by building the multilayer layer by layer

Industry

CPC
H05K3/4644

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K3/00Apparatus or processes for manufacturing printed circuits

Current Industry

H05K3/4644by building the multilayer layer by layer

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Circuit board
- Patent number 12,309,941
- Issue date May 20, 2025
- LG Innotek Co., Ltd
- Se Woong Na
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Providing one or more carbon layers to a copper conductive material...
- Patent number 12,289,831
- Issue date Apr 29, 2025
- Cisco Technology, Inc.
- Joel Goergen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board
- Patent number 12,289,829
- Issue date Apr 29, 2025
- Ibiden Co., Ltd.
- Jun Sakai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods for manufacturing thermoplastic liquid crystal polymer film...
- Patent number 12,280,550
- Issue date Apr 22, 2025
- Kuraray Co., Ltd.
- Takahiro Nakashima
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Low sheet resistance coating
- Patent number 12,284,770
- Issue date Apr 22, 2025
- Vitro Flat Glass LLC
- Zhixun Ma
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board
- Patent number 12,279,368
- Issue date Apr 15, 2025
- Ibiden Co., Ltd.
- Satoru Kawai
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Wiring circuit board and producing method thereof
- Patent number 12,279,367
- Issue date Apr 15, 2025
- Nitto Denko Corporation
- Rihito Fukushima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board
- Patent number 12,245,366
- Issue date Mar 4, 2025
- Kyocera Corporation
- Hidetoshi Yugawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Information handling system and peripheral printed circuit board ha...
- Patent number 12,245,372
- Issue date Mar 4, 2025
- Dell Products L.P.
- Peng Lip Goh
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Printed circuit board having embedded component
- Patent number 12,185,478
- Issue date Dec 31, 2024
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Gerald Weidinger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Copper-clad laminate and method of forming the same
- Patent number 12,173,201
- Issue date Dec 24, 2024
- VERSIV COMPOSITES LIMITED
- Jennifer Adamchuk
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Circuit board structure and manufacturing method thereof
- Patent number 12,160,953
- Issue date Dec 3, 2024
- Unimicron Technology Corp.
- Kai-Ming Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Providing a lower inductance path in a routing substrate for a capa...
- Patent number 12,160,952
- Issue date Dec 3, 2024
- QUALCOMM Incorporated
- Biancun Xie
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Catheter splines with embedded circuit elements
- Patent number 12,150,751
- Issue date Nov 26, 2024
- BIOSENSE WEBSTER (ISRAEL) LTD.
- Assaf Govari
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Embedded circuit board and manufacturing method thereof
- Patent number 12,156,348
- Issue date Nov 26, 2024
- QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD
- Cheng-Yi Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fabrication of superconducting devices that control direct currents...
- Patent number 12,148,974
- Issue date Nov 19, 2024
- International Business Machines Corporation
- Baleegh Abdo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board and method for producing circuit board
- Patent number 12,133,328
- Issue date Oct 29, 2024
- Murata Manufacturing Co., Ltd.
- Tomoki Kato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Patterned article including electrically conductive elements
- Patent number 12,133,327
- Issue date Oct 29, 2024
- 3M Innovative Properties Company
- Raymond P. Johnston
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring structure, method for manufacturing same, and semiconductor...
- Patent number 12,114,437
- Issue date Oct 8, 2024
- Resonac Corporation
- Masaya Toba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board structure and manufacturing method thereof
- Patent number 12,108,530
- Issue date Oct 1, 2024
- Unimicron Technology Corp.
- Kuang-Ching Fan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-layer printed circuit board made of different materials and m...
- Patent number 12,108,544
- Issue date Oct 1, 2024
- TSE CO., LTD.
- Eun Ha Park
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Millimeter thick magnetic PCB with high relative permeability and d...
- Patent number 12,094,630
- Issue date Sep 17, 2024
- Winchester Technologies, LLC
- Nian-Xiang Sun
- B32 - LAYERED PRODUCTS
Information Patent Grant
Integrated electronic device with flexible and stretchable substrate
- Patent number 12,096,553
- Issue date Sep 17, 2024
- Carnegie Mellon University
- Gary K. Fedder
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Printed wiring board
- Patent number 12,082,338
- Issue date Sep 3, 2024
- Ibiden Co., Ltd.
- Satoru Kawai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer substrate and method for manufacturing same
- Patent number 12,063,738
- Issue date Aug 13, 2024
- Murata Manufacturing Co., Ltd.
- Kosuke Nishio
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Catalyzed metal foil and uses thereof to produce electrical circuits
- Patent number 12,063,748
- Issue date Aug 13, 2024
- AVERATEK CORPORATION
- Shinichi Iketani
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Power module and manufacturing method thereof
- Patent number 12,058,814
- Issue date Aug 6, 2024
- Delta Electronics (Shanghai) Co., Ltd.
- Shouyu Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices and methods related to metallization of ceramic substrates...
- Patent number 12,058,806
- Issue date Aug 6, 2024
- Skyworks Solutions, Inc.
- Shaul Branchevsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed wiring board and method for manufacturing printed wiring board
- Patent number 12,052,819
- Issue date Jul 30, 2024
- Ibiden Co., Ltd.
- Tomohiro Kobayashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stacked-layer board, electronic component module, and method of man...
- Patent number 12,052,821
- Issue date Jul 30, 2024
- Murata Manufacturing Co., Ltd.
- Takuya Goitsuka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
PRINTED DE-COUPLING PLANE FOR PRINTED CIRCUIT BOARDS
- Publication number 20250168968
- Publication date May 22, 2025
- Microsoft Technology Licensing, LLC
- Chee Kiong FONG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE SUBSTRATE AND MANUFACTURING METHOD THEREOF
- Publication number 20250159800
- Publication date May 15, 2025
- AaltoSemi Inc.
- Min-Yao CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20250159806
- Publication date May 15, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Yongjin Oh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ECO-FRIENDLY PRINTED CIRCUIT BOARD FOR HIGH TEMPERATURE AND LOW TEM...
- Publication number 20250151193
- Publication date May 8, 2025
- SANDISK TECHNOLOGIES, INC.
- Vigneshwarram Kumaresan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE
- Publication number 20250151195
- Publication date May 8, 2025
- IBIDEN CO., LTD.
- Masashi KUWABARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Stamping Surface Profile in Design Layer and Using Patterned Electr...
- Publication number 20250137159
- Publication date May 1, 2025
- AT&S Austria Technologie & Systemtechnik AG
- Heinrich TRISCHLER
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
REDUCED PRINTED CIRCUIT BOARD EXPANSION IN INTEGRATED SENSOR-LENS A...
- Publication number 20250142191
- Publication date May 1, 2025
- GoPro, Inc.
- Ian Copeland Griggs
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
PER LAYER ANTI-PAD STRUCTURE FOR BALL GRID ARRAY PRINTED CIRCUIT BO...
- Publication number 20250142716
- Publication date May 1, 2025
- Astera Labs, Inc.
- Long YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COIL CARRIER BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20250142728
- Publication date May 1, 2025
- PHOENIX PIONEER TECHNOLOGY CO., LTD.
- Che-Wei HSU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20250126712
- Publication date Apr 17, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Young Kuk Ko
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING METHOD OF PACKAGING SUBSTRATE AND PACKAGING SUBSTRATE...
- Publication number 20250125270
- Publication date Apr 17, 2025
- ABSOLICS INC.
- Chae Mook LIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, PRINTED C...
- Publication number 20250116930
- Publication date Apr 10, 2025
- Resonac Corporation
- Naomitsu KOMORI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250106992
- Publication date Mar 27, 2025
- InnoLux Corporation
- Chen-Kuan KAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT CARRIER AND METHOD
- Publication number 20250106993
- Publication date Mar 27, 2025
- Vitesco Technologies GMBH
- Detlev BAGUNG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CHIP PACKAGE WITH EMBEDDED AND SHIELDED INDUCTORS
- Publication number 20250096089
- Publication date Mar 20, 2025
- ADVANCED MICRO DEVICES, INC.
- Robert Grant SPURNEY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICES AND METHODS RELATED TO METALLIZATION OF CERAMIC SUBSTRATES...
- Publication number 20250089154
- Publication date Mar 13, 2025
- Skyworks Solutions, Inc.
- Shaul BRANCHEVSKY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CATHETER SPLINES WITH EMBEDDED CIRCUIT ELEMENTS
- Publication number 20250082220
- Publication date Mar 13, 2025
- BIOSENSE WEBSTER (ISRAEL) LTD.
- Assaf Govari
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
GENERATION OF RANDOM SECURITY CIRCUIT PATTERNS FOR IN-SITU FABRICAT...
- Publication number 20250089174
- Publication date Mar 13, 2025
- International Business Machines Corporation
- Hongqing ZHANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250081338
- Publication date Mar 6, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Sang Ho JEONG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BRIDGE PRINTED CIRCUIT BOARD EMBEDDED WITHIN ANOTHER PRINTED CIRCUI...
- Publication number 20250081348
- Publication date Mar 6, 2025
- Intel Corporation
- Arumanayagam RAJASEKAR
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20250071912
- Publication date Feb 27, 2025
- InnoLux Corporation
- Ming-Chih TSAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20250056721
- Publication date Feb 13, 2025
- HongQiSheng Precision Electronics (QinHuangdao) Co., Ltd.
- Cheng-Jia LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE CIRCUIT BOARD AND METHOD FOR FABRICATING THE SAME
- Publication number 20250056715
- Publication date Feb 13, 2025
- HongQiSheng Precision Electronics (QinHuangdao) Co., Ltd.
- Chao WANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGH-INTEGRATION-LEVEL CARRIER PLATE AND MANUFACTURING METHOD
- Publication number 20250056722
- Publication date Feb 13, 2025
- SHANGHAI METAPWR ELECTRONICS CO., LTD
- Shouyu Hong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE AND METHOD OF FABRICATING ELECTRONIC DEVICE
- Publication number 20250016926
- Publication date Jan 9, 2025
- BEIJING BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Huiying Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PATTERNED ARTICLE INCLUDING ELECTRICALLY CONDUCTIVE ELEMENTS
- Publication number 20250016916
- Publication date Jan 9, 2025
- 3M Innovative Properties Company
- Raymond P. Johnston
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Catalyzed Metal Foil and Uses Thereof
- Publication number 20240407106
- Publication date Dec 5, 2024
- Averatek Corporation
- Shinichi Iketani
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
WIRING STRUCTURE, METHOD FOR MANUFACTURING SAME, AND SEMICONDUCTOR...
- Publication number 20240397635
- Publication date Nov 28, 2024
- Resonac Corporation
- Masaya TOBA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BURIED SKIP VIAS FOR IMPROVED SIGNAL AND POWER INTEGRITY
- Publication number 20240389230
- Publication date Nov 21, 2024
- NVIDIA Corporation
- Mingyi Yu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20240389231
- Publication date Nov 21, 2024
- IBIDEN CO., LTD.
- Masashi KUWABARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

by building the multilayer layer by layer

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Circuit board

Providing one or more carbon layers to a copper conductive material...

Printed wiring board

Methods for manufacturing thermoplastic liquid crystal polymer film...

Low sheet resistance coating

Printed wiring board

Wiring circuit board and producing method thereof

Wiring board

Information handling system and peripheral printed circuit board ha...

Printed circuit board having embedded component

Copper-clad laminate and method of forming the same

Circuit board structure and manufacturing method thereof

Providing a lower inductance path in a routing substrate for a capa...

Catheter splines with embedded circuit elements

Embedded circuit board and manufacturing method thereof

Fabrication of superconducting devices that control direct currents...

Circuit board and method for producing circuit board

Patterned article including electrically conductive elements

Wiring structure, method for manufacturing same, and semiconductor...

Circuit board structure and manufacturing method thereof

Multi-layer printed circuit board made of different materials and m...

Millimeter thick magnetic PCB with high relative permeability and d...

Integrated electronic device with flexible and stretchable substrate

Printed wiring board

Multilayer substrate and method for manufacturing same

Catalyzed metal foil and uses thereof to produce electrical circuits

Power module and manufacturing method thereof

Devices and methods related to metallization of ceramic substrates...

Printed wiring board and method for manufacturing printed wiring board

Stacked-layer board, electronic component module, and method of man...

Patents Applicationslast 30 patents

PRINTED DE-COUPLING PLANE FOR PRINTED CIRCUIT BOARDS

PACKAGE SUBSTRATE AND MANUFACTURING METHOD THEREOF

PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

ECO-FRIENDLY PRINTED CIRCUIT BOARD FOR HIGH TEMPERATURE AND LOW TEM...

WIRING SUBSTRATE

Stamping Surface Profile in Design Layer and Using Patterned Electr...

REDUCED PRINTED CIRCUIT BOARD EXPANSION IN INTEGRATED SENSOR-LENS A...

PER LAYER ANTI-PAD STRUCTURE FOR BALL GRID ARRAY PRINTED CIRCUIT BO...

COIL CARRIER BOARD AND MANUFACTURING METHOD THEREOF

PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

MANUFACTURING METHOD OF PACKAGING SUBSTRATE AND PACKAGING SUBSTRATE...

PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, PRINTED C...

ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME

CIRCUIT CARRIER AND METHOD

CHIP PACKAGE WITH EMBEDDED AND SHIELDED INDUCTORS

DEVICES AND METHODS RELATED TO METALLIZATION OF CERAMIC SUBSTRATES...

CATHETER SPLINES WITH EMBEDDED CIRCUIT ELEMENTS

GENERATION OF RANDOM SECURITY CIRCUIT PATTERNS FOR IN-SITU FABRICAT...

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

BRIDGE PRINTED CIRCUIT BOARD EMBEDDED WITHIN ANOTHER PRINTED CIRCUI...

ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF

CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

FLEXIBLE CIRCUIT BOARD AND METHOD FOR FABRICATING THE SAME

HIGH-INTEGRATION-LEVEL CARRIER PLATE AND MANUFACTURING METHOD

ELECTRONIC DEVICE AND METHOD OF FABRICATING ELECTRONIC DEVICE

PATTERNED ARTICLE INCLUDING ELECTRICALLY CONDUCTIVE ELEMENTS

Catalyzed Metal Foil and Uses Thereof

WIRING STRUCTURE, METHOD FOR MANUFACTURING SAME, AND SEMICONDUCTOR...

BURIED SKIP VIAS FOR IMPROVED SIGNAL AND POWER INTEGRITY

PRINTED WIRING BOARD