ELEMENTS

GENERATION OF RANDOM SECURITY CIRCUIT PATTERNS FOR IN-SITU FABRICAT...

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

BRIDGE PRINTED CIRCUIT BOARD EMBEDDED WITHIN ANOTHER PRINTED CIRCUI...

ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF

CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

FLEXIBLE CIRCUIT BOARD AND METHOD FOR FABRICATING THE SAME

HIGH-INTEGRATION-LEVEL CARRIER PLATE AND MANUFACTURING METHOD

ELECTRONIC DEVICE AND METHOD OF FABRICATING ELECTRONIC DEVICE

PATTERNED ARTICLE INCLUDING ELECTRICALLY CONDUCTIVE ELEMENTS

Catalyzed Metal Foil and Uses Thereof

WIRING STRUCTURE, METHOD FOR MANUFACTURING SAME, AND SEMICONDUCTOR...

BURIED SKIP VIAS FOR IMPROVED SIGNAL AND POWER INTEGRITY

PRINTED WIRING BOARD

METHOD FOR MANUFACTURING SUBSTRATE MATERIAL FOR SEMICONDUCTOR PACKA...

WIRING BOARD AND MANUFACTURING METHOD THEREFOR

EMBEDDED INDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

GUIDED TRANSPORT PATH CORRECTION

THERMALLY IMPROVED SUBSTRATE STRUCTURE AND PACKAGE ASSEMBLY WITH TH...

PATTERNED CONDUCTIVE ARTICLE

FLEXIBLE ELECTRONIC CIRCUIT FOR ULTRASOUND CATHETERS AND RELATED DE...

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

ORGANIC SUBSTRATE-BASED WEARABLE PLATFORM AND METHODS FOR ON-BODY S...

ELECTRONIC DEVICE AND MANUFACTURING METHOD OF ELECTRONIC DEVICE

CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF