BRIEF DESCRIPTION OF DRAWINGS
FIGS. 1A to 1E illustrate a fabrication method for fabricating a supporting column of a heat sink according to the present invention;
FIG. 2A is a diagram of an exploded diagram of a conventional liquid cooled heat sink;
FIG. 2B is a diagram of the conventional liquid cooled heat sink after assembly; and
FIG. 3 shows a fabrication method of a supporting column of the conventional liquid cooled heat sink.
DETAILED DESCRIPTION OF PREFERRED EMBODIMENTS
The following illustrative embodiments are provided to illustrate the disclosure of the present invention, these and other advantages and effects can be apparent to those skilled in the art after reading the disclosure of this specification. The present invention can also be performed or applied by other different embodiments. The details of the specification may be on the basis of different points and applications, and numerous modifications and variations can be devised without departing from the spirit of the present invention.
FIGS. 1A to 1E show a method for fabricating a supporting column of a heat sink according to the present invention.
First, as shown in FIG. 1A, a substrate 11 is provided. The substrate 11 is made of copper, aluminum or alloy thereof. In the present invention, a concave portion 111 is formed in a central portion of the substrate 11, and has a size defined according to volume of the cooled liquid to be injected to the substrate 11.
Then, as shown in FIG. 1B, a material injection board 12 having at least a through hole 121 is disposed on the concave portion 111 of the substrate 11. The through hole 121 of the material injection board 12 is located at a position of the substrate 11 where a supporting column is to be formed. In the present embodiment, the through hole 121 of the material injection board 12 has a cylindrical structure. Of course, the through hole 121 may have other structures. Preferably, if the material injection board 12 has two through holes 121, these through holes 121 are equal to each other in diameter.
As shown in FIG. 1C, aggregate 13 is injected into the through hole 121. The aggregate 13 is made of copper, aluminium or alloy thereof. In the present embodiment, the aggregate 13 is predisposed above the material injection board 12 and injected into the through hole 121 while being shaken.
Further, as shown in FIG. 1D, the substrate 11, the material injection board 12 and the aggregate 13 are disposed under a high temperature environment for sintering. In the present embodiment, the high temperature environment is provided by such as a high temperature furnace.
Finally, as shown in FIG. 1E, after the aggregate 13 is formalized, the material injection board 12 is removed from the substrate 11. Thereby, a supporting column 131 is formed on the concave portion 111 of the substrate 11. In the present embodiment, after the aggregate 13 is sintered, the substrate 11, the material injection board 12 and the aggregate 13 are removed from the high temperature environment, and the material injection board 12 is removed from the substrate 11 so as to form the supporting column 131.
Through the above method, capillary structure and density of the supporting column can be controlled and improved, thereby increasing heat dissipating efficiency of the heat sink.
The above-described descriptions of the detailed embodiments are only to illustrate the preferred implementation according to the present invention, and it is not to limit the scope of the present invention, i.e., other changes still can be implemented in the present invention. Accordingly, all modifications and variations completed by those with ordinary skill in the art should fall within the scope of present invention defined by the appended claims.
Patent Application
20080047141
