the conductive material being removed by irradiation

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CPC
H05K3/027

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K3/00Apparatus or processes for manufacturing printed circuits

Current Industry

H05K3/027the conductive material being removed by irradiation

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Electronic component mounting substrate, electronic component mount...
- Patent number 12,256,491
- Issue date Mar 18, 2025
- Sony Group Corporation
- Koji Aoyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Droplet actuator fabrication apparatus, systems, and related methods
- Patent number 12,201,980
- Issue date Jan 21, 2025
- Abbott Laboratories
- Andrew Fischer
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Grant
Communication cable including a mosaic tape
- Patent number 12,142,390
- Issue date Nov 12, 2024
- Panduit Corp.
- Royal O. Jenner
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board structure including a closed cavity
- Patent number 11,967,758
- Issue date Apr 23, 2024
- Skyworks Solutions, Inc.
- Ki Wook Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed wiring board and method for manufacturing the same
- Patent number 11,930,589
- Issue date Mar 12, 2024
- Ibiden Co., Ltd.
- Yoshihiko Hayashi
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Stretchable electronics and methods of making the same
- Patent number 11,923,103
- Issue date Mar 5, 2024
- Carnegie Mellon University
- Carmel Majidi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electronic device housings with patterned electrolytic plating layers
- Patent number 11,910,538
- Issue date Feb 20, 2024
- Hewlett-Packard Development Company, L.P.
- Yi-Chen Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fine feature formation techniques for printed circuit boards
- Patent number 11,903,138
- Issue date Feb 13, 2024
- Intel Corporation
- Eric Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Optimization of high resolution digitally encoded laser scanners fo...
- Patent number 11,888,084
- Issue date Jan 30, 2024
- nLIGHT, Inc.
- Ken Gross
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Communication cable including a mosaic tape
- Patent number 11,756,707
- Issue date Sep 12, 2023
- Panduit Corp.
- Royal O. Jenner
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrostatic trap mass spectrometer with improved ion injection
- Patent number 11,742,192
- Issue date Aug 29, 2023
- Leco Corporation
- Anatoly N. Verenchikov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silver nanowire-mesh (Ag NW-mesh) electrode and manufacturing metho...
- Patent number 11,735,330
- Issue date Aug 22, 2023
- Korea Institute of Science and Technology
- Sang Woo Kim
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Pattern-edged metal-plane resonance-suppression
- Patent number 11,729,900
- Issue date Aug 15, 2023
- Intel Corporation
- Stephen Harvey Hall
- G05 - CONTROLLING REGULATING
Information Patent Grant
Method for manufacturing wiring board
- Patent number 11,700,686
- Issue date Jul 11, 2023
- Toyota Jidosha Kabushiki Kaisha
- Keiji Kuroda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method of metal structure
- Patent number 11,672,081
- Issue date Jun 6, 2023
- Innolux Corporation
- Hsueh-Hsuan Chou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing wiring board
- Patent number 11,665,829
- Issue date May 30, 2023
- Toyota Jidosha Kabushiki Kaisha
- Haruki Kondoh
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Touch sensor with auxiliary conductive unit on transparent electrode
- Patent number 11,561,658
- Issue date Jan 24, 2023
- Young Fast Optoelectronics Co., Ltd.
- Chih-Chiang Pai
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Ion beam lithography method based on ion beam lithography system
- Patent number 11,538,653
- Issue date Dec 27, 2022
- Beijing Normal University
- Bin Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board structure including a closed cavity
- Patent number 11,527,819
- Issue date Dec 13, 2022
- Skyworks Solutions, Inc.
- Ki Wook Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabrication of a soft-matter printed circuit board
- Patent number 11,523,514
- Issue date Dec 6, 2022
- Carnegie Mellon University
- Carmel Majidi
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Reel-to-reel lamination methods and devices in FPC fabrication
- Patent number 11,516,921
- Issue date Nov 29, 2022
- MANAFLEX, LLC
- Robert Clinton Lane
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Application specific electronics packaging systems, methods and dev...
- Patent number 11,503,718
- Issue date Nov 15, 2022
- Molex, LLC
- Marko Spiegel
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Reel-to-reel laser ablation methods and devices in FPC fabrication
- Patent number 11,490,523
- Issue date Nov 1, 2022
- Robert Clinton Lane
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Communication cable including a mosaic tape
- Patent number 11,476,016
- Issue date Oct 18, 2022
- Panduit Corp.
- Royal O. Jenner
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System producing a conductive path on a substrate
- Patent number 11,464,114
- Issue date Oct 4, 2022
- Orbotech Ltd.
- Zvi Kotler
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Embedded circuit board and method of manufacturing same
- Patent number 11,452,211
- Issue date Sep 20, 2022
- SHENNAN CIRCUITS CO., LTD.
- Lixiang Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Photosensitive resin composition, method of producing electrically...
- Patent number 11,422,464
- Issue date Aug 23, 2022
- Toray Industries, Inc.
- Yohei Konoshima
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Touch panel
- Patent number 11,422,463
- Issue date Aug 23, 2022
- TPK Touch Solutions Inc.
- Chao-Sung Li
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Optimization of high resolution digitally encoded laser scanners fo...
- Patent number 11,411,132
- Issue date Aug 9, 2022
- nLIGHT, Inc.
- Ken Gross
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Liquid metal fusion with conductive inks and pastes
- Patent number 11,395,413
- Issue date Jul 19, 2022
- Carnegie Mellon University
- Mahmoud Tavakoli
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS

Patents Applicationslast 30 patents

Information Patent Application
CIRCUIT BOARD HAVING AN EDGE CONTAINING CONDUCTIVE REGIONS
- Publication number 20250063664
- Publication date Feb 20, 2025
- Teradyne, Inc.
- Daniel L. Engel
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMMUNICATION CABLE INCLUDING A MOSAIC TAPE
- Publication number 20250037905
- Publication date Jan 30, 2025
- Panduit Corp.
- Royal O. Jenner
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING CONDUCTIVE CIRCUIT BOARD AND CONDUCTIVE CI...
- Publication number 20240365473
- Publication date Oct 31, 2024
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- YU-HSIEN LIAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic device and manufacturing method thereof
- Publication number 20240274543
- Publication date Aug 15, 2024
- InnoLux Corporation
- Yan-Tang DAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSPARENT CONDUCTING FILM AND METHOD FOR FORMING TRANSPARENT COND...
- Publication number 20240188220
- Publication date Jun 6, 2024
- Resonac Corporation
- Shigeru YAMAKI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBTRACTIVE METHOD FOR MANUFACTURING CIRCUIT BOARD WITH FINE INTERC...
- Publication number 20240107680
- Publication date Mar 28, 2024
- HSU-TUNG CHEN
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
MATERIAL DEPOSITION METHOD AND MATERIAL DEPOSITION APPARATUS
- Publication number 20240066550
- Publication date Feb 29, 2024
- Intel Corporation
- Fanyi ZHU
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
WIRING BOARD, SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING WIR...
- Publication number 20230292435
- Publication date Sep 14, 2023
- KIOXIA Corporation
- Tomonori Kawata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PERMEABLE ELEMENT
- Publication number 20230085480
- Publication date Mar 16, 2023
- Universitat Linz
- Thomas STOCKINGER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING WIRING SUBSTRATE
- Publication number 20230063719
- Publication date Mar 2, 2023
- IBIDEN CO., LTD.
- Michimasa TAKAHASHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Communication Cable Including a Mosaic Tape
- Publication number 20230005643
- Publication date Jan 5, 2023
- Panduit Corp.
- Royal O. Jenner
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT MOUNTING SUBSTRATE, ELECTRONIC COMPONENT MOUNT...
- Publication number 20220408560
- Publication date Dec 22, 2022
- SONY GROUP CORPORATION
- Koji AOYAMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIQUID METAL FUSION WITH CONDUCTIVE INKS AND PASTES
- Publication number 20220346238
- Publication date Oct 27, 2022
- Carnegie Mellon University
- Mahmoud TAVAKOLI
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
PATTERN-EDGED METAL-PLANE RESONANCE-SUPPRESSION
- Publication number 20220304143
- Publication date Sep 22, 2022
- Intel Corporation
- Stephen Harvey Hall
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MAKING A MOLDED INTERCONNECT DEVICE
- Publication number 20220279656
- Publication date Sep 1, 2022
- Molex, LLC
- Tsuey Choo CHANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CO-AXIAL VIA STRUCTURE AND MANUFACTURING METHOD OF THE SAME
- Publication number 20220240375
- Publication date Jul 28, 2022
- Unimicron Technology Corp.
- Ching-Sheng CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HYBRID MECHANICAL DRILL
- Publication number 20220212282
- Publication date Jul 7, 2022
- International Business Machines Corporation
- Sarah K. Czaplewski-Campbell
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE HOUSINGS WITH PATTERNED ELECTROLYTIC PLATING LAYERS
- Publication number 20220167505
- Publication date May 26, 2022
- Hewlett-Packard Development Company, L.P.
- Yi-Chen Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PHOTOSENSITIVE FIBER-FORMING COMPOSITION AND METHOD FOR FORMING FIB...
- Publication number 20220146934
- Publication date May 12, 2022
- TOYAMA PREFECTURE
- Yoshiyuki YOKOYAMA
- D01 - NATURAL OR ARTIFICIAL THREADS OR FIBRES SPINNING
Information Patent Application
MANUFACTURING METHOD OF METAL STRUCTURE
- Publication number 20220087030
- Publication date Mar 17, 2022
- InnoLux Corporation
- Hsueh-Hsuan CHOU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20220078903
- Publication date Mar 10, 2022
- IBIDEN CO., LTD.
- Yoshihiko HAYASHI
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SILVER NANOWIRE-MESH (AG NW-MESH) ELECTRODE AND MANUFACTURING METHO...
- Publication number 20220051829
- Publication date Feb 17, 2022
- Korea Institute of Science and Technology
- Sang Woo KIM
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT PATTERN FORMING SHEET, CIRCUIT PATTERN MANUFACTURING APPARA...
- Publication number 20220019147
- Publication date Jan 20, 2022
- Kantatsu Co., Ltd.
- Eiji OSHIMA
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
EMBEDDED CIRCUIT BOARD AND METHOD OF MANUFACTURING SAME
- Publication number 20220015238
- Publication date Jan 13, 2022
- SHENNAN CIRCUITS CO., LTD.
- LIXIANG HUANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING WIRING BOARD, AND WIRING BOARD
- Publication number 20220007506
- Publication date Jan 6, 2022
- Toyota Jidosha Kabushiki Kaisha
- Keiji KURODA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TOUCH SENSOR WITH AUXILIARY CONDUCTIVE UNIT ON TRANSPARENT ELECTRODE
- Publication number 20210382581
- Publication date Dec 9, 2021
- Young Fast Optoelectronics Co., Ltd.
- Chih-Chiang Pai
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
FINE FEATURE FORMATION TECHNIQUES FOR PRINTED CIRCUIT BOARDS
- Publication number 20210352807
- Publication date Nov 11, 2021
- Intel Corporation
- ERIC LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING WIRING BOARD, AND WIRING BOARD
- Publication number 20210204409
- Publication date Jul 1, 2021
- Toyota Jidosha Kabushiki Kaisha
- Haruki KONDOH
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
System Producing a Conductive Path on a Substrate
- Publication number 20210195756
- Publication date Jun 24, 2021
- ORBOTECH LTD.
- Zvi KOTLER
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for Forming Auxiliary Conductive Unit on Transparent Electro...
- Publication number 20210173519
- Publication date Jun 10, 2021
- Young Fast Optoelectronics Co., Ltd.
- Chih-Chiang Pai
- G06 - COMPUTING CALCULATING COUNTING

the conductive material being removed by irradiation

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Electronic component mounting substrate, electronic component mount...

Droplet actuator fabrication apparatus, systems, and related methods

Communication cable including a mosaic tape

Printed circuit board structure including a closed cavity

Printed wiring board and method for manufacturing the same

Stretchable electronics and methods of making the same

Electronic device housings with patterned electrolytic plating layers

Fine feature formation techniques for printed circuit boards

Optimization of high resolution digitally encoded laser scanners fo...

Communication cable including a mosaic tape

Electrostatic trap mass spectrometer with improved ion injection

Silver nanowire-mesh (Ag NW-mesh) electrode and manufacturing metho...

Pattern-edged metal-plane resonance-suppression

Method for manufacturing wiring board

Manufacturing method of metal structure

Method for manufacturing wiring board

Touch sensor with auxiliary conductive unit on transparent electrode

Ion beam lithography method based on ion beam lithography system

Printed circuit board structure including a closed cavity

Method for fabrication of a soft-matter printed circuit board

Reel-to-reel lamination methods and devices in FPC fabrication

Application specific electronics packaging systems, methods and dev...

Reel-to-reel laser ablation methods and devices in FPC fabrication

Communication cable including a mosaic tape

System producing a conductive path on a substrate

Embedded circuit board and method of manufacturing same

Photosensitive resin composition, method of producing electrically...

Touch panel

Optimization of high resolution digitally encoded laser scanners fo...

Liquid metal fusion with conductive inks and pastes

Patents Applicationslast 30 patents

CIRCUIT BOARD HAVING AN EDGE CONTAINING CONDUCTIVE REGIONS

COMMUNICATION CABLE INCLUDING A MOSAIC TAPE

METHOD FOR MANUFACTURING CONDUCTIVE CIRCUIT BOARD AND CONDUCTIVE CI...

Electronic device and manufacturing method thereof

TRANSPARENT CONDUCTING FILM AND METHOD FOR FORMING TRANSPARENT COND...

SUBTRACTIVE METHOD FOR MANUFACTURING CIRCUIT BOARD WITH FINE INTERC...

MATERIAL DEPOSITION METHOD AND MATERIAL DEPOSITION APPARATUS

WIRING BOARD, SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING WIR...

PERMEABLE ELEMENT

METHOD FOR MANUFACTURING WIRING SUBSTRATE

Communication Cable Including a Mosaic Tape

ELECTRONIC COMPONENT MOUNTING SUBSTRATE, ELECTRONIC COMPONENT MOUNT...

LIQUID METAL FUSION WITH CONDUCTIVE INKS AND PASTES

PATTERN-EDGED METAL-PLANE RESONANCE-SUPPRESSION

METHOD OF MAKING A MOLDED INTERCONNECT DEVICE

CO-AXIAL VIA STRUCTURE AND MANUFACTURING METHOD OF THE SAME

HYBRID MECHANICAL DRILL

ELECTRONIC DEVICE HOUSINGS WITH PATTERNED ELECTROLYTIC PLATING LAYERS

PHOTOSENSITIVE FIBER-FORMING COMPOSITION AND METHOD FOR FORMING FIB...

MANUFACTURING METHOD OF METAL STRUCTURE

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

SILVER NANOWIRE-MESH (AG NW-MESH) ELECTRODE AND MANUFACTURING METHO...

CIRCUIT PATTERN FORMING SHEET, CIRCUIT PATTERN MANUFACTURING APPARA...

EMBEDDED CIRCUIT BOARD AND METHOD OF MANUFACTURING SAME

METHOD FOR MANUFACTURING WIRING BOARD, AND WIRING BOARD

TOUCH SENSOR WITH AUXILIARY CONDUCTIVE UNIT ON TRANSPARENT ELECTRODE

FINE FEATURE FORMATION TECHNIQUES FOR PRINTED CIRCUIT BOARDS

METHOD FOR MANUFACTURING WIRING BOARD, AND WIRING BOARD

System Producing a Conductive Path on a Substrate

Method for Forming Auxiliary Conductive Unit on Transparent Electro...