Selective deposition

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CPC
H01L21/28562

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/28562Selective deposition

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Method of processing substrate, method of manufacturing semiconduct...
- Patent number 12,170,206
- Issue date Dec 17, 2024
- Kokusai Electric Corporation
- Arito Ogawa
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Selective processing with etch residue-based inhibitors
- Patent number 12,131,909
- Issue date Oct 29, 2024
- Lam Research Corporation
- Kashish Sharma
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor devices with dissimlar materials and methods
- Patent number 12,132,086
- Issue date Oct 29, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Gordon M. Grivna
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memories having vertically stacked conductive filled structures
- Patent number 12,114,492
- Issue date Oct 8, 2024
- Micron Technology, Inc.
- Jordan D. Greenlee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for forming a metallic film on a substrate by cyclical depo...
- Patent number 12,106,965
- Issue date Oct 1, 2024
- ASM IP Holding B.V.
- Katja Väyrynen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of forming interconnect structure
- Patent number 12,080,595
- Issue date Sep 3, 2024
- Samsung Electronics Co., Ltd.
- Keunwook Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming barrier layer in semiconductor structure
- Patent number 12,062,573
- Issue date Aug 13, 2024
- Yangtze Memory Technologies Co., Ltd.
- Peng Zhou
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for selectively depositing a metallic film on a substrate
- Patent number 12,033,861
- Issue date Jul 9, 2024
- ASM IP Holding B.V.
- Delphine Longrie
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method and structure for determining blocking ability of copper dif...
- Patent number 12,027,462
- Issue date Jul 2, 2024
- SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD.
- Xiaobo Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of for bonding noble metal structure with a dielectric layer...
- Patent number 12,027,190
- Issue date Jul 2, 2024
- Seagate Technology LLC
- Xiaoyue Huang
- G11 - INFORMATION STORAGE
Information Patent Grant
Via structure and methods of forming the same
- Patent number 12,010,933
- Issue date Jun 11, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wei-Chieh Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Doped selective metal caps to improve copper electromigration with...
- Patent number 11,990,368
- Issue date May 21, 2024
- Applied Materials, Inc.
- Mehul B. Naik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicide films through selective deposition
- Patent number 11,978,635
- Issue date May 7, 2024
- Applied Materials, Inc.
- Swaminathan Srinivasan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Self-aligned barrier for metal vias
- Patent number 11,972,974
- Issue date Apr 30, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Sung-Li Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Atomic layer deposition on 3D NAND structures
- Patent number 11,972,952
- Issue date Apr 30, 2024
- Lam Research Corporation
- Ruopeng Deng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device, substrate processing...
- Patent number 11,967,500
- Issue date Apr 23, 2024
- Kokusai Electric Corporation
- Arito Ogawa
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Selective tungsten deposition at low temperatures
- Patent number 11,967,525
- Issue date Apr 23, 2024
- Applied Materials, Inc.
- Yi Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective cobalt deposition on copper surfaces
- Patent number 11,959,167
- Issue date Apr 16, 2024
- Applied Materials, Inc.
- Sang-Ho Yu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Techniques and device structure based upon directional seeding and...
- Patent number 11,956,978
- Issue date Apr 9, 2024
- Applied Materials, Inc.
- M. Arif Zeeshan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal adhesion layer to promote metal plug adhesion
- Patent number 11,955,379
- Issue date Apr 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Pei-Wen Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure having alternating selective metal and diel...
- Patent number 11,942,426
- Issue date Mar 26, 2024
- International Business Machines Corporation
- Son Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-region diffusion barrier containing titanium, silicon and nit...
- Patent number 11,942,365
- Issue date Mar 26, 2024
- Eugenus, Inc.
- Vinayak Veer Vats
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of etching metal-containing layers
- Patent number 11,942,332
- Issue date Mar 26, 2024
- Applied Materials, Inc.
- Akhil Mehrotra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming via structure having low interface resistance
- Patent number 11,929,321
- Issue date Mar 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Li-Zhen Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device, method of processing...
- Patent number 11,923,191
- Issue date Mar 5, 2024
- Kokusai Electric Corporation
- Shoma Miyata
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,915,981
- Issue date Feb 27, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Peng-Soon Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device having an oxygen free platinum group metal film
- Patent number 11,894,233
- Issue date Feb 6, 2024
- Applied Materials, Inc.
- Yixiong Yang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Enhanced spatial ALD of metals through controlled precursor mixing
- Patent number 11,887,856
- Issue date Jan 30, 2024
- Applied Materials, Inc.
- Kelvin Chan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Self-aligned contacts
- Patent number 11,887,891
- Issue date Jan 30, 2024
- Intel Corporation
- Mark T. Bohr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for depositing fluorine/carbon-free conformal tungsten
- Patent number 11,887,855
- Issue date Jan 30, 2024
- Applied Materials, Inc.
- Xinyu Fu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF DEPOSITING FILM
- Publication number 20240429039
- Publication date Dec 26, 2024
- Samsung Electronics Co., Ltd.
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Methods of Filling Openings with Conductive Material, and Assemblie...
- Publication number 20240407160
- Publication date Dec 5, 2024
- Micron Technology, Inc.
- Jordan D. Greenlee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING INTERCONNECT STRUCTURE
- Publication number 20240395613
- Publication date Nov 28, 2024
- Samsung Electronics Co., Ltd.
- Keunwook SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS GAS RAMP DURING SEMICONDUCTOR PROCESSING
- Publication number 20240376598
- Publication date Nov 14, 2024
- LAM RESEARCH CORPORATION
- Jasmine LIN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
VIA STRUCTURE AND METHODS OF FORMING THE SAME
- Publication number 20240334847
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei-Chieh Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW RESISTIVITY FILMS CONTAINING MOLYBDENUM
- Publication number 20240297075
- Publication date Sep 5, 2024
- LAM RESEARCH CORPORATION
- Shruti Vivek THOMBARE
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ATOMIC LAYER DEPOSITION ON 3D NAND STRUCTURES
- Publication number 20240266177
- Publication date Aug 8, 2024
- LAM RESEARCH CORPORATION
- Ruopeng Deng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TUNGSTEN WORDLINE FILL IN HIGH ASPECT RATIO 3D NAND ARCHITECTURE
- Publication number 20240249949
- Publication date Jul 25, 2024
- LAM RESEARCH CORPORATION
- Erica Maxine Chen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METAL ADHESION LAYER TO PROMOTE METAL PLUG ADHESION
- Publication number 20240249977
- Publication date Jul 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Pei-Wen WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED BARRIER FOR METAL VIAS
- Publication number 20240243009
- Publication date Jul 18, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Sung-Li WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240234212
- Publication date Jul 11, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Peng-Soon LIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE COBALT DEPOSITION ON COPPER SURFACES
- Publication number 20240218503
- Publication date Jul 4, 2024
- Applied Materials, Inc.
- Sang-Ho YU
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PROCESSING SYSTEM AND METHODS FOR FORMING VOID-FREE AND SEAM-FREE T...
- Publication number 20240209500
- Publication date Jun 27, 2024
- Applied Materials, Inc.
- Xi CEN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
CONTACT LAYER FORMATION WITH MICROWAVE ANNEALING FOR NMOS DEVICES
- Publication number 20240203742
- Publication date Jun 20, 2024
- Applied Materials, Inc.
- Nicolas Louis BREIL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF SELECTIVELY FORMING LAYER USING ATOMIC LAYER DEPOSITION A...
- Publication number 20240203788
- Publication date Jun 20, 2024
- Samsung Electronics Co., Ltd.
- Eunhyoung CHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESSING METHOD, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, PR...
- Publication number 20240186137
- Publication date Jun 6, 2024
- Kokusai Electric Corporation
- Shoma Miyata
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
VIA STRUCTURE HAVING LOW INTERFACE RESISTANCE
- Publication number 20240178132
- Publication date May 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Li-Zhen YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD AND MET...
- Publication number 20240120213
- Publication date Apr 11, 2024
- Samsung Electronics Co., Ltd.
- Woo Rim LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE PROCESSING WITH ETCH RESIDUE-BASED INHIBITORS
- Publication number 20240038539
- Publication date Feb 1, 2024
- LAM RESEARCH CORPORATION
- Kashish Sharma
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR DEVICES WITH DISSIMLAR MATERIALS AND METHODS
- Publication number 20240030293
- Publication date Jan 25, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Gordon M. Grivna
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FORMING A TRANSITION METAL NIOBIUM NITRIDE FILM ON A SU...
- Publication number 20240030035
- Publication date Jan 25, 2024
- ASM IP HOLDING B.V.
- Jerry Peijun Chen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SELF-ALIGNED CONTACTS
- Publication number 20240030067
- Publication date Jan 25, 2024
- Intel Corporation
- Mark T. BOHR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT PLUGS FOR SEMICONDUCTOR DEVICE AND METHOD OF FORMING SAME
- Publication number 20240021501
- Publication date Jan 18, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Mrunal A. Khaderbad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW RESISTANCE PULSED CVD TUNGSTEN
- Publication number 20240006180
- Publication date Jan 4, 2024
- LAM RESEARCH CORPORATION
- Yu PAN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ATOMIC LAYER DEPOSITION USING NOVEL OXYGEN-CONTAINING PRECURSORS
- Publication number 20230416915
- Publication date Dec 28, 2023
- Applied Materials, Inc.
- Geetika Bajaj
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
CLUSTER PROCESSING SYSTEM FOR FORMING A METAL CONTAINING MATERIAL
- Publication number 20230377958
- Publication date Nov 23, 2023
- Applied Materials, Inc.
- Keith Tatseun WONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF FIELD-SUPPRESSION CVD TUNGSTEN (W) FILL ON PVD W LINER
- Publication number 20230326791
- Publication date Oct 12, 2023
- Applied Materials, Inc.
- Zhimin QI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
AREA SELECTIVE ORGANIC MATERIAL REMOVAL
- Publication number 20230307247
- Publication date Sep 28, 2023
- ASM IP HOLDING B.V.
- Mikko Ritala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF SELECTIVELY FORMING COBALT METAL LAYER BY USING COBALT CO...
- Publication number 20230257409
- Publication date Aug 17, 2023
- Samsung Electronics Co., Ltd.
- Soyoung LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED CONTACTS
- Publication number 20230154793
- Publication date May 18, 2023
- Intel Corporation
- Mark T. BOHR
- H01 - BASIC ELECTRIC ELEMENTS

Selective deposition

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method of processing substrate, method of manufacturing semiconduct...

Selective processing with etch residue-based inhibitors

Semiconductor devices with dissimlar materials and methods

Memories having vertically stacked conductive filled structures

Methods for forming a metallic film on a substrate by cyclical depo...

Method of forming interconnect structure

Method for forming barrier layer in semiconductor structure

Method for selectively depositing a metallic film on a substrate

Method and structure for determining blocking ability of copper dif...

Method of for bonding noble metal structure with a dielectric layer...

Via structure and methods of forming the same

Doped selective metal caps to improve copper electromigration with...

Silicide films through selective deposition

Self-aligned barrier for metal vias

Atomic layer deposition on 3D NAND structures

Method of manufacturing semiconductor device, substrate processing...

Selective tungsten deposition at low temperatures

Selective cobalt deposition on copper surfaces

Techniques and device structure based upon directional seeding and...

Metal adhesion layer to promote metal plug adhesion

Semiconductor structure having alternating selective metal and diel...

Multi-region diffusion barrier containing titanium, silicon and nit...

Methods of etching metal-containing layers

Method for forming via structure having low interface resistance

Method of manufacturing semiconductor device, method of processing...

Semiconductor device and manufacturing method thereof

Electronic device having an oxygen free platinum group metal film

Enhanced spatial ALD of metals through controlled precursor mixing

Self-aligned contacts

Methods for depositing fluorine/carbon-free conformal tungsten

Patents Applicationslast 30 patents

METHOD OF DEPOSITING FILM

Methods of Filling Openings with Conductive Material, and Assemblie...

METHOD OF FORMING INTERCONNECT STRUCTURE

PROCESS GAS RAMP DURING SEMICONDUCTOR PROCESSING

VIA STRUCTURE AND METHODS OF FORMING THE SAME

LOW RESISTIVITY FILMS CONTAINING MOLYBDENUM

ATOMIC LAYER DEPOSITION ON 3D NAND STRUCTURES

TUNGSTEN WORDLINE FILL IN HIGH ASPECT RATIO 3D NAND ARCHITECTURE

METAL ADHESION LAYER TO PROMOTE METAL PLUG ADHESION

SELF-ALIGNED BARRIER FOR METAL VIAS

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SELECTIVE COBALT DEPOSITION ON COPPER SURFACES

PROCESSING SYSTEM AND METHODS FOR FORMING VOID-FREE AND SEAM-FREE T...

CONTACT LAYER FORMATION WITH MICROWAVE ANNEALING FOR NMOS DEVICES

METHOD OF SELECTIVELY FORMING LAYER USING ATOMIC LAYER DEPOSITION A...

PROCESSING METHOD, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, PR...

VIA STRUCTURE HAVING LOW INTERFACE RESISTANCE

SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD AND MET...

SELECTIVE PROCESSING WITH ETCH RESIDUE-BASED INHIBITORS

SEMICONDUCTOR DEVICES WITH DISSIMLAR MATERIALS AND METHODS

METHODS FOR FORMING A TRANSITION METAL NIOBIUM NITRIDE FILM ON A SU...

SELF-ALIGNED CONTACTS

CONTACT PLUGS FOR SEMICONDUCTOR DEVICE AND METHOD OF FORMING SAME

LOW RESISTANCE PULSED CVD TUNGSTEN

ATOMIC LAYER DEPOSITION USING NOVEL OXYGEN-CONTAINING PRECURSORS

CLUSTER PROCESSING SYSTEM FOR FORMING A METAL CONTAINING MATERIAL

SELF FIELD-SUPPRESSION CVD TUNGSTEN (W) FILL ON PVD W LINER

AREA SELECTIVE ORGANIC MATERIAL REMOVAL

METHOD OF SELECTIVELY FORMING COBALT METAL LAYER BY USING COBALT CO...

SELF-ALIGNED CONTACTS