Number | Date | Country | Kind |
---|---|---|---|
62-133797 | May 1987 | JPX |
Number | Name | Date | Kind |
---|---|---|---|
4518629 | Jench | May 1985 | |
4541892 | Jench | Sep 1985 | |
4614563 | Kubo | Sep 1986 | |
4624864 | Haztmann | Nov 1986 |
Entry |
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Maeda et al., "Highly Reliable One-Micron-Rule Interconnection Utilizing TiN Barrier Metal," IEDM, pp. 610-613, 1985. |
Gardner et al., "Layered and Homogeneous Films of Aluminum and Aluminum/Silicon with Titanium and Tungsten for Multilevel Interconnects," IEEE Transactions on Electron Devices, vol. ED-32, No. 2, pp. 174`4 183, Feb. 1985. |