a substrate forming part of the encapsulation

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H01L23/3121

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/3121a substrate forming part of the encapsulation

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and inspection method
- Patent number 12,169,216
- Issue date Dec 17, 2024
- Rohm Co., Ltd.
- Tsuyoshi Tachi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package
- Patent number 12,165,984
- Issue date Dec 10, 2024
- Advanced Semiconductor Engineering, Inc.
- Hao-Chih Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packages with cavities and methods of manufactur...
- Patent number 12,165,942
- Issue date Dec 10, 2024
- Texas Instruments Incorporated
- Jesus Bajo Bautista
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
RF amplifier devices including top side contacts and methods of man...
- Patent number 12,166,003
- Issue date Dec 10, 2024
- MACOM Technology Solutions Holdings, Inc.
- Basim Noori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,165,965
- Issue date Dec 10, 2024
- Kabushiki Kaisha Toshiba
- Tomohiro Iguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and method for manufacturing the same
- Patent number 12,165,982
- Issue date Dec 10, 2024
- Advanced Semiconductor Engineering, Inc.
- Hsu-Nan Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 12,165,946
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chi-Yang Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a semiconductor element having elect...
- Patent number 12,166,002
- Issue date Dec 10, 2024
- Rohm Co., Ltd.
- Yosui Futamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip package unit comprising thermal protection film and assoc...
- Patent number 12,159,792
- Issue date Dec 3, 2024
- Chengdu Monolithic Power Systems Co., Ltd.
- Yingjiang Pu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with lead between a plurality of encapsulated...
- Patent number 12,159,816
- Issue date Dec 3, 2024
- Rohm Co., Ltd.
- Kentaro Nasu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with front side and back side redistribution...
- Patent number 12,159,823
- Issue date Dec 3, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Michael Kelly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,159,810
- Issue date Dec 3, 2024
- Denso Corporation
- Akinori Sakakibara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including antenna
- Patent number 12,154,873
- Issue date Nov 26, 2024
- Samsung Electronics Co., Ltd.
- Yongkoon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a semiconductor device including vertical contact...
- Patent number 12,154,860
- Issue date Nov 26, 2024
- SanDisk Technologies, Inc.
- Zhongli Ji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through wafer trench isolation between transistors in an integrated...
- Patent number 12,148,717
- Issue date Nov 19, 2024
- Texas Instruments Incorporated
- Scott Robert Summerfelt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,142,541
- Issue date Nov 12, 2024
- Samsung Electronics Co., Ltd.
- Jeonggi Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coreless architecture and processing strategy for EMIB-based substr...
- Patent number 12,142,567
- Issue date Nov 12, 2024
- Intel Corporation
- Xiao Di Sun Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, power conversion apparatus, and manufacturing...
- Patent number 12,142,540
- Issue date Nov 12, 2024
- Mitsubishi Electric Corporation
- Masayuki Mafune
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package including multiple semiconductor devices
- Patent number 12,142,551
- Issue date Nov 12, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Jerome Teysseyre
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna-in-package devices and methods of making
- Patent number 12,136,759
- Issue date Nov 5, 2024
- STATS ChipPAC Pte. Ltd.
- HunTeak Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic module
- Patent number 12,136,576
- Issue date Nov 5, 2024
- Peter C. Salmon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure
- Patent number 12,132,006
- Issue date Oct 29, 2024
- Advanced Semiconductor Engineering, Inc.
- Pao-Nan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package having multiple chips integrated therein and manufacturing...
- Patent number 12,125,821
- Issue date Oct 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
RF devices with enhanced performance and methods of forming the sam...
- Patent number 12,125,739
- Issue date Oct 22, 2024
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure and manufacturing method thereof
- Patent number 12,125,827
- Issue date Oct 22, 2024
- Yangtze Memory Technologies Co., Ltd.
- XinRu Zeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device packaging warpage control
- Patent number 12,125,716
- Issue date Oct 22, 2024
- NXP USA, INC.
- Zhiwei Gong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating electronic package structure
- Patent number 12,125,760
- Issue date Oct 22, 2024
- Richwave Technology Corp.
- Yu-Lung Wen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermoelectric cooling packages
- Patent number 12,125,766
- Issue date Oct 22, 2024
- Samsung Electronics Co., Ltd.
- Tae Hwan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a semiconductor package with connection lug
- Patent number 12,125,772
- Issue date Oct 22, 2024
- Infineon Technologies Austria AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 12,125,829
- Issue date Oct 22, 2024
- Innolux Corporation
- Jen-Hai Chi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHODS FOR FORMING A POWER SEMICONDUCTOR MODULE ARRANGEMENT
- Publication number 20240420968
- Publication date Dec 19, 2024
- INFINEON TECHNOLOGIES AG
- Alexander Schmer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20240421014
- Publication date Dec 19, 2024
- Samsung Electronics Co., Ltd.
- Injae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR FORMING THE SAME
- Publication number 20240421015
- Publication date Dec 19, 2024
- JCET STATS ChipPAC Korea Limited
- SeungHyun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240421099
- Publication date Dec 19, 2024
- Samsung Electronics Co., Ltd.
- Junghoon Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240421103
- Publication date Dec 19, 2024
- Advanced Semiconductor Engineering, Inc.
- Chia Hsiu HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240421123
- Publication date Dec 19, 2024
- Samsung Electronics Co., Ltd.
- Chengtar Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240421132
- Publication date Dec 19, 2024
- DENSO CORPORATION
- Shingo TSUCHIMOCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT ASSEMBLIES HAVING LOW SURFACE ENERGY EPOXY BARRI...
- Publication number 20240421116
- Publication date Dec 19, 2024
- Donald Cunningham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Edge Recess Design for Molded and Fusion or Hybrid Bonded Integrate...
- Publication number 20240421013
- Publication date Dec 19, 2024
- Apple Inc.
- Jixuan Gong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING
- Publication number 20240413030
- Publication date Dec 12, 2024
- NXP USA, Inc.
- You Ge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR PACKAGE AND LOWER SEMICONDUCTOR PACKAGE USED...
- Publication number 20240413038
- Publication date Dec 12, 2024
- Samsung Electronics Co., Ltd.
- Hwanjoo PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE, POWER ELECTRONIC SUBSTRATE AND METHOD FOR FAB...
- Publication number 20240413046
- Publication date Dec 12, 2024
- INFINEON TECHNOLOGIES AG
- Frank Sauerland
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR PRODUCING A SEAL FOR A SEMICONDUCTOR MODULE, AND A HOUS...
- Publication number 20240413025
- Publication date Dec 12, 2024
- INFINEON TECHNOLOGIES AG
- Georg Troska
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240413062
- Publication date Dec 12, 2024
- Advanced Semiconductor Engineering, Inc.
- Jen-Hao PAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NITRIDE SEMICONDUCTOR MODULE
- Publication number 20240413235
- Publication date Dec 12, 2024
- Rohm Co., Ltd.
- Hirotaka Otake
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDING AN ELECTRONIC COMPONENT IN A CORE OF AN INTEGRATED CIRCUI...
- Publication number 20240413029
- Publication date Dec 12, 2024
- Microsoft Technology Licensing, LLC
- Jon Thomas Woodyard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE AND MANUFACTURING METHOD THEREOF
- Publication number 20240413072
- Publication date Dec 12, 2024
- Dyi-Chung HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORMING SHALLOW TRENCH FOR DICING AND STRUCTURES THEREOF
- Publication number 20240413102
- Publication date Dec 12, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hung-Pin Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE MODULE AND METHOD FOR FABRICATION OF THE SAME
- Publication number 20240413067
- Publication date Dec 12, 2024
- Unimicron Technology Corp.
- Chia-Yu PENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240404972
- Publication date Dec 5, 2024
- Samsung Electronics Co., Ltd.
- Seyeong Seok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR FORMING THE SAME
- Publication number 20240404900
- Publication date Dec 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chuei-Tang WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND PACKAGE STRUCTURE OF SEMICONDUCTOR DEVICE
- Publication number 20240404941
- Publication date Dec 5, 2024
- ROHM CO., LTD.
- Asuma IMAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY SYSTEM
- Publication number 20240405010
- Publication date Dec 5, 2024
- KIOXIA Corporation
- Hayato MASUBUCHI
- G11 - INFORMATION STORAGE
Information Patent Application
REDISTRIBUTION LAYER METALLIC LAYOUT STRUCTURE AND METHOD WITH WARP...
- Publication number 20240404853
- Publication date Dec 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Dian-Hau CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240395681
- Publication date Nov 28, 2024
- ROHM CO., LTD.
- Bungo TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE INCLUDING A DUMMY BAR AND METHODS OF FORMING THE PACKAGE
- Publication number 20240395730
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Ching-Chen Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND INTERCONNECTION STRUCTURE
- Publication number 20240395784
- Publication date Nov 28, 2024
- Advanced Semiconductor Engineering, Inc.
- Kuei-Hao TSENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH ELECTRICALLY INSULATED CARRIER AND AT LEAST ONE STEP O...
- Publication number 20240395646
- Publication date Nov 28, 2024
- INFINEON TECHNOLOGIES AG
- Edward FUERGUT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMITTERS FOR INTEGRATED POWER CARD COOLING
- Publication number 20240395657
- Publication date Nov 28, 2024
- DENSO International America, Inc.
- Sean Schoneboom
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240395723
- Publication date Nov 28, 2024
- Rohm Co., Ltd.
- Isamu Nishimura
- H01 - BASIC ELECTRIC ELEMENTS

a substrate forming part of the encapsulation

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device and inspection method

Semiconductor device package

Integrated circuit packages with cavities and methods of manufactur...

RF amplifier devices including top side contacts and methods of man...

Semiconductor device

Semiconductor package structure and method for manufacturing the same

Semiconductor package and manufacturing method thereof

Semiconductor device including a semiconductor element having elect...

Flip chip package unit comprising thermal protection film and assoc...

Semiconductor device with lead between a plurality of encapsulated...

Semiconductor package with front side and back side redistribution...

Semiconductor device

Semiconductor package including antenna

Method of forming a semiconductor device including vertical contact...

Through wafer trench isolation between transistors in an integrated...

Semiconductor package

Coreless architecture and processing strategy for EMIB-based substr...

Semiconductor device, power conversion apparatus, and manufacturing...

Package including multiple semiconductor devices

Antenna-in-package devices and methods of making

Microelectronic module

Semiconductor package structure

Package having multiple chips integrated therein and manufacturing...

RF devices with enhanced performance and methods of forming the sam...

Chip package structure and manufacturing method thereof

Semiconductor device packaging warpage control

Method for fabricating electronic package structure

Thermoelectric cooling packages

Method of forming a semiconductor package with connection lug

Electronic device

Patents Applicationslast 30 patents

METHODS FOR FORMING A POWER SEMICONDUCTOR MODULE ARRANGEMENT

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

SEMICONDUCTOR PACKAGE AND METHOD FOR FORMING THE SAME

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE

INTEGRATED CIRCUIT ASSEMBLIES HAVING LOW SURFACE ENERGY EPOXY BARRI...

Edge Recess Design for Molded and Fusion or Hybrid Bonded Integrate...

PACKAGED SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING

STACKED SEMICONDUCTOR PACKAGE AND LOWER SEMICONDUCTOR PACKAGE USED...

SEMICONDUCTOR MODULE, POWER ELECTRONIC SUBSTRATE AND METHOD FOR FAB...

METHODS FOR PRODUCING A SEAL FOR A SEMICONDUCTOR MODULE, AND A HOUS...

PACKAGE STRUCTURE

NITRIDE SEMICONDUCTOR MODULE

EMBEDDING AN ELECTRONIC COMPONENT IN A CORE OF AN INTEGRATED CIRCUI...

SUBSTRATE AND MANUFACTURING METHOD THEREOF

FORMING SHALLOW TRENCH FOR DICING AND STRUCTURES THEREOF

ELECTRONIC PACKAGE MODULE AND METHOD FOR FABRICATION OF THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD FOR FORMING THE SAME

SEMICONDUCTOR DEVICE AND PACKAGE STRUCTURE OF SEMICONDUCTOR DEVICE

SEMICONDUCTOR MEMORY SYSTEM

REDISTRIBUTION LAYER METALLIC LAYOUT STRUCTURE AND METHOD WITH WARP...

SEMICONDUCTOR DEVICE

PACKAGE INCLUDING A DUMMY BAR AND METHODS OF FORMING THE PACKAGE

ELECTRONIC DEVICE AND INTERCONNECTION STRUCTURE

PACKAGE WITH ELECTRICALLY INSULATED CARRIER AND AT LEAST ONE STEP O...

EMITTERS FOR INTEGRATED POWER CARD COOLING

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE