the bent parts being the outer leads

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

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H01L23/49555the bent parts being the outer leads

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 12,211,764
- Issue date Jan 28, 2025
- Mitsubishi Electric Corporation
- Ken Sakamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging structure of power semiconductor module
- Patent number 12,205,872
- Issue date Jan 21, 2025
- STARPOWER SEMICONDUCTOR LTD.
- Danting Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated high voltage electronic device with high relative permit...
- Patent number 12,170,164
- Issue date Dec 17, 2024
- Texas Instruments Incorporated
- Enis Tuncer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having at least one resin part that closes one...
- Patent number 12,119,279
- Issue date Oct 15, 2024
- Mitsubishi Electric Corporation
- Mamoru Togami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Press-fit power module and related methods
- Patent number 12,119,576
- Issue date Oct 15, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Jie Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead adapters for semiconductor package
- Patent number 12,113,000
- Issue date Oct 8, 2024
- Infineon Technologies AG
- Ajay Poonjal Pai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with electrically insulated carrier and at least one step o...
- Patent number 12,094,793
- Issue date Sep 17, 2024
- Infineon Technologies AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices having a plurality of offsets in leads suppor...
- Patent number 12,087,676
- Issue date Sep 10, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Jae Min Bae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, printed circuit board (PCB), and method of in...
- Patent number 12,080,634
- Issue date Sep 3, 2024
- The Noco Company
- James P. McBride
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional functional integration
- Patent number 12,074,098
- Issue date Aug 27, 2024
- Texas Instruments Incorporated
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multichip packaged semiconductor device
- Patent number 12,057,377
- Issue date Aug 6, 2024
- MagnaChip Semiconductor, Ltd.
- Hyun Dong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package with surface contact wire extensions
- Patent number 12,040,260
- Issue date Jul 16, 2024
- Texas Instruments Incorporated
- Makoto Shibuya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder surface features for integrated circuit packages
- Patent number 12,021,011
- Issue date Jun 25, 2024
- Texas Instruments Incorporated
- Amirul Afiq Bin Hud
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packages with electrical fuses
- Patent number 12,009,336
- Issue date Jun 11, 2024
- Texas Instruments Incorporated
- Mahmud Halim Chowdhury
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame assembly for a semiconductor device
- Patent number 11,973,009
- Issue date Apr 30, 2024
- Nexperia B.V.
- Ricardo Lagmay Yandoc
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module with semiconductor packages mounted on metal frame
- Patent number 11,973,012
- Issue date Apr 30, 2024
- Infineon Technologies Austria AG
- Andreas Grassmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number RE49912
- Issue date Apr 9, 2024
- Rohm Co., Ltd.
- Akihiro Kimura
Information Patent Grant
Packaged module and metal plate
- Patent number 11,955,891
- Issue date Apr 9, 2024
- HUAWEI DIGITAL POWER TECHNOLOGIES CO., LTD.
- Zhiqiang Xiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,935,820
- Issue date Mar 19, 2024
- Sansha Electric Manufacturing Co., Ltd.
- Tomohiro Yamanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device comprising first and second lead frames
- Patent number 11,929,306
- Issue date Mar 12, 2024
- Kabushiki Kaisha Toshiba
- Kakeru Yamaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a bidirectional switch
- Patent number 11,923,276
- Issue date Mar 5, 2024
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor device with dual heat dissipation structures
- Patent number 11,908,771
- Issue date Feb 20, 2024
- Infineon Technologies AG
- Jayaganasan Narayanasamy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor device and semiconductor device
- Patent number 11,894,291
- Issue date Feb 6, 2024
- Mitsubishi Electric Corporation
- Shuhei Yokoyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with electrically insulated carrier and at least one step o...
- Patent number 11,876,028
- Issue date Jan 16, 2024
- Infineon Technologies AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded semiconductor package having a negative standoff
- Patent number 11,862,541
- Issue date Jan 2, 2024
- Infineon Technologies AG
- Thomas Stoek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module apparatus, cooling structure, and electric vehicle or...
- Patent number 11,854,937
- Issue date Dec 26, 2023
- Rohm Co., Ltd.
- Katsuhiko Yoshihara
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Leads for leadframe and semiconductor package
- Patent number 11,830,791
- Issue date Nov 28, 2023
- Texas Instruments Incorporated
- You Chye How
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded RF power package
- Patent number 11,823,986
- Issue date Nov 21, 2023
- Ampleon Netherlands B.V.
- Leonardus Theodorus Maria Raben
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coated semiconductor devices
- Patent number 11,791,248
- Issue date Oct 17, 2023
- Texas Instruments Incorporated
- Sreenivasan Kalyani Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Universal semiconductor package molds
- Patent number 11,791,170
- Issue date Oct 17, 2023
- Texas Instruments Incorporated
- Anis Fauzi Bin Abdul Aziz
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250022777
- Publication date Jan 16, 2025
- ROHM CO., LTD.
- Shingo YOSHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Devices and Methods for Manufacturing Thereof
- Publication number 20250022780
- Publication date Jan 16, 2025
- INFINEON TECHNOLOGIES AG
- Thomas Bemmerl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR ASSEMBLIES
- Publication number 20250006693
- Publication date Jan 2, 2025
- NEXPERIA B.V.
- Ricardo Yandoc
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING A SEMICONDUCTOR PACKAGE ASSEMBLY AS WELL A...
- Publication number 20240429135
- Publication date Dec 26, 2024
- NEXPERIA B.V.
- Vegneswary Ramalingam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH ELECTRICALLY INSULATED CARRIER AND AT LEAST ONE STEP O...
- Publication number 20240395646
- Publication date Nov 28, 2024
- INFINEON TECHNOLOGIES AG
- Edward FUERGUT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240377851
- Publication date Nov 14, 2024
- NUVOTON TECHNOLOGY CORPORATION JAPAN
- Satoshi ENDO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF IMPROVING PACKAGE CREEPAGE DISTANCE
- Publication number 20240371712
- Publication date Nov 7, 2024
- NEXPERIA B.V.
- Hans-Juergen Funke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADFRAME COMPRISING A LEAD WITH AN ELEVATION FOR INCREASING MECHAN...
- Publication number 20240347427
- Publication date Oct 17, 2024
- INFINEON TECHNOLOGIES AG
- Edward FÜRGUT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGES WITH ELECTRICAL FUSES
- Publication number 20240332243
- Publication date Oct 3, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Mahmud Halim CHOWDHURY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE FOR PRESS FIT ASSEMBLY
- Publication number 20240332141
- Publication date Oct 3, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Kwang-Soo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR MODULE WITH ADAPTABLE POWER CONTACTS AND METHOD...
- Publication number 20240332142
- Publication date Oct 3, 2024
- INFINEON TECHNOLOGIES AG
- Michael Fügl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP-ON-CHIP POWER CARD HAVING IMMERSION COOLING
- Publication number 20240321698
- Publication date Sep 26, 2024
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Feng Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR MODULE AND POWER ELECTRONICS DEVICE
- Publication number 20240322697
- Publication date Sep 26, 2024
- Waldemar Jakobi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240312883
- Publication date Sep 19, 2024
- Rohm Co., Ltd.
- Kelvin Hadinata WIBOWO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Semiconductor Package
- Publication number 20240304507
- Publication date Sep 12, 2024
- Wolfspeed, Inc.
- Geza Dezsi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER TRANSISTOR CHIP PACKAGE
- Publication number 20240304528
- Publication date Sep 12, 2024
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE HAVING A MULTI-LEVEL LEAD FRAME
- Publication number 20240304527
- Publication date Sep 12, 2024
- INFINEON TECHNOLOGIES AG
- Dominic Raithel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHIELDED LEAD PACKAGE FOR HIGH VOLTAGE DEVICES
- Publication number 20240290676
- Publication date Aug 29, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Masamitsu Matsuura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240290694
- Publication date Aug 29, 2024
- ROHM CO., LTD.
- Ryotaro KAKIZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME ASSEMBLY FOR A SEMICONDUCTOR DEVICE
- Publication number 20240258207
- Publication date Aug 1, 2024
- NEXPERIA B.V.
- Ricardo Yandoc
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Module with Semiconductor Packages Mounted on Metal Frame
- Publication number 20240258216
- Publication date Aug 1, 2024
- Infineon Technologies Austria AG
- Andreas Grassmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240258186
- Publication date Aug 1, 2024
- ROHM CO., LTD.
- Ryotaro KAKIZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE WITH ISOLATION
- Publication number 20240258211
- Publication date Aug 1, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED MODULE PACKAGE WITH AN EMI SHIELDING BARRIER
- Publication number 20240258245
- Publication date Aug 1, 2024
- TEXAS INSTRUMENTS INCORPORATED
- KWANG-SOO KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE WITH VERTICALLY STACKED PASSIVE COMPONENT
- Publication number 20240258288
- Publication date Aug 1, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Makoto Shibuya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Semiconductor Apparatus and Power Conversion Apparatus
- Publication number 20240243041
- Publication date Jul 18, 2024
- MITSUBISHI ELECTRIC CORPORATION
- Tatsunori YANAGIMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE AND TEST SOCKET FOR US...
- Publication number 20240201223
- Publication date Jun 20, 2024
- RENESAS ELECTRONICS CORPORATION
- Toshitsugu ISHII
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240203808
- Publication date Jun 20, 2024
- ROHM CO., LTD.
- Koichi KITAGURO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NOVEL PACKAGING STRUCTURE OF POWER SEMICONDUCTOR MODULE
- Publication number 20240203841
- Publication date Jun 20, 2024
- STARPOWER SEMICONDUCTOR LTD.
- Danting FENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITIVE COUPLING PACKAGE STRUCTURE
- Publication number 20240194573
- Publication date Jun 13, 2024
- LITE-ON SINGAPORE PTE. LTD.
- You-Fa WANG
- H01 - BASIC ELECTRIC ELEMENTS

the bent parts being the outer leads

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device and method of manufacturing the same

Packaging structure of power semiconductor module

Integrated high voltage electronic device with high relative permit...

Semiconductor device having at least one resin part that closes one...

Press-fit power module and related methods

Lead adapters for semiconductor package

Package with electrically insulated carrier and at least one step o...

Semiconductor devices having a plurality of offsets in leads suppor...

Semiconductor device, printed circuit board (PCB), and method of in...

Three-dimensional functional integration

Multichip packaged semiconductor device

Electronic package with surface contact wire extensions

Solder surface features for integrated circuit packages

Packages with electrical fuses

Lead frame assembly for a semiconductor device

Power module with semiconductor packages mounted on metal frame

Semiconductor device

Packaged module and metal plate

Semiconductor device

Semiconductor device comprising first and second lead frames

Semiconductor device including a bidirectional switch

Power semiconductor device with dual heat dissipation structures

Manufacturing method of semiconductor device and semiconductor device

Package with electrically insulated carrier and at least one step o...

Molded semiconductor package having a negative standoff

Power module apparatus, cooling structure, and electric vehicle or...

Leads for leadframe and semiconductor package

Molded RF power package

Coated semiconductor devices

Universal semiconductor package molds

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE

Semiconductor Devices and Methods for Manufacturing Thereof

METHOD OF MANUFACTURING SEMICONDUCTOR ASSEMBLIES

METHOD FOR MANUFACTURING A SEMICONDUCTOR PACKAGE ASSEMBLY AS WELL A...

PACKAGE WITH ELECTRICALLY INSULATED CARRIER AND AT LEAST ONE STEP O...

SEMICONDUCTOR DEVICE

METHOD OF IMPROVING PACKAGE CREEPAGE DISTANCE

LEADFRAME COMPRISING A LEAD WITH AN ELEVATION FOR INCREASING MECHAN...

PACKAGES WITH ELECTRICAL FUSES

SEMICONDUCTOR DEVICE PACKAGE FOR PRESS FIT ASSEMBLY

POWER SEMICONDUCTOR MODULE WITH ADAPTABLE POWER CONTACTS AND METHOD...

CHIP-ON-CHIP POWER CARD HAVING IMMERSION COOLING

POWER SEMICONDUCTOR MODULE AND POWER ELECTRONICS DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

Power Semiconductor Package

POWER TRANSISTOR CHIP PACKAGE

POWER MODULE HAVING A MULTI-LEVEL LEAD FRAME

SHIELDED LEAD PACKAGE FOR HIGH VOLTAGE DEVICES

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

LEAD FRAME ASSEMBLY FOR A SEMICONDUCTOR DEVICE

Power Module with Semiconductor Packages Mounted on Metal Frame

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE PACKAGE WITH ISOLATION

MOLDED MODULE PACKAGE WITH AN EMI SHIELDING BARRIER

SEMICONDUCTOR DEVICE PACKAGE WITH VERTICALLY STACKED PASSIVE COMPONENT

Power Semiconductor Apparatus and Power Conversion Apparatus

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE AND TEST SOCKET FOR US...

SEMICONDUCTOR DEVICE

NOVEL PACKAGING STRUCTURE OF POWER SEMICONDUCTOR MODULE

CAPACITIVE COUPLING PACKAGE STRUCTURE