Claims
- 1. The method of making a flexible printed circuit structure for use in connection with upholstered seats, which comprises(a) furnishing a circuit substrate formed of lightly woven, thin fabric having top and bottom surfaces, (b) applying adhesive to one of said surfaces, (c) screen printing the other of said surfaces with multiple repeats of a desired electrical circuit pattern, (d) die cutting said circuit substrate into multiple sectional areas each including a complete individual repeat of said desired circuit pattern, (e) providing a flexible and distortable upholstery material, and (f) adhesively bonding individual ones of said die cut sectional areas to a surface of said upholstery material.
- 2. The method according to claim 1, wherein(a) said thin fabric is provided in a thickness of about 0.003 inch.
- 3. The method according to claim 1, wherein(a) said adhesive comprises a long life acrylic based pressure sensitive adhesive or a long life heat activated adhesive.
- 4. The method according to claim 3, wherein(a) said pressure sensitive adhesive is applied to a thickness of about 0.0015 inches to 0.002 inches.
- 5. The method according to claim 1, wherein(a) a protective layer is applied over said electrical circuit pattern.
- 6. The method according to claim 5, wherein(a) said protective layer is selectively screen printed over substantially only the pattern of the printed circuit.
- 7. The method according to claim 3, wherein(a) said heat activated adhesive is thermally actuated for adhesive bonding of said cut sectional areas to said upholstery material.
RELATED APPLICATION
This application is a division of my application Ser. No. 09/362,849, filed Jul. 28, 1999, which in turn was a continuation-in-part of my application Ser. No. 09/244,219, filed Feb. 4, 1999.
US Referenced Citations (27)
Continuation in Parts (1)
|
Number |
Date |
Country |
Parent |
09/244219 |
Feb 1999 |
US |
Child |
09/362849 |
|
US |