Patent Application
20250149347
This application claims priority of China Patent Application No. 202311446863.7, filed on Nov. 2, 2023, the entirety of which is incorporated by reference herein.
The present invention relates to a method for fabricating a semiconductor packaging structure, and, in particular, to a method for fabricating a semiconductor packaging structure by disposing posts.
For current power modules molded with epoxy resin, the structural features of the product are designed on the mold. However, different molds need to be designed for products with different structural characteristics. That is, the molds are not interchangeable, resulting in high mold manufacturing costs.
Also, the production of products with complex structural features is often limited by the capabilities of the molding process.
In accordance with one embodiment of the present disclosure, a method for fabricating a semiconductor packaging structure is provided. The fabrication method includes providing a lower mold. The fabrication method includes disposing a plurality of semiconductor components on the lower mold. The fabrication method includes disposing a plurality of first metal structures on the lower mold, wherein the first metal structures are located on both sides of the semiconductor components. The fabrication method includes providing an upper mold to assemble with the lower mold to accommodate the semiconductor components and the first metal structures. The fabrication method includes filling a packaging material between the lower mold and the upper mold. The fabrication method includes removing the upper mold, the lower mold and the first metal structures to form a plurality of through holes in the packaging material located on both sides of the semiconductor components.
In some embodiments, the step of disposing the semiconductor components and the first metal structures on the lower mold includes providing a carrier; disposing a tape on the carrier; disposing the semiconductor components and the first metal structures on the tape; and disposing the carrier on the lower mold.
In some embodiments, the step of disposing the semiconductor components on the lower mold includes providing a carrier; disposing the semiconductor components on the carrier; and transferring the semiconductor components to the lower mold. In some embodiments, the method for fabricating a semiconductor packaging structure further includes transferring the semiconductor components to the lower mold through a plurality of second metal structures disposed on the lower mold. In some embodiments, the step of disposing the first metal structures on the lower mold includes locking the first metal structures to the upper mold; and assembling the upper mold and the lower mold.
In some embodiments, the method for fabricating a semiconductor packaging structure further includes cutting the packaging material to form a plurality of semiconductor packaging structures, wherein each semiconductor packaging structure includes a semiconductor component, a packaging material covering the semiconductor component, and through holes penetrating the packaging material. In some embodiments, in each of the semiconductor packaging structures, the packaging material has a first sidewall and a second sidewall opposite the first sidewall, and the angle between the first sidewall and the second sidewall and the horizontal plane is 90 degrees.
In accordance with one embodiment of the present disclosure, a semiconductor packaging structure which is fabricated by the disclosed method for fabricating a semiconductor packaging structure is provided.
In some embodiments, the packaging material has a first sidewall and a second sidewall opposite the first sidewall, and the angle between the first sidewall and the second sidewall and the horizontal plane is 90 degrees.
In some embodiments, the semiconductor packaging structure further includes a plurality of positioning holes located on both sides of the semiconductor component, wherein the positioning holes are closer to the semiconductor component than the through holes.
In the present disclosure, when products of different sizes or structural features are to be produced, there is no need to design different molds. That is, different products can share the same mold, and only through the structural design of the detachable posts and subsequent cutting procedures, the required products can be produced. Through the disclosed process technology, the commonality of molds can be increased and the cost of mold development can be saved.
Since there is no need to design the structural features of the product on the mold, the structural strength of the mold is also improved, making the mold more tolerable. In addition, The present disclosure utilizes cutting and molding technology after demolding to easily produce products with vertical sides, overcoming traditional manufacturing process limitations.
The disclosure can be more fully understood from the following detailed description when read with the accompanying figures. It is worth noting that in accordance with standard practice in the industry, various features are not drawn to scale. In fact, the dimensions of the various features may be arbitrarily increased or reduced for clarity of discussion.
Various embodiments or examples are provided in the following description to implement different features of the present disclosure. The elements and arrangement described in the following specific examples are merely provided for introducing the present disclosure and serve as examples without limiting the scope of the present disclosure. For example, when a first component is referred to as “on a second component”, it may directly contact the second component, or there may be other components in between, and the first component and the second component do not come in direct contact with one another.
It should be understood that additional operations may be provided before, during, and/or after the described method. In accordance with some embodiments, some of the stages (or steps) described below may be replaced or omitted.
In this specification, spatial terms may be used, such as “below”, “lower”, “above”, “higher” and similar terms, for briefly describing the relationship between an element relative to another element in the figures. Besides the directions illustrated in the figures, the components may be used or operated in different directions. When the component is turned to different directions (such as rotated 45 degrees or other directions), the spatially related adjectives used in it will also be interpreted according to the turned position. In some embodiments of the present disclosure, terms concerning attachments, coupling and the like, such as “connected” and “interconnected,” refer to a relationship wherein structures are secured or attached to one another either directly or indirectly through intervening structures, as well as both movable or rigid attachments or relationships, unless expressly described otherwise.
Herein, the terms “about”, “around” and “substantially” typically mean a value is in a range of +/−15% of a stated value, typically a range of +/−10% of the stated value, typically a range of +/−5% of the stated value, typically a range of +/−3% of the stated value, typically a range of +/−2% of the stated value, typically a range of +/−1% of the stated value, or typically a range of +/−0.5% of the stated value. The stated value of the present disclosure is an approximate value. Namely, the meaning of “about”, “around” and “substantially” may be implied if there is no specific description of “about”, “around” and “substantially”.
It should be understood that, although the terms “first”, “second”, “third”, etc. may be used herein to describe various elements, components, regions, layers, portions and/or sections, these elements, components, regions, layers, portions and/or sections should not be limited by these terms. These terms are only used to distinguish one element, component, region, layer, portion or section from another element, component, region, layer, portion or section. Thus, a first element, component, region, layer, portion or section discussed below could be termed a second element, component, region, layer, portion or section without departing from the teachings of the present disclosure.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs. It should be appreciated that, in each case, the term, which is defined in a commonly used dictionary, should be interpreted as having a meaning that conforms to the relative skills of the present disclosure and the background or the context of the present disclosure, and should not be interpreted in an idealized or overly formal manner unless so defined.
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In some embodiments, the carrier 14 may include metal, but the present disclosure is not limited thereto, and other suitable hard materials with heat-resistant, pressure-resistant and support properties are also applicable to the present disclosure. In some embodiments, the tape 16 may include heat-resistant tape, but the present disclosure is not limited thereto, and other suitable materials with heat-resistant, pressure-resistant and adhesive properties are also applicable to the present disclosure.
In some embodiments, the semiconductor components 18 may include power components, but the present disclosure is not limited thereto. In some embodiments, the semiconductor component 18 may include a substrate 26, a first metal layer 28, a second metal layer 30, a conductive component 32, and a chip 33. The first metal layer 28 and the second metal layer 30 are disposed on opposite sides of the substrate 26. The first metal layer 28 is in contact with the tape 16. The conductive component 32 is disposed on the second metal layer 30 to connect to an external circuit (not shown). The chip 33 is disposed on the second metal layer 30, as shown in
In some embodiments, the first metal structures 20 may include columnar metal structures, for example, cylindrical metal structures, but the present disclosure is not limited thereto, and other suitable three-dimensional shapes are also applicable to the present disclosure, and may be designed according to product requirements. In some embodiments, between the adjacent semiconductor components 18, a plurality of first metal structures 20 may be included. For example, between the adjacent semiconductor components 18, there is an even number of the first metal structures 20, so that a semiconductor packaging structure formed after cutting has symmetrical through holes for subsequent screw locking, but the present disclosure is not limited thereto, and other suitable locations and quantities of the first metal structures 20 are also applicable to the present disclosure, and may be designed according to product requirements.
In some embodiments, the packaging material 22 may include solid molding materials, liquid molding materials, anisotropic conductive film (ACF), or sheet molding materials, but the present disclosure is not limited thereto, and other suitable molding materials are also applicable to the present disclosure.
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In some embodiments, the semiconductor components 180 may include power components, but the present disclosure is not limited thereto. In some embodiments, the semiconductor component 180 may include a substrate 260, a first metal layer 280, a second metal layer 300, a conductive component 320, and a chip 330. The first metal layer 280 and the second metal layer 300 are disposed on opposite sides of the substrate 260. The first metal layer 280 is in contact with the lower mold 120. The conductive component 320 is disposed on the second metal layer 300 to connect to an external circuit (not shown). The chip 330 is disposed on the second metal layer 300, as shown in
In some embodiments, the first metal structures 200 may include columnar metal structures, for example, cylindrical metal structures, but the present disclosure is not limited thereto, and other suitable three-dimensional shapes are also applicable to the present disclosure, and may be designed according to product requirements. In some embodiments, between the adjacent semiconductor components 180, a plurality of first metal structures 200 may be included. For example, between the adjacent semiconductor components 180, there is an even number of the first metal structures 200, so that a semiconductor packaging structure formed after cutting has symmetrical through holes for subsequent screw locking, but the present disclosure is not limited thereto, and other suitable locations and quantities of the first metal structures 200 are also applicable to the present disclosure, and may be designed according to product requirements.
In some embodiments, the second metal structures 210 may include columnar metal structures, for example, cylindrical metal structures, but the present disclosure is not limited thereto, and other suitable three-dimensional shapes are also applicable to the present disclosure, and may be designed according to product requirements. In the present disclosure, the second metal structure 210 is disposed at a specific position on the lower mold 120 to serve as a positioning post for transferring the semiconductor component 180 to the lower mold 120, so that the semiconductor component 180 can be smoothly disposed at a predetermined position on the lower mold 120.
In some embodiments, the packaging material 220 may include solid molding materials, liquid molding materials, anisotropic conductive film (ACF), or sheet molding materials, but the present disclosure is not limited thereto, and other suitable molding materials are also applicable to the present disclosure.
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In the present disclosure, when products of different sizes or structural features are to be produced, there is no need to design different molds. That is, different products can share the same mold, and only through the structural design of the detachable posts and subsequent cutting procedures, the required products can be produced. Through the disclosed process technology, the commonality of molds can be increased and the cost of mold development can be saved.
Since there is no need to design the structural features of the product on the mold, the structural strength of the mold is also improved, making the mold more tolerable. In addition, The present disclosure utilizes cutting and molding technology after demolding to easily produce products with vertical sides, overcoming traditional manufacturing process limitations.
Although some embodiments of the present disclosure and their advantages have been described in detail, it should be understood that various changes, substitutions and alterations can be made herein without departing from the spirit and scope of the disclosure as defined by the appended claims. The features of the various embodiments can be used in any combination as long as they do not depart from the spirit and scope of the present disclosure. Moreover, the scope of the present application is not intended to be limited to the particular embodiments of the process, machine, manufacture, composition of matter, means, methods and steps described in the specification. As one of ordinary skill in the art will readily appreciate from the present disclosure, processes, machines, manufacture, compositions of matter, means, methods, or steps, presently existing or later to be developed, that perform substantially the same function or achieve substantially the same result as the corresponding embodiments described herein may be utilized according to the present disclosure. Accordingly, the appended claims are intended to include within their scope such processes, machines, manufacture, compositions of matter, means, methods or steps. In addition, each claim constitutes an individual embodiment, and the claimed scope of the present disclosure includes the combinations of the claims and embodiments. The scope of protection of present disclosure is subject to the definition of the scope of the appended claims. Any embodiment or claim of the present disclosure does not need to meet all the purposes, advantages, and features disclosed in the present disclosure.
| Number | Date | Country | Kind |
|---|---|---|---|
| 202311446863.7 | Nov 2023 | CN | national |
