Holders for supporting the complete device in operation

Industry

CPC
H01L23/32

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/32Holders for supporting the complete device in operation

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Chip socket, testing fixture and chip testing method thereof
- Patent number 12,292,455
- Issue date May 6, 2025
- NANYA TECHNOLOGY CORPORATION
- Shih-Ting Lin
- G11 - INFORMATION STORAGE
Information Patent Grant
Patterned bolster plate and composite back plate for semiconductor...
- Patent number 12,279,395
- Issue date Apr 15, 2025
- Intel Corporation
- Phil Geng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit chip storage container
- Patent number 12,243,793
- Issue date Mar 4, 2025
- SanDisk Technologies, Inc.
- Nadav Tsur
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System in a package modifications
- Patent number 12,243,794
- Issue date Mar 4, 2025
- OCTAVO SYSTEMS LLC
- Michael Kenneth Conti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor device and method for manufacturing power semic...
- Patent number 12,232,300
- Issue date Feb 18, 2025
- Mitsubishi Electric Corporation
- Noriyuki Besshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stiffener ring and surface packaging assembly
- Patent number 12,232,250
- Issue date Feb 18, 2025
- Huawei Technologies Co., Ltd.
- Chuncheng Gong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cryogenic packaging for thermalization of low temperature devices
- Patent number 12,219,737
- Issue date Feb 4, 2025
- International Business Machines Corporation
- Oblesh Jinka
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Embedded cooling systems and methods of manufacturing embedded cool...
- Patent number 12,191,233
- Issue date Jan 7, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through electrode substrate and semiconductor device
- Patent number 12,183,661
- Issue date Dec 31, 2024
- Dai Nippon Printing Co., Ltd.
- Satoru Kuramochi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chip retaining structure to fix a chip module
- Patent number 12,165,943
- Issue date Dec 10, 2024
- FOXCONN (KUNSHAN) COMPUTER CONNECTOR CO., LTD.
- Fang-Jwu Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and method for bonding of substrates
- Patent number 12,131,907
- Issue date Oct 29, 2024
- EV Group E. Thallner GmbH
- Thomas Wagenleitner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Supports for thinned semiconductor substrates and related methods
- Patent number 12,132,005
- Issue date Oct 29, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multidie supports and related methods
- Patent number 12,132,008
- Issue date Oct 29, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having at least one resin part that closes one...
- Patent number 12,119,279
- Issue date Oct 15, 2024
- Mitsubishi Electric Corporation
- Mamoru Togami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pressing device for directly or indirectly applying pressure to pow...
- Patent number 12,094,797
- Issue date Sep 17, 2024
- Semikron Elektronik GmbH & Co. KG
- Ingo Bogen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor apparatus
- Patent number 12,074,090
- Issue date Aug 27, 2024
- Fuji Electric Co., Ltd.
- Shinichiro Adachi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip bonding apparatus and securing assembly therefor
- Patent number 12,074,133
- Issue date Aug 27, 2024
- GUANGZHOU AIFO LIGHT COMMUNICATION TECHNOLOGY COMPANY LTD.
- Guoqiang Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of forming the same
- Patent number 12,051,668
- Issue date Jul 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Switched-mode light-emitting diode (LED) display unit satisfying fi...
- Patent number 12,035,490
- Issue date Jul 9, 2024
- NANJING LOPU CO., LTD.
- Bin Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Curved semiconductor die systems and related methods
- Patent number 12,020,972
- Issue date Jun 25, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate and method for manufacturing the same
- Patent number 11,990,396
- Issue date May 21, 2024
- Resonac Corporation
- Kazuyuki Mitsukura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packages having support rings
- Patent number 11,990,381
- Issue date May 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu-Rong Chun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IC chip holder
- Patent number 11,982,687
- Issue date May 14, 2024
- Brother Kogyo Kabushiki Kaisha
- Hidekazu Komiya
- G01 - MEASURING TESTING
Information Patent Grant
Method of producing circuit boards
- Patent number 11,974,404
- Issue date Apr 30, 2024
- TOPPAN INC.
- Yuki Nitta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip socket, testing fixture and chip testing method thereof
- Patent number 11,959,939
- Issue date Apr 16, 2024
- NANYA TECHNOLOGY CORPORATION
- Shih-Ting Lin
- G11 - INFORMATION STORAGE
Information Patent Grant
Device and method for bonding of substrates
- Patent number 11,955,339
- Issue date Apr 9, 2024
- EV Group E. Thallner GmbH
- Thomas Wagenleitner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure and method for manufacturing the same, and m...
- Patent number 11,929,313
- Issue date Mar 12, 2024
- Shanghai Tianma Micro-Electronics Co., Ltd.
- Mingyu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic assembly
- Patent number 11,901,310
- Issue date Feb 13, 2024
- Tesla, Inc.
- Mengzhi Pang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module
- Patent number 11,894,292
- Issue date Feb 6, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Qing Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System in a package modifications
- Patent number 11,869,823
- Issue date Jan 9, 2024
- OCTAVO SYSTEMS LLC
- Michael Kenneth Conti
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
HIGH-FREQUENCY CIRCUIT COMPONENT
- Publication number 20250149472
- Publication date May 8, 2025
- Murata Manufacturing Co., Ltd.
- Hisatoshi KAWABATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH ELECTRODE SUBSTRATE AND SEMICONDUCTOR DEVICE
- Publication number 20250046681
- Publication date Feb 6, 2025
- DAI NIPPON PRINTING CO., LTD.
- Satoru KURAMOCHI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTIDIE SUPPORTS AND RELATED METHODS
- Publication number 20250022813
- Publication date Jan 16, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUPPORTS FOR THINNED SEMICONDUCTOR SUBSTRATES AND RELATED METHODS
- Publication number 20250022808
- Publication date Jan 16, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING THEREOF
- Publication number 20240379369
- Publication date Nov 14, 2024
- Yangtze Memory Technologies Co., Ltd.
- Qingyi Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Chip Package with Detachable Chips
- Publication number 20240332110
- Publication date Oct 3, 2024
- Western Digital Technologies, Inc.
- Rotem Sela
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CURVED SEMICONDUCTOR DIE SYSTEMS AND RELATED METHODS
- Publication number 20240297065
- Publication date Sep 5, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIQUID METAL CONNECTION DEVICE AND METHOD
- Publication number 20240297119
- Publication date Sep 5, 2024
- Intel Corporation
- Srikant Nekkanty
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240282684
- Publication date Aug 22, 2024
- Resonac Corporation
- Kazuyuki MITSUKURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD UNIT AND METHOD FOR DESIGNING THE SAME
- Publication number 20240224421
- Publication date Jul 4, 2024
- TOPPAN Holdings Inc.
- Ryoma TANABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND POWER CONVERTER
- Publication number 20240222233
- Publication date Jul 4, 2024
- Mitsubishi Electric Corporation
- Hodaka ROKUBUICHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE AND METHOD FOR BONDING OF SUBSTRATES
- Publication number 20240213025
- Publication date Jun 27, 2024
- EV GROUP E. THALLNER GMBH
- Thomas Wagenleitner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP SOCKET, TESTING FIXTURE AND CHIP TESTING METHOD THEREOF
- Publication number 20240192252
- Publication date Jun 13, 2024
- NANYA TECHNOLOGY CORPORATION
- SHIH-TING LIN
- G01 - MEASURING TESTING
Information Patent Application
Locking Clip, a Semiconductor Device, and a Method of Manufacturing...
- Publication number 20240153838
- Publication date May 9, 2024
- NEXPERIA B.V.
- Ricardo Yandoc
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STORAGE DEVICE AND INFORMATION PROCESSING SYSTEM
- Publication number 20240147625
- Publication date May 2, 2024
- KIOXIA Corporation
- Akinobu HIROTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM IN A PACKAGE MODIFICATIONS
- Publication number 20240087975
- Publication date Mar 14, 2024
- Octavo Systems LLC
- Michael Kenneth CONTI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUPPORTS FOR THINNED SEMICONDUCTOR SUBSTRATES AND RELATED METHODS
- Publication number 20240079343
- Publication date Mar 7, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED COOLING SYSTEMS AND METHODS OF MANUFACTURING EMBEDDED COOL...
- Publication number 20240038633
- Publication date Feb 1, 2024
- INVENSAS BONDING TECHNOLOGIES, INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING AN ELECTROTECHNICAL ARRANGEMENT, ELECTRONIC CO...
- Publication number 20240006255
- Publication date Jan 4, 2024
- ROBERT BOSCH GmbH
- Ingo Fritsch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230402334
- Publication date Dec 14, 2023
- Fuji Electric Co., Ltd.
- Toshio DENTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT CHIP STORAGE CONTAINER
- Publication number 20230378014
- Publication date Nov 23, 2023
- Western Digital Technologies, Inc.
- Nadav Tsur
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Application
CHIP PACKAGE STRUCTURE WITH ANCHOR STRUCTURE
- Publication number 20230369250
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hui-Ting LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH ELECTRODE SUBSTRATE AND SEMICONDUCTOR DEVICE
- Publication number 20230335465
- Publication date Oct 19, 2023
- DAI NIPPON PRINTING CO., LTD.
- Satoru KURAMOCHI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME
- Publication number 20230299033
- Publication date Sep 21, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANODIZED FILM SUBSTRATE BASE, ANODIZED FILM SUBSTRATE PART HAVING S...
- Publication number 20230290740
- Publication date Sep 14, 2023
- POINT ENGINEERING CO., LTD.
- Bum Mo AHN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE
- Publication number 20230230894
- Publication date Jul 20, 2023
- SIEMENS AKTIENGESELLSCHAFT
- Jens Schmenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIQUID METAL CONNECTION DEVICE AND METHOD
- Publication number 20230187850
- Publication date Jun 15, 2023
- Intel Corporation
- Ziyin Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SWITCHED-MODE LIGHT-EMITTING DIODE (LED) DISPLAY UNIT SATISFYING FI...
- Publication number 20230171903
- Publication date Jun 1, 2023
- NANJING LOPU CO., LTD.
- Bin ZHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20230118368
- Publication date Apr 20, 2023
- Showa Denko Materials Co., Ltd.
- Kazuyuki MITSUKURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Packages Having Support Rings
- Publication number 20230103560
- Publication date Apr 6, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Rong Chun
- H01 - BASIC ELECTRIC ELEMENTS

Holders for supporting the complete device in operation

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Chip socket, testing fixture and chip testing method thereof

Patterned bolster plate and composite back plate for semiconductor...

Integrated circuit chip storage container

System in a package modifications

Power semiconductor device and method for manufacturing power semic...

Stiffener ring and surface packaging assembly

Cryogenic packaging for thermalization of low temperature devices

Embedded cooling systems and methods of manufacturing embedded cool...

Through electrode substrate and semiconductor device

Chip retaining structure to fix a chip module

Device and method for bonding of substrates

Supports for thinned semiconductor substrates and related methods

Multidie supports and related methods

Semiconductor device having at least one resin part that closes one...

Pressing device for directly or indirectly applying pressure to pow...

Semiconductor apparatus

Chip bonding apparatus and securing assembly therefor

Semiconductor package and method of forming the same

Switched-mode light-emitting diode (LED) display unit satisfying fi...

Curved semiconductor die systems and related methods

Substrate and method for manufacturing the same

Integrated circuit packages having support rings

IC chip holder

Method of producing circuit boards

Chip socket, testing fixture and chip testing method thereof

Device and method for bonding of substrates

Chip package structure and method for manufacturing the same, and m...

Electronic assembly

Power module

System in a package modifications

Patents Applicationslast 30 patents

HIGH-FREQUENCY CIRCUIT COMPONENT

THROUGH ELECTRODE SUBSTRATE AND SEMICONDUCTOR DEVICE

MULTIDIE SUPPORTS AND RELATED METHODS

SUPPORTS FOR THINNED SEMICONDUCTOR SUBSTRATES AND RELATED METHODS

SEMICONDUCTOR DEVICE AND METHOD OF FORMING THEREOF

Multi-Chip Package with Detachable Chips

CURVED SEMICONDUCTOR DIE SYSTEMS AND RELATED METHODS

LIQUID METAL CONNECTION DEVICE AND METHOD

SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME

WIRING BOARD UNIT AND METHOD FOR DESIGNING THE SAME

SEMICONDUCTOR DEVICE AND POWER CONVERTER

DEVICE AND METHOD FOR BONDING OF SUBSTRATES

CHIP SOCKET, TESTING FIXTURE AND CHIP TESTING METHOD THEREOF

Locking Clip, a Semiconductor Device, and a Method of Manufacturing...

SEMICONDUCTOR STORAGE DEVICE AND INFORMATION PROCESSING SYSTEM

SYSTEM IN A PACKAGE MODIFICATIONS

SUPPORTS FOR THINNED SEMICONDUCTOR SUBSTRATES AND RELATED METHODS

EMBEDDED COOLING SYSTEMS AND METHODS OF MANUFACTURING EMBEDDED COOL...

METHOD FOR PRODUCING AN ELECTROTECHNICAL ARRANGEMENT, ELECTRONIC CO...

SEMICONDUCTOR DEVICE

INTEGRATED CIRCUIT CHIP STORAGE CONTAINER

CHIP PACKAGE STRUCTURE WITH ANCHOR STRUCTURE

THROUGH ELECTRODE SUBSTRATE AND SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME

ANODIZED FILM SUBSTRATE BASE, ANODIZED FILM SUBSTRATE PART HAVING S...

POWER MODULE

LIQUID METAL CONNECTION DEVICE AND METHOD

SWITCHED-MODE LIGHT-EMITTING DIODE (LED) DISPLAY UNIT SATISFYING FI...

SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME

Integrated Circuit Packages Having Support Rings