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SEMICONDUCTOR CHIP STRUCTURE
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Publication number 20250087531
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Publication date Mar 13, 2025
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Samsung Electronics Co., Ltd.
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Sangjun PARK
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H01 - BASIC ELECTRIC ELEMENTS
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MICROELECTRONIC ASSEMBLIES
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Publication number 20250046625
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Publication date Feb 6, 2025
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ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
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Belgacem Haba
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H01 - BASIC ELECTRIC ELEMENTS
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PLANAR PASSIVATION LAYERS
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Publication number 20240355695
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Publication date Oct 24, 2024
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Taiwan Semiconductor Manufacturing Co., LTD
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Po-Shu WANG
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H01 - BASIC ELECTRIC ELEMENTS
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MULTI LEVEL CONTACT ETCH
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Publication number 20240339328
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Publication date Oct 10, 2024
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TOKYO ELECTRON LIMITED
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Alec Dorfner
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H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR DEVICE STRUCTURES
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Publication number 20240249976
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Publication date Jul 25, 2024
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Taiwan Semiconductor Manufacturing Co., Ltd.
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Hsin-Che Chiang
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H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR DEVICE
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Publication number 20240203885
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Publication date Jun 20, 2024
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Taiwan Semiconductor Manufacturing Company, Ltd.
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Chih-Hsuan LIN
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H01 - BASIC ELECTRIC ELEMENTS
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STACKED FET CONTACT FORMATION
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Publication number 20240105590
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Publication date Mar 28, 2024
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International Business Machines Corporation
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Koichi Motoyama
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H01 - BASIC ELECTRIC ELEMENTS
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