Method for manufacturing semiconductor device

Abstract

Disclosed is a method for manufacturing a semiconductor device. This method includes the step of forming a diffusion barrier film, which is interposed between a silicon film and a metal film and functions to prevent diffusion between the silicon and metal films. The diffusion barrier film is formed of a WSixNy film or a WSix film by using an ALD process.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

The above and other objects, features and advantages of the present invention will be more apparent from the following detailed description taken in conjunction with the accompanying drawings, in which:

FIGS. 1A and 1B are process-by-process sectional views for explaining a semiconductor device manufacturing method according to the prior art;

FIG. 2 is a ternary phase diagram of W—Si—N; and

FIGS. 3A and 3B are process-by-process sectional views for explaining a semiconductor device manufacturing method in accordance with a preferred embodiment of the present invention.

Claims

1. A method for manufacturing a semiconductor device, the method comprising the step of: forming a diffusion barrier film, that is interposed between a silicon film and a metal film and which functions to prevent diffusion between the silicon and metal films, the diffusion barrier film being formed of a WSixNy film by using an Atomic Layer Deposition (ALD) process.

2. The method as claimed in claim 1, wherein the metal film is any one selected from of the group consisting of a tungsten film, a copper film and an aluminum film.

3. The method as claimed in claim 1, wherein the WSixNy film is formed at a pressure of 10 mTorr to 10 Torr and a temperature of 300 to 500° C. by using the ALD process.

4. The method as claimed in claim 1, wherein in the step of forming the WSixNy film by using the ALD process, any one or more selected from the group consisting of WF6, WCl6, WBr6, W(CO)6, W(C2H2)6, W(PF3)6, W(allyl)4, (C2H5)WH2, [CH3(C5H4)]2WH2, (C5H5)W(CO)3(CH3), W(butadiene)3, W(methylvinyl-ketone)3, (C5H5)HW(CO)3, (C7H8)W(CO)3 and (1,5-COD)W(CO)4 is used as a W source gas.

5. The method as claimed in claim 1, wherein in the step of forming the WSixNy film by using the ALD process, any one or more selected from the group consisting of B2H6, BH3 and B10H14 is used as a reducing gas for reducing the W source gas.

6. The method as claimed in claim 1, wherein in the step of forming the WSixNy film by using the ALD process, any one or more selected from the group consisting of SiH4, Si2H6 and SiH2Cl2 is used as a Si source gas.

7. The method as claimed in claim 1, wherein in the step of forming the WSixNy film by using the ALD process, any one or more selected from the group consisting of NH3 and N2H4 is used as a N source gas.

8. The method as claimed in claim 1, wherein the WSixNy film is formed by repeatedly performing a deposition cycle, in which W source gas supply and purge, reducing gas supply and purge, Si source gas supply and purge, and N source gas supply and purge are carried out in sequence, according to the ALD process.

9. The method as claimed in claim 8, wherein any one or more of the reducing gas, Si source gas, and the N source gas is supplied in a plasma state.

10. The method as claimed in claim 1, wherein the WSixNy film is formed by repeatedly performing a deposition cycle, in which reducing gas supply and purge, W source gas supply and purge, Si source gas supply and purge, and N source gas supply and purge are carried out in sequence, according to the ALD process.

11. The method as claimed in claim 10, wherein any one or more of the reducing gas, Si source gas, and the N source gas is supplied in a plasma state.

12. The method as claimed in claim 1, wherein the WSixNy film is formed by repeatedly performing a deposition cycle, in which reducing gas supply and purge, W source gas supply and purge, N source gas supply and purge, and Si source gas supply and purge are carried out in sequence, according to the ALD process.

13. The method as claimed in claim 12, wherein any one or more of the reducing gas, Si source gas, and the N source gas is supplied in a plasma state.e

14. The method as claimed in claim 1, wherein the WSixNy film is formed by repeatedly performing a deposition cycle, in which W source gas supply and purge, reducing gas supply and purge, N source gas supply and purge, and Si source gas supply and purge are carried out in sequence, according to the ALD process.

15. The method as claimed in claim 8, wherein any one or more of the reducing gas, Si source gas, and the N source gas is supplied in a plasma state.

16. A method for manufacturing a semiconductor device, the method comprising the step of: forming a diffusion barrier film, which is interposed between a silicon film and a metal film and functions to prevent diffusion between the silicon and metal films, the diffusion barrier film being formed of a WSix film by using an ALD process.

17. The method as claimed in claim 15, wherein the metal film is any one selected from of the group consisting of a tungsten film, a copper film and an aluminum film.

18. The method as claimed in claim 15, wherein the WSix film is formed at a pressure of 10 mTorr to 10 Torr and a temperature of 300 to 500° C. by using the ALD process.

19. The method as claimed in claim 15, wherein in the step of forming the WSix film by using the ALD process, any one selected from the group consisting of WF6, WCl6, WBr6, W(CO)6, W(C2H2)6, W(PF3)6, W(allyl)4, (C2H5)WH2, [CH3(C5H4)]2WH2, (C5H5)W(CO)3(CH3), W(butadiene)3, W(methylvinyl-ketone)3, (C5H5)HW(CO)3, (C7H8)W(CO)3 and (1,5-COD)W(CO)4 is used as a W source gas.

20. The method as claimed in claim 15, wherein in the step of forming the WSix film by using the ALD process, any one selected from the group consisting of B2H6, BH3 and B10H14 is used as a reducing gas for reducing the W source gas.

21. The method as claimed in claim 15, wherein in the step of forming the WSix film by using the ALD process, any one selected from the group consisting of SiH4, Si2H6 and SiH2Cl2 is used as a Si source gas.

22. The method as claimed in claim 15, wherein the WSix film is formed by repeatedly performing a deposition cycle, in which W source gas supply and purge, reducing gas supply and purge, and Si source gas supply and purge are carried out in sequence, according to the ALD process.

23. The method as claimed in claim 22, wherein any one or more of the reducing gas and the Si source gas is supplied in a plasma state.

24. The method as claimed in claim 15, wherein the WSix film is formed by repeatedly performing a deposition cycle, in which reducing gas supply and purge, W source gas supply and purge, and Si source gas supply and purge are carried out in sequence, according to the ALD process.

25. The method as claimed in claim 24, wherein any one or more of the reducing gas and the Si source gas is supplied in a plasma state.

26. A method for manufacturing a semiconductor device, the method comprising the steps of: forming a gate insulating film on a semiconductor substrate;forming a polysilicon film on the gate insulating film;forming a WSixNy film as a diffusion barrier film on the polysilicon film by using an ALD process;forming a metal film on the WSixNy film; andetching the metal film, the WSixNy film, the polysilicon film and the gate insulating film to form a gate.

27. A method for manufacturing a semiconductor device, the method comprising the steps of: forming a gate insulating film on a semiconductor substrate;forming a polysilicon film on the gate insulating film;forming a WSix film as a diffusion barrier film on the polysilicon film by using an ALD process;forming a metal film on the WSix film; andetching the metal film, the WSix film, the polysilicon film and the gate insulating film to form a gate.

28. A semiconductor device comprising: a diffusion barrier film, interposed between a silicon film and a metal film, said diffusion barrier film preventing diffusion between the silicon and metal films and being formed of a WSixNy film using an Atomic Layer Deposition (ALD) process.

29. A semiconductor device comprising: a diffusion barrier film, interposed between a silicon film and a metal film, said diffusion barrier film preventing diffusion between the silicon and metal films and being formed of a WSix film using an Atomic Layer Deposition (ALD) process.