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ELECTRICITY
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Electric techniques
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PRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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Apparatus or processes for manufacturing printed circuits
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H05K3/4644
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Patents Grants
last 30 patents
Information
Patent Grant
Circuit board
Patent number
12,309,941
Issue date
May 20, 2025
LG Innotek Co., Ltd
Se Woong Na
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Providing one or more carbon layers to a copper conductive material...
Patent number
12,289,831
Issue date
Apr 29, 2025
Cisco Technology, Inc.
Joel Goergen
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Printed wiring board
Patent number
12,289,829
Issue date
Apr 29, 2025
Ibiden Co., Ltd.
Jun Sakai
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Methods for manufacturing thermoplastic liquid crystal polymer film...
Patent number
12,280,550
Issue date
Apr 22, 2025
Kuraray Co., Ltd.
Takahiro Nakashima
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information
Patent Grant
Low sheet resistance coating
Patent number
12,284,770
Issue date
Apr 22, 2025
Vitro Flat Glass LLC
Zhixun Ma
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Printed wiring board
Patent number
12,279,368
Issue date
Apr 15, 2025
Ibiden Co., Ltd.
Satoru Kawai
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Wiring circuit board and producing method thereof
Patent number
12,279,367
Issue date
Apr 15, 2025
Nitto Denko Corporation
Rihito Fukushima
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Wiring board
Patent number
12,245,366
Issue date
Mar 4, 2025
Kyocera Corporation
Hidetoshi Yugawa
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Information handling system and peripheral printed circuit board ha...
Patent number
12,245,372
Issue date
Mar 4, 2025
Dell Products L.P.
Peng Lip Goh
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Printed circuit board having embedded component
Patent number
12,185,478
Issue date
Dec 31, 2024
AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
Gerald Weidinger
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Copper-clad laminate and method of forming the same
Patent number
12,173,201
Issue date
Dec 24, 2024
VERSIV COMPOSITES LIMITED
Jennifer Adamchuk
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information
Patent Grant
Circuit board structure and manufacturing method thereof
Patent number
12,160,953
Issue date
Dec 3, 2024
Unimicron Technology Corp.
Kai-Ming Yang
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Providing a lower inductance path in a routing substrate for a capa...
Patent number
12,160,952
Issue date
Dec 3, 2024
QUALCOMM Incorporated
Biancun Xie
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Catheter splines with embedded circuit elements
Patent number
12,150,751
Issue date
Nov 26, 2024
BIOSENSE WEBSTER (ISRAEL) LTD.
Assaf Govari
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Embedded circuit board and manufacturing method thereof
Patent number
12,156,348
Issue date
Nov 26, 2024
QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD
Cheng-Yi Yang
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Fabrication of superconducting devices that control direct currents...
Patent number
12,148,974
Issue date
Nov 19, 2024
International Business Machines Corporation
Baleegh Abdo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Circuit board and method for producing circuit board
Patent number
12,133,328
Issue date
Oct 29, 2024
Murata Manufacturing Co., Ltd.
Tomoki Kato
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Patterned article including electrically conductive elements
Patent number
12,133,327
Issue date
Oct 29, 2024
3M Innovative Properties Company
Raymond P. Johnston
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Wiring structure, method for manufacturing same, and semiconductor...
Patent number
12,114,437
Issue date
Oct 8, 2024
Resonac Corporation
Masaya Toba
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Circuit board structure and manufacturing method thereof
Patent number
12,108,530
Issue date
Oct 1, 2024
Unimicron Technology Corp.
Kuang-Ching Fan
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Multi-layer printed circuit board made of different materials and m...
Patent number
12,108,544
Issue date
Oct 1, 2024
TSE CO., LTD.
Eun Ha Park
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Millimeter thick magnetic PCB with high relative permeability and d...
Patent number
12,094,630
Issue date
Sep 17, 2024
Winchester Technologies, LLC
Nian-Xiang Sun
B32 - LAYERED PRODUCTS
Information
Patent Grant
Integrated electronic device with flexible and stretchable substrate
Patent number
12,096,553
Issue date
Sep 17, 2024
Carnegie Mellon University
Gary K. Fedder
B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information
Patent Grant
Printed wiring board
Patent number
12,082,338
Issue date
Sep 3, 2024
Ibiden Co., Ltd.
Satoru Kawai
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Multilayer substrate and method for manufacturing same
Patent number
12,063,738
Issue date
Aug 13, 2024
Murata Manufacturing Co., Ltd.
Kosuke Nishio
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Catalyzed metal foil and uses thereof to produce electrical circuits
Patent number
12,063,748
Issue date
Aug 13, 2024
AVERATEK CORPORATION
Shinichi Iketani
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Power module and manufacturing method thereof
Patent number
12,058,814
Issue date
Aug 6, 2024
Delta Electronics (Shanghai) Co., Ltd.
Shouyu Hong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Devices and methods related to metallization of ceramic substrates...
Patent number
12,058,806
Issue date
Aug 6, 2024
Skyworks Solutions, Inc.
Shaul Branchevsky
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Printed wiring board and method for manufacturing printed wiring board
Patent number
12,052,819
Issue date
Jul 30, 2024
Ibiden Co., Ltd.
Tomohiro Kobayashi
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Stacked-layer board, electronic component module, and method of man...
Patent number
12,052,821
Issue date
Jul 30, 2024
Murata Manufacturing Co., Ltd.
Takuya Goitsuka
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
Information
Patent Application
PRINTED DE-COUPLING PLANE FOR PRINTED CIRCUIT BOARDS
Publication number
20250168968
Publication date
May 22, 2025
Microsoft Technology Licensing, LLC
Chee Kiong FONG
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
PACKAGE SUBSTRATE AND MANUFACTURING METHOD THEREOF
Publication number
20250159800
Publication date
May 15, 2025
AaltoSemi Inc.
Min-Yao CHEN
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
Publication number
20250159806
Publication date
May 15, 2025
Samsung Electro-Mechanics Co., Ltd.
Yongjin Oh
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
ECO-FRIENDLY PRINTED CIRCUIT BOARD FOR HIGH TEMPERATURE AND LOW TEM...
Publication number
20250151193
Publication date
May 8, 2025
SANDISK TECHNOLOGIES, INC.
Vigneshwarram Kumaresan
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
WIRING SUBSTRATE
Publication number
20250151195
Publication date
May 8, 2025
IBIDEN CO., LTD.
Masashi KUWABARA
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Stamping Surface Profile in Design Layer and Using Patterned Electr...
Publication number
20250137159
Publication date
May 1, 2025
AT&S Austria Technologie & Systemtechnik AG
Heinrich TRISCHLER
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
REDUCED PRINTED CIRCUIT BOARD EXPANSION IN INTEGRATED SENSOR-LENS A...
Publication number
20250142191
Publication date
May 1, 2025
GoPro, Inc.
Ian Copeland Griggs
H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information
Patent Application
PER LAYER ANTI-PAD STRUCTURE FOR BALL GRID ARRAY PRINTED CIRCUIT BO...
Publication number
20250142716
Publication date
May 1, 2025
Astera Labs, Inc.
Long YANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
COIL CARRIER BOARD AND MANUFACTURING METHOD THEREOF
Publication number
20250142728
Publication date
May 1, 2025
PHOENIX PIONEER TECHNOLOGY CO., LTD.
Che-Wei HSU
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
Publication number
20250126712
Publication date
Apr 17, 2025
Samsung Electro-Mechanics Co., Ltd.
Young Kuk Ko
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
MANUFACTURING METHOD OF PACKAGING SUBSTRATE AND PACKAGING SUBSTRATE...
Publication number
20250125270
Publication date
Apr 17, 2025
ABSOLICS INC.
Chae Mook LIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, PRINTED C...
Publication number
20250116930
Publication date
Apr 10, 2025
Resonac Corporation
Naomitsu KOMORI
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME
Publication number
20250106992
Publication date
Mar 27, 2025
InnoLux Corporation
Chen-Kuan KAO
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
CIRCUIT CARRIER AND METHOD
Publication number
20250106993
Publication date
Mar 27, 2025
Vitesco Technologies GMBH
Detlev BAGUNG
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
CHIP PACKAGE WITH EMBEDDED AND SHIELDED INDUCTORS
Publication number
20250096089
Publication date
Mar 20, 2025
ADVANCED MICRO DEVICES, INC.
Robert Grant SPURNEY
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DEVICES AND METHODS RELATED TO METALLIZATION OF CERAMIC SUBSTRATES...
Publication number
20250089154
Publication date
Mar 13, 2025
Skyworks Solutions, Inc.
Shaul BRANCHEVSKY
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CATHETER SPLINES WITH EMBEDDED CIRCUIT ELEMENTS
Publication number
20250082220
Publication date
Mar 13, 2025
BIOSENSE WEBSTER (ISRAEL) LTD.
Assaf Govari
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
GENERATION OF RANDOM SECURITY CIRCUIT PATTERNS FOR IN-SITU FABRICAT...
Publication number
20250089174
Publication date
Mar 13, 2025
International Business Machines Corporation
Hongqing ZHANG
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
Publication number
20250081338
Publication date
Mar 6, 2025
Samsung Electro-Mechanics Co., Ltd.
Sang Ho JEONG
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
BRIDGE PRINTED CIRCUIT BOARD EMBEDDED WITHIN ANOTHER PRINTED CIRCUI...
Publication number
20250081348
Publication date
Mar 6, 2025
Intel Corporation
Arumanayagam RAJASEKAR
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
Publication number
20250071912
Publication date
Feb 27, 2025
InnoLux Corporation
Ming-Chih TSAI
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
Publication number
20250056721
Publication date
Feb 13, 2025
HongQiSheng Precision Electronics (QinHuangdao) Co., Ltd.
Cheng-Jia LI
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
FLEXIBLE CIRCUIT BOARD AND METHOD FOR FABRICATING THE SAME
Publication number
20250056715
Publication date
Feb 13, 2025
HongQiSheng Precision Electronics (QinHuangdao) Co., Ltd.
Chao WANG
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
HIGH-INTEGRATION-LEVEL CARRIER PLATE AND MANUFACTURING METHOD
Publication number
20250056722
Publication date
Feb 13, 2025
SHANGHAI METAPWR ELECTRONICS CO., LTD
Shouyu Hong
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
ELECTRONIC DEVICE AND METHOD OF FABRICATING ELECTRONIC DEVICE
Publication number
20250016926
Publication date
Jan 9, 2025
BEIJING BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
Huiying Li
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
PATTERNED ARTICLE INCLUDING ELECTRICALLY CONDUCTIVE ELEMENTS
Publication number
20250016916
Publication date
Jan 9, 2025
3M Innovative Properties Company
Raymond P. Johnston
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Catalyzed Metal Foil and Uses Thereof
Publication number
20240407106
Publication date
Dec 5, 2024
Averatek Corporation
Shinichi Iketani
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
WIRING STRUCTURE, METHOD FOR MANUFACTURING SAME, AND SEMICONDUCTOR...
Publication number
20240397635
Publication date
Nov 28, 2024
Resonac Corporation
Masaya TOBA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BURIED SKIP VIAS FOR IMPROVED SIGNAL AND POWER INTEGRITY
Publication number
20240389230
Publication date
Nov 21, 2024
NVIDIA Corporation
Mingyi Yu
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
PRINTED WIRING BOARD
Publication number
20240389231
Publication date
Nov 21, 2024
IBIDEN CO., LTD.
Masashi KUWABARA
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR