Smoothing of the dielectric

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H01L21/76819

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

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H01L21/76819Smoothing of the dielectric

Industries

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Patents Grantslast 30 patents

Information Patent Grant
In-situ PECVD cap layer
- Patent number 12,252,782
- Issue date Mar 18, 2025
- Lam Research Corporation
- Jeremy David Fields
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor device and a manufacturing method thereof
- Patent number 12,199,014
- Issue date Jan 14, 2025
- Samsung Electronics Co., Ltd.
- Kyeong Bin Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor structure having elastic memb...
- Patent number 12,198,977
- Issue date Jan 14, 2025
- NANYA TECHNOLOGY CORPORATION
- Shing-Yih Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fin field-effect transistor with a gate structure having a dielectr...
- Patent number 12,183,823
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Neng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip structure
- Patent number 12,176,245
- Issue date Dec 24, 2024
- Samsung Electronics Co., Ltd.
- Sangjun Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming an interconnect structure having an air gap and s...
- Patent number 12,159,838
- Issue date Dec 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Szu-Ping Tung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for forming recesses in source/drain regions and devices fo...
- Patent number 12,132,089
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yu-Lien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming semiconductor memory device
- Patent number 12,058,851
- Issue date Aug 6, 2024
- United Microelectronics Corp.
- Yi-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Planar passivation layers
- Patent number 12,046,527
- Issue date Jul 23, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Po-Shu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assemblies
- Patent number 12,046,482
- Issue date Jul 23, 2024
- Adeia Semiconductor Bonding Technologies, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device and ion beam irradiati...
- Patent number 12,040,155
- Issue date Jul 16, 2024
- Kioxia Corporation
- Junichi Hashimoto
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Subtractively patterned interconnect structures for integrated circ...
- Patent number 12,027,458
- Issue date Jul 2, 2024
- Intel Corporation
- Kevin Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structures
- Patent number 12,027,415
- Issue date Jul 2, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsin-Che Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices having a conductive pillar and methods of man...
- Patent number 12,027,495
- Issue date Jul 2, 2024
- Samsung Electronics Co., Ltd.
- Kun Sil Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Trench etching process for photoresist line roughness improvement
- Patent number 12,020,933
- Issue date Jun 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sheng-Lin Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact structure and method of forming the same
- Patent number 12,021,030
- Issue date Jun 25, 2024
- Yangtze Memory Technologies Co., Ltd.
- Wei Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory cell stack and via formation for a memory device
- Patent number 12,022,666
- Issue date Jun 25, 2024
- Micron Technology, Inc.
- David Ross Economy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polishing composition, polishing method, and method for producing s...
- Patent number 11,992,914
- Issue date May 28, 2024
- Fujimi Incorporated
- I-Chun Chang
- B24 - GRINDING POLISHING
Information Patent Grant
Integrated circuit devices including a via and methods of forming t...
- Patent number 11,978,668
- Issue date May 7, 2024
- Samsung Electronics Co., Ltd.
- Ming He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit interconnect structure having discontinuous barr...
- Patent number 11,978,663
- Issue date May 7, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chin-Lung Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and methods of forming the same
- Patent number 11,973,027
- Issue date Apr 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Pei-Yu Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Redistribution substrate, method of fabricating the same, and semic...
- Patent number 11,973,028
- Issue date Apr 30, 2024
- Samsung Electronics Co., Ltd.
- Jongyoun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fully aligned subtractive processes and electronic devices therefrom
- Patent number 11,967,527
- Issue date Apr 23, 2024
- Applied Materials, Inc.
- He Ren
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Via for semiconductor device connection and methods of forming the...
- Patent number 11,961,800
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a porous dielectric layer, and metho...
- Patent number 11,955,424
- Issue date Apr 9, 2024
- Adeia Semiconductor Solutions LLC
- Benjamin David Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device and semiconductor devices
- Patent number 11,955,430
- Issue date Apr 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Hsuan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Via patterning for integrated circuits
- Patent number 11,942,424
- Issue date Mar 26, 2024
- International Business Machines Corporation
- Tao Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of fabricating the same
- Patent number 11,908,796
- Issue date Feb 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Yu Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polishing pad, semiconductor fabricating device and fabricating met...
- Patent number 11,883,926
- Issue date Jan 30, 2024
- Kioxia Corporation
- Takahiko Kawasaki
- B24 - GRINDING POLISHING
Information Patent Grant
Memory device
- Patent number 11,823,950
- Issue date Nov 21, 2023
- Winbond Electronics Corp.
- Huang-Nan Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CHEMICAL PLANARIZATION OF NON-METALLIC MATERIALS
- Publication number 20250091176
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- CHEMPOWER CORPORATION
- Sudhanshu Misra
- B24 - GRINDING POLISHING
Information Patent Application
SEMICONDUCTOR CHIP STRUCTURE
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- Sangjun PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING AN INTERCONNECT STRUCTURE HAVING AN AIR GAP AND S...
- Publication number 20250070027
- Publication date Feb 27, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Szu-Ping Tung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES
- Publication number 20250046625
- Publication date Feb 6, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER-LEVEL DIE SINGULATION USING BURIED SACRIFICIAL STRUCTURE
- Publication number 20250048714
- Publication date Feb 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Te Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING AN INTERCONNECT VIA
- Publication number 20250029872
- Publication date Jan 23, 2025
- IMEC vzw
- Anshul Gupta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Surface Profile Control Of Passivation Layers In Integrated Circuit...
- Publication number 20250014943
- Publication date Jan 9, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Zheng Yong LIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING A POROUS DIELECTRIC LAYER, AND METHO...
- Publication number 20240413076
- Publication date Dec 12, 2024
- Adeia Semiconductor Solutions LLC
- Benjamin David Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20240395699
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Wen PAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR MANUFACTURING AN INTERCONNECT STRUCTURE
- Publication number 20240387358
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- KHADERBAD MRUNAL ABHIJITH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE
- Publication number 20240387248
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuan-Wei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240379561
- Publication date Nov 14, 2024
- NANYA TECHNOLOGY CORPORATION
- JI-FENG LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLANAR PASSIVATION LAYERS
- Publication number 20240355695
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Co., LTD
- Po-Shu WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE INCLUDING NITROGEN...
- Publication number 20240347449
- Publication date Oct 17, 2024
- NANYA TECHNOLOGY CORPORATION
- YING-CHENG CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE INCLUDING NITROGEN...
- Publication number 20240347448
- Publication date Oct 17, 2024
- NANYA TECHNOLOGY CORPORATION
- YING-CHENG CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING SEMICONDUCTOR MEMORY DEVICE
- Publication number 20240349493
- Publication date Oct 17, 2024
- UNITED MICROELECTRONICS CORP.
- Yi-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI LEVEL CONTACT ETCH
- Publication number 20240339328
- Publication date Oct 10, 2024
- TOKYO ELECTRON LIMITED
- Alec Dorfner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRENCH ETCHING PROCESS FOR PHOTORESIST LINE ROUGHNESS IMPROVEMENT
- Publication number 20240332020
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sheng-Lin HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING SEMICONDUCTOR MEMORY DEVICE
- Publication number 20240324187
- Publication date Sep 26, 2024
- UNITED MICROELECTRONICS CORP.
- Yi-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBTRACTIVELY PATTERNED INTERCONNECT STRUCTURES FOR INTEGRATED CIRC...
- Publication number 20240304543
- Publication date Sep 12, 2024
- Intel Corporation
- Kevin Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT INTERCONNECT STRUCTURE HAVING DISCONTINUOUS BARR...
- Publication number 20240290653
- Publication date Aug 29, 2024
- Taiwan Semiconductor Manufacturing Co., LTD
- Chin-Lung Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING SEMICONDUCTOR DEVICE
- Publication number 20240274527
- Publication date Aug 15, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Pei-Yu Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIA FOR SEMICONDUCTOR DEVICE CONNECTION
- Publication number 20240250020
- Publication date Jul 25, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURES
- Publication number 20240249976
- Publication date Jul 25, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsin-Che Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240203885
- Publication date Jun 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hsuan LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT INTERCONNECT LEVEL COMPRISING MULTI-HEIGHT LINES...
- Publication number 20240170394
- Publication date May 23, 2024
- Intel Corporation
- Elijah Karpov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240153815
- Publication date May 9, 2024
- Samsung Electronics Co., Ltd.
- Kyuhoon Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLANARIZATION STRUCTURE FOR MIM TOPOGRAPHY
- Publication number 20240145377
- Publication date May 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Liang-Shiuan Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED FET CONTACT FORMATION
- Publication number 20240105590
- Publication date Mar 28, 2024
- International Business Machines Corporation
- Koichi Motoyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WET ETCH PROCESS AND METHODS TO FORM AIR GAPS BETWEEN METAL INTERCO...
- Publication number 20240087950
- Publication date Mar 14, 2024
- TOKYO ELECTRON LIMITED
- Shan Hu
- H01 - BASIC ELECTRIC ELEMENTS

Smoothing of the dielectric

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

In-situ PECVD cap layer

Semiconductor device and a manufacturing method thereof

Manufacturing method of semiconductor structure having elastic memb...

Fin field-effect transistor with a gate structure having a dielectr...

Semiconductor chip structure

Method of forming an interconnect structure having an air gap and s...

Methods for forming recesses in source/drain regions and devices fo...

Method of forming semiconductor memory device

Planar passivation layers

Microelectronic assemblies

Method of manufacturing semiconductor device and ion beam irradiati...

Subtractively patterned interconnect structures for integrated circ...

Semiconductor device structures

Semiconductor devices having a conductive pillar and methods of man...

Trench etching process for photoresist line roughness improvement

Contact structure and method of forming the same

Memory cell stack and via formation for a memory device

Polishing composition, polishing method, and method for producing s...

Integrated circuit devices including a via and methods of forming t...

Integrated circuit interconnect structure having discontinuous barr...

Semiconductor device and methods of forming the same

Redistribution substrate, method of fabricating the same, and semic...

Fully aligned subtractive processes and electronic devices therefrom

Via for semiconductor device connection and methods of forming the...

Semiconductor device including a porous dielectric layer, and metho...

Method of manufacturing semiconductor device and semiconductor devices

Via patterning for integrated circuits

Semiconductor device and method of fabricating the same

Polishing pad, semiconductor fabricating device and fabricating met...

Memory device

Patents Applicationslast 30 patents

CHEMICAL PLANARIZATION OF NON-METALLIC MATERIALS

SEMICONDUCTOR CHIP STRUCTURE

METHOD OF FORMING AN INTERCONNECT STRUCTURE HAVING AN AIR GAP AND S...

MICROELECTRONIC ASSEMBLIES

WAFER-LEVEL DIE SINGULATION USING BURIED SACRIFICIAL STRUCTURE

METHOD FOR PRODUCING AN INTERCONNECT VIA

Surface Profile Control Of Passivation Layers In Integrated Circuit...

SEMICONDUCTOR DEVICE INCLUDING A POROUS DIELECTRIC LAYER, AND METHO...

INTEGRATED CIRCUIT STRUCTURE AND METHOD FOR FORMING THE SAME

METHODS FOR MANUFACTURING AN INTERCONNECT STRUCTURE

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE

INTERCONNECT STRUCTURE AND MANUFACTURING METHOD THEREOF

PLANAR PASSIVATION LAYERS

METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE INCLUDING NITROGEN...

METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE INCLUDING NITROGEN...

METHOD OF FORMING SEMICONDUCTOR MEMORY DEVICE

MULTI LEVEL CONTACT ETCH

TRENCH ETCHING PROCESS FOR PHOTORESIST LINE ROUGHNESS IMPROVEMENT

METHOD OF FORMING SEMICONDUCTOR MEMORY DEVICE

SUBTRACTIVELY PATTERNED INTERCONNECT STRUCTURES FOR INTEGRATED CIRC...

INTEGRATED CIRCUIT INTERCONNECT STRUCTURE HAVING DISCONTINUOUS BARR...

METHODS OF FORMING SEMICONDUCTOR DEVICE

VIA FOR SEMICONDUCTOR DEVICE CONNECTION

SEMICONDUCTOR DEVICE STRUCTURES

SEMICONDUCTOR DEVICE

INTEGRATED CIRCUIT INTERCONNECT LEVEL COMPRISING MULTI-HEIGHT LINES...

SEMICONDUCTOR DEVICES AND METHOD OF MANUFACTURING THE SAME

PLANARIZATION STRUCTURE FOR MIM TOPOGRAPHY

STACKED FET CONTACT FORMATION

WET ETCH PROCESS AND METHODS TO FORM AIR GAPS BETWEEN METAL INTERCO...